CN111010809A

CN111010809A - Three-layer flexible copper-clad plate hot baking tray

Info

Publication number: CN111010809A
Application number: CN201910952613.8A
Authority: CN
Inventors: 李继川
Original assignee: Shandong Jinding Electronic Materials Co ltd
Current assignee: Shandong Jinding Electronic Materials Co ltd
Priority date: 2019-10-09
Filing date: 2019-10-09
Publication date: 2020-04-14

Abstract

The invention provides a three-layer flexible copper-clad plate hot baking tray, and mainly relates to the field of copper-clad plate preparation. The utility model provides a tray is baked to three-layer flexible copper-clad plate heat, includes the base plate, the base plate is the circular slab, the base plate center sets up the main cut, the base plate surface sets up a plurality of rows of auxiliary opening, and multiseriate the auxiliary opening is circumference evenly distributed around the base plate centre of a circle, and every adjacent two sets set up a set of a plurality of and press from both sides the hole between the auxiliary opening. The invention has the beneficial effects that: according to the invention, a certain number of air holes are formed in the product tray, so that high-temperature gas flow is increased, the heat utilization efficiency of the product is improved, and the peeling strength of the product is improved.

Description

Three-layer flexible copper-clad plate hot baking tray

Technical Field

The invention mainly relates to the field of copper-clad plate preparation, in particular to a three-layer flexible copper-clad plate hot baking tray.

Background

The three-layer flexible copper clad laminate has the characteristics of low cost, light weight, thinness and flexibility, and is widely applied to electronic products such as smart phones, tablet computers, automotive electronics, digital cameras and the like. In the preparation process of the three-layer flexible copper clad laminate, a thermal baking device is needed to cure and mold the adhesive. The existing baking equipment and process have the defects that the heating degrees of different positions of a product are greatly different, the peel strength of the product at partial positions is low, and the downstream FPC is not used in production.

Disclosure of Invention

In order to solve the defects of the prior art, the invention provides the three-layer flexible copper-clad plate hot baking tray, which increases the flow of high-temperature gas by adding a certain number of air holes on the product tray, improves the heat utilization efficiency of the product and improves the peeling strength of the product.

In order to achieve the purpose, the invention is realized by the following technical scheme:

the utility model provides a tray is baked to three-layer flexible copper-clad plate heat, includes the base plate, the base plate is the circular slab, the base plate center sets up the main cut, the base plate surface sets up a plurality of rows of auxiliary opening, and multiseriate the auxiliary opening is circumference evenly distributed around the base plate centre of a circle, and every adjacent two sets set up a set of a plurality of and press from both sides the hole between the auxiliary opening.

The clamping holes are three, the clamping holes are distributed in an isosceles triangle shape between two rows of auxiliary holes, the vertex clamping holes of the isosceles triangle are located close to one side of the circle center of the substrate, and the bottom perpendicular line of the isosceles triangle coincides with the diameter of the substrate.

A plurality of bulges are uniformly arranged on the top surface of the substrate.

And flanges are punched at the edges of the main hole, the auxiliary hole and the clamping hole towards the bottom surface of the substrate, and the flange protruding heights of the holes are consistent.

Each row of the auxiliary holes are communicated, and each group of the clamping holes are communicated.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the tray for baking the copper-clad plate is provided with the main hole as the main flowing hole of the hot air flow, the auxiliary holes are arranged in a plurality of rows and matched with the main control, the hot air flow of the main hole is circulated, and the gap of the heat flow between the auxiliary holes is filled by arranging the clamping holes, so that the heat flow can uniformly flow between the substrate and the tray, the substrate is heated more uniformly, the integral peeling strength of the substrate is ensured, the product quality is improved, and the requirements of downstream customers are met.

Drawings

FIG. 1 is a schematic structural diagram of embodiment 1 of the present invention;

FIG. 2 is a schematic structural diagram of embodiment 2 of the present invention;

FIG. 3 is a schematic structural diagram of embodiment 3 of the present invention;

FIG. 4 is a schematic structural diagram of embodiment 4 of the present invention;

fig. 5 is a schematic view of a conventional tray structure.

