CN111014864A - Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing - Google Patents

Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing Download PDF

Info

Publication number
CN111014864A
CN111014864A CN201911256462.9A CN201911256462A CN111014864A CN 111014864 A CN111014864 A CN 111014864A CN 201911256462 A CN201911256462 A CN 201911256462A CN 111014864 A CN111014864 A CN 111014864A
Authority
CN
China
Prior art keywords
solder
joint
brazing
placing
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201911256462.9A
Other languages
Chinese (zh)
Other versions
CN111014864B (en
Inventor
丁敏
王剑
郝红
冀志强
席亚斌
赵格龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyuan University of Technology
Original Assignee
Taiyuan University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyuan University of Technology filed Critical Taiyuan University of Technology
Priority to CN201911256462.9A priority Critical patent/CN111014864B/en
Publication of CN111014864A publication Critical patent/CN111014864A/en
Application granted granted Critical
Publication of CN111014864B publication Critical patent/CN111014864B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A method for manufacturing a joint with directional grain brazing seams by rapid ultrasonic assistance belongs to the technical field of brazing, and aims to provide a method for orienting the grain brazing seams. The strength of the aluminum alloy joint is higher than that of the aluminum alloy joint prepared by the existing method due to the directional structure, the process is simpler, and an intermediate layer is not needed.

Description

Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing
Technical Field
The invention belongs to the technical field of brazing, and particularly relates to a method for preparing a joint with directional grain brazing seams by means of rapid ultrasonic auxiliary manufacturing.
Background
During brazing, in the large gap, crystal grains can grow up without directionality, and the large crystal grains can influence the strength of the joint; when the small gap is adopted, a crystal grain layer is arranged along the width direction of the brazing seam, the gap is reduced, the amount of solidified metal is reduced, smooth plane crystal grains can be formed after solidification, and the strength of the welding seam is improved. However, how to make the crystal grains in the brazing seams have directionality is an urgent problem to be solved for improving the brazing strength of the aluminum alloy.
The ultrasonic-assisted brazing technology is characterized in that ultrasonic influence is applied in the brazing process, the ultrasonic can generate the action of cavitation and acoustic flow, the crystal grains can be refined, and the growth direction of the crystal grains is disturbed, so that the brazing seam cannot keep the complete directional growth of columnar crystals during solidification, and the microstructure and the mechanical property of a formed part are influenced.
Disclosure of Invention
The invention aims to provide a method for brazing seam grain orientation, in particular to an ultrasonic auxiliary welding method for low-temperature soft soldering of aluminum, which ensures that the interior of a joint molten pool always keeps positive temperature gradient along the X-axis direction in the brazing process, thereby ensuring that a columnar crystal structure in a formed piece continuously grows from a parent metal along the X-axis forming direction and ensuring that a formed brazing seam obtains a complete solidified columnar crystal structure.
The invention adopts the following technical scheme:
a method for preparing a joint with directional grain brazing seams by rapid ultrasonic-assisted manufacturing comprises the following steps:
firstly, putting SnZn eutectic solder into a quartz container for melting, and then adding multilayer graphene oxide and SiC micron particles;
secondly, keeping the temperature at 230-;
thirdly, heating the steel mould to 180-200 ℃, and casting the mixed solder in the quartz container into the steel mould;
fourthly, placing the steel mould filled with the mixed solder in a room temperature environment, and cooling to obtain the solder;
fifthly, placing the welding part of the aluminum alloy plate on a heating platform, placing 0.3-0.5g of solder on the welding part, keeping the gap between 0.03-0.1mm, applying 10-30N pressure at the welding temperature of 230-250 ℃, applying ultrasonic power of 300-500W, welding for 1-3s, and cooling to room temperature to obtain the brazing seam joint with the crystal grains oriented along the X axis of the base material.
In the first step, the multilayer graphene oxide accounts for 1-4% of the eutectic solder by mass, the thickness of the multilayer graphene oxide is 10-50nm, the SiC micron particles account for 1-4% of the eutectic solder by mass, and the size of the SiC micron particles is 10-50 um.
The invention has the following beneficial effects:
the invention discloses a preparation method of a joint with directional grain brazing seams by rapid ultrasonic-assisted manufacturing, which has the following beneficial effects: the surface of the aluminum joint prepared by the steps and the process is smooth and has good toughness. The melting temperature of the brazing filler metal is 180-195 ℃, the brazing temperature is 230-250 ℃, the method is good in manufacturability, the maximum joint strength can reach 90MPa, the strength is higher than that of an aluminum alloy joint prepared by the existing method due to the fact that the structure has directionality, the process is simpler, and an intermediate layer is not needed.
Drawings
FIG. 1 is a typical metallographic picture of a linker according to example 1 of the present invention.
Detailed Description
Example 1
Firstly, putting SnZn eutectic solder into a quartz container for melting, and then adding 4% of multilayer graphene oxide and 2% of SiC micron particles by mass ratio. The thickness of the multilayer graphene oxide is 10nm, and the size of SiC micron particles is 10 um.
And secondly, keeping the temperature at 230 ℃ and stirring uniformly, and then slowly cooling the quartz container to 180 ℃ at room temperature to prepare the mixed solder.
Step three, heating the steel die to 180 ℃ while performing the step two, and casting the mixed solder in the quartz container into the steel die;
and fourthly, placing the steel mould filled with the mixed solder in a room temperature environment for cooling to obtain the used solder.
Fifthly, placing the welding part of the aluminum alloy plate on a heating platform, placing 0.3g of solder on the welding part, keeping the gap between the welding part and the heating platform at 0.03mm, welding at 230 ℃, applying 20N pressure and ultrasonic power of 300W for 1s, and then cooling to room temperature to obtain the brazing seam joint with crystal grains oriented along the X axis of the base metal.
Example 2
Firstly, putting SnZn eutectic solder into a quartz container for melting, and then adding 1% of multilayer graphene oxide and 1% of SiC micron particles by mass ratio. The thickness of the multilayer graphene oxide is 30nm, and the size of SiC micron particles is 40 um.
And secondly, keeping the temperature at 250 ℃, uniformly stirring, and then slowly cooling the quartz container to 190 ℃ at room temperature to prepare the mixed solder.
Step three, heating the steel die to 190 ℃ while performing the step two, and casting the mixed solder in the quartz container into the steel die;
and fourthly, placing the steel mould filled with the mixed solder in a room temperature environment for cooling to obtain the used solder.
Fifthly, placing the welding part of the aluminum alloy plate on a heating platform, placing 0.4g of solder on the welding part, keeping the gap between 0.05mm, welding at 240 ℃, applying 30N pressure and 500W ultrasonic power, welding for 1s, and then cooling to room temperature to obtain the brazing seam joint with crystal grains oriented along the X axis of the base metal.
Example 3
Firstly, putting SnZn eutectic solder into a quartz container for melting, and then adding 3% of multilayer graphene oxide and 4% of SiC micron particles by mass ratio. The thickness of the multilayer graphene oxide is 50nm, and the size of SiC micron particles is 50 um.
And secondly, keeping the temperature at 300 ℃, uniformly stirring, and then slowly cooling the quartz container to 200 ℃ in a room temperature environment to prepare the mixed solder.
Step three, heating the steel die to 180 ℃ while performing the step two, and casting the mixed solder in the quartz container into the steel die;
and fourthly, placing the steel mould filled with the mixed solder in a room temperature environment for cooling to obtain the used solder.
Fifthly, placing the welding part of the aluminum alloy plate on a heating platform, placing 0.5g of solder on the welding part, keeping the gap between 0.10mm, welding at 250 ℃, applying 20N pressure and 400W ultrasonic power, welding for 2s, and then cooling to room temperature to obtain the brazing seam joint with crystal grains oriented along the X axis of the base material.

Claims (2)

1. A method for preparing a joint with directional grain brazing seams by rapid ultrasonic-assisted manufacturing is characterized by comprising the following steps of: the method comprises the following steps:
firstly, putting SnZn eutectic solder into a quartz container for melting, and then adding multilayer graphene oxide and SiC micron particles;
secondly, keeping the temperature at 230-;
thirdly, heating the steel mould to 180-200 ℃, and casting the mixed solder in the quartz container into the steel mould;
fourthly, placing the steel mould filled with the mixed solder in a room temperature environment, and cooling to obtain the solder;
fifthly, placing the welding part of the aluminum alloy plate on a heating platform, placing 0.3-0.5g of solder on the welding part, keeping the gap between 0.03-0.1mm, applying 10-30N pressure at the welding temperature of 230-250 ℃, applying ultrasonic power of 300-500W, welding for 1-3s, and cooling to room temperature to obtain the brazing seam joint with the crystal grains oriented along the X axis of the base material.
2. The method for preparing a joint with directional grain brazing seam by the aid of rapid ultrasound according to claim 1, wherein the method comprises the following steps: in the first step, the multilayer graphene oxide accounts for 1-4% of the eutectic solder by mass, the thickness of the multilayer graphene oxide is 10-50nm, the SiC micron particles account for 1-4% of the eutectic solder by mass, and the size of the SiC micron particles is 10-50 um.
CN201911256462.9A 2019-12-10 2019-12-10 Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing Active CN111014864B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911256462.9A CN111014864B (en) 2019-12-10 2019-12-10 Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911256462.9A CN111014864B (en) 2019-12-10 2019-12-10 Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing

Publications (2)

Publication Number Publication Date
CN111014864A true CN111014864A (en) 2020-04-17
CN111014864B CN111014864B (en) 2022-04-01

Family

ID=70208239

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911256462.9A Active CN111014864B (en) 2019-12-10 2019-12-10 Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing

Country Status (1)

Country Link
CN (1) CN111014864B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127969A (en) * 1990-03-22 1992-07-07 University Of Cincinnati Reinforced solder, brazing and welding compositions and methods for preparation thereof
CN1196989A (en) * 1997-04-08 1998-10-28 亚瑞亚·勃朗勃威力有限公司 Method of brazing directionally solidified or monocrystalline components
CN101323062A (en) * 2008-07-16 2008-12-17 太仓市南仓金属材料有限公司 Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof
CN101474699A (en) * 2009-01-19 2009-07-08 哈尔滨工业大学 Ultrasonic soldering method of aluminum or aluminum alloy
CN102581504A (en) * 2012-03-23 2012-07-18 天津大学 Graphene reinforced lead-free solder and preparation method thereof
CN102699562A (en) * 2012-06-11 2012-10-03 太原理工大学 Aluminum low-temperature soft solder and manufacturing method thereof
CN106271177A (en) * 2016-09-23 2017-01-04 哈尔滨工业大学深圳研究生院 A kind of interconnection solder and interconnection manufacturing process thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5127969A (en) * 1990-03-22 1992-07-07 University Of Cincinnati Reinforced solder, brazing and welding compositions and methods for preparation thereof
CN1196989A (en) * 1997-04-08 1998-10-28 亚瑞亚·勃朗勃威力有限公司 Method of brazing directionally solidified or monocrystalline components
CN101323062A (en) * 2008-07-16 2008-12-17 太仓市南仓金属材料有限公司 Silicon carbide granule enhancement type tin-silver-zinc compound solder and manufacture method thereof
CN101474699A (en) * 2009-01-19 2009-07-08 哈尔滨工业大学 Ultrasonic soldering method of aluminum or aluminum alloy
CN102581504A (en) * 2012-03-23 2012-07-18 天津大学 Graphene reinforced lead-free solder and preparation method thereof
CN102699562A (en) * 2012-06-11 2012-10-03 太原理工大学 Aluminum low-temperature soft solder and manufacturing method thereof
CN106271177A (en) * 2016-09-23 2017-01-04 哈尔滨工业大学深圳研究生院 A kind of interconnection solder and interconnection manufacturing process thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
宋仁伯: "《材料成形工艺学》", 28 February 2019, 北京:冶金工业出版社 *
张亮等: "纳米-微米颗粒增强复合钎料研究最新进展", 《中南大学学报(自然科学版)》 *

Also Published As

Publication number Publication date
CN111014864B (en) 2022-04-01

Similar Documents

Publication Publication Date Title
CN108486433B (en) Al-Mg-Sc-Zr series aluminum alloy composition for selective laser melting technology and preparation method of formed part
CN104191057B (en) A kind of preparation method of porous metal matrix bluk recombination brazing filler metal alloy soldered fitting
CN102912175B (en) Preparation method of gold-tin alloy solder foil
CN110394522B (en) Deformed nickel-based alloy and cast Ni3Brazing process of Al-based alloy
CN106077996B (en) Active heat resisting copper base solder and preparation method thereof for aluminium bronze/stainless steel soldering
Wu et al. Microstructural evolution of SiC joints soldered using Zn–Al filler metals with the assistance of ultrasound
CN113881875B (en) Three-dimensional framework structure metal reinforced aluminum matrix composite material and preparation method thereof
CN105385869A (en) Manufacturing method for high-niobium TiAl system intermetallic compound and TC4 titanium alloy composite component
JP2018111868A (en) Method for manufacturing cylindrical sputtering target
CN103231180A (en) Aluminum alloy low-temperature brazing solder and production method thereof
CN113732560B (en) Nickel-chromium-based welding wire capable of effectively controlling heat cracking, method and groove form
CN113814607B (en) Transition layer welding wire and method for preparing titanium-steel composite material through arc melting-brazing
CN109022842B (en) Method for preparing superfine structure gold-tin eutectic alloy soldering lug through one-step vacuum suction casting
CN111014864B (en) Preparation method for joint with directional grain brazing seam through rapid ultrasonic-assisted manufacturing
JP2013116473A (en) Method for manufacturing heat sink, and the heat sink
CN113857479A (en) Preparation method of titanium metal component based on powder injection molding
CN105057918A (en) Strap-shaped brazing material for rare earth iron-based permanent magnet and preparation method of strap-shaped brazing material
CN107326225A (en) Aluminium alloy and preparation method thereof, target material assembly and its manufacture method
CN101327515A (en) Method for processing thick line blank of alloy wire rod made from leadless metal spraying material
CN103817334B (en) A kind of Al-Zn composite and solid alloy preparation method thereof
CN107838513A (en) A kind of method that SiCp/Al composites soldering carries out soldering with the preparation method of soft solder and using the solder
CN109396634B (en) Magnesium alloy ultrasonic-assisted welding method with pure Pb as intermediate reaction material layer
CN106975737A (en) A kind of efficient die casting preparation method of ultra-thin Sn/Au eutectic material
JP2010247219A (en) Method of manufacturing coated composite material, and coated composite material
CN110666394A (en) Titanium-based amorphous solder with low welding temperature and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant