CN210897324U - Manufacturing system of sectional type photovoltaic solder strip - Google Patents
Manufacturing system of sectional type photovoltaic solder strip Download PDFInfo
- Publication number
- CN210897324U CN210897324U CN201922251084.7U CN201922251084U CN210897324U CN 210897324 U CN210897324 U CN 210897324U CN 201922251084 U CN201922251084 U CN 201922251084U CN 210897324 U CN210897324 U CN 210897324U
- Authority
- CN
- China
- Prior art keywords
- powder
- base band
- solder
- pattern surface
- manufacturing system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Coating With Molten Metal (AREA)
- Photovoltaic Devices (AREA)
Abstract
The utility model relates to the technical field of sectional photovoltaic solder strips, in particular to a manufacturing system of sectional photovoltaic solder strips, when the base band is skillfully used for moving, the drive component is matched to drive the powder baffle plate to reciprocate between the shielding station and the powder adding station, so that the solder powder falling from the hopper falls onto the pattern surface of the base band at intervals, and scraping the solder powder exceeding the preset thickness through a forming die orifice to ensure that the solder powder layer on the pattern surface is in the preset thickness, then melting the solder powder on the pattern surface by a hot melting device, cooling after the solder powder is taken out of the hot melting device to form a flat solder section, the filling of the pattern groove interval on the pattern surface is the smooth welding material section, the production of the sectional type photovoltaic welding strip with high efficiency and high precision is realized, the production cost is greatly reduced, the market competitiveness is improved, the structure is simple and novel, the failure rate is low, and the photovoltaic welding strip is suitable for mass production.
Description
Technical Field
The utility model belongs to the technical field of sectional type photovoltaic solder strip technique and specifically relates to a manufacturing system in sectional type photovoltaic solder strip.
Background
At present, the reflection of light on the market welds the area and mostly is the one side and levels, and the one side is the decorative pattern form, and the decorative pattern main part is reflection solar ray to improve shading reuse rate, thereby promote photovoltaic module generating efficiency.
In order to protect the copper base material of the welding strip and be capable of being welded with the battery piece, the surface of the welding strip is coated with a tin-lead solder layer, the tin-lead solder layer on the surface of the welding strip is generally uniformly coated, the thickness of the tin-lead solder layer coated on the welding strip is very high, if the thickness of the tin-lead solder layer is too thick, the pattern grooves on the pattern surface of the welding strip can be easily filled with the tin-lead solder after hot melting welding; if the thickness of the tin-lead solder layer is too thin, a cold joint phenomenon can occur after the hot melting welding, so that the welding of the welding strip and the battery piece is poor;
in contrast, a sectional type reflective welding strip is also available in the market at present, namely, the pattern surface of the welding strip is sectional type; the tin-lead solder layer is thinner at the position needing light reflection on the pattern surface; the tin-lead solder layer is thicker at the position needing to be welded on the pattern surface; how to form the tin-lead solder layer on the pattern surface of the solder strip in a segmented manner is a key for realizing mass production of the segmented solder strip, which is also a technical problem that needs to be solved urgently by the technical personnel in the field.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: in order to solve the problem of how to form a tin-lead solder layer on the pattern surface of the solder strip in a segmented manner, a manufacturing system of a segmented photovoltaic solder strip is provided.
The utility model provides a technical scheme that its technical problem adopted is: a manufacturing system of a sectional type photovoltaic solder strip comprises a solder powder adding device and a hot melting device which are sequentially arranged along the moving direction of a base strip, wherein one surface of the base strip with a pattern groove is a pattern surface, and the pattern surface of the base strip is upward;
the device for adding the solder powder comprises a hopper for containing the solder powder, a powder baffle plate arranged between a discharge port of the hopper and a base band, a forming die orifice and a driving assembly, wherein the hopper is positioned above the base band, the discharge port of the hopper is opposite to a pattern surface of the base band, the driving assembly is used for driving the powder baffle plate to reciprocate between a shielding station and a powder adding station, the powder baffle plate blocks the solder powder at the discharge port from reaching the pattern surface of the base band when the powder baffle plate is positioned at the shielding station, and the powder baffle plate removes the blocking of the solder powder when the powder baffle plate is positioned at the shielding station;
the forming die is positioned between the hot melting device and the powder baffle and is used for scraping solder powder with the thickness exceeding the preset thickness on the pattern surface;
the hot melting device is used for melting the solder powder on the pattern surface.
