CN111019474A - 一种耐高温电子元件保护膜的制造方法 - Google Patents

一种耐高温电子元件保护膜的制造方法 Download PDF

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CN111019474A
CN111019474A CN201911233257.0A CN201911233257A CN111019474A CN 111019474 A CN111019474 A CN 111019474A CN 201911233257 A CN201911233257 A CN 201911233257A CN 111019474 A CN111019474 A CN 111019474A
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protective film
resin
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electronic element
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张梦雨
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Xuzhou Hongjie Electronic Co Ltd
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Abstract

本发明公开了一种耐高温电子元件保护膜的制造方法，其步骤为：(1)：称取树脂基材、分散剂、固化剂和二氧化硅气凝胶；(2)：将树脂基材进行湿磨；(3)：将树脂基材加热软化；(4)：将分散剂和二氧化硅气凝胶加入软化的树脂基材中，并充分搅拌，形成泥状保护膜；(5)：将泥状保护膜均匀涂抹在电子元件的表面，并加入固化剂，待保护膜凝固，即完成制造。本发明通过简单的步骤即可完成保护膜的制造,且提高了保护膜的弹性、韧性和强度；同时，二氧化硅气凝胶出色的保温性能使保护膜可以较好的隔绝电子元件与环境，使保护膜在高温环境下也不会脱落，间接提高了电子元件在高温环境下的工作性能。

Description

一种耐高温电子元件保护膜的制造方法
技术领域
本发明涉及电子零配件制造领域，具体是一种耐高温电子元件保护膜的制造方法。
背景技术
电子元件是构成电子设备或者机电设备的重要零件，体积相对较小而且比较零散。包装的不恰当，往往导致电子元件受到环境因素的影响，而出现氧化、变形或其它损害，导致电子元件的功能受到影响，甚至给整个设备带来危害，因此，需要给电子元件包裹一层保护膜。
现有技术中的电子元件保护膜弹性差、韧性差、强度低，且易在高温环境中软化。
发明内容
针对现有技术中存在的问题，本发明的目的是提供一种耐高温电子元件保护膜的制造方法。
本发明采用的技术方案是：一种耐高温电子元件保护膜的制造方法，包括以下步骤：
(1)：按质量份配比称取15-25份的树脂基材、2-5份的分散剂、3-5份的固化剂和8-15份的二氧化硅气凝胶；
(2)：将树脂基材放入湿磨机，以无水乙醇和甲醇混合液作为湿磨介质进行湿磨；
(3)：将湿磨后的树脂基材加热至80-100℃，将树脂基材软化；
(4)：将分散剂和二氧化硅气凝胶同时加入软化的树脂基材中，并充分搅拌，使二氧化硅气凝胶充分分散在树脂基材中，形成泥状保护膜；
(5)：将泥状保护膜均匀涂抹在电子元件的表面，并加入固化剂，待保护膜凝固，即完成耐高温的电子元件保护膜的制造。
优选地，树脂基材由有机硅树脂、酚醛树脂、聚氯乙烯树脂、聚乙烯树脂、聚丙烯树脂、ABS树脂、环氧树脂和丙烯酸树脂中的一种或多种混合而成；
所述分散剂由硅酸钙、硅酸镁、硅酸钠、三聚磷酸钠、六偏磷酸钠、焦磷酸钠、三乙基己基磷酸、十二烷基硫酸钠、甲基戊醇、纤维素衍生物、聚丙烯酰胺、古尔胶和脂肪酸聚乙二醇酯中的一种或多种混合而成；
所述固化剂由乙烯基三胺、二氨基环己烷、二乙烯三胺、三乙烯四胺、多乙烯多胺、二丙烯三胺、三甲基六亚甲基二胺、二乙胺和二氨基二苯基甲烷中的一种或多种混合而成。
本发明的一种耐高温电子元件保护膜的制造方法,通过简单的步骤即可完成保护膜的制造,且在保护膜的树脂基材中掺杂了新型材料二氧化硅气凝胶，提高了保护膜的弹性、韧性和强度；同时，二氧化硅气凝胶出色的保温性能使保护膜可以较好的隔绝电子元件与环境，使保护膜在高温环境下也不会脱落，间接提高了电子元件在高温环境下的工作性能。
具体实施方式
下面结合实施例对本发明作进一步详细说明。
实施例1
制造一批耐高温的电子元件保护膜，其步骤为：
(1)：按质量份配比称取15份的树脂基材、2份的分散剂、3份的固化剂和15份的二氧化硅气凝胶；
所述所述树脂基材由酚醛树脂、环氧树脂和丙烯酸树脂混合而成。
所述分散剂由硅酸钙、硅酸镁、硅酸钠、三聚磷酸钠、六偏磷酸钠、焦磷酸钠、三乙基己基磷酸、十二烷基硫酸钠、甲基戊醇、纤维素衍生物、聚丙烯酰胺、古尔胶和脂肪酸聚乙二醇酯混合而成；
所述固化剂由乙烯基三胺、二氨基环己烷、二乙烯三胺、三乙烯四胺、多乙烯多胺、二丙烯三胺、三甲基六亚甲基二胺、二乙胺和二氨基二苯基甲烷混合而成。
(2)：将树脂基材放入湿磨机，以无水乙醇和甲醇混合液作为湿磨介质进行湿磨；
(3)：将湿磨后的树脂基材加热至80℃，将树脂基材软化；
(4)：将分散剂和二氧化硅气凝胶同时加入软化的树脂基材中，并充分搅拌，使二氧化硅气凝胶充分分散在树脂基材中，形成泥状保护膜；
(5)：将泥状保护膜均匀涂抹在电子元件的表面，并加入固化剂，待保护膜凝固，即完成耐高温的电子元件保护膜的制造。
该批电子元件保护膜较之普通保护膜对照组，弹性提高55％、抗压强度达到20Mpa、热导系数降低98％。
实施例2
制造一批耐高温的电子元件保护膜，其步骤为：
(1)：按质量份配比称取25份的树脂基材、5份的分散剂、5份的固化剂和8份的二氧化硅气凝胶；
所述树脂基材由有机硅树脂、酚醛树脂、聚氯乙烯树脂、聚乙烯树脂、聚丙烯树脂、ABS树脂、环氧树脂和丙烯酸树脂中的一种或多种混合而成；
所述分散剂由硅酸钙、聚丙烯酰胺、古尔胶和脂肪酸聚乙二醇酯混合而成；
所述固化剂由乙烯基三胺、二氨基环己烷、二乙烯三胺、三乙烯四胺和二氨基二苯基甲烷混合而成。
(2)：将树脂基材放入湿磨机，以无水乙醇和甲醇混合液作为湿磨介质进行湿磨；
(3)：将湿磨后的树脂基材加热至96℃，将树脂基材软化；
(4)：将分散剂和二氧化硅气凝胶同时加入软化的树脂基材中，并充分搅拌，使二氧化硅气凝胶充分分散在树脂基材中，形成泥状保护膜；
(5)：将泥状保护膜均匀涂抹在电子元件的表面，并加入固化剂，待保护膜凝固，即完成耐高温的电子元件保护膜的制造。
该批电子元件保护膜较之普通保护膜对照组，弹性提高50％、抗压强度达到18Mpa、热导系数降低95％。

