CN111647791A - CoNiCrCu solid solution for heterojunction interface bonding and preparation method and application thereof - Google Patents
CoNiCrCu solid solution for heterojunction interface bonding and preparation method and application thereof Download PDFInfo
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- 239000006104 solid solution Substances 0.000 title claims abstract description 94
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 72
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 36
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000010941 cobalt Substances 0.000 claims abstract description 32
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 32
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 17
- 239000010937 tungsten Substances 0.000 claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- 239000000654 additive Substances 0.000 claims abstract description 14
- 230000000996 additive effect Effects 0.000 claims abstract description 14
- 239000011651 chromium Substances 0.000 claims abstract description 14
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 14
- 230000004927 fusion Effects 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims description 75
- 239000002184 metal Substances 0.000 claims description 75
- 239000000843 powder Substances 0.000 claims description 40
- 229910045601 alloy Inorganic materials 0.000 claims description 33
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 14
- 238000007599 discharging Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 238000003723 Smelting Methods 0.000 claims description 9
- 238000012216 screening Methods 0.000 claims description 9
- 239000000243 solution Substances 0.000 claims description 8
- 229910052786 argon Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000004615 ingredient Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 238000010146 3D printing Methods 0.000 claims description 3
- 238000000889 atomisation Methods 0.000 claims description 3
- 238000009689 gas atomisation Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000001556 precipitation Methods 0.000 abstract description 3
- 229910000831 Steel Inorganic materials 0.000 description 18
- 239000010959 steel Substances 0.000 description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 14
- 238000007545 Vickers hardness test Methods 0.000 description 12
- 238000009864 tensile test Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 7
- 238000007873 sieving Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000005253 cladding Methods 0.000 description 5
- 238000001000 micrograph Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
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- 239000002131 composite material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
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- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 229910001068 laves phase Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
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- 238000001878 scanning electron micrograph Methods 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
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- B22F1/0003—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
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Abstract
The invention discloses a CoNiCrCu solid solution for heterogeneous interface combination and a preparation method and application thereof, wherein the CoNiCrCu solid solution comprises the following components in percentage by weight: 20-30% of cobalt; 17-27% of chromium; 20-30% of nickel; the balance being copper. The CoNiCrCu solid solution is used as a raw material, and a gradient material is synthesized by adopting a laser additive manufacturing or fusion welding method, so that the difference of the thermal expansion coefficient, the melting point, the elastic modulus and the like of a heterogeneous interface can be effectively alleviated, the residual stress level at the heterogeneous interface in the additive manufacturing process can be reduced, the precipitation of a hard brittle phase is avoided, the manufacturing requirement of the combination of heterogeneous parts can be met, and a high-strength combination interface is manufactured. The CoNiCrCu solid solution is used for connecting heterogeneous materials, has high connection interface strength and hardness, and can be widely applied to the combination of heterogeneous parts such as steel-aluminum, steel-tungsten or steel-copper.
Description
Technical Field
The invention relates to a CoNiCrCu solid solution for heterogeneous interface bonding, and a preparation method and application thereof.
Background
With the development of science and technology and the rapid advance of industry, the requirements of people on materials are higher and higher, the performance of a single material cannot meet the development requirements of science and technology, the composite application of multiple materials becomes the tide of the times, the composite application of heterogeneous materials can not only achieve higher performance, but also save the material cost.
However, the dissimilar materials have many problems in connection due to differences in physical properties. Taking the connection of steel-aluminum dissimilar metals as an example, the iron and aluminum are difficult to be directly connected because of the large difference of the radii of the aluminum and iron atoms, the difference of the valence and the electronegativity, and the small similarity of the crystal structures.
At present, steel/aluminum heterogeneous parts are generally prepared by methods such as mechanical connection and welding, but because Fe and Al atoms are infinitely mutually soluble in a molten state, the solubility of Fe in Al at room temperature is almost zero, and Fe and Al atoms form a brittle and hard intermetallic compound at the moment, so that the performance of a welded joint is reduced, and the strength of a steel-aluminum dissimilar metal connecting material is influenced. In the traditional process, a fusion welding process joint has the advantages of high strength, good smoothness, strong controllability of welding parameters and the like, but intermetallic compounds for reducing the strength of the joint can be generated in the welding process, and meanwhile, the requirement on the cleanliness of plates is high and welding defects exist; the mechanical connection has the advantages of simple process and guaranteed connection strength, but the air tightness of the joint cannot be guaranteed. Therefore, a new process means is urgently needed to be found to solve the defects of the traditional process.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a CoNiCrCu solid solution for heterojunction.
In order to achieve the purpose, the invention adopts the technical scheme that: a CoNiCrCu solid solution for use in heterointerface bonding, the CoNiCrCu solid solution having a composition, in weight percent, of:
preferably, the CoNiCrCu solid solution is configured by 25% of cobalt, 22% of chromium, 25% of nickel and 28% of copper in percentage by weight.
Preferably, the CoNiCrCu solid solution is in a powder shape, and the particle size of the CoNiCrCu solid solution powder is 100-350 meshes.
Preferably, the CoNiCrCu solid solution is in a bulk shape or in a thin film shape.
Further, the CoNiCrCu solid solution is obtained by 3D printing and forming.
It is a second object of the present invention to provide a method for preparing a CoNiCrCu solid solution for heterointerface bonding as described above,
in order to achieve the purpose, the invention adopts the technical scheme that: a preparation method of the CoNiCrCu solid solution for the heterointerface bonding comprises the following steps:
(1) preparing materials: preparing metal cobalt, metal chromium, metal nickel and metal copper according to target components;
(2) smelting: adding the prepared metal cobalt, metal chromium, metal nickel and metal copper into a medium-frequency induction furnace, electrifying and heating to melt the metal cobalt, metal chromium, metal nickel and metal copper, and discharging the metal cobalt, metal chromium, metal nickel and metal copper after the components in front of the furnace are adjusted to be qualified;
(3) vacuum gas atomization: atomizing the alloy solution obtained in the step (2) to obtain alloy powder, wherein an atomizing medium is argon;
(4) and (3) drying: drying the alloy powder obtained by atomization in the step (3);
(5) screening: and (5) screening the alloy powder obtained by drying in the step (4) by using a screening machine to screen out the alloy powder with the set required particle size range, namely the required powdery CoNiCrCu solid solution.
Preferably, the CoNiCrCu solid solution obtained in the step (5) is sent into a 3D printer for molding, and the CoNiCrCu solid solution in a block shape or a film shape is obtained and used as a raw material for the heterogeneous interface bonding fusion welding.
Preferably, the powdery CoNiCrCu solid solution obtained in the step (5) is used as a raw material for carrying out the heterogeneous interface bonding in the laser additive manufacturing process.
Preferably, in the smelting process in the step (2), a small amount of prepared metal cobalt, metal chromium, metal nickel and metal copper ingredients are firstly added into the medium-frequency induction furnace to be smelted, and then the rest ingredients are added into the molten alloy solution as a supplement.
The third purpose of the invention is to provide an application of the CoNiCrCu solid solution for the heterointerface bonding.
In order to achieve the purpose, the invention adopts the technical scheme that: use of a CoNiCrCu solid solution for heterointerface bonding as described above in steel-aluminum, steel-tungsten, or steel-copper dissimilar component bonding, wherein the CoNiCrCu solid solution forms a transition layer between dissimilar materials.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: the CoNiCrCu solid solution for bonding the heterogeneous interface and the preparation method and application thereof provided by the invention are characterized in that the CoNiCrCu solid solution is used as a raw material, a gradient material is synthesized by adopting a laser additive manufacturing or fusion welding method, the differences of the thermal expansion coefficient, the melting point, the elastic modulus and the like of the heterogeneous interface can be effectively alleviated, the residual stress level at the heterogeneous interface in the additive manufacturing process can be reduced, the precipitation of a hard brittle phase is avoided, the manufacturing requirement of bonding of heterogeneous parts can be met, and a high-strength bonding interface is manufactured. The CoNiCrCu solid solution is used for connecting heterogeneous materials, has high connection interface strength and hardness, and can be widely applied to the combination of heterogeneous parts such as steel-aluminum, steel-tungsten or steel-copper.
