CN111056825B - 一种抗弯型高温复合承烧板及其制备方法 - Google Patents
一种抗弯型高温复合承烧板及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种抗弯型高温复合承烧板,属于耐火窑具制备领域,外表层由氧化铝为主体组成作承载隔离层、内表层由碳化硅为主体组成作承载支撑层,外表层与内表层之间设置由氧化锆为主体组成的增韧界面层,同时本发明还公开了上述承烧板的制备方法;本发明与传统技术相比,在充分掌握复合承烧板使用环境要求及产生损坏的主要原因基础上,通过界面层的设置,增强了内外层的结合强度,改善了中间层的高温抗折强度,提高了复合承烧板的高温强度,比较有效反映出复合承烧板的抗弯性能的提高,延长了复合承烧板的使用寿命,降低使用单位的制造成本。
Description
技术领域
本发明属于耐火窑具制备领域,具体涉及一种抗弯型高温复合承烧板及其制备方法。
背景技术
复合承烧板是以磁性材料为代表的电子元件烧结的承载窑具,一般以碳化硅为中间层、氧化铝为包裹层的复合结构。电子元件中含有铁、氧、锰、锌等元素在高温烧结时易与硅等元素产生反应,外层氧化铝层直接接触承烧制品,减少造成对磁性材料污染。内层利用碳化硅的高温抗折强度较好的特性,为承烧板提供承载强度。但目前该结构的复合承烧板在高温承载条件下比较容易产生弯曲变形,甚至出现裂纹或开裂,影响复合承烧板的使用寿命。另外中国专利:CN200610036944.X公开一种复合承烧板及制造方法,是采用氧化铝材料混和后做成基板,在基板上喷涂高纯氧化铝过渡层,再在过渡层上喷涂氧化锆,经烘干高温烧成后制得氧化锆-氧化铝的复合耐火材料。所述的复合承烧板层与层间的结合力强,在高温下不断裂或裂缝。但实际在高温使用条件下,氧化铝基板层的高温强度很容量弱化,承烧板容量产生弯曲变形,另喷涂氧化锆与氧化铝由于线膨胀系数差异在冷热急变循环的使用环境下容易出现脱落或开裂的问题。
发明内容
本发明的目的在于针对现有技术的不足,提供一种抗弯型高温复合承烧板,外表层由氧化铝为主体组成作承载隔离层、内表层由碳化硅为主体组成作承载支撑层,外表层与内表层之间设置由氧化锆为主体组成的增韧界面层。
本发明的另一目的在于提供上述承烧板的制备方法。
为了达到上述发明目的,本发明具体是这样来实现的:一种抗弯型高温复合承烧板,其特征在于,由外往内依次是氧化铝层、氧化锆层、碳化硅层的三层结构复合承烧板,所述各层包括以下质量百分比的组分:
氧化铝层:氧化铝粉≤50um 40~50%、刚玉60~100目20~30%、刚玉325目15~20%、高岭土≤200目2~10%;
氧化锆层:氧化锆250~400目90~95%、氧化钙325目3~6%、氧化钇325目2~4%;
碳化硅层:碳化硅6~30目35~50%、碳化硅80~120目30~40%、碳化硅325目10~20%、高岭土<270目3~10%。
制备上述抗弯型高温复合承烧板的方法,先将各层料按各自组份原料的质量百分比进行均质混料,困料备用;成型时在模具中依次进行均匀布料,然后在大吨位压机上进行成型压制;压制后得到的坯体依次送入不同阶梯温度段的烘房烘干处理;经干燥后的坯体进行高温烧成,烧成温度控制在1400~1550℃,烧成周期为48~72h。
本发明关键在于烧成后,氧化锆微粉能对外表层氧化铝层与内表层碳化硅层内的高岭土中的二氧化硅成分反表层中间形成氧化锆界面层,界面层的厚度约为0.1-0.5mm,界面层与外层料和内层料间呈错综交错的结构,经高温烧结在界面间形成含氧化铝的稳定氧化锆晶相结应生成的玻璃相起增韧效果,增加材料的断裂功,提高界面层与基层间的结合强度,提高制品的高温抗折强度,并解决氧化锆层在三明治复合承烧板的烧成制度的适应性问题。
