CN110989292B - 一种基板制备精细纹理的方法 - Google Patents
一种基板制备精细纹理的方法 Download PDFInfo
- Publication number
- CN110989292B CN110989292B CN201911254741.1A CN201911254741A CN110989292B CN 110989292 B CN110989292 B CN 110989292B CN 201911254741 A CN201911254741 A CN 201911254741A CN 110989292 B CN110989292 B CN 110989292B
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- substrate
- photoresist
- etching
- fine texture
- exposure
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- 239000000758 substrate Substances 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 27
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 89
- 238000005530 etching Methods 0.000 claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 238000001039 wet etching Methods 0.000 claims abstract description 8
- 238000011161 development Methods 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims abstract description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- SQEHCNOBYLQFTG-UHFFFAOYSA-M lithium;thiophene-2-carboxylate Chemical compound [Li+].[O-]C(=O)C1=CC=CS1 SQEHCNOBYLQFTG-UHFFFAOYSA-M 0.000 claims description 7
- 238000004132 cross linking Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 230000001680 brushing effect Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 6
- -1 drying Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000001020 plasma etching Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911254741.1A CN110989292B (zh) | 2019-12-10 | 2019-12-10 | 一种基板制备精细纹理的方法 |
Applications Claiming Priority (1)
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CN201911254741.1A CN110989292B (zh) | 2019-12-10 | 2019-12-10 | 一种基板制备精细纹理的方法 |
Publications (2)
Publication Number | Publication Date |
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CN110989292A CN110989292A (zh) | 2020-04-10 |
CN110989292B true CN110989292B (zh) | 2023-03-17 |
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Family Applications (1)
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CN201911254741.1A Active CN110989292B (zh) | 2019-12-10 | 2019-12-10 | 一种基板制备精细纹理的方法 |
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CN (1) | CN110989292B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112321168A (zh) * | 2020-10-19 | 2021-02-05 | 武汉金鸿桦烨电子科技有限公司 | 一种在玻璃表面形成精密光学纹路的加工方法 |
CN113955946A (zh) * | 2021-10-20 | 2022-01-21 | 滁州明永光电科技有限公司 | 一种新型纹理效果的制作方法 |
CN117383840A (zh) * | 2023-10-18 | 2024-01-12 | 东莞市友辉光电科技有限公司 | 一种用于车载显示防眩盖板的制备方法 |
Citations (9)
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---|---|---|---|---|
CN102170763A (zh) * | 2010-02-27 | 2011-08-31 | 比亚迪股份有限公司 | 一种表面有皮纹纹理的金属壳体及其制备方法 |
CN103199016A (zh) * | 2013-03-15 | 2013-07-10 | 上海华力微电子有限公司 | 防止光刻胶在湿法刻蚀中产生缺陷的工艺方法 |
JP2014071408A (ja) * | 2012-10-01 | 2014-04-21 | Shin Etsu Chem Co Ltd | パターン形成方法 |
CN103889158A (zh) * | 2014-03-17 | 2014-06-25 | 深圳市宇顺电子股份有限公司 | 一种石墨烯精细线路的制备方法 |
CN104205350A (zh) * | 2012-03-12 | 2014-12-10 | 三菱电机株式会社 | 太阳能电池单元的制造方法 |
CN106249549A (zh) * | 2016-10-21 | 2016-12-21 | 南京华东电子信息科技股份有限公司 | 有机膜技术与ito薄膜技术共用掩膜板的方法 |
CN109239815A (zh) * | 2017-07-10 | 2019-01-18 | 上海箩箕技术有限公司 | 盖板及其形成方法、盖板母板、电子设备 |
CN109946922A (zh) * | 2019-04-23 | 2019-06-28 | 马颖鏖 | 光学表面微轮廓二维直接成像制造及光学表面平整修形方法 |
CN110429061A (zh) * | 2019-08-19 | 2019-11-08 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
-
2019
- 2019-12-10 CN CN201911254741.1A patent/CN110989292B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102170763A (zh) * | 2010-02-27 | 2011-08-31 | 比亚迪股份有限公司 | 一种表面有皮纹纹理的金属壳体及其制备方法 |
CN104205350A (zh) * | 2012-03-12 | 2014-12-10 | 三菱电机株式会社 | 太阳能电池单元的制造方法 |
JP2014071408A (ja) * | 2012-10-01 | 2014-04-21 | Shin Etsu Chem Co Ltd | パターン形成方法 |
CN103199016A (zh) * | 2013-03-15 | 2013-07-10 | 上海华力微电子有限公司 | 防止光刻胶在湿法刻蚀中产生缺陷的工艺方法 |
CN103889158A (zh) * | 2014-03-17 | 2014-06-25 | 深圳市宇顺电子股份有限公司 | 一种石墨烯精细线路的制备方法 |
CN106249549A (zh) * | 2016-10-21 | 2016-12-21 | 南京华东电子信息科技股份有限公司 | 有机膜技术与ito薄膜技术共用掩膜板的方法 |
CN109239815A (zh) * | 2017-07-10 | 2019-01-18 | 上海箩箕技术有限公司 | 盖板及其形成方法、盖板母板、电子设备 |
CN109946922A (zh) * | 2019-04-23 | 2019-06-28 | 马颖鏖 | 光学表面微轮廓二维直接成像制造及光学表面平整修形方法 |
CN110429061A (zh) * | 2019-08-19 | 2019-11-08 | 京东方科技集团股份有限公司 | 一种显示基板及其制作方法、显示装置 |
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Effective date of registration: 20231216 Address after: 430000 No.111, 1st floor, No.1 standard workshop, zone 3, Junshan science and Technology Industrial Park, Wuhan Economic and Technological Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Jinhong Huaye Electronic Technology Co.,Ltd. Address before: 523000 Industrial Zone, Chuangye Road, Bajiaowo Community, Wanjiang District, Dongguan City, Guangdong Province Patentee before: U-GREAT OPTOELECTRONICS TECHNOLOGY CO.,LTD. |
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Effective date of registration: 20240105 Address after: 523000 building 3, No.1, bajiaowo Chuangye Road, Wanjiang street, Dongguan City, Guangdong Province Patentee after: U-GREAT OPTOELECTRONICS TECHNOLOGY CO.,LTD. Address before: 430000 No.111, 1st floor, No.1 standard workshop, zone 3, Junshan science and Technology Industrial Park, Wuhan Economic and Technological Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Jinhong Huaye Electronic Technology Co.,Ltd. |