CN110996526A - Method for manufacturing signal via hole - Google Patents
Method for manufacturing signal via hole Download PDFInfo
- Publication number
- CN110996526A CN110996526A CN201911380190.3A CN201911380190A CN110996526A CN 110996526 A CN110996526 A CN 110996526A CN 201911380190 A CN201911380190 A CN 201911380190A CN 110996526 A CN110996526 A CN 110996526A
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- China
- Prior art keywords
- material layer
- soft material
- metal
- hole ring
- metal hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the technical field of PCBs (printed circuit boards), and discloses a method for manufacturing a signal via hole, which comprises the following steps: manufacturing a metal hole ring on the first core plate positioned on the appointed layer; manufacturing an anti-electroplating soft material layer on the surface of the metal hole ring; pressing to form a multilayer board; drilling and wedge-shaped processing to form a through hole penetrating through the metal hole ring and the soft material layer, wherein the metal hole ring is deformed into a wedge-shaped structure extruded towards the soft material layer so as to cover the soft material layer on an exposed area of the hole wall; depositing a conductive layer on the multilayer board, and then removing the metal layer covered outside the soft material layer to expose the soft material layer; and (4) electroplating. The embodiment of the invention adopts the existing common materials on the market and combines and utilizes various mature processing technologies, realizes the manufacturing requirement of breaking the signal via hole on the specified layer, greatly reduces the production cost, has no design and manufacturing limit conditions, effectively ensures the processing quality, and is beneficial to batch popularization and application.
Description
Technical Field
The invention relates to the technical field of Printed Circuit Boards (PCBs), in particular to a method for manufacturing a signal via hole.
Background
The PCB is a support body of the electronic component and a carrier for connecting the electronic component and the electric appliance, and is widely applied to various electronic devices. As the functions of electronic devices are gradually enhanced, PCBs built therein are also gradually developed into multi-layer PCBs.
In the design process of the multilayer PCB, the routing of high-speed signals inevitably needs layer-changing routing, so that via holes are arranged among all layers of the multilayer PCB and are used for connecting printed wires among all layers of the PCB.
Aiming at the manufacturing requirement that a via hole appointed layer is required to be completely disconnected in PCB manufacturing, the manufacturing requirement is usually realized by combining some special manufacturing materials and special processes at present, and the particularity of the manufacturing materials and the manufacturing processes not only greatly limits the batch manufacturing and application of the process, but also brings higher manufacturing cost, and has a plurality of problems of more design and manufacturing limiting conditions and the like.
Disclosure of Invention
The invention aims to provide a method for manufacturing signal via holes, which overcomes the defects of high production cost, more design and manufacturing limit conditions, incapability of batch manufacturing and the like of the conventional signal via hole processing technology.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of making a signal via, the method comprising:
manufacturing a metal hole ring in a preset drilling area for a first core plate positioned on an appointed layer according to a preset plate stacking sequence;
manufacturing an anti-electroplating soft material layer on the surface of the metal hole ring;
stacking the first core plate and other core plates according to a preset sequence and then pressing to form a multilayer plate;
drilling and wedge-shaped processing to form a through hole penetrating through the metal hole ring and the soft material layer, wherein the metal hole ring is deformed into a wedge-shaped structure extruded towards the soft material layer so as to cover the soft material layer on an exposed area of the hole wall;
depositing a conductive layer on the multilayer board, and then removing the metal layer covered outside the soft material layer to expose the soft material layer;
and electroplating the through hole.
Optionally, the step of performing the drilling operation and the wedge machining operation includes:
drilling holes in the multilayer board; forming a high-temperature environment which is not lower than a preset temperature threshold in the drilling process, wherein the preset temperature threshold is the lowest environment temperature which enables the metal hole ring and the soft material layer to reach a specified softening degree;
and simultaneously, in the drilling process, the metal hole ring is pulled by a drill so that the metal hole ring is extruded and deformed to form the wedge-shaped structure on one side of the soft material layer.
Optionally, the step of performing the drilling operation and the wedge machining operation includes:
drilling a hole in the multilayer board to form a through hole penetrating through the metal hole ring and the soft material layer;
after drilling, softening the metal hole ring and the soft material layer;
and pressing and transforming the softened metal hole ring to one side of the soft material layer by using a specified tool to form the wedge-shaped structure.
Optionally, after the step of electroplating the through hole, the method further includes: and removing the soft material layer.
Optionally, the soft material layer includes a dry film, ink, or a film material.
Optionally, the method for manufacturing the dry film on the surface of the metal eyelet ring includes:
firstly, the dry film is pasted on the surface of the first core plate on which the metal hole ring is manufactured;
and then, removing the dry film part covering the region outside the surface of the metal hole ring in an exposure and development mode, and only reserving the dry film part covering the surface region of the metal hole ring.
Optionally, the method for manufacturing the thin film material on the surface of the metal eyelet ring includes:
the surface of the first core plate, on which the metal hole ring is manufactured, is adhered with the thin film material;
and then removing the film material part covering the area outside the surface of the metal hole ring in a windowing way such as laser cutting, and only reserving the film material part covering the surface area of the metal hole ring.
Optionally, the metal hole ring is 0.1mm-0.2mm larger than the single edge of the signal via hole, and the soft material layer completely covers the metal hole ring.
Compared with the prior art, the invention has the beneficial effects that:
the embodiment of the invention adopts the existing common materials on the market and combines and utilizes various mature processing technologies, realizes the manufacturing requirement of breaking the signal via hole on the specified layer, greatly reduces the production cost, has no design and manufacturing limit conditions, effectively ensures the processing quality, and is beneficial to batch popularization and application.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a flowchart of a method for manufacturing a signal via according to an embodiment of the present invention;
fig. 2 is a schematic diagram illustrating a manufacturing process of a signal via according to an embodiment of the present invention;
fig. 3 is an enlarged view of a portion a of fig. 2.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, the method for manufacturing a signal via with a hole wall and a copper layer disconnected at a specific layer according to the present embodiment specifically includes the following steps:
In this embodiment, the designated layer refers to a pre-designated hole wall copper layer breaking position of the via to be processed. In this step, according to the position of the designated layer, a core board is selected from core boards of each layer to be manufactured to form the PCB, and is used as a first core board to be manufactured with the metal ring 1 in the preset drilling area.
It should be noted that, in this embodiment, the designated layer may be one layer or may be multiple layers, and the number of the selected first core boards is consistent with the number of the designated layers. When the designated layer is a K layer (K is more than or equal to 1), the finally prepared hole wall copper layer of the signal via hole is divided into mutually disconnected K +1 parts along the axial direction of the via hole.
Meanwhile, the manufacturing number of the metal hole rings 1 on each first core board and the manufacturing area of each metal hole ring 1 are set according to the number of the through holes to be processed and the drilling positions on the surface of the PCB.
The metal ring 1 may be made of copper foil, and may be made simultaneously with the inner layer circuit pattern, or may be made step by step, and is not limited specifically.
In order to obtain higher product quality, each metal hole ring 1 is 0.1mm-0.2mm larger than the aperture single side of the corresponding through hole to be processed.
102, manufacturing an anti-electroplating soft material layer 2 covering the surface of the metal hole ring 1 on the first core board.
Soft material refers to a material which is soft in texture, resistant to high temperature and high pressure and can be removed in a certain manner. For example, the soft material may be a dry film, or may be ink that is not heat-curable, or other material as long as it has the above characteristics.
When a dry film is adopted, the method for manufacturing the dry film covering the surface of the metal eyelet 1 may specifically include: firstly, a dry film is pasted on the surface of the first core plate on which the metal hole ring 1 is manufactured, then, the dry film part covering the area outside the surface of the metal hole ring 1 is removed in an exposure and development mode, and only the dry film part covering the surface area of the metal hole ring 1 is reserved.
When other thin film materials are adopted, the method for manufacturing the soft material layer 2 covering the surface of the metal hole ring 1 specifically comprises the following steps: a thin film material is pasted on the surface of the first core plate, on which the metal hole ring 1 is manufactured, and then the thin film material part covering the area outside the surface of the metal hole ring 1 is removed through windowing modes such as laser cutting, and only the thin film material part covering the surface area of the metal hole ring 1 is reserved.
And 103, stacking the first core plate and other core plates according to a preset sequence, and then pressing to form the multilayer plate.
Specifically, before lamination, corresponding inner layer circuit pattern manufacturing needs to be respectively completed on other core boards; during pressing, prepregs are required to be stacked between adjacent layers of core boards, the core boards and the core boards are overlapped or copper foils are stacked on the outer surfaces of the outer layer core boards, and a high-temperature and high-pressure pressing mode is adopted to press the core boards and the core boards into a whole so as to form the multilayer board.
And step 104, drilling at a preset position of the drilling surface by taking any plate surface of the multilayer plate as the drilling surface, and forming a through hole penetrating through the corresponding metal hole ring 1 and the corresponding soft material layer 2 on the specified layer.
Meanwhile, a high-temperature environment is formed in the drilling process, so that the metal hole ring 1 and the soft material layer 2 are softened to a certain degree; when a hole is drilled to a designated layer, the drill is used to pull the metal hole ring 1, so that the metal hole ring 1 is extruded and deformed to one side of the soft material layer 2 to form a wedge-shaped structure, and the soft material layer 2 is not exposed due to being covered by the metal hole ring 1, as shown in fig. 3.
In this embodiment, the soft material layer 2 is mainly made of polymer resin, and has strong plasticity; the metal ring 1 is mainly made of copper foil, and the plasticity is low; the base material of the multilayer board can be made of glass fiber, resin and inorganic solid filler, most of the base material is the glass fiber soaked with the resin, and the inorganic filler is added. Therefore, the plasticity of the base material is lower than that of the soft material layer 2 and higher than that of the metal hole ring 1.
In the drilling process, the rotation speed of the drill is controlled, so that a preset high-temperature environment (such as 200-300 ℃) is generated by friction between the high-speed cutting drill and the multilayer board, the base material, the metal hole ring 1 and the soft material layer 2 of the multilayer board are softened in the high-temperature environment, and meanwhile, based on the material characteristics, the metal hole ring 1 deforms under the rotary cutting extrusion and the heat effect of the drill and extrudes the softened base material and the soft material layer 2; after drilling is finished, the temperature is reduced, the base material and the soft material layer 2 recover to a rigid state, the metal hole ring 1 cannot recover to an original state after extrusion deformation due to low plasticity, the extrusion degree of the metal hole ring 1 to the soft material layer 2 is higher than that of the soft material layer 2 to the base material, and therefore the metal hole ring 1 located on a specified layer is formed into a wedge-shaped structure, namely a nail head shape, and the outer edge of the soft material layer 2 close to the hole wall is covered. And, the greater the thickness of the soft material layer 2, the higher the degree of wedge.
In the embodiment, a high-temperature environment is manufactured by using different characteristics of three materials (the base material, the metal hole ring 1 and the soft material layer 2), so that the metal hole ring 1 is deformed into the soft and plastic soft material layer 2 under the extrusion action of the drill to form an oriented wedge-shaped structure.
And 105, depositing a conductive layer on the plate surface of the multilayer plate and the inner wall of the through hole.
The conductive layer can be carbon powder or graphite, and is deposited on the plate surface and the hole wall of the multilayer plate in a physical adsorption mode. The conductive layer is positively charged, so that the conductive layer is mainly adsorbed and deposited on the negatively charged base material of the multilayer board, and the surface adsorption amount of the positively charged copper layer is very small or the conductive layer is easy to clean and fall off.
And 106, carrying out microetching on the multilayer board on which the conductive layer is deposited, removing the metal part of the metal hole ring 1, which covers the soft material layer 2, and simultaneously removing a small amount of conductive layer attached to the surface of the metal part so as to expose the soft material layer 2.
And 107, carrying out whole-board electroplating on the multilayer board.
In the electroplating process, the positions of the hole walls, which are provided with the conductive layers and the copper layers, are all plated with the copper layers, and the positions of the hole walls, which are provided with the soft material layers 2, cannot be plated with the copper layers. After the whole board is electroplated, the hole wall copper layer is disconnected at the corresponding position (namely the designated layer) of the soft material layer 2.
In this step, the soft material layer 2 at the designated layer position can be completely removed by adopting a conventional film removing process, and the details are not limited.
In this embodiment, the wedge-shaped processing step of processing the metal eyelet 1 into the wedge-shaped structure from the conventional structure and the conventional drilling step of the signal via hole are implemented by synchronous operations, that is, in the drilling step, a high-temperature environment is generated by high-speed rotation friction of a drill to soften the metal eyelet 1 and the soft material layer 2, and the drill is used to extrude and deform the metal eyelet 1 and the soft material layer 2.
Indeed, in other embodiments, the two processes may also be performed in steps: the conventional drilling process is firstly carried out, and then the wedge-shaped processing process is carried out on the metal ring 1 at the designated layer position.