Reference numerals shown in the drawings: 1. a substrate; 2. a main hole; 3. a secondary hole; 4. a clamping hole; 5. a protrusion; 6. and (5) flanging.

Detailed Description

The invention is further described with reference to the accompanying drawings and specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and these equivalents also fall within the scope of the present application.

As shown in fig. 1-4, the tray for baking the three-layer flexible copper-clad plate comprises a substrate 1, wherein the substrate 1 is a circular plate, and the substrate is used as a tray for supporting the copper-clad plate so as to bake the copper-clad plate in an oven. The center of the base plate 1 is provided with a main hole 2 which is used as a main hot air flow hole. The surface of the base plate 1 is provided with a plurality of rows of auxiliary holes 3, the auxiliary holes 3 are circumferentially and uniformly distributed around the circle center of the base plate 1, and the arrangement mode that the auxiliary holes surround the main hole enables hot air flow passing through the auxiliary holes to form a hooking effect with the hot air flow of the main hole, so that circulation of the hot air flow is realized, and the baking uniformity of the bottom surface of the copper-clad plate is improved. A group of a plurality of clamping holes 4 are arranged between every two adjacent rows of the auxiliary holes 3, the clamping holes fill the blank zone between the auxiliary holes far away from one end of the main hole, and hot air flow in the zone is guaranteed, so that the uniformity of heating of the copper-clad plate is further guaranteed, the integral peeling strength of the base plate is guaranteed, the product quality is improved, and the requirements of downstream customers are met.

Specifically, it is three to press from both sides hole 4, and is three press from both sides hole 4 and be the isosceles triangle distribution between two vice holes 3, isosceles triangle's summit presss from both sides hole 4 and is located and is close to 1 centre of a circle one side of base plate, isosceles triangle base perpendicular with 1 diameter coincidence of base plate. Through the even setting of double-layered hole between two vice holes, can provide more even hot gas flow for the toasting of base plate to the homogeneity that the guarantee base plate wholly toasted.

Specifically, a plurality of protrusions 5 are uniformly arranged on the top surface of the substrate 1. The copper-clad plate placed on the substrate is supported by the protrusions, so that a certain space is reserved between the copper-clad plate and the substrate, a foundation is provided for circulation of hot air flow, and the heat baking uniformity of the copper-clad plate is guaranteed.

Specifically, flanges 6 are punched at the edges of the main hole 2, the auxiliary hole 3 and the clamping hole 4 towards the bottom surface of the base plate 1, and the protruding heights of the flanges 6 of the holes are consistent. The flanging stamping provides a transition area for the hole on the front surface of the substrate, so that the edge position of the hole gradually drops, a space which is fully contacted with hot air flow is provided for the copper-clad plate placed on the hole, the heated uniformity of the copper-clad plate is guaranteed, the baking effect of the copper-clad plate is improved, and the peeling strength of the copper-clad plate is enhanced.

Specifically, the auxiliary holes 3 in each row are communicated, and the clamping holes 4 in each group are communicated. Through the communication between the auxiliary holes and the communication between the clamping holes, the circulation effect of hot air flow in the auxiliary holes and the clamping holes is better, and through the structure of the enlarged through hole, the copper-clad plate is heated more uniformly in the area.

Example 1:

the three-layer flexible copper clad laminate hot baking tray comprises a substrate 1, wherein the substrate 1 is a circular plate, a main hole 2 is formed in the center of the substrate 1, the diameter of the main hole is 1/4-1/3 of the diameter of the substrate, a plurality of rows of auxiliary holes 3 are formed in the surface of the substrate 1, each row of auxiliary holes are provided with 3-6 holes, the auxiliary holes 3 are uniformly distributed around the circle center of the substrate 1 in a circumferential mode, and the positions between the auxiliary holes in each row are 45 degrees. A group of a plurality of clamping holes 4 are arranged between every two adjacent rows of the auxiliary holes 3. In this embodiment, the number of the clamping holes 4 is three, the three clamping holes 4 are distributed in an isosceles triangle between two rows of the auxiliary holes 3, the vertex clamping holes 4 of the isosceles triangle are located at one side close to the center of the circle of the substrate 1, and the perpendicular line of the bottom side of the isosceles triangle coincides with the diameter of the substrate 1. In this embodiment the diameter of the clamping hole is the same as the diameter of the secondary hole.