Drawings
FIG. 1 is a scanning electron microscope photograph of the steel and CoNiCrCu solid solution heterogeneous interface at the steel-aluminum heterojunction of example 1;
FIG. 2 is a scanning electron microscope photograph of the steel and CoNiCrCu solid solution heterogeneous interface at the steel-tungsten heterogeneous connection of example 1;
FIG. 3 is a scanning electron microscope photograph of the steel and CoNiCrCu solid solution heterogeneous interface at the steel-copper heterogeneous connection of example 1;
FIG. 4 is a scanning electron microscope image of the heterogeneous interface in the case of steel-tungsten heterojunction at a laser power of 800W in example 2;
FIG. 5 is a scanning electron microscope image of the hetero-interface in the case of steel-tungsten hetero-junction in the case of laser power of 1000W in example 2;
FIG. 6 is a scanning electron microscope image of the hetero-interface in the case of steel-tungsten hetero-junction in the case of the laser power of 1200W in example 2;
FIG. 7 is a scanning electron microscope image of the heterogeneous interface in the case of steel-tungsten heterogeneous connection at a laser power of 1400W in example 2;
FIG. 8 is a scanning electron microscope image of the heterogeneous interface in the case of steel-tungsten heterogeneous connection at a laser power of 1600W in example 2;
FIG. 9 is a scanning electron micrograph of a CoNiCrCu solid solution obtained in example 3, wherein the depth of the molten pool is 0.2 mm.
Detailed Description
The technical solution of the present invention is further explained below.
The invention provides a CoNiCrCu solid solution for heterojunction interface bonding, which comprises the following components in percentage by weight: 20-30% of cobalt; 17-27% of chromium; 20-30% of nickel; the balance of copper, which accounts for 13-43%.
The CoNiCrCu solid solution is a disordered and disordered solid solution, has a higher entropy value, and can reduce the energy of a system and improve the stability of the system due to high disorder degree. The CoNiCrCu solid solution can be used as a transition layer for connecting dissimilar materials, so that residual stress caused by huge physical property difference of a dissimilar material interface can be effectively buffered, the dissimilar materials are prevented from being directly contacted to form a brittle Laves phase, and the processing performance of the materials is reduced.
The effect of each element in the CoNiCrCu solid solution is as follows:
cobalt element: the adhesive can ensure that the material has certain toughness;
nickel element: the melting point of the solid solution is reduced, and the laser energy is reduced, so that the heat affected zone can be effectively reduced;
chromium element: the ductility and the hardness of the material are improved;
copper element: copper belongs to a cheaper alloy element, and the cost can be reduced on the basis of achieving the material performance.
The CoNiCrCu solid solution can be powder, can be used as a material for carrying out heterojunction bonding in laser additive manufacturing, and can form a gradient material in the additive manufacturing process, so that the difference of the thermal expansion coefficient, the melting point, the elastic modulus and the like of a heterojunction can be effectively alleviated, the residual stress level at the position of the heterojunction in the additive manufacturing process can be reduced, the precipitation of a hard brittle phase is avoided, and the manufacturing requirement of a heterogeneous part is met.
The CoNiCrCu solid solution can also be formed into a block shape or a film shape by 3D printing, and the CoNiCrCu solid solution in the block shape or the film shape is used as a material for heterogeneous interface bonding welding.