When the stepped operation mode is adopted, in the wedge-shaped processing procedure, a softening technology (not limited to a high-temperature softening mode, but also other softening liquid medicines can be applied to realize a softening effect, specifically, not limited) can be firstly adopted to soften the metal hole ring 1 and the soft material layer 2 on the appointed layer, and then tools such as a drill and the like which can realize the extruding or pulling functions are used for extruding and deforming the metal hole ring 1 to one side of the soft material layer 2 until a wedge-shaped structure meeting the requirements is formed.
In summary, the method for manufacturing the signal via hole provided by the embodiment of the invention adopts the existing common materials in the market and combines and utilizes various mature processing technologies, so that the manufacturing requirement of the signal via hole on the disconnection of the specified layer is realized, the production cost is greatly reduced, a plurality of design and manufacturing limiting conditions are avoided, the processing quality is effectively ensured, the bad phenomena of separation, displacement and the like between core plates of all layers of the PCB product are avoided, and the whole process flow is simple and has strong realizability. In addition, the method has a plurality of unique effects in the aspect of signal and assembly function design, can be applied to realizing the zero stub control requirement of the signal via hole, manufacturing a buried hole through one-time pressing, manufacturing a double-sided compression joint hole through one-time pressing, realizing a plurality of networks in one hole and the like, and has a larger application market.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A method for making a signal via, the method comprising:
manufacturing a metal hole ring in a preset drilling area for a first core plate positioned on an appointed layer according to a preset plate stacking sequence;
manufacturing an anti-electroplating soft material layer on the surface of the metal hole ring;
stacking the first core plate and other core plates according to a preset sequence and then pressing to form a multilayer plate;
drilling and wedge-shaped processing to form a through hole penetrating through the metal hole ring and the soft material layer, wherein the metal hole ring is deformed into a wedge-shaped structure extruded towards the soft material layer so as to cover the soft material layer on an exposed area of the hole wall;
depositing a conductive layer on the multilayer board, and then removing the metal layer covered outside the soft material layer to expose the soft material layer;
and electroplating the through hole.
2. The method of making a signal via of claim 1, wherein said step of performing a drilling operation and a wedge machining operation comprises:
drilling holes in the multilayer board; forming a high-temperature environment which is not lower than a preset temperature threshold in the drilling process, wherein the preset temperature threshold is the lowest environment temperature which enables the metal hole ring and the soft material layer to reach a specified softening degree;
and simultaneously, in the drilling process, the metal hole ring is pulled by a drill so that the metal hole ring is extruded and deformed to form the wedge-shaped structure on one side of the soft material layer.
3. The method of making a signal via of claim 1, wherein said step of performing a drilling operation and a wedge machining operation comprises:
drilling a hole in the multilayer board to form a through hole penetrating through the metal hole ring and the soft material layer;
after drilling, softening the metal hole ring and the soft material layer;
and pressing and transforming the softened metal hole ring to one side of the soft material layer by using a specified tool to form the wedge-shaped structure.
4. The method of making a signal via of claim 1, further comprising, after said step of electroplating said via: and removing the soft material layer.
5. The method of claim 1, wherein the flexible material layer comprises a dry film, ink, or film material.
6. The method of claim 5, wherein the step of forming the dry film on the surface of the metal eyelet comprises:
firstly, the dry film is pasted on the surface of the first core plate on which the metal hole ring is manufactured;
and then, removing the dry film part covering the region outside the surface of the metal hole ring in an exposure and development mode, and only reserving the dry film part covering the surface region of the metal hole ring.
7. The method of claim 5, wherein said step of forming said thin film material on said metal eyelet surface comprises:
the surface of the first core plate, on which the metal hole ring is manufactured, is adhered with the thin film material;
and then removing the film material part covering the area outside the surface of the metal hole ring in a windowing way such as laser cutting, and only reserving the film material part covering the surface area of the metal hole ring.
8. The method of claim 1, wherein the metal eyelet is 0.1mm-0.2mm larger than a single edge of the signal eyelet, and the flexible material layer completely covers the metal eyelet.
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| CN201911380190.3A CN110996526B (en) | 2019-12-27 | 2019-12-27 | Method for manufacturing signal via hole |
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| CN201911380190.3A CN110996526B (en) | 2019-12-27 | 2019-12-27 | Method for manufacturing signal via hole |
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| CN110996526B (en) | 2020-11-03 |
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