CN111009474B - Design method for solving production deviation of QFN (quad Flat No lead) packaged parts - Google Patents
Design method for solving production deviation of QFN (quad Flat No lead) packaged parts Download PDFInfo
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- CN111009474B CN111009474B CN201911110914.2A CN201911110914A CN111009474B CN 111009474 B CN111009474 B CN 111009474B CN 201911110914 A CN201911110914 A CN 201911110914A CN 111009474 B CN111009474 B CN 111009474B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 abstract description 16
- 230000005484 gravity Effects 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 230000009194 climbing Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
A design method for solving the deviation of the production of QFN packaged parts relates to the field of servers and comprises the following steps: the pins on the bottom surface of the packaging part extend to two sides to form an epitaxial horizontal pin and a vertical pin is arranged in the vertical direction; a large-area hollow part is arranged inside the extension horizontal pin. And a gap notch is formed in the middle of the vertical pin. A plurality of horizontal notches extending leftwards and rightwards are arranged on two sides of the gap notch. The invention can solve the problem of deviation in the production of QFN packaged parts: for example, the gravity center is easy to be unstable, after welding is completed, the deviation problem occurs, so that the part can not well contact the PCB, after improvement, the part can not deviate during production, meanwhile, the welding area can be increased, the welding quality is improved, the welding reliability is ensured, and the stability and the safety of the product are ensured.
Description
Technical Field
The invention relates to the field of servers, in particular to a design method for solving the problem of production deviation of QFN (quad Flat No lead) packaged parts.
Background
With the increase of the variety of personal electronic consumer products and the development of various data clouds, the application range of servers and personal electronic consumer products is wider and wider. The application quantity of electronic parts in the electronic industry is increased, the frequency of signals is increased, QFN type packaging is adopted more and more, the area of the parts can be reduced if the packaging with the external leakage pins is adopted due to the fact that pins of part of the parts are very many, and the area of the bottom surface pins can be enlarged compared with that of common packaging materials by adopting a bottom surface pin mode, so that the electronic parts have excellent electrical performance.
And some parts, such as crystal oscillators, the whole area of the parts is very small, and the height of the parts cannot be very low, so that the situation of unstable gravity center is easy to occur when the crystal oscillator adopting the packaging is in practical production, and after welding is finished, the problem of deviation occurs, so that the crystal oscillator cannot well contact the PCB.
Disclosure of Invention
Aiming at the problem that the welding of the packaged parts is easy to deviate, the invention provides a design method for solving the production deviation of the parts of the QFN type package, and the problem can be avoided.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a design method for solving the deviation of the production of QFN packaged parts comprises the following steps: the pins on the bottom surface of the packaging part extend to two sides to form an epitaxial horizontal pin and a vertical pin is arranged in the vertical direction; a large-area hollow part is arranged inside the extension horizontal pin.
Furthermore, the extension horizontal pin is of a comb-shaped sawtooth structure.
Furthermore, a gap notch is formed in the middle of the vertical pin.
Furthermore, a plurality of horizontal notches extending leftwards and rightwards are arranged on two sides of the gap notch.
Furthermore, a plurality of oblique notches which are obliquely upwards are arranged on two sides of the gap notch.
Further, the horizontal notches are linearly arranged on the vertical pins.
The invention has the beneficial effects that:
the invention can solve the problem of deviation in the production of QFN packaged parts: for example, the gravity center is easy to be unstable, after welding is completed, the deviation problem occurs, so that the part can not well contact the PCB, after improvement, the part can not deviate during production, meanwhile, the welding area can be increased, the welding quality is improved, the welding reliability is ensured, and the stability and the safety of the product are ensured.
Drawings
FIG. 1 is a schematic structural diagram of a first embodiment;
FIG. 2 is a schematic structural diagram of a second embodiment;
fig. 3 is a schematic diagram of a three-dimensional structure when the epitaxial horizontal pins are connected with the vertical pins.
In the figure: 1 crystal oscillator, 2 epitaxial horizontal pins and 3 vertical pins.