The invention also provides a preparation method of the CoNiCrCu solid solution for the heterojunction interface junction, which specifically comprises the following process steps:
(1) preparing materials:
adopting metal cobalt, metal chromium, metal nickel and metal copper as raw materials, and preparing according to target components;
(2) smelting:
adding the prepared metal cobalt, metal chromium, metal nickel and metal copper into a medium-frequency induction furnace, and electrifying and heating to melt the metal cobalt, the metal chromium, the metal nickel and the metal copper. In the smelting step, a small amount of prepared metal cobalt, metal chromium, metal nickel and metal copper ingredients are added into a medium-frequency induction furnace, smelting is carried out firstly, and then the rest ingredients are added into a molten alloy solution as a supplementary material. When the supplementary material is added, the temperature in the medium frequency induction furnace is controlled at 1500-1550 ℃;
after the smelting is finished, discharging the molten steel after the components in front of the furnace are qualified, and controlling the discharging temperature to be 1450-1500 ℃;
(3) vacuum gas atomization:
atomizing the alloy solution obtained in the step (2) to obtain alloy powder, wherein the atomizing medium is argon, and the atomizing pressure is 2-10 MPa;
(4) and (3) drying:
drying the alloy powder obtained by atomization in the step (3), wherein a far infrared dryer is adopted in the step, and the drying temperature is 200-250 ℃;
(5) screening:
and (5) screening the alloy powder obtained by drying in the step (4) by using a screening machine to screen out the alloy powder with the set required particle size range, namely the required powdery CoNiCrCu solid solution. Preferably, the particle size of the CoNiCrCu solid solution powder is 100-350 meshes, and the solid solution powder in the particle size range is screened out to be used as finished powder for later use.
The sources of the raw materials used in the present invention are not limited, and all of them are commercially available.
The powdery CoNiCrCu solid solution can be directly used as a material for laser additive manufacturing and processing for heterogeneous interface bonding; if a fusion welding process is adopted to connect heterogeneous materials, the powdery CoNiCrCu solid solution is printed and formed in a block shape or a film shape through 3D, and then the solid solution is used as a heterogeneous interface bonding fusion welding material.
The technical solution of the present invention is further described with reference to the following specific examples:
example 1
The formula comprises the following components in percentage by weight: 25% of cobalt, 22% of chromium, 25% of nickel and 28% of copper. Adding the prepared metal cobalt, metal chromium, metal nickel and metal copper into a medium-frequency induction furnace, electrifying and heating to melt the metal cobalt, the metal chromium, the metal nickel and the metal copper, and controlling the temperature in the medium-frequency induction furnace to be about 1520 ℃. And discharging after the components are adjusted to be qualified in front of the furnace, wherein the discharging temperature is 1460 ℃.
And atomizing the alloy melt to prepare alloy powder, wherein the atomizing medium is argon, and the atomizing pressure is 4 MPa. And drying the atomized alloy powder by using a far infrared dryer at the drying temperature of 210 ℃. Then sieving with a sieving machine to obtain a particle size of 100～350 mesh powder is used as finished powder. The finished powder is directly used as a powdery CoNiCrCu solid solution and is used as a material for carrying out heterojunction bonding in laser additive manufacturing and processing.
(1) For steel-aluminium bonding
Using steel as a substrate, cladding CoNiCrCu solid solution and metallic aluminum on the steel plate with the power of 1200w, and obtaining the material by adopting laser additive manufacturingThe solid solution obtained by the manufacturing method is the steel-aluminum dissimilar connecting material of the transition layer. Using CoNiCrCu solid solution as a transition layer to obtain a gradient material FexCoNiCrCuAl1-x。
(2) For steel-tungsten bonding
The method comprises the steps of cladding CoNiCrCu solid solution and metal steel on a steel plate by taking tungsten as a substrate, and obtaining the steel-tungsten dissimilar connection material taking the solid solution obtained by a laser material increase manufacturing method as a transition layer, wherein the power of the steel plate is 1200w. Using CoNiCrCu solid solution as a transition layer to obtain a gradient material FexCoNiCrCuW1-x。
(3) For steel-copper bonding
The steel is used as a substrate, CoNiCrCu solid solution and metallic copper are clad on a steel plate, and the power is 1200w. Using CoNiCrCu solid solution as a transition layer to obtain a gradient material FexCoNiCrCuCu1-x。
The scanning electron microscope pictures of the heterogeneous interfaces of the CoNiCrCu solid solution for steel-aluminum bonding, steel-tungsten bonding and steel-copper bonding are respectively shown in fig. 1, fig. 2 and fig. 3, and in the pictures, we can see that no Laves phase is precipitated at the connecting interface of the steel and the CoNiCrCu solid solution, which shows that the steel and the CoNiCrCu solid solution realize good solid solution, a good transition material is formed, and the difference of physical properties of the heterogeneous materials is effectively buffered.