有益效果:本发明与传统技术相比,在充分掌握复合承烧板使用环境要求及产生损坏的主要原因基础上,通过氧化锆层界面层的设置,改进优化颗粒级配及制造工艺,提高了复合承烧板的高温抗折强度,比较有效反映出复合承烧板的抗弯功能,延长了复合承烧板的使用寿命25%以上,降低使用单位的制造成本。
具体实施方式
实施例1:
一种抗弯型高温复合承烧板,由外往内依次是氧化铝层、氧化锆层、碳化硅层的三层结构复合承烧板,所述承烧板各层各组份原料的质量百分比为,氧化铝层:氧化铝粉≤50um 50%、刚玉60~100目25%、刚玉325目15%、高岭土≤200目10%;氧化锆层:氧化锆250~400目90%、氧化钙325目6%、氧化钇325目4%;
碳化硅层:碳化硅6~30目35%、碳化硅80~120目40%、碳化硅325目15%、高岭土<270目10%;先将氧化铝层料、碳化硅层料分别按组份的质量百分比要求在混料机中进行混料3~4小时,混料均匀后下料堆放,困料36~48小时后备用;另将氧化锆层料按组份的质量百分比要求在干混料机中进行混料6~8小时,混料均匀后下料堆放,困料12~24小时后备用;在备好的模具内按层次分批次进行布料,要求刮料到位,布料均匀,在大吨位压机上按层次分阶段加压成型,压制后经过不同阶梯温度段分段干燥,得干燥坯件备烧;经1450~1500℃的高温窑炉烧成36~60小时制得。烧成后,外表层和内表层中间形成氧化锆界面层,氧化锆界面层厚度为0.1mm。经过使用单位的应用认证,本承烧板在以磁性材料为代表的电子元件烧结窑炉中使用达到200次以上,不发生弯曲变形,也不会产生开裂和脱落,具有良好的抗弯型高温隔离性能和较长的使用寿命。
实施例2:
一种抗弯型高温复合承烧板,参考实施例1,所述承烧板各层各组份原料的质量百分比为,氧化铝层:氧化铝粉≤50um 40%、刚玉60~100目30%、刚玉325目25%、高岭土≤200目5%;氧化锆层:氧化锆250~400目92%、氧化钙325目5%、氧化钇325目3%;碳化硅层:碳化硅6~30目40%、碳化硅80~120目35%、碳化硅325目20%、高岭土<270目5%;先将氧化铝层料、碳化硅层料分别按组份的质量百分比要求在混料机中进行混料3~4小时,混料均匀后下料堆放,困料36~48小时后备用;另将氧化锆层料按组份的质量百分比要求在干混料机中进行混料6~8小时,混料均匀后下料堆放,困料12~24小时后备用;在备好的模具内按层次分批次进行布料,要求刮料到位,布料均匀,在大吨位压机上按层次分阶段加压成型,压制后经过不同阶梯温度段分段干燥,得干燥坯件备烧;经1450~1500℃的高温窑炉烧成36~60小时制得。烧成后,外表层和内表层中间形成氧化锆界面层,氧化锆界面层厚度为0.2mm。经过使用单位的应用认证,本承烧板在以磁性材料为代表的电子元件烧结窑炉中使用达到190次以上,不发生弯曲变形,也不会产生开裂和脱落,具有良好的抗弯型高温隔离性能和较长的使用寿命。
实施例3:
