CN110957394A - Manufacturing system and manufacturing method of sectional type photovoltaic solder strip - Google Patents
Manufacturing system and manufacturing method of sectional type photovoltaic solder strip Download PDFInfo
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- CN110957394A CN110957394A CN201911291851.5A CN201911291851A CN110957394A CN 110957394 A CN110957394 A CN 110957394A CN 201911291851 A CN201911291851 A CN 201911291851A CN 110957394 A CN110957394 A CN 110957394A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 180
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 239000000843 powder Substances 0.000 claims abstract description 190
- 238000002844 melting Methods 0.000 claims abstract description 43
- 230000008018 melting Effects 0.000 claims abstract description 43
- 230000004907 flux Effects 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 21
- 230000000903 blocking effect Effects 0.000 claims description 19
- 238000007790 scraping Methods 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 15
- 238000000137 annealing Methods 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 13
- 238000011084 recovery Methods 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims description 7
- 230000001154 acute effect Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 description 29
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 19
- 238000002360 preparation method Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 239000012634 fragment Substances 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to the technical field of sectional photovoltaic solder strips, in particular to a manufacturing system of a sectional photovoltaic solder strip and a manufacturing method thereof, which skillfully utilize the technical scheme that when a base strip moves, a driving assembly is matched to drive a powder baffle plate to reciprocate between a shielding station and a powder adding station, solder powder falling from a hopper falls on a pattern surface of the base strip at intervals, the solder powder exceeding the preset thickness is scraped by a forming die opening, a solder powder layer on the pattern surface is in the preset thickness, then the solder powder on the pattern surface is melted on the pattern surface by a hot melting device, and after the solder powder is taken out of the hot melting device, the solder powder is cooled to form a flat solder section, so that the pattern grooves on the pattern surface are filled into the flat solder section at intervals, the sectional photovoltaic solder strip is produced at high efficiency and high precision, the production cost is greatly reduced, the market competitiveness is improved, the structure is simple and novel, and the failure rate is low, is suitable for mass production.
Description
Technical Field
The invention relates to the technical field of sectional photovoltaic solder strips, in particular to a manufacturing system of a sectional photovoltaic solder strip and a preparation method thereof.
Background
At present, the reflection of light on the market welds the area and mostly is the one side and levels, and the one side is the decorative pattern form, and the decorative pattern main part is reflection solar ray to improve shading reuse rate, thereby promote photovoltaic module generating efficiency.
In order to protect the copper base material of the welding strip and be capable of being welded with the battery piece, the surface of the welding strip is coated with a tin-lead solder layer, the tin-lead solder layer on the surface of the welding strip is generally uniformly coated, the thickness of the tin-lead solder layer coated on the welding strip is very high, if the thickness of the tin-lead solder layer is too thick, the pattern grooves on the pattern surface of the welding strip can be easily filled with the tin-lead solder after hot melting welding; if the thickness of the tin-lead solder layer is too thin, a cold joint phenomenon can occur after the hot melting welding, so that the welding of the welding strip and the battery piece is poor;
in contrast, a sectional type reflective welding strip is also available in the market at present, namely, the pattern surface of the welding strip is sectional type; the tin-lead solder layer is thinner at the position needing light reflection on the pattern surface; the tin-lead solder layer is thicker at the position needing to be welded on the pattern surface; how to form the tin-lead solder layer on the pattern surface of the solder strip in a segmented manner is a key for realizing mass production of the segmented solder strip, which is also a technical problem that needs to be solved urgently by the technical personnel in the field.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: in order to solve the problem of how to form a tin-lead solder layer on the pattern surface of the solder strip in a segmented manner, a manufacturing system of a segmented photovoltaic solder strip and a preparation method thereof are provided.
The technical scheme adopted by the invention for solving the technical problems is as follows: a manufacturing system of a sectional type photovoltaic solder strip comprises a solder powder adding device and a hot melting device which are sequentially arranged along the moving direction of a base strip, wherein one surface of the base strip with a pattern groove is a pattern surface, and the pattern surface of the base strip is upward;
the device for adding the solder powder comprises a hopper for containing the solder powder, a powder baffle plate arranged between a discharge port of the hopper and a base band, a forming die orifice and a driving assembly, wherein the hopper is positioned above the base band, the discharge port of the hopper is opposite to a pattern surface of the base band, the driving assembly is used for driving the powder baffle plate to reciprocate between a shielding station and a powder adding station, the powder baffle plate blocks the solder powder at the discharge port from reaching the pattern surface of the base band when the powder baffle plate is positioned at the shielding station, and the powder baffle plate removes the blocking of the solder powder when the powder baffle plate is positioned at the shielding station;
the forming die is positioned between the hot melting device and the powder baffle and is used for scraping solder powder with the thickness exceeding the preset thickness on the pattern surface;
the hot melting device is used for melting the solder powder on the pattern surface.
When the base band is ingeniously utilized to move, the driving assembly is matched with the powder baffle plate to drive the powder baffle plate to reciprocate between the shielding station and the powder adding station, solder powder falling from the hopper falls onto the pattern surface of the base band at intervals, the solder powder exceeding the preset thickness is scraped through the forming die opening, the solder powder layer on the pattern surface is at the preset thickness, the solder powder on the pattern surface is melted on the pattern surface through the hot melting device, and the solder powder is cooled to form a flat solder section after the solder powder exits from the hot melting device, so that the pattern groove on the pattern surface is filled at intervals into the flat solder section, the high-efficiency and high-precision production of the sectional photovoltaic solder strip is realized, the production cost is greatly reduced, the structure is simple and novel, the fault rate is low, and the photovoltaic solder strip is suitable for mass production.
Furthermore, the forming die comprises a scraper and a support plate, the scraper is positioned above the base band, the support plate is positioned below the base band and supports the base band, the scraper is obliquely arranged along the length direction of the base band, and an included angle A between the scraper and the length direction of the base band is an acute angle;
the channel with a certain height is formed between the scraping plate and the supporting plate, so that the channel only allows the solder powder layer with the preset thickness to pass through along with the base band, redundant solder powder can be scraped off from the base band by the scraping plate, the solder powder layer on the base band is ensured to be in the preset thickness, the forming precision is improved, and the scraping plate which is obliquely arranged can scrape the redundant solder powder to the side of the base band, so that the solder powder is prevented from being scraped onto the reflecting section of the base band.
Further, a protective sleeve is arranged below the powder baffle, the base band penetrates through the protective sleeve, and an opening is formed in the position, opposite to the discharge hole of the hopper, of the upper surface of the protective sleeve; the arrangement of the protective sleeve enables the solder powder falling from the discharge port of the hopper to only reach the pattern surface of the base band through the opening of the protective sleeve, and the solder powder is prevented from falling to the part outside the smooth solder section of the pattern surface.
Furthermore, a recovery tank for collecting solder powder is arranged below the base band, and the recovery tank is opposite to the powder baffle plate; therefore, the solder powder falling out of the powder baffle plate and the base band can be collected for recycling.
Further, the forming die is opposite to the recovery groove; so that the solder powder scraped by the molding die can be collected for recycling.
The base band is soaked in the soldering flux trough in advance and then reaches the solder powder adding device; after the base band passes through the soldering flux trough, a certain amount of soldering flux can be attached to the surface of the base band, and subsequent solder powder can stay on the pattern surface.
Further, the device also comprises an annealing device, wherein the base band reaches the soldering flux trough after being annealed by the annealing device in advance; after the base band is continuously annealed by the annealing device, the yield strength is greatly reduced, the base band has the characteristic of super softness, hidden cracking and fragment risks in welding are effectively reduced, and the reliability of the assembly is improved.
The base band passes through the hot melting device and then reaches the marking device; the marking device marks a marking point at the starting point of each flat solder segment so as to be beneficial to the use and identification of a subsequent customer.
Further, the device also comprises an electroplating device, wherein the base band passes through the marking device and then reaches the electroplating device; the surface of the base band except the pattern surface is plated with 5-20um tin-lead solder plating, and the pattern surface is plated with 1-5um tin-lead solder plating.
Further, the device also comprises a winding device, and the base band reaches the winding device after passing through the electroplating device.