When the base band is ingeniously utilized to move, the driving assembly is matched with the powder baffle plate to drive the powder baffle plate to reciprocate between the shielding station and the powder adding station, solder powder falling from the hopper falls onto the pattern surface of the base band at intervals, the solder powder exceeding the preset thickness is scraped through the forming die opening, the solder powder layer on the pattern surface is at the preset thickness, the solder powder on the pattern surface is melted on the pattern surface through the hot melting device, and the solder powder is cooled to form a flat solder section after the solder powder exits from the hot melting device, so that the pattern groove on the pattern surface is filled at intervals into the flat solder section, the high-efficiency and high-precision production of the sectional photovoltaic solder strip is realized, the production cost is greatly reduced, the structure is simple and novel, the fault rate is low, and the photovoltaic solder strip is suitable for mass production.
Furthermore, the forming die comprises a scraper and a support plate, the scraper is positioned above the base band, the support plate is positioned below the base band and supports the base band, the scraper is obliquely arranged along the length direction of the base band, and an included angle A between the scraper and the length direction of the base band is an acute angle;
the channel with a certain height is formed between the scraping plate and the supporting plate, so that the channel only allows the solder powder layer with the preset thickness to pass through along with the base band, redundant solder powder can be scraped off from the base band by the scraping plate, the solder powder layer on the base band is ensured to be in the preset thickness, the forming precision is improved, and the scraping plate which is obliquely arranged can scrape the redundant solder powder to the side of the base band, so that the solder powder is prevented from being scraped onto the reflecting section of the base band.
Further, a protective sleeve is arranged below the powder baffle, the base band penetrates through the protective sleeve, and an opening is formed in the position, opposite to the discharge hole of the hopper, of the upper surface of the protective sleeve; the arrangement of the protective sleeve enables the solder powder falling from the discharge port of the hopper to only reach the pattern surface of the base band through the opening of the protective sleeve, and the solder powder is prevented from falling to the part outside the smooth solder section of the pattern surface.
Furthermore, a recovery tank for collecting solder powder is arranged below the base band, and the recovery tank is opposite to the powder baffle plate; therefore, the solder powder falling out of the powder baffle plate and the base band can be collected for recycling.
Further, the forming die is opposite to the recovery groove; so that the solder powder scraped by the molding die can be collected for recycling.
The base band is soaked in the soldering flux trough in advance and then reaches the solder powder adding device; after the base band passes through the soldering flux trough, a certain amount of soldering flux can be attached to the surface of the base band, and subsequent solder powder can stay on the pattern surface.
Further, the device also comprises an annealing device, wherein the base band reaches the soldering flux trough after being annealed by the annealing device in advance; after the base band is continuously annealed by the annealing device, the yield strength is greatly reduced, the base band has the characteristic of super softness, hidden cracking and fragment risks in welding are effectively reduced, and the reliability of the assembly is improved.
The base band passes through the hot melting device and then reaches the marking device; the marking device marks a marking point at the starting point of each flat solder segment so as to be beneficial to the use and identification of a subsequent customer.
Further, the device also comprises an electroplating device, wherein the base band passes through the marking device and then reaches the electroplating device; the surface of the base band except the pattern surface is plated with 5-20um tin-lead solder plating, and the pattern surface is plated with 1-5um tin-lead solder plating.
Further, the device also comprises a winding device, and the base band reaches the winding device after passing through the electroplating device.
The preparation method of the manufacturing system adopting the sectional type photovoltaic solder strip at least comprises the following steps:
step 1), adding powder: continuously feeding solder powder to the base band pressed with the pattern grooves by a solder powder feeding device, enabling the pattern surface of the base band to be upward, and keeping the solder powder in the hopper to continuously fall from the discharge port of the hopper to the pattern surface of the base band;
meanwhile, the driving assembly drives the powder baffle to move back and forth between the shielding station and the powder adding station, and when the powder baffle moves to the shielding station, the powder baffle stops the solder powder at the discharge port from reaching the pattern surface of the base band, so that a section of the pattern surface is free of the solder powder and is a light reflecting section; when the powder blocking plