CN110996649A

CN110996649A - SMT feeding statistical method and system

Info

Publication number: CN110996649A
Application number: CN201911209443.0A
Authority: CN
Inventors: 倪欢
Original assignee: Shenzhen Zhiwei Intelligent Software Development Co Ltd
Current assignee: Shenzhen Zhiwei Intelligent Software Development Co Ltd
Priority date: 2019-12-01
Filing date: 2019-12-01
Publication date: 2020-04-10
Anticipated expiration: 2039-12-01
Also published as: CN110996649B

Abstract

The disclosure provides an SMT feeding statistical method and a related product, wherein the method comprises the following steps: the method comprises the steps that a terminal shoots a first picture before a feeding port is started, and the first picture is identified to determine a first quantity x of materials; the terminal shoots a second picture after feeding the material at the feeding hole, and the second picture is identified to determine a second quantity y of the material; and the terminal repeats the steps in each feeding period, takes the sum of the difference values of all the feeding periods as the total number, and reports the total number and the type of the materials to the server. The technical scheme provided by the application has the advantage of accurate statistics.

Description

SMT feeding statistical method and system

Technical Field

The invention relates to the technical field of information, in particular to an SMT feeding statistical method and an SMT feeding statistical system.

Background

The SMT patch refers to a short of a series of process flows processed on the basis of a PCB (printed circuit board). SMT is Surface mount technology (Surface mount technology), an acronym for Surface mount technology, which is one of the most popular techniques and processes in the electronic assembly industry.

The total quantity of materials loaded by the conventional SMT cannot be counted, so that the counting of the materials is inaccurate, and the cost is increased.

Disclosure of Invention

The embodiment of the invention provides an SMT feeding statistical method and related products, and has the advantage that the SMT yield can be improved.

In a first aspect, an embodiment of the present invention provides an SMT feeding statistical method, where the method includes the following steps:

A. the method comprises the steps that a terminal shoots a first picture before a feeding port is started, and the first picture is identified to determine a first quantity x of materials;

B. the terminal shoots a second picture after feeding the material at the feeding hole, and the second picture is identified to determine a second quantity y of the material;

and the terminal repeats the step A and the step B in each feeding period, takes the sum of the difference values of all the feeding periods as the total number, and reports the total number and the type of the materials to the server.

Optionally, the method further includes:

if the second number y is larger than zero, identifying a second picture to determine y positions corresponding to the y materials, extracting y suction nozzles corresponding to the y positions, and sending the y suction nozzles to a server to analyze the reason of material falling.

Optionally, the method further includes:

and counting the feeding period with y being larger than zero, and sending the mark of the feeding period to the server.

Optionally, the method further includes:

if the second quantity y is larger than zero, identifying the second picture to determine y positions corresponding to the y materials, controlling the suction nozzles at the y positions to independently adsorb the materials, and if the materials cannot be adsorbed, sending alarm information to the server.

Optionally, the method further includes:

and if y of the n continuous feeding periods is larger than zero, identifying whether materials at the same position exist in the second pictures of the n feeding periods, if so, determining the fault of the suction nozzle corresponding to the materials, and sending alarm information to the server.

In a second aspect, an SMT feed statistics system is provided, the system comprising: a processor;

a processor for executing step A and step B

A. The method comprises the steps that a terminal shoots a first picture before a feeding port is started, and the first picture is identified to determine a first quantity x of materials; B. the terminal shoots a second picture after feeding the material at the feeding hole, and the second picture is identified to determine a second quantity y of the material;

and the processor is used for repeating the step A and the step B in each feeding period, taking the sum of the difference values of all the feeding periods as the total number, and reporting the total number and the type of the materials to the server.

Optionally, the processor is further configured to identify the second picture to determine y positions corresponding to the y materials if the second number y is greater than zero, extract y suction nozzles corresponding to the y positions, and send the y suction nozzles to the server to analyze the reason for material dropping.

Optionally, the processor is specifically configured to count a loading period in which y is greater than zero, and send an identifier of the loading period to the server.

Optionally, the processor is specifically configured to identify the second picture to determine y positions corresponding to the y materials if the second number y is greater than zero, control the suction nozzles at the y positions to independently adsorb the materials, and send an alarm message to the server if the materials cannot be adsorbed.

