CN110913682A

CN110913682A - SMT (surface Mount technology) reloading method and system

Info

Publication number: CN110913682A
Application number: CN201911198947.7A
Authority: CN
Inventors: 倪欢
Original assignee: Shenzhen Zhiwei Intelligent Software Development Co Ltd
Current assignee: Shenzhen Zhiwei Intelligent Software Development Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-03-24

Abstract

The present disclosure provides an SMT refueling method and related product, the method comprising the steps of: the method comprises the steps that a terminal collects a first picture of an SMT material area, and identifies the first picture to obtain states of a plurality of materials in the material area; the terminal extracts n identifications of the materials in the abnormal state, and generates an abnormal list from the n identifications; and the terminal acquires the suction nozzles corresponding to the n materials corresponding to the n identifications and sets the suction nozzles to be out of work. The technical scheme that this application provided has the advantage that improves work efficiency.

Description

SMT (surface Mount technology) reloading method and system

Technical Field

The invention relates to the technical field of information, in particular to an SMT refueling method and an SMT refueling system.

Background

The SMT patch refers to a short of a series of process flows processed on the basis of a PCB (printed circuit board). SMT is Surface mount technology (Surface mount technology), an acronym for Surface mount technology, which is one of the most popular techniques and processes in the electronic assembly industry.

The automatic reloading can not be realized by the conventional SMT, and the yield of the SMT is reduced.

Disclosure of Invention

The embodiment of the invention provides an SMT material changing method and a related product, which can realize automatic material changing and improve the yield of SMT.

In a first aspect, an embodiment of the present invention provides an SMT refueling method, where the method includes the following steps:

the method comprises the steps that a terminal collects a first picture of an SMT material area, and the first picture is identified to obtain states of a plurality of materials in the material area;

the terminal extracts n identifications of the materials in the abnormal state, and generates an abnormal list from the n identifications;

and the terminal acquires the suction nozzles corresponding to the n materials corresponding to the n identifications and sets the suction nozzles to be out of work.

Optionally, the method further includes:

the method comprises the steps of enabling a first picture to form input data, inputting the input data into an identification model to execute n-layer convolution operation to obtain a convolution result, determining a plurality of areas corresponding to a plurality of materials according to the convolution result, comparing the areas to determine abnormal areas in the areas, and determining the materials corresponding to the abnormal areas as the materials in the n materials.

Optionally, the determining abnormal regions in the plurality of regions by comparing the plurality of regions specifically includes:

calculating a difference value between a first area and a second area in the plurality of areas to obtain a first difference value, calculating a difference value between the first area and a third area to obtain a second difference value if the first difference value is larger than a set threshold value, calculating a difference value between the second area and the third area to obtain a third difference value, determining that the second area is an abnormal area if the second difference value is smaller than the set threshold value and the third difference value is larger than the set threshold value, and determining that the first area is the abnormal area if the third difference value is smaller than the set threshold value and the second difference value is larger than the set threshold value.

Optionally, the method further includes:

the number of the inactive suction nozzle is determined and when the suction nozzle of the number is operated, the suction nozzle corresponding to the number is skipped.

Optionally, the method further includes:

and the terminal sucks n materials from the new material area to perform the patching.

In a second aspect, an SMT refueling system is provided, said system comprising: a processor and a communication unit, wherein the processor is connected with the communication unit,

the processor is used for acquiring a first picture of the SMT material area and identifying the first picture to obtain the states of a plurality of materials in the material area; extracting n identifications of the material in an abnormal state, and generating an abnormal list from the n identifications; and acquiring suction nozzles corresponding to n materials corresponding to the n identifications, and setting the suction nozzles not to work.

Optionally, the processor is further configured to compose the first picture into input data, input the input data into the identification model, perform n-layer convolution operation to obtain a convolution result, determine a plurality of regions corresponding to the plurality of materials according to the convolution result, compare the plurality of regions to determine an abnormal region in the plurality of regions, and determine the material corresponding to the abnormal region as the material in the n materials.

Optionally, the processor is specifically configured to calculate a difference between a first region and a second region in the plurality of regions to obtain a first difference, calculate a difference between the first region and a third region to obtain a second difference if the first difference is greater than a set threshold, calculate a difference between the second region and the third region to obtain a third difference, determine that the second region is an abnormal region if the second difference is smaller than the set threshold and the third difference is greater than the set threshold, and determine that the first region is an abnormal region if the third difference is smaller than the set threshold and the second difference is greater than the set threshold.

Optionally, the communication unit is specifically configured to determine a label of an inoperative nozzle, and when the suction nozzle of the label is operated, skip the suction nozzle corresponding to the label.

Optionally, the processing unit is further configured to suck n materials from a new material area by the terminal to perform the pasting.

In a third aspect, a computer-readable storage medium is provided, which stores a program for electronic data exchange, wherein the program causes a terminal to execute the method provided in the first aspect.

The embodiment of the invention has the following beneficial effects:

the technical scheme provided by the application can be seen that the first picture of the SMT material area is collected, and the states of a plurality of materials in the material area are obtained by identifying the first picture; extracting n identifications of the materials in the abnormal state, generating an abnormal list from the n identifications, acquiring suction nozzles corresponding to the n materials corresponding to the n identifications, and setting the suction nozzles not to work. The technical scheme that this application provided just so learns the material in advance and under the prerequisite of being abnormal material, just not inhale the material with the suction nozzle, can not paste the PCB board like this promptly, and then avoided unusual material to be pasted the problem that the PCB board yields is low by the PCB board that leads to, has improved SMT's yields.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device.

FIG. 2 is a schematic flow chart of an SMT refueling method.

Fig. 3 is a schematic structural diagram of an SMT refueling system according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The terms "first," "second," "third," and "fourth," etc. in the description and claims of the invention and in the accompanying drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, result, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

SMT paster refers to the abbreviation of a series of process flows that are processed on a PCB basis. Pcb (printedcuit board) is a printed circuit board.

SMT is Surface mount Technology (Surface Mounted Technology), an acronym for Surface Mounted Technology, which is one of the most popular techniques and processes in the electronic assembly industry. Surface Mount Technology (SMT) is known as Surface mount or Surface mount technology. The surface-mounted component (SMC/SMD, chip component in Chinese) without pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is welded and assembled by methods such as reflow soldering or dip soldering.

In general, electronic products used by people are designed according to a designed circuit diagram by adding various capacitors, resistors and other electronic components to pcb, so that various types of electric appliances need different smt patch processing technologies to process.

In the pursuit of miniaturization of electronic products, the size of the through-hole plug-in components used in the past has not been reduced. The electronic products are more fully functional, and the Integrated Circuits (ICs) used are free of through-hole components, especially large-scale, highly integrated ICs, and surface-mounted components have to be used. Mass production of products, automation of production, high yield at low cost by manufacturers, production of high quality products to meet customer demands and enhance market competitiveness in the development of electronic components, development of Integrated Circuits (ICs), and multi-component application of semiconductor materials. The electronic technology revolution is imperative and follows the international trend. It is conceivable that development of the surface assembly technique and process of smt is not possible in the case where the production process of manufacturers of international cpus, image processing devices such as intel, amd, etc. is refined to 20 nm or more.

The processing of the SMT patch has the advantages of high assembly density, small volume of an electronic product and light weight, the volume and the weight of a patch element are only about 1/10 of those of a traditional plug-in component, and after SMT is generally adopted, the volume of the electronic product is reduced by 40-60%, and the weight is reduced by 60-80%. High reliability and strong vibration resistance. The welding spot defect rate is low. The high frequency characteristics are good. Electromagnetic and radio frequency interference is reduced. The automation is easy to realize, and the production efficiency is improved. The cost is reduced by 30-50%. Saving materials, energy, equipment, manpower, time, etc.

Due to the complexity of the process flow of processing the smt patches, a plurality of factories for processing the smt patches appear, the processing of the smt patches is specially carried out, and in Shenzhen, due to the vigorous development of the electronic industry, the processing of the smt patches is prosperous in one industry.

The SMT basic process comprises silk-screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, detecting, and repairing

And (3) silk-screen printing: the solder paste or the patch adhesive is printed on the bonding pad of the PCB in an leaking mode, and preparation is made for welding of components. The used equipment is a screen printer (screen printer) which is positioned at the forefront end of an SMT production line.

Dispensing: the glue is dripped to the fixed position of the PCB, and the main function of the glue is to fix the components on the PCB. The used equipment is a glue dispenser and is positioned at the foremost end of the SMT production line or behind the detection equipment.

Mounting: the function is to accurately mount the surface mount components to fixed positions on the PCB. The used equipment is a chip mounter and is positioned behind a silk screen printer in an SMT production line.

And (3) curing: the function is to melt the surface mount adhesive, so that the surface mount component and the PCB are firmly bonded together. The used equipment is a curing oven and is positioned behind a chip mounter in an SMT production line.

And (3) reflow soldering: the function is to melt the soldering paste, so that the surface assembly component and the PCB are firmly bonded together. The used equipment is a reflow oven and is positioned behind a chip mounter in an SMT production line.

Cleaning: the function of the PCB is to remove soldering residues, such as soldering flux, on the assembled PCB, which are harmful to human bodies. The used equipment is a cleaning machine, and the position can be unfixed, can be on-line or not.

And (3) detection: the PCB assembling device has the function of detecting the welding quality and the assembling quality of the assembled PCB. The equipment comprises a magnifier, a microscope, an on-line tester (ICT), a flying probe tester, an Automatic Optical Inspection (AOI), an X-RAY inspection system, a function tester and the like. The position can be configured at a suitable place of the production line according to the detection requirement.

Repairing: the function of the method is to rework the PCB which is detected to have faults. The tools used are soldering irons, rework stations, etc. Is arranged at any position in the production line.

The electronic device related to the embodiments of the present application may include various handheld devices, vehicle-mounted devices, wearable devices (smart watches, smart bracelets, wireless headsets, augmented reality/virtual reality devices, smart glasses), computing devices or other processing devices connected to wireless modems, and various forms of User Equipment (UE), Mobile Stations (MS), terminal devices (terminal device), and the like, which have wireless communication functions. For convenience of description, the above-mentioned devices are collectively referred to as electronic devices.

The following describes embodiments of the present application in detail.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application, where the electronic device 100 includes a storage and processing circuit 110, and a sensor 170 connected to the storage and processing circuit 110, where:

the electronic device 100 may include control circuitry, which may include storage and processing circuitry 110. The storage and processing circuitry 110 may be a memory, such as a hard drive memory, a non-volatile memory (e.g., flash memory or other electronically programmable read-only memory used to form a solid state drive, etc.), a volatile memory (e.g., static or dynamic random access memory, etc.), etc., and the embodiments of the present application are not limited thereto. Processing circuitry in storage and processing circuitry 110 may be used to control the operation of electronic device 100. The processing circuitry may be implemented based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, display driver integrated circuits, and the like.

The storage and processing circuitry 110 may be used to run software in the electronic device 100, such as an Internet browsing application, a Voice Over Internet Protocol (VOIP) telephone call application, an email application, a media playing application, operating system functions, and so forth. Such software may be used to perform control operations such as, for example, camera-based image capture, ambient light measurement based on an ambient light sensor, proximity sensor measurement based on a proximity sensor, information display functionality based on status indicators such as status indicator lights of light emitting diodes, touch event detection based on a touch sensor, functionality associated with displaying information on multiple (e.g., layered) display screens, operations associated with performing wireless communication functionality, operations associated with collecting and generating audio signals, control operations associated with collecting and processing button press event data, and other functions in the electronic device 100, to name a few.

The electronic device 100 may include input-output circuitry 150. The input-output circuit 150 may be used to enable the electronic device 100 to input and output data, i.e., to allow the electronic device 100 to receive data from an external device and also to allow the electronic device 100 to output data from the electronic device 100 to the external device. The input-output circuit 150 may further include a sensor 170. Sensor 170 may include the ultrasonic fingerprint identification module, may also include ambient light sensor, proximity sensor based on light and electric capacity, touch sensor (for example, based on light touch sensor and/or capacitanc touch sensor, wherein, touch sensor may be a part of touch display screen, also can regard as a touch sensor structure independent utility), acceleration sensor, and other sensors etc., the ultrasonic fingerprint identification module can be integrated in the screen below, or, the ultrasonic fingerprint identification module can set up in electronic equipment's side or back, do not do the restriction here, this ultrasonic fingerprint identification module can be used to gather the fingerprint image.

The sensor 170 may include an Infrared (IR) camera or an RGB camera, and when the IR camera takes a picture, the pupil reflects infrared light, so the IR camera takes a pupil image more accurately than the RGB camera; the RGB camera needs to perform more subsequent image processing, the calculation precision and accuracy are higher than those of the IR camera, the universality is better than that of the IR camera, and the calculation amount is large.

Input-output circuit 150 may also include one or more display screens, such as display screen 130. The display 130 may include one or a combination of liquid crystal display, organic light emitting diode display, electronic ink display, plasma display, display using other display technologies. The display screen 130 may include an array of touch sensors (i.e., the display screen 130 may be a touch display screen). The touch sensor may be a capacitive touch sensor formed by a transparent touch sensor electrode (e.g., an Indium Tin Oxide (ITO) electrode) array, or may be a touch sensor formed using other touch technologies, such as acoustic wave touch, pressure sensitive touch, resistive touch, optical touch, and the like, and the embodiments of the present application are not limited thereto.

The electronic device 100 may also include an audio component 140. The audio component 140 may be used to provide audio input and output functionality for the electronic device 100. The audio components 140 in the electronic device 100 may include a speaker, a microphone, a buzzer, a tone generator, and other components for generating and detecting sound.

The communication circuit 120 may be used to provide the electronic device 100 with the capability to communicate with external devices. The communication circuit 120 may include analog and digital input-output interface circuits, and wireless communication circuits based on radio frequency signals and/or optical signals. The wireless communication circuitry in communication circuitry 120 may include radio-frequency transceiver circuitry, power amplifier circuitry, low noise amplifiers, switches, filters, and antennas. For example, the wireless Communication circuitry in Communication circuitry 120 may include circuitry to support Near Field Communication (NFC) by transmitting and receiving Near Field coupled electromagnetic signals. For example, the communication circuit 120 may include a near field communication antenna and a near field communication transceiver. The communications circuitry 120 may also include a cellular telephone transceiver and antenna, a wireless local area network transceiver circuitry and antenna, and so forth.

The electronic device 100 may further include a battery, power management circuitry, and other input-output units 160. The input-output unit 160 may include buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, cameras, light emitting diodes and other status indicators, and the like.

A user may input commands through input-output circuitry 150 to control the operation of electronic device 100, and may use output data of input-output circuitry 150 to enable receipt of status information and other outputs from electronic device 100.

The electronic device described above with reference to fig. 1 may be configured to implement the following functions:

referring to fig. 2, fig. 2 provides an SMT refueling method, which is performed by the terminal shown in fig. 1 as shown in fig. 2, and includes the following steps:

step S201, a terminal collects a first picture of an SMT material area, and the first picture is identified to obtain states of a plurality of materials in the material area;

s202, extracting n identifications of the materials in the abnormal state by the terminal, and generating an abnormal list by the n identifications;

and S203, the terminal acquires the suction nozzles corresponding to the n materials corresponding to the n identifications, and sets the suction nozzles not to work.

According to the technical scheme, a first picture of the SMT material area is collected, and states of a plurality of materials in the material area are obtained by identifying the first picture; extracting n identifications of the materials in the abnormal state, generating an abnormal list from the n identifications, acquiring suction nozzles corresponding to the n materials corresponding to the n identifications, and setting the suction nozzles not to work. The technical scheme that this application provided just so learns the material in advance and under the prerequisite of being abnormal material, just not inhale the material with the suction nozzle, can not paste the PCB board like this promptly, and then avoided unusual material to be pasted the problem that the PCB board yields is low by the PCB board that leads to, has improved SMT's yields.

Optionally, the identifying the first picture to obtain the states of the plurality of materials in the material area may specifically include:

Optionally, the determining the abnormal region in the plurality of regions by comparing the plurality of regions specifically may include:

Optionally, the method further includes:

Optionally, the method may further include:

The invention implements the flow chart of the electronic equipment component dynamic positioning, the related information inquiry and the equipment maintenance example; the invention discloses a dynamic linking system for auxiliary picture pixel positioning of an electronic element, which is characterized in that: the comprehensive method is a comprehensive method for dynamically positioning and identifying components based on picture pixel coordinate dynamic link, implementing overhaul guidance on electronic equipment to be repaired and searching for emergency replacement components on a distributed database, and comprises the following steps:

operating the application software of the dynamic component positioning system;

selecting the type of the electronic equipment to be repaired;

selecting a printed board to be repaired or an electrical schematic diagram;

adjusting the display scale of the printed board diagram or the electrical principle diagram to adapt to the use requirement;

and selecting a target component, wherein the target component refers to a test point or a component to be judged, which needs to be checked by an electronic equipment maintenance worker in the process of completing maintenance activities. The method provides three ways for searching a target component:

sliding the printed board picture, searching a target component, clicking the component by a left key, and completing operation; or sliding the electrical schematic picture, searching a target component, clicking the component by a left key, and finishing the operation; or the serial number of the component is recorded, and the operation is finished by a return key or double-click;

after the target component is found, the application software displays two pictures at the same time, and the pictures are respectively marked and displayed by taking the target component as the center;