Detailed Description
As shown in fig. 1 to 3, a design method for solving the offset of the part production of QFN package includes the following steps:
1) the pins on the bottom surface of the packaging part extend towards two sides to form an epitaxial horizontal pin and a vertical pin is arranged in the vertical direction. Referring to fig. 1, in the present embodiment, the package component is a crystal oscillator 1, a bottom pin of the crystal oscillator extends to an outer side of the bottom surface of the crystal oscillator to form an epitaxial horizontal pin 2, and a vertical pin 3 is disposed on the epitaxial horizontal pin. Because the extension horizontal pins are added, the whole area of the bottom surface pins of the crystal oscillator is increased, so that the whole crystal oscillator is more stable when being placed on a PCB (printed circuit board), and is not easy to deviate during welding; due to the design of the vertical pins, the side face also has a welding part, so that the welding area of the whole part can be increased.
2) The inside large tracts of land fretwork that is equipped with of extension horizontal pin, in this case embodiment, extension horizontal pin is comb shape sawtooth structure, and is a lot bigger than before because increased extension horizontal pin and leads to the whole pin area of crystal oscillator, if on the pin direct welding of grow PCB board, because fine flow occasionally of tin cream welding adopts big piece integral type pin, can lead to the part to suspend, and the skew very easy has improved this region for solving this problem, adopts comb shape sawtooth structure.
The comb-shaped sawtooth structure is adopted, the reason that large-area hollowing is convenient to weld is not considered, the pin part needs a stable structure, and therefore the comb-shaped structure is adopted, and the structural stability of the pin is kept.
3) The middle part of the vertical pin is provided with a gap, the tin paste tin climbing difficulty needs to be considered because the vertical pin is vertical, and the tin climbing difficulty is reduced due to the design of the gap.
4) Gap breach both sides are equipped with a plurality of breachs that extend to controlling, when guaranteeing the solder paste welding, the solder paste also can extend in the horizontal direction, increases the tin height of climbing of solder paste.
In addition to the technical features described in the specification, the technology is known to those skilled in the art.
Claims (3)
1. A design method for solving the deviation of the production of parts packaged by QFN (quad Flat No lead) packages is characterized by comprising the following steps: the pins on the bottom surface of the packaging part extend to two sides to form an epitaxial horizontal pin and a vertical pin is arranged in the vertical direction; a large-area hollow part is arranged inside the epitaxial horizontal pin; the extension horizontal pin is of a comb-shaped sawtooth structure; a gap notch is formed in the middle of the vertical pin; the vertical pin is welded with the side face of the packaging part;
a plurality of horizontal notches extending leftwards and rightwards are arranged on two sides of the gap notch.
2. The method as claimed in claim 1, wherein a plurality of oblique notches are formed on both sides of the gap notch.
3. The design method for solving the part production deviation of the QFN type package as claimed in claim 1, wherein the horizontal notches are linearly arranged on the vertical pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911110914.2A CN111009474B (en) | 2019-11-15 | 2019-11-15 | Design method for solving production deviation of QFN (quad Flat No lead) packaged parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911110914.2A CN111009474B (en) | 2019-11-15 | 2019-11-15 | Design method for solving production deviation of QFN (quad Flat No lead) packaged parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111009474A CN111009474A (en) | 2020-04-14 |
| CN111009474B true CN111009474B (en) | 2022-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911110914.2A Active CN111009474B (en) | 2019-11-15 | 2019-11-15 | Design method for solving production deviation of QFN (quad Flat No lead) packaged parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111009474B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5270492A (en) * | 1991-08-26 | 1993-12-14 | Rohm Co., Ltd. | Structure of lead terminal of electronic device |
| US20090091007A1 (en) * | 2007-10-05 | 2009-04-09 | Texas Instruments Incorporated | Semiconductor Device Having Grooved Leads to Confine Solder Wicking |
| CN103053081A (en) * | 2010-08-02 | 2013-04-17 | 矢崎总业株式会社 | Fixed metal fitting for components to be mounted to circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6461041A (en) * | 1987-09-01 | 1989-03-08 | Nec Corp | Lead frame |
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2019
- 2019-11-15 CN CN201911110914.2A patent/CN111009474B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5270492A (en) * | 1991-08-26 | 1993-12-14 | Rohm Co., Ltd. | Structure of lead terminal of electronic device |
| US20090091007A1 (en) * | 2007-10-05 | 2009-04-09 | Texas Instruments Incorporated | Semiconductor Device Having Grooved Leads to Confine Solder Wicking |
| CN103053081A (en) * | 2010-08-02 | 2013-04-17 | 矢崎总业株式会社 | Fixed metal fitting for components to be mounted to circuit board |
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| Publication number | Publication date |
|---|---|
| CN111009474A (en) | 2020-04-14 |
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