The preparation method of the manufacturing system adopting the sectional type photovoltaic solder strip at least comprises the following steps:
step 1), adding powder: continuously feeding solder powder to the base band pressed with the pattern grooves by a solder powder feeding device, enabling the pattern surface of the base band to be upward, and keeping the solder powder in the hopper to continuously fall from the discharge port of the hopper to the pattern surface of the base band;
meanwhile, the driving assembly drives the powder baffle to move back and forth between the shielding station and the powder adding station, and when the powder baffle moves to the shielding station, the powder baffle stops the solder powder at the discharge port from reaching the pattern surface of the base band, so that a section of the pattern surface is free of the solder powder and is a light reflecting section; when the powder blocking plate is positioned at the shielding station, the powder blocking plate releases the blocking of the solder powder, the solder powder falling from the discharge port falls onto the pattern surface of the base band, and a section of the pattern surface is provided with a solder powder layer;
step 2), powder scraping: passing the base band added with the powder in the step 1 through a forming die orifice to enable the forming die orifice to scrape the solder powder with the thickness exceeding the preset thickness on the pattern surface;
step 3), hot melting: and (3) enabling the base band subjected to powder scraping in the step (2) to pass through a hot melting device, melting the solder powder layer on the pattern surface in the hot melting device, and cooling and condensing the solder powder layer on the pattern surface on the base band after the base band is discharged from the hot melting device to form a flat solder section.
The invention has the beneficial effects that: when the base band moves, the driving assembly is matched to drive the powder blocking plate to reciprocate between the shielding station and the powder adding station, so that the solder powder falling from the hopper falls onto the pattern surface of the base band at intervals, the solder powder exceeding the preset thickness is scraped off through the forming die opening, the solder powder layer on the pattern surface is in the preset thickness, the solder powder on the pattern surface is melted on the pattern surface through the hot melting device, and the solder powder is cooled to form a flat solder section after leaving the hot melting device, so that the pattern grooves on the pattern surface are filled into the flat solder section at intervals, the high-efficiency and high-precision production of the sectional photovoltaic solder band is realized, the production cost is greatly reduced, the market competitiveness is improved, the structure is simple and novel, the failure rate is low, and the photovoltaic solder band is suitable for mass production.
Drawings
The invention is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic view of a manufacturing system for a segmented photovoltaic solder strip of the present invention;
FIG. 2 is a schematic diagram of the hopper, powder baffle, drive assembly and base belt in the sectional photovoltaic solder strip manufacturing system of the present invention;
FIG. 3 is a schematic front view of a forming die in the segmented photovoltaic solder strip manufacturing system of the present invention;
FIG. 4 is a schematic top view of a forming die in a segmented photovoltaic solder strip manufacturing system of the present invention;
fig. 5 is a schematic view of a segmented photovoltaic solder ribbon of the present invention.
In the figure: 1. an annealing device;
2. a soldering flux trough;
3. 3-1 parts of solder powder adding device, 3-11 parts of hopper, 3-2 parts of discharge port, 3-3 parts of powder baffle, 3-4 parts of driving component, 3-41 parts of forming die, 3-42 parts of scraping plate, 3-5 parts of supporting plate, 3-51 parts of protective sleeve, 3-6 parts of opening and a recovery tank;
4. a hot melting device;
5. a marking device;
6. an electroplating device;
7. a winding device;
8. 8-1 parts of base band, 8-2 parts of flat solder section, 8-3 parts of light reflecting section and marking points.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic diagrams illustrating the basic structure of the present invention only in a schematic manner, and thus show only the constitution related to the present invention, and directions and references (e.g., upper, lower, left, right, etc.) may be used only to help the description of the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.