inquiring relevant information such as dynamic and static parameters, dynamic parameters, damage judgment methods, emergency substitution methods and the like of a target component:

through the indication of a printed board diagram, a target component is found on the actual equipment, whether the target component is damaged or not is judged according to the provided related information, and the quick judgment and positioning of the electronic equipment fault are implemented:

the system software has the function of searching for emergency replacement components, provides component information which is close to the technical index of a target component in the same type of electronic equipment or different types of electronic equipment, provides other types of component information capable of replacing the target component, and implements emergency repair of the failed electronic equipment under the emergency condition;

the system software has a network application function, and the method can realize remote diagnosis and technical support for troubleshooting of the electronic equipment on the network. The method comprises the following steps:

electronic equipment maintenance personnel determine a target component according to maintenance information obtained by preliminary judgment, and three ways for obtaining the target component are generally available:

firstly, the appearance of actual electronic equipment is visually observed, components and parts are obviously damaged, and target components and parts can be searched by the method of e-1):

[ or, secondly, the electrical principle analysis is carried out through an electrical principle graph, and a target component is searched after a test point or a component to be judged is deduced;

or, thirdly, through related maintenance experience technical data, obtaining the label information of the test point or the component to be judged, and searching the target component.

Referring to fig. 3, fig. 3 provides an SMT refueling system, said system comprising: a processor and a communication unit, wherein the processor is connected with the communication unit,

Embodiments of the present invention also provide a computer storage medium, wherein the computer storage medium stores a computer program for electronic data interchange, and the computer program enables a computer to execute part or all of the steps of any one of the SMT refueling methods as recited in the above method embodiments.

Embodiments of the present invention also provide a computer program product comprising a non-transitory computer readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps of any one of the SMT reloading methods as described in the above method embodiments.

It should be noted that, for simplicity of description, the above-mentioned method embodiments are described as a series of acts or combination of acts, but those skilled in the art will recognize that the present invention is not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the invention. Further, those skilled in the art should also appreciate that the embodiments described in the specification are exemplary embodiments and that the acts and modules illustrated are not necessarily required to practice the invention.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one type of division of logical functions, and there may be other divisions when actually implementing, for example, a plurality of units or components may be combined or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of some interfaces, devices or units, and may be an electric or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit may be implemented in the form of hardware, or may be implemented in the form of a software program module.

The integrated units, if implemented in the form of software program modules and sold or used as stand-alone products, may be stored in a computer readable memory. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a memory and includes several instructions for causing a computer device (which may be a personal computer, a server, a network device, or the like) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned memory comprises: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic disk, or an optical disk, which can store program codes.

Those skilled in the art will appreciate that all or part of the steps in the methods of the above embodiments may be implemented by associated hardware instructed by a program, which may be stored in a computer-readable memory, which may include: flash Memory disks, Read-Only memories (ROMs), Random Access Memories (RAMs), magnetic or optical disks, and the like.

The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims

1. An SMT refueling method, characterized in that the method comprises the following steps:

2. The method of claim 1, further comprising:

3. The method of claim 1, wherein comparing the plurality of regions to determine abnormal regions in the plurality of regions comprises:

4. The method of claim 3, further comprising:

5. The method of claim 1, further comprising:

6. An SMT refueling system, the system comprising: a processor, a communication unit, characterized in that,

7. The system of claim 6,

the processor is further configured to compose the first picture into input data, input the input data into the identification model, execute n-layer convolution operation to obtain a convolution result, determine a plurality of regions corresponding to the plurality of materials according to the convolution result, compare the plurality of regions to determine an abnormal region in the plurality of regions, and determine a material corresponding to the abnormal region as a material in the n materials.

8. The system of claim 1,

the processor is specifically configured to calculate a difference between a first region and a second region in the plurality of regions to obtain a first difference, calculate a difference between the first region and a third region to obtain a second difference if the first difference is greater than a set threshold, calculate a difference between the second region and the third region to obtain a third difference, determine that the second region is an abnormal region if the second difference is less than the set threshold and the third difference is greater than the set threshold, and determine that the first region is an abnormal region if the third difference is less than the set threshold and the second difference is greater than the set threshold.

9. The system of claim 3,

the communication unit is specifically used for determining the label of the non-working suction nozzle, and when the suction nozzle with the label is operated, the suction nozzle corresponding to the label is skipped.

10. The system of claim 6,

and the processing unit is also used for sucking n materials from the new material area by the terminal to execute the paster.