The gradient material obtained under different use conditions is subjected to a Vickers hardness test, the bottom-retaining time of the Vickers hardness test is 10s, the testing force is 200g, and the testing results are as follows:
results of Vickers hardness test
The vickers hardness test results show that: the hardness of the gradient material obtained under different use conditions is higher, which shows that the gradient material obtained by taking the CoNiCrCu solid solution as the transition layer can obtain higher hardness, so that the application of the combined heterogeneous material is wider.
The tensile test is carried out on the gradient material obtained under different use conditions, and the test results are as follows:
tensile test results
The tensile test results show that the tensile strength and the elongation percentage after fracture of the gradient material obtained under different use conditions are high, and the gradient material obtained by taking the CoNiCrCu solid solution as the transition layer can obtain high tensile strength and elongation percentage after fracture, and has good bonding strength between heterogeneous materials such as steel-aluminum, steel-tungsten, steel-copper and the like.
Example 2
The formula comprises the following components in percentage by weight: 30% of cobalt, 27% of chromium, 30% of nickel and 13% of copper. Adding the prepared metal cobalt, metal chromium, metal nickel and metal copper into a medium-frequency induction furnace, electrifying and heating to melt the metal cobalt, the metal chromium, the metal nickel and the metal copper, and controlling the temperature in the medium-frequency induction furnace to be about 1520 ℃. And discharging after the components are adjusted to be qualified in front of the furnace, wherein the discharging temperature is 1460 ℃.
And atomizing the alloy melt to prepare alloy powder, wherein the atomizing medium is argon, and the atomizing pressure is 4 MPa. And drying the atomized alloy powder by using a far infrared dryer at the drying temperature of 210 ℃. Then sieving with a sieving machine to obtain a particle size of 100～350 mesh powder is used as finished powder. The finished powder is directly used as a powdery CoNiCrCu solid solution and is used as a material for carrying out heterojunction bonding in laser additive manufacturing and processing.
In this embodiment, tungsten is used as a substrate, a CoNiCrCu solid solution and a metal steel are clad on a steel plate, and a cladding experiment is performed with powers of 800w,1000w,1200w and 1400,1600w, respectively, to obtain 5 groups of gradient materials Fe with a CoNiCrCu solid solution as a transition layerxCoNiCrCuW1-x
The scanning electron microscope pictures of the heterogeneous interfaces of the steel-tungsten heterogeneous connection after cladding processing under the 5 laser powers are respectively shown in fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8, and it can be seen from the pictures that no obvious crack appears at the joint interface when the laser power of fig. 6 is 1200W, which indicates that the mismatch of the thermal expansion coefficient is effectively relieved by the transition layer.
The gradient materials obtained under different powers are subjected to a Vickers hardness test, the bottom-retaining time of the Vickers hardness test is 10s, the testing force is 200g, and the testing results are as follows
Results of Vickers hardness test
The vickers hardness test results show that: the hardness of the gradient material obtained under different powers is in a larger value, which indicates that the gradient material obtained by using a CoNiCrCu solid solution as a transition layer can obtain a very high hardness, but we can see that when the laser power is 1200w, the hardness of the obtained material is more increased, which indicates that the laser power of 1200w is an optimal parameter for experiments.
The tensile test was performed on the gradient material obtained at different powers, with the following test results:
tensile test results
The tensile test results show that the tensile strength and the elongation after fracture of the gradient material obtained under different powers are both in a large value, which indicates that the gradient material obtained by using the CoNiCrCu solid solution as the transition layer in the embodiment can obtain very high tensile strength and elongation after fracture, but we can see that the tensile strength and the elongation after fracture of the obtained material are particularly prominent when the laser power is 1200w, so that the laser power of 1200w is adopted as the optimal parameter of the experiment.
Example 3
The formula comprises the following components in percentage by weight: 25% of cobalt, 22% of chromium, 25% of nickel and 28% of copper. Adding the prepared metal cobalt, metal chromium, metal nickel and metal copper into a medium-frequency induction furnace, electrifying and heating to melt the metal cobalt, the metal chromium, the metal nickel and the metal copper, and controlling the temperature in the medium-frequency induction furnace to be about 1520 ℃. And discharging after the components are adjusted to be qualified in front of the furnace, wherein the discharging temperature is 1460 ℃.
And atomizing the alloy melt to prepare alloy powder, wherein the atomizing medium is argon, and the atomizing pressure is 4 MPa. And drying the atomized alloy powder by using a far infrared dryer at the drying temperature of 210 ℃. Then, powder with the granularity range of 100-350 meshes is sieved out by a powder sieving machine to be used as finished powder. The finished powder is directly used as a powdery CoNiCrCu solid solution and is used as a material for carrying out heterojunction bonding in laser additive manufacturing and processing.
Using steel as a substrate, cladding CoNiCrCu solid solution and metallic copper on the steel plate with the power of 1200w, and performing laser cladding experiments respectively with the depth of a molten pool of 0.2mm, 0.4 mm, 0.6mm and 0.8 mm to obtain 4 groups of gradient materials Fe with the CoNiCrCu solid solution as a transition layerxCoNiCrCuCu1-x。
FIG. 9 is a scanning electron microscope picture of CoNiCrCu solid solution at a bath depth of 0.2mm, from which we can observe that the picture is a continuous solid solution and no precipitated phase appears, which shows that the gradient material can effectively form a transition layer with a dissimilar material and alleviate the difference of physical properties. Meanwhile, we can see from the figure that the gradient material phase distribution is not particularly uniform, which indicates that the depth of the molten pool is 0.2mm, which is not the optimal parameter for the experiment.
Performing Vickers hardness test on the gradient material obtained under different molten pool depths, wherein the bottom-keeping time of the Vickers hardness test is 10s, the testing force is 200g, and the testing results are as follows
Results of Vickers hardness test
The vickers hardness test results show that: the hardness of the gradient material obtained by different molten pool depths is in a larger value, which shows that the gradient material obtained by taking CoNiCrCu solid solution as a transition layer can obtain very high hardness, but we can see that when the molten pool depth is 0.6mm, the hardness of the obtained material is more increased, and fully shows that the molten pool depth is 0.6mm as the optimal parameter of the experiment.
The tensile test is carried out on the gradient material obtained under different molten pool depths, and the test results are as follows:
tensile test results
The tensile test result shows that the tensile strength and the elongation after fracture of the gradient material obtained by different molten pool depths are both in a larger value, which indicates that the gradient material obtained by taking CoNiCrCu solid solution as the transition layer can obtain very high tensile strength and elongation after fracture, but we can see that when the molten pool depth is 0.6mm, the obtained tensile strength and elongation after fracture of the material are more increased, and that the molten pool depth is 0.6mm is the optimal parameter of the experiment.
Example 4
The formula comprises the following components in percentage by weight: 20% of cobalt, 17% of chromium, 20% of nickel and 43% of copper. Adding the prepared metal cobalt, metal chromium, metal nickel and metal copper into a medium-frequency induction furnace, electrifying and heating to melt the metal cobalt, the metal chromium, the metal nickel and the metal copper, and controlling the temperature in the medium-frequency induction furnace to be about 1520 ℃. And discharging after the components are adjusted to be qualified in front of the furnace, wherein the discharging temperature is 1460 ℃.
And atomizing the alloy melt to prepare alloy powder, wherein the atomizing medium is argon, and the atomizing pressure is 4 MPa. And drying the atomized alloy powder by using a far infrared dryer at the drying temperature of 210 ℃. Then sieving with a sieving machine to obtain a particle size of 100～350 mesh powder is used as finished powder.
And (3) feeding the finished product powder into a 3D printer for molding, and molding to obtain the high-entropy alloy block. The high-entropy alloy block is placed between iron and copper by adopting a splicing welding method, and the joint is melted by adopting laser to obtain the steel-copper dissimilar connection material taking CoNiCrCu solid solution obtained by adopting a fusion welding method as a transition layer, namely the gradient material Fe taking the CoNiCrCu solid solution as the transition layerxCoNiCrCuCu1-x。
The above-mentioned embodiments are merely illustrative of the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.
Claims (10)
1. A CoNiCrCu solid solution for heterojunction, characterized in that: the CoNiCrCu solid solution comprises the following components in percentage by weight:
20-30% of cobalt;
17-27% of chromium;
20-30% of nickel;
the balance of copper.
2. A CoNiCrCu solid solution for use in heterointerface bonding according to claim 1, wherein: the CoNiCrCu solid solution is prepared from 25% of cobalt, 22% of chromium, 25% of nickel and 28% of copper in percentage by weight.
3. A CoNiCrCu solid solution for use in heterointerface bonding according to claim 1, wherein: the CoNiCrCu solid solution is powdery, and the particle size of the CoNiCrCu solid solution powder is 100-350 meshes.
4. A CoNiCrCu solid solution for use in heterointerface bonding according to claim 1, wherein: the CoNiCrCu solid solution is in a block shape or a film shape.
5. A CoNiCrCu solid solution for use in heterointerface bonding according to claim 4, wherein: the CoNiCrCu solid solution is obtained by 3D printing and forming.
6. A method of preparing a CoNiCrCu solid solution for use in the heterointerface bonding of claim 1, comprising the steps of:
(1) preparing materials: preparing metal cobalt, metal chromium, metal nickel and metal copper according to target components;
(2) smelting: adding the prepared metal cobalt, metal chromium, metal nickel and metal copper into a medium-frequency induction furnace, electrifying and heating to melt the metal cobalt, metal chromium, metal nickel and metal copper, and discharging the metal cobalt, metal chromium, metal nickel and metal copper after the components in front of the furnace are adjusted to be qualified;
(3) vacuum gas atomization: atomizing the alloy solution obtained in the step (2) to obtain alloy powder, wherein an atomizing medium is argon;
(4) and (3) drying: drying the alloy powder obtained by atomization in the step (3);
(5) screening: and (5) screening the alloy powder obtained by drying in the step (4) by using a screening machine to screen out the alloy powder with the set required particle size range, namely the required powdery CoNiCrCu solid solution.
7. The method of claim 6, wherein: and (4) feeding the CoNiCrCu solid solution obtained in the step (5) into a 3D printer for molding to obtain a bulk or film CoNiCrCu solid solution serving as a raw material for heterogeneous interface bonding fusion welding.
8. The method of claim 6, wherein: and (4) taking the powdery CoNiCrCu solid solution obtained in the step (5) as a raw material for carrying out the heterogeneous interface bonding in the laser additive manufacturing process.
9. The method of claim 6, wherein: in the smelting process of the step (2), a small amount of prepared metal cobalt, metal chromium, metal nickel and metal copper ingredients are firstly added into the medium-frequency induction furnace, smelting is carried out, and then the rest ingredients are added into the molten alloy solution as a supplementary material.
10. Use of a CoNiCrCu solid solution for heterointerface bonding according to any of claims 1 to 5 in steel-aluminum, steel-tungsten, or steel-copper dissimilar component bonding, wherein the CoNiCrCu solid solution forms a transition layer between dissimilar materials.
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