JPS61133697A - Electronic component mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

TECHNICAL FIELD The present invention relates to a mounting apparatus for electronic components, particularly surface-mounted chip components, and more particularly to an in-line high-density chip component mounting machine.

Prior Art Type A methods have been devised and implemented for mounting chip components. One of these methods is the in-line method shown in FIG. 1, in which a large number of component suction devices 1 are arranged in a line and the substrates 2 are sequentially flowed underneath. This method has a relatively simple structure and allows for 111,112 units of equipment, but the disadvantage is that the equipment becomes very long if a large board is used or a large number of parts are attached (therefore, a large number of parts are picked up incorrectly). was there.

OBJECTS It is an object of the present invention to solve these problems and provide an inexpensive high-speed component mounting device.

Embodiment In FIG. 2, the slider 4 in the suction device guide 3, which is formed by a rope, is driven by a stepping motor 5 via a timing belt 6. The slider 4 is made of self-sliding plastic so that the laterally fatigued shoe 7 slides on the inner surface of the guide 3, and the suction bit 8 attached to the slider 4 smoothly moves to a component suction device (not shown) such as a tape feeder. This allows it to be moved between the board and the board. The stepping motor alternates between A and B.
This is to prevent interference with adjacent motors.

By lateral fatigue of the component suction device in this manner, the width of the device is significantly reduced, and the suction devices can be arranged at intervals of 30 to 36 mm. If the component suction devices are arranged in close contact with each other in this way, if the board is large, it will be necessary to mount several components on the board at the same time, which cannot be achieved with tact feeding based on the width of the board, so a single device is not enough. The substrate feeding device is a continuous feeder, and parts are rapidly dropped onto the moving substrate by a suction bit and crimped.

Figure 3 shows parts installed in close proximity to the board feeding device f9.
This figure shows the arrangement of a feeding device 3, in which a substrate 2 placed on a substrate feeding device (conveyor) is fed at a constant speed by a stepping motor 10. The tip of the substrate is detected by the sensor 11, and a counter (not shown) is reset F and starts counting the body force pulses of the stepping motor 10 from that point.

The board moves away from under the suction bit group 8, which attracts the component and stops at a pre-programmed position, and when it reaches the pre-memorized count, the vacuum of the suction bit is cut off and the component falls onto the board. do. In order to ensure complete adhesion to the substrate, the suction part 12 of the suction bit is suspended by a spring 13 as shown in Figure 2B. When the vacuum is cut off during component mounting, the vacuum pressure begins to drop and the bit 12 begins to descend due to its inertia and continues to descend until the bit 12 crosses the resting position and the component is crimped onto the board. The number of component supply devices to be controlled can be easily controlled by ensuring that their total width does not exceed the substrate width.In this way, multiple component suction device groups controlled by the substrate edge sensor are further arranged. By doing this, it is possible to mount 1% of the number of components in succession, so a high-speed chip component mounting machine can be constructed.For example, if one board is sent in 10 seconds and 100 quintillion components are mounted, it will take 0.1 seconds per point. It is a high-speed mount. Even in this case, the mounting preparation time per mounting unit F is 10 seconds, so even a simple mounting W device can withstand repeated use. Also, suction errors from the component supply device occur. Even in such a case, it is possible to try pasting several times and improve the reliability of the system.In addition, in this case, the speed of the substrate feeding device can be temporarily reduced to facilitate retrying.

The substrate may be positioned using reference pins as shown in FIG. 2, but in the case of a flexible substrate, it is preferable to place it on a metal substrate 15 as shown in B and send the terminal end using claws 16. In this case, both ends of the substrate 15 are fed by guides (not shown) so that there is no play. The claws 16 may be formed by making the conveyor out of stainless steel and cutting it up.

In order to prevent this claw from scraping the substrate 15, the board is attached to and removed from the conveyor by a known method (not shown) in which the transfer claw 17 is activated when the sensor 18 detects the tip of the board 16 from A to B, as shown in Figure 4. will be transferred. The sensor position is board 1
It should be made before the end of the pulley 6 reaches just above the pulley 19.

When using a plurality of devices in series, a sensor 20.20° is installed to correct the speed difference, and synchronization is achieved by knowing the difference in operating time and dropping the faster speed for a certain period of time.

Effects As is clear from the above explanation, according to the method of the present invention, a high-speed chip component mounting device can be manufactured at low cost.

[Brief explanation of the drawing]

Figure 1 is a conceptual diagram of a conventional in-line mounting device. FIG. 2 is a partially cutaway perspective view of a component mounting unit of the present invention. FIG. 3 is a configuration of the present invention [! Figure 1-4 is a perspective view of the present Bf4 substrate transfer method for removing BR; Figure 1-5 is a diagram illustrating the same method when a plurality of devices of the present invention are used.

Claims (1)

[Claims] 1) In an electronic chip component mounting device having a feeding device that continuously feeds the substrate at a constant speed and a plurality of component feeding units that transfer the chip components, An electronic component mounting device characterized in that a component in a component feeding unit controlled by each sensor to be confirmed is dropped and crimped when a predetermined pulse count is reached. 2) An electronic component mounting device according to claim 1, in which the speed of the board feeding device is reduced when a component suction error occurs in the device 3) A device for mounting a board in the device described above 2. The electronic component mounting device according to claim 1, wherein the transfer device that is attached to and removed from the feeding device is provided with a sensor so that the feeding claw of the substrate feeding device finishes feeding the substrate during horizontal movement. 4) In a system in which a plurality of the above-mentioned devices are used in series, the speed difference of the substrate feeding devices is detected and the speed of the faster feeding device is reduced for a certain period of time to achieve synchronization. The electronic component mounting device according to item 1. 5) The electronic component mounting apparatus according to claim 1, wherein the suction bit is lowered beyond the rest position to press the component onto the board.