Optionally, the processor is further configured to, if y of n consecutive feeding periods is greater than zero, identify whether there is a material at the same position in the second picture of the n feeding periods, e.g., a material at the same position, determine a suction nozzle fault corresponding to the material, and send an alarm message to the server.

In a third aspect, a computer-readable storage medium is provided, which stores a program for electronic data exchange, wherein the program causes a terminal to execute the method provided in the first aspect.

The embodiment of the invention has the following beneficial effects:

the terminal shoots a first picture before the material loading port is started, and identifies the first picture to determine the first quantity x of the materials; shooting a second picture after the feeding hole is fed, and identifying and determining a second quantity y of the materials for the second picture; and repeating the steps S201 and S202 in each feeding period, counting the total number of the difference values of all the feeding periods, and reporting the total number and the type of the material to a server. Therefore, the total quantity of the fed materials can be determined through automatic identification, and the accuracy of material statistics is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device.

FIG. 2 is a flow chart of a statistical method for SMT feeding.

Fig. 3 is a schematic structural diagram of an SMT feeding statistical system according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terms "first," "second," "third," and "fourth," etc. in the description and claims of the invention and in the accompanying drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, result, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

The electronic device related to the embodiments of the present application may include various handheld devices, vehicle-mounted devices, wearable devices (smart watches, smart bracelets, wireless headsets, augmented reality/virtual reality devices, smart glasses), computing devices or other processing devices connected to wireless modems, and various forms of User Equipment (UE), Mobile Stations (MS), terminal devices (terminal device), and the like, which have wireless communication functions. For convenience of description, the above-mentioned devices are collectively referred to as electronic devices.

SMT paster refers to the abbreviation of a series of process flows that are processed on a PCB basis. Pcb (printedcuit board) is a printed circuit board.

SMT is Surface mount Technology (Surface Mounted Technology), an acronym for Surface Mounted Technology, which is one of the most popular techniques and processes in the electronic assembly industry. Surface Mount Technology (SMT) is known as Surface mount or Surface mount technology. The surface-mounted component (SMC/SMD, chip component in Chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is soldered and assembled by means of reflow soldering, dip soldering and the like.

In general, electronic products used by people are designed according to a designed circuit diagram by adding various capacitors, resistors and other electronic components to pcb, so that various types of electric appliances need different smt patch processing technologies to process.

In the pursuit of miniaturization of electronic products, the size of the through-hole plug-in components used in the past has not been reduced. The electronic products are more fully functional, and the Integrated Circuits (ICs) used are free of through-hole components, especially large-scale, highly integrated ICs, and surface-mounted components have to be used. Mass production of products, automation of production, high yield at low cost by manufacturers, production of high quality products to meet customer demands and enhance market competitiveness in the development of electronic components, development of Integrated Circuits (ICs), and multi-component application of semiconductor materials. The electronic technology revolution is imperative and follows the international trend. It is conceivable that development of the surface assembly technique and process of smt is not possible in the case where the production process of manufacturers of international cpus, image processing devices such as intel, amd, etc. is refined to 20 nm or more.

The processing of the SMT patch has the advantages of high assembly density, small volume of an electronic product and light weight, the volume and the weight of a patch element are only about 1/10 of those of a traditional plug-in component, and after SMT is generally adopted, the volume of the electronic product is reduced by 40-60%, and the weight is reduced by 60-80%. High reliability and strong vibration resistance. The welding spot defect rate is low. The high frequency characteristics are good. Electromagnetic and radio frequency interference is reduced. The automation is easy to realize, and the production efficiency is improved. The cost is reduced by 30-50%. Saving materials, energy, equipment, manpower, time, etc.

Due to the complexity of the process flow of processing the smt patches, a plurality of factories for processing the smt patches appear, the processing of the smt patches is specially carried out, and in Shenzhen, due to the vigorous development of the electronic industry, the processing of the smt patches is prosperous in one industry.

The SMT basic process comprises silk-screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, detecting, and repairing

And (3) silk-screen printing: the solder paste or the patch adhesive is printed on the bonding pad of the PCB in an leaking mode, and preparation is made for welding of components. The used equipment is a screen printer (screen printer) which is positioned at the forefront end of an SMT production line.

Dispensing: the glue is dripped to the fixed position of the PCB, and the main function of the glue is to fix the components on the PCB. The used equipment is a glue dispenser and is positioned at the foremost end of the SMT production line or behind the detection equipment.

Mounting: the function is to accurately mount the surface mount components to fixed positions on the PCB. The used equipment is a chip mounter and is positioned behind a silk screen printer in an SMT production line.

And (3) curing: the function is to melt the surface mount adhesive, so that the surface mount component and the PCB are firmly bonded together. The used equipment is a curing oven and is positioned behind a chip mounter in an SMT production line.

And (3) reflow soldering: the function is to melt the soldering paste, so that the surface assembly component and the PCB are firmly bonded together. The used equipment is a reflow oven and is positioned behind a chip mounter in an SMT production line.

Cleaning: the function of the PCB is to remove soldering residues, such as soldering flux, on the assembled PCB, which are harmful to human bodies. The used equipment is a cleaning machine, and the position can be unfixed, can be on-line or not.

And (3) detection: the PCB assembling device has the function of detecting the welding quality and the assembling quality of the assembled PCB. The equipment comprises a magnifier, a microscope, an on-line tester (ICT), a flying probe tester, an Automatic Optical Inspection (AOI), an X-RAY inspection system, a function tester and the like. The position can be configured at a suitable place of the production line according to the detection requirement.

Repairing: the function of the method is to rework the PCB which is detected to have faults. The tools used are soldering irons, rework stations, etc. Is arranged at any position in the production line.

The following describes embodiments of the present application in detail.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application, where the electronic device 100 includes a storage and processing circuit 110, and a sensor 170 connected to the storage and processing circuit 110, where:

the electronic device 100 may include control circuitry, which may include storage and processing circuitry 110. The storage and processing circuitry 110 may be a memory, such as a hard drive memory, a non-volatile memory (e.g., flash memory or other electronically programmable read-only memory used to form a solid state drive, etc.), a volatile memory (e.g., static or dynamic random access memory, etc.), etc., and the embodiments of the present application are not limited thereto. Processing circuitry in storage and processing circuitry 110 may be used to control the operation of electronic device 100. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.

The storage and processing circuitry 110 may be used to run software in the electronic device 100, such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) telephone call application, an email application, a media playing application, operating system functions, and so forth. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) display screens, operations associated with performing wireless communication functionality, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in the electronic device 100, to name a few.

The electronic device 100 may include input-output circuitry 150. The input-output circuit 150 may be used to enable the electronic device 100 to input and output data, i.e., to allow the electronic device 100 to receive data from an external device and also to allow the electronic device 100 to output data from the electronic device 100 to the external device. The input-output circuit 150 may further include a sensor 170. Sensor 170 may include the ultrasonic fingerprint identification module, may also include ambient light sensor, proximity sensor based on light and electric capacity, touch sensor (for example, based on light touch sensor and/or capacitanc touch sensor, wherein, touch sensor may be a part of touch display screen, also can regard as a touch sensor structure independent utility), acceleration sensor, and other sensors etc., the ultrasonic fingerprint identification module can be integrated in the screen below, or, the ultrasonic fingerprint identification module can set up in electronic equipment's side or back, do not do the restriction here, this ultrasonic fingerprint identification module can be used to gather the fingerprint image.

The sensor 170 may include an Infrared (IR) camera or an RGB camera, and when the IR camera takes a picture, the pupil reflects infrared light, so the IR camera takes a pupil image more accurately than the RGB camera; the RGB camera needs to perform more subsequent image processing, the calculation precision and accuracy are higher than those of the IR camera, the universality is better than that of the IR camera, and the calculation amount is large.

Input-output circuit 150 may also include one or more display screens, such as display screen 130. The display 130 may include one or a combination of liquid crystal display, organic light emitting diode display, electronic ink display, plasma display, display using other display technologies. The display screen 130 may include an array of touch sensors (i.e., the display screen 130 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.

The electronic device 100 may also include an audio component 140. The audio component 140 may be used to provide audio input and output functionality for the electronic device 100. The audio components 140 in the electronic device 100 may include a speaker, a microphone, a buzzer, a tone generator, and other components for generating and detecting sound.

The communication circuit 120 may be used to provide the electronic device 100 with the capability to communicate with external devices. The communication circuit 120 may include analog and digital input-output interface circuits, and wireless communication circuits based on radio frequency signals and/or optical signals. The wireless communication circuitry in communication circuitry 120 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, and antennas. For example, the wireless Communication circuitry in Communication circuitry 120 may include circuitry to support Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, the communication circuit 120 may include a near field communication antenna and a near field communication transceiver. The communications circuitry 120 may also include a cellular telephone transceiver and antenna, a wireless local area network transceiver circuitry and antenna, and so forth.

The electronic device 100 may further include a battery, power management circuitry, and other input-output units 160. The input-output unit 160 may include buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, cameras, light emitting diodes and other status indicators, and the like.

A user may input commands through input-output circuitry 150 to control the operation of electronic device 100, and may use output data of input-output circuitry 150 to enable receipt of status information and other outputs from electronic device 100.

The electronic device described above with reference to fig. 1 may be configured to implement the following functions:

referring to fig. 2, fig. 2 provides an SMT feeding statistical method, which is performed by the terminal shown in fig. 1, as shown in fig. 2, and includes the following steps:

step S201, shooting a first picture by the terminal before starting a feeding port, and identifying the first picture to determine a first quantity x of materials;

step S202, shooting a second picture after the terminal loads materials on the material loading port, and identifying and determining a second quantity y of the materials for the second picture;

and S203, the terminal repeats the steps S201 and S202 in each feeding period, takes the sum of the differences of all the feeding periods as the total number, and reports the total number and the type of the materials to the server.

According to the technical scheme, a terminal shoots a first picture before a feeding port is started, and identifies the first picture to determine a first quantity x of materials; shooting a second picture after the feeding hole is fed, and identifying and determining a second quantity y of the materials for the second picture; and repeating the steps S201 and S202 in each feeding period, counting the total number of the difference values of all the feeding periods, and reporting the total number and the type of the material to a server. Therefore, the total quantity of the fed materials can be determined through automatic identification, and the accuracy of material statistics is improved.

Optionally, the method further includes:

Optionally, the method may further include:

The data statistics is a general term of data statistics of SMT industry or other operation processes, and is used in the fields of historical data, scientific experiments, inspection, statistics and the like. So as to accurately and rapidly search and classify.

Referring to fig. 3, fig. 3 provides an SMT loading statistics system, said system comprising: a processor;

a processor for executing step A and step B

Embodiments of the present invention further provide a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program enables a computer to perform part or all of the steps of any one of the SMT feeding statistical methods as described in the above method embodiments.

Embodiments of the present invention also provide a computer program product comprising a non-transitory computer readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps of any one of the SMT statistical methods as recited in the above method embodiments.

It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are exemplary embodiments and that the acts and modules illustrated are not necessarily required to practice the invention.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one type of division of logical functions, and there may be other divisions when actually implementing, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit may be implemented in the form of hardware, or may be implemented in the form of a software program module.

The integrated units, if implemented in the form of software program modules and sold or used as stand-alone products, may be stored in a computer readable memory. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a memory and includes several instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned memory comprises: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.

Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by associated hardware instructed by a program, which may be stored in a computer-readable memory, which may include: flash Memory disks, Read-Only memories (ROMs), Random Access Memories (RAMs), magnetic or optical disks, and the like.

The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. A statistical method for SMT feeding is characterized by comprising the following steps:

2. The method of claim 1, further comprising:

3. The method of claim 1, further comprising:

4. The method of claim 1, further comprising:

5. The method of claim 1, further comprising:

6. An SMT feed statistics system, said system comprising: a processor and a camera, which is characterized in that,

a processor for executing step A and step B

7. The system of claim 6,

and the processor is further used for identifying the second picture to determine y positions corresponding to the y materials if the second quantity y is greater than zero, extracting y suction nozzles corresponding to the y positions, and sending the y suction nozzles to the server to analyze the material dropping reason.

8. The system of claim 6,

the processor is specifically configured to count a loading period in which y is greater than zero, and send an identifier of the loading period to the server.

9. The system of claim 6,

the processor is specifically configured to identify the second picture to determine y positions corresponding to the y materials if the second quantity y is greater than zero, control the suction nozzles at the y positions to independently adsorb the materials, and send warning information to the server if the materials cannot be adsorbed.

10. The system of claim 9,

the processor is further configured to, if y of n consecutive feeding periods is greater than zero, identify whether a material at the same position exists in the second picture of the n feeding periods, e.g., a material at the same position exists, determine a suction nozzle fault corresponding to the material, and send an alarm message to the server.