一种抗弯型高温复合承烧板,参考实施例1,所述承烧板各层各组份原料的质量百分比为,所述承烧板各层各组份原料的质量百分比为,氧化铝层:氧化铝粉≤50um 47%、刚玉60~100目28%、刚玉325目23%、高岭土≤200目2%;氧化锆层:氧化锆250~400目94%、氧化钙325目4%、氧化钇325目2%;碳化硅层:碳化硅6~30目45%、碳化硅80~120目37%、碳化硅325目10%、高岭土<270目8%;先将氧化铝层料、碳化硅层料分别按组份的质量百分比要求在混料机中进行混料3~4小时,混料均匀后下料堆放,困料36~48小时后备用;另将氧化锆层料按组份的质量百分比要求在干混料机中进行混料6~8小时,混料均匀后下料堆放,困料12~24小时后备用;在备好的模具内按层次分批次进行布料,要求刮料到位,布料均匀,在大吨位压机上按层次分阶段加压成型,压制后经过不同阶梯温度段分段干燥,得干燥坯件备烧;经1450~1500℃的高温窑炉烧成36~60小时制得。烧成后,外表层和内表层中间形成氧化锆界面层,氧化锆界面层厚度为0.3mm。经过使用单位的应用认证,本承烧板在以磁性材料为代表的电子元件烧结窑炉中使用达到206次以上,不发生弯曲变形,也不会产生开裂和脱落,具有良好的抗弯型高温隔离性能和较长的使用寿命。
实施例4:
一种抗弯型高温复合承烧板,参考实施例1,所述承烧板各层各组份原料的质量百分比为,所述承烧板各层各组份原料的质量百分比为,氧化铝层:氧化铝粉≤50um 48%、刚玉60~100目20%、刚玉325目24%、高岭土≤200目8%;氧化锆层:氧化锆250~400目95%、氧化钙325目3%、氧化钇325目2%;碳化硅层:碳化硅6~30目50%、碳化硅80~120目30%、碳化硅325目17%、高岭土<270目3%;先将氧化铝层料、碳化硅层料分别按组份的质量百分比要求在混料机中进行混料3~4小时,混料均匀后下料堆放,困料36~48小时后备用;另将氧化锆层料按组份的质量百分比要求在干混料机中进行混料6~8小时,混料均匀后下料堆放,困料12~24小时后备用;在备好的模具内按层次分批次进行布料,要求刮料到位,布料均匀,在大吨位压机上按层次分阶段加压成型,压制后经过不同阶梯温度段分段干燥,得干燥坯件备烧;经1450~1500℃的高温窑炉烧成36~60小时制得。烧成后,外表层和内表层中间形成氧化锆界面层,氧化锆界面层厚度为0.5mm。经过使用单位的应用认证,本承烧板在以磁性材料为代表的电子元件烧结窑炉中使用达到196次以上,不发生弯曲变形,也不会产生开裂和脱落,具有良好的抗弯型高温隔离性能和较长的使用寿命。
Claims (2)
1.一种抗弯型高温复合承烧板,其特征在于,外表层由氧化铝为主体组成作承载隔离层、内表层由碳化硅为主体组成作承载支撑层,外表层与内表层之间设置由氧化锆为主体组成的增韧界面层,所述承烧板各层各组份原料的质量百分比为:
氧化铝层:氧化铝粉≤50μm 40~50%、刚玉60~100目20~30%、刚玉325目15~20%、高岭土≤200目2~10%;
氧化锆增韧界面层:氧化锆250~400目90~95%、氧化钙325目3~6%、氧化钇325目2~4%;
碳化硅层:碳化硅6~30目35~50%、碳化硅80~120目30~40%、碳化硅325目10~20%、高岭土<270目3~10%;
烧成后,外层和内层中间形成氧化锆增韧界面层,界面层厚度为0 .1~0 .5mm。
2.权利要求1所述抗弯型高温复合承烧板的制备方法,其特征在于,先将各层料按各自组份原料的质量百分比进行均质混料,困料备用;成型时在模具中依次进行均匀布料,然后在大吨位压机上进行成型压制;压制后得到的坯体依次送入不同阶梯温度段的烘房烘干处理;经干燥后的坯体进行高温烧成,烧成温度控制在1400~1550℃,烧成周期为48~72h。
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