The tray of the embodiment 1 is adopted to carry the copper-clad plate for heat drying, and the peel strength of five groups of the obtained copper-clad plates is detected to be 1.53N/mm on average.

Example 2:

based on embodiment 1, a plurality of protrusions 5 are uniformly disposed on the top surface of the substrate 1 in this embodiment. The bulges are metal particles or bulges punched by a spot welding or spot punching head.

The tray of the embodiment 1 is adopted to carry the copper-clad plate for heat drying, and the peel strength of five groups of the obtained copper-clad plates is detected to be 1.62N/mm on average.

Example 3:

for embodiment 1 or embodiment 2, in this embodiment, the flanges 6 are punched towards the bottom surface of the base plate 1 at the edges of the main hole 2, the auxiliary hole 3 and the clamping hole 4, and the flanges 6 of each hole protrude to the same height. The edge turning edge enables the edge position of the front surface hole of the substrate to be gradually sunken.

The tray of the embodiment 1 is adopted to carry the copper-clad plate for heat drying, and the peel strength of five groups of the obtained copper-clad plates is detected to be 1.57N/mm on average.

Example 4:

in any of embodiments 1-3, the secondary holes 3 in each row are communicated, and the clamping holes 4 in each group are communicated. One row of the auxiliary holes can be directly communicated into long holes, and one group of the clamping holes can be directly connected to the triangular through holes.

The tray of the embodiment 1 is adopted to carry the copper-clad plate for heat drying, and the peel strength of five groups of the obtained copper-clad plates is detected to be 1.55N/mm on average.

The peel strength of the copper clad laminate obtained by carrying out heat drying on a common tray under the same condition is 1.12N/mm. Therefore, compared with the existing copper-clad plate heat drying tray, the copper-clad plate can be heated more uniformly, so that the peel strength of the copper-clad plate is enhanced.

Claims

1. The utility model provides a three-layer flexible copper-clad plate heat toasts tray, includes base plate (1), its characterized in that: the base plate (1) is a circular plate, the center of the base plate (1) is provided with a main hole (2), the surface of the base plate (1) is provided with a plurality of rows of auxiliary holes (3), the auxiliary holes (3) are uniformly distributed in a circumferential manner around the circle center of the base plate (1), and every two adjacent rows of auxiliary holes are provided with a plurality of clamping holes (4) between the auxiliary holes (3).

2. The thermal baking tray for the three-layer flexible copper-clad plate according to claim 1, characterized in that: press from both sides hole (4) and have threely, it is three press from both sides hole (4) and be isosceles triangle distribution between two vice holes (3), isosceles triangle's summit presss from both sides hole (4) and is located and is close to base plate (1) centre of a circle one side, isosceles triangle base perpendicular with base plate (1) diameter coincidence.

3. The thermal baking tray for the three-layer flexible copper-clad plate according to claim 1, characterized in that: a plurality of bulges (5) are uniformly arranged on the top surface of the base plate (1).

4. The tray for baking the three-layer flexible copper clad laminate according to any one of claims 1 to 3, wherein: the main hole (2), the auxiliary hole (3) and the clamping hole (4) are punched with flanges (6) towards the bottom surface of the base plate (1), and the flanges (6) of each hole are consistent in protruding height.

5. The tray for baking the three-layer flexible copper clad laminate according to any one of claims 1 to 3, wherein: each row of the auxiliary holes (3) are communicated, and each group of the clamping holes (4) are communicated.