Claims (2)

1.一种耐高温电子元件保护膜的制造方法，其特征在于，包括以下步骤：
(1)：按质量份配比称取15-25份的树脂基材、2-5份的分散剂、3-5份的固化剂和8-15份的二氧化硅气凝胶；
(2)：将树脂基材放入湿磨机，以无水乙醇和甲醇混合液作为湿磨介质进行湿磨；
(3)：将湿磨后的树脂基材加热至80-100℃，将树脂基材软化；
(4)：将分散剂和二氧化硅气凝胶同时加入软化的树脂基材中，并充分搅拌，使二氧化硅气凝胶充分分散在树脂基材中，形成泥状保护膜；
(5)：将泥状保护膜均匀涂抹在电子元件的表面，并加入固化剂，待保护膜凝固，即完成耐高温的电子元件保护膜的制造。
2.根据权利要求1所述的一种耐高温电子元件保护膜的制造方法，其特征在于，所述树脂基材由有机硅树脂、酚醛树脂、聚氯乙烯树脂、聚乙烯树脂、聚丙烯树脂、ABS树脂、环氧树脂和丙烯酸树脂中的一种或多种混合而成；
所述分散剂由硅酸钙、硅酸镁、硅酸钠、三聚磷酸钠、六偏磷酸钠、焦磷酸钠、三乙基己基磷酸、十二烷基硫酸钠、甲基戊醇、纤维素衍生物、聚丙烯酰胺、古尔胶和脂肪酸聚乙二醇酯中的一种或多种混合而成；
所述固化剂由乙烯基三胺、二氨基环己烷、二乙烯三胺、三乙烯四胺、多乙烯多胺、二丙烯三胺、三甲基六亚甲基二胺、二乙胺和二氨基二苯基甲烷中的一种或多种混合而成。
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