Example 1
As shown in fig. 1, a manufacturing system of a sectional photovoltaic solder strip includes a solder powder adding device 3 and a hot melting device 4 sequentially arranged along a moving direction of a base strip 8, wherein one surface of the base strip 8 having a pattern groove is a pattern surface, and the pattern surface of the base strip 8 faces upward;
the solder powder adding device 3 is provided with a hopper 3-1 for containing solder powder, a powder blocking plate 3-2 arranged between a discharge port 3-11 of the hopper 3-1 and a base band 8, a forming die opening 3-4 and a driving assembly 3-3, wherein the hopper 3-1 is positioned above the base band 8, the discharge port 3-11 of the hopper is opposite to the pattern surface of the base band 8, the driving assembly 3-3 is used for driving the powder blocking plate 3-2 to reciprocate between a shielding station and a powder adding station, the powder blocking plate 3-2 blocks the solder powder at the discharge port 3-11 from reaching the pattern surface of the base band 8 when the powder blocking plate 3-2 is positioned at the shielding station, and the powder blocking plate 3-2 releases the blocking of the solder powder when the powder blocking plate 3-2 is positioned at the shielding station;
the forming die opening 3-4 is positioned between the hot melting device 4 and the powder baffle 3-2 and is used for scraping solder powder with the thickness exceeding the preset thickness on the pattern surface;
the hot melting device 4 is used for melting the solder powder on the pattern surface.
The driving assembly 3-3 in the embodiment can adopt a motor or an air cylinder, when the driving assembly 3-3 adopts the motor, the output end of the motor is in transmission connection with the powder baffle plate 3-2, the motor drives the powder baffle plate 3-2 to rotate from the powder adding station to the shielding station, and then the shielding station rotates to the powder adding station, so that the circulation is realized; when the driving assembly 3-3 adopts the air cylinder, the output end of the air cylinder is in transmission connection with the powder baffle plate 3-2, the air cylinder drives the powder baffle plate 3-2 to move from the powder adding station to the shielding station, and then the powder baffle plate returns to the powder adding station from the shielding station, so that circulation is realized.
The forming die opening 3-4 comprises a scraping plate 3-41 and a supporting plate 3-42, the scraping plate 3-41 is positioned above the base band 8, the supporting plate 3-42 is positioned below the base band 8 and supports the base band 8, the scraping plate 3-41 is obliquely arranged along the length direction of the base band 8, and an included angle A between the scraping plate 3-41 and the length direction of the base band 8 is an acute angle;
the channels with certain height are formed between the scrapers 3-41 and the supporting plates 3-42, so that only a solder powder layer with preset thickness can pass through the base belt 8, and the redundant solder powder can be scraped off from the base belt 8 by the scrapers 3-41, so that the solder powder layer on the base belt 8 is ensured to be in the preset thickness, the forming precision is improved, and the obliquely arranged scrapers 3-41 can scrape the redundant solder powder to the side of the base belt 8 so as to avoid the solder powder from being scraped to the light reflecting section 8-2 of the base belt 8.
A protective sleeve 3-5 is arranged below the powder baffle 3-2, the base belt 8 penetrates through the protective sleeve 3-5, and an opening 3-51 is formed in the position, opposite to the discharge hole 3-11 of the hopper 3-1, of the upper surface of the protective sleeve 3-5; the length of the opening 3-51 on the protective sleeve 3-5 is slightly larger than that of the flat solder section 8-1, and the protective sleeve 3-5 is arranged, so that solder powder falling from the discharge port 3-11 of the hopper 3-1 can only reach the pattern surface of the base band 8 through the opening 3-51 of the protective sleeve 3-5, and the solder powder is prevented from falling to the part outside the flat solder section 8-1 of the pattern surface.
A recovery tank 3-6 for collecting solder powder is arranged below the base band 8, and the recovery tank 3-6 is opposite to the powder baffle 3-2; so that the solder powder falling out of the powder baffle 3-2 and the base band 8 can be collected for recycling.
The forming die opening 3-4 is opposite to the recovery groove 3-6; so that the solder powder scraped off by the molding dies 3-4 can be collected for recycling.
The base band 8 is soaked in the soldering flux trough 2 in advance and then reaches the solder powder adding device 3; after the base band 8 passes through the soldering flux trough 2, a certain amount of soldering flux can be adhered to the surface of the base band, and subsequent solder powder can stay on the pattern surface.
The device also comprises an annealing device 1, wherein the base band 8 reaches the soldering flux trough 2 after being annealed by the annealing device 1 in advance; after the base band 8 is continuously annealed by the annealing device 1, the yield strength is greatly reduced, the base band has the characteristic of super softness, hidden cracking and fragment risks in welding are effectively reduced, and the reliability of the assembly is improved.
The base band 8 passes through the hot melting device 4 and then reaches the marking device 5; the marking device 5 marks a marking point 8-3 at the starting point of each flat solder segment 8-1 so as to facilitate the use and identification of a subsequent customer.
The base band 8 passes through the marking device 5 and then reaches the electroplating device 6; the surface of the base band 8 except the pattern surface is plated with 5-20um tin-lead solder plating, and the pattern surface is plated with 1-5um tin-lead solder plating.
The device further comprises a winding device 7, and the base band 8 reaches the winding device 7 after passing through the electroplating device 6.
The cross section of the welding strip in the embodiment is square, the pattern surface of the base strip 8 is pressed into continuous pattern grooves through a pattern roller, the base strip 8 can specifically adopt a copper base strip 8, and the base strip 8 sequentially passes through related devices of the manufacturing system at the moving speed of 100 plus 150 meters/minute under the action of the driving force of an external power mechanism; the solder powder in the hopper 3-1 is spherical tin-lead solder powder with the grain diameter of 25-45 μm.
The preparation method of the manufacturing system adopting the sectional type photovoltaic solder strip at least comprises the following steps:
step 1), annealing: continuously annealing the base band 8 pressed with the pattern grooves by an annealing device 1; the yield strength of the base band 8 is reduced, the ultra-soft characteristic is achieved, the hidden crack and fragment risks in welding are effectively reduced, and the reliability of the assembly is improved;
step 2), adding soldering flux: continuously passing the annealed base band 8 through a soldering flux trough 2 to adhere a certain amount of soldering flux; the subsequent solder powder can be stopped on the pattern surface;
step 3), adding powder: continuously passing the base band 8 added with the soldering flux through a soldering flux powder adding device 3 to add the soldering flux powder, enabling the pattern surface of the base band 8 to be upward, and keeping the soldering flux powder in the hopper 3-1 to continuously fall from a discharge port 3-11 of the hopper 3-1 to the pattern surface of the base band 8;
meanwhile, the driving assembly 3-3 drives the powder baffle 3-2 to move back and forth between the shielding station and the powder adding station, when the powder baffle 3-2 moves to the shielding station, the powder baffle 3-2 stops the solder powder at the discharge port 3-11 from reaching the pattern surface of the base band 8, so that a section of the solder powder on the pattern surface is not provided and is a light reflecting section 8-2; when the powder baffle 3-2 is positioned at the shielding station, the powder baffle 3-2 releases the blocking of the solder powder, the solder powder dropped from the discharge port 3-11 falls on the pattern surface of the base band 8, and a section of the pattern surface is provided with a solder powder layer;
step 4), powder scraping: passing the base band 8 after being powdered in the step 3 through a forming die opening 3-4, so that the forming die opening 3-4 scrapes off solder powder with a thickness exceeding the preset thickness on the pattern surface;
step 5), hot melting: the base band 8 after powder scraping in the step 2 passes through the hot melting device 4, the solder powder layer on the pattern surface is melted in the hot melting device 4, and after the base band 8 goes out of the hot melting device 4, the solder powder layer on the pattern surface is cooled and condensed on the base band 8 to form a flat solder section 8-1;
step 6), marking: continuously passing the base band 8 after passing through the hot melting device 4 through the marking device 5, and marking a marking point 8-3 at the starting point of each flat solder segment 8-1 by the marking device 5; so as to facilitate the identification of subsequent customer use;
step 7), electroplating: continuously passing the base band 8 after passing through the marking device 5 through an electroplating device 6, plating a tin-lead solder coating of 5-20um on the surface of the base band 8 except the pattern surface by the electroplating device 6, and plating a tin-lead solder coating of 1-5um on the pattern surface;
and 8) taking up, namely rolling the welding strip obtained after electroplating by using a collecting device to finish the preparation of the welding strip.
The pattern surface of the prepared sectional type reflective welding strip is provided with a plurality of repeating units along the length direction, and each repeating unit consists of a reflective section 8-2 and a flat welding material section 8-1; the upper surface of the light reflecting section 8-2 is provided with a pattern groove structure, the lower surface of the welding strip at the position corresponding to the light reflecting section 8-2 is flat and is welded on the front surface of the battery piece, so that the light is fully utilized for multiple times, and the output power of the assembly is increased; the upper surface and the lower surface of the part of the welding strip corresponding to the flat welding material section 8-1 are flat, and the welding strip is welded on the back surface of the battery plate and is in flat contact with the back electrode to form good ohmic contact;
the preparation method has the advantages that the base band 8 has high running speed and high productivity, the tin-lead solder powder can be recycled, the utilization rate can reach more than 98 percent, and the production cost is greatly reduced;
the flat solder section 8-1 of the sectional photovoltaic solder strip produced by the preparation method is formed by filling tin-lead solder powder, so that the reliability of welding is greatly improved, and the empty-void solder and series-reverse rate of customers are reduced.
The welding strip is subjected to online annealing treatment, has the characteristic of ultra-softness, effectively reduces hidden cracking and fragment risks in welding, and increases the reliability of the assembly.
The welding strip can directly use the traditional welding mode, does not increase the cost of single series welding, and is suitable for mass production.
The principle of the embodiment is as follows: when the base band 8 moves, the driving assembly 3-3 is matched to drive the powder baffle plate 3-2 to reciprocate between the shielding station and the powder adding station, so that the solder powder falling from the hopper 3-1 falls on the pattern surface of the base band 8 at intervals, the solder powder exceeding the preset thickness is scraped through the forming die opening 3-4, the solder powder layer on the pattern surface is in the preset thickness, the solder powder on the pattern surface is melted on the pattern surface through the hot melting device 4, and the smooth solder section 8-1 is formed after the solder powder is taken out of the hot melting device 4 and cooled, so that the pattern grooves on the pattern surface are filled into the smooth solder section 8-1 at intervals, the segmented photovoltaic solder band is produced at high efficiency and high precision, the production cost is greatly reduced, the structure is simple, the fault rate is low, and the photovoltaic solder band is suitable for mass production; wherein, the solder powder in the hopper 3-1 can continuously and automatically fall by the self weight.
In light of the foregoing description of the preferred embodiment of the present invention, it is to be understood that numerous changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (11)
1. The utility model provides a manufacturing system of sectional type photovoltaic solder strip which characterized in that: the hot melting device comprises a solder powder adding device (3) and a hot melting device (4) which are sequentially arranged along the moving direction of a base band (8), wherein one surface of the base band (8) with a pattern groove is a pattern surface, and the pattern surface of the base band (8) is upward;
the solder powder feeding device (3) is provided with a hopper (3-1) for containing solder powder, a powder baffle plate (3-2) arranged between a discharge port (3-11) of the hopper (3-1) and a base band (8), a forming die opening (3-4) and a driving assembly (3-3), wherein the hopper (3-1) is positioned above the base band (8), the discharge port (3-11) is opposite to the pattern surface of the base band (8), the driving component (3-3) is used for driving the powder baffle plate (3-2) to move back and forth between the shielding station and the powder adding station, when the powder baffle plate (3-2) is positioned at the shielding station, the powder baffle plate (3-2) stops the solder powder at the discharge port (3-11) from reaching the pattern surface of the base band (8), when the powder blocking plate (3-2) is positioned at the shielding station, the powder blocking plate (3-2) releases the blocking of the solder powder;
the forming die opening (3-4) is positioned between the hot melting device (4) and the powder baffle plate (3-2) and is used for scraping solder powder with a thickness exceeding a preset thickness on the pattern surface;
and the hot melting device (4) is used for melting the solder powder on the pattern surface.
2. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: manufacturing system of sectional type photovoltaic solder strip, its characterized in that: the forming die opening (3-4) comprises a scraper (3-41) and a support plate (3-42), the scraper (3-41) is located above the base band (8), the support plate (3-42) is located below the base band (8) and supports the base band (8), the scraper (3-41) is obliquely arranged along the length direction of the base band (8), and an included angle A between the scraper (3-41) and the length direction of the base band (8) is an acute angle.
3. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: a protective sleeve (3-5) is arranged below the powder baffle (3-2), the base belt (8) penetrates through the protective sleeve (3-5), and an opening (3-51) is formed in the position, opposite to the discharge hole (3-11) of the hopper (3-1), of the upper surface of the protective sleeve (3-5).
4. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: a recovery tank (3-6) for collecting solder powder is arranged below the base belt (8), and the recovery tank (3-6) is opposite to the powder baffle plate (3-2).
5. The segmented photovoltaic solder strip manufacturing system of claim 4, wherein: the forming die opening (3-4) is opposite to the recovery groove (3-6).
6. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: the base band is characterized by further comprising a soldering flux trough (2) used for containing soldering flux, and the base band (8) is soaked in the soldering flux trough (2) in advance and then reaches the soldering flux powder adding device (3).
7. The segmented photovoltaic solder strip manufacturing system of claim 6, wherein: the flux soldering machine is characterized by further comprising an annealing device (1), wherein the base band (8) reaches the flux trough (2) after being annealed by the annealing device (1) in advance.
8. The segmented photovoltaic solder strip manufacturing system of claim 6, wherein: the hot melting device is characterized by further comprising a marking device (5), and the base tape (8) reaches the marking device (5) after passing through the hot melting device (4).
9. The segmented photovoltaic solder strip manufacturing system of claim 8, wherein: the base band marking device further comprises an electroplating device (6), and the base band (8) reaches the electroplating device (6) after passing through the marking device (5).
10. The segmented photovoltaic solder strip manufacturing system of claim 6, wherein: the device is characterized by further comprising a winding device (7), wherein the base band (8) reaches the winding device (7) after passing through the electroplating device (6).
11. A method of making a manufacturing system using the segmented photovoltaic solder ribbon of any one of claims 1-10, wherein: at least comprises the following steps:
step 1), adding powder: continuously passing the base belt (8) pressed with the pattern grooves through a solder powder adding device (3) to add solder powder, enabling the pattern surface of the base belt (8) to be upward, and keeping the solder powder in the hopper (3-1) to continuously fall from a discharge port (3-11) of the hopper (3-1) to the pattern surface of the base belt (8);
meanwhile, the driving assembly (3-3) drives the powder baffle (3-2) to move back and forth between the shielding station and the powder adding station, and when the powder baffle (3-2) moves to the shielding station, the powder baffle (3-2) stops solder powder at the discharge port (3-11) from reaching the pattern surface of the base band (8), so that a part of the pattern surface is free of solder powder and is a light reflecting section (8-2); when the powder blocking plate (3-2) is positioned at the shielding station, the powder blocking plate (3-2) releases the blocking of the solder powder, the solder powder falling from the discharge port (3-11) falls onto the pattern surface of the base band (8), and a section of the pattern surface is provided with a layer of solder powder layer;
step 2), powder scraping: enabling the base band (8) which is added with the powder in the step 1 to pass through a forming die opening (3-4), and scraping the solder powder with the thickness exceeding the preset thickness on the pattern surface by the forming die opening (3-4);
step 3), hot melting: and (3) enabling the base band (8) subjected to powder scraping in the step (2) to pass through a hot melting device (4), melting the solder powder layer on the pattern surface in the hot melting device (4), and cooling and condensing the solder powder layer on the pattern surface on the base band (8) after the base band (8) is taken out of the hot melting device (4) to form a flat solder section (8-1).
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115254547A (en) * | 2022-09-28 | 2022-11-01 | 江苏威腾新材料科技有限公司 | Photovoltaic round wire manufacturing device and manufacturing method thereof |
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2019
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115254547A (en) * | 2022-09-28 | 2022-11-01 | 江苏威腾新材料科技有限公司 | Photovoltaic round wire manufacturing device and manufacturing method thereof |
CN115254547B (en) * | 2022-09-28 | 2023-01-10 | 江苏威腾新材料科技有限公司 | Photovoltaic round wire manufacturing device and manufacturing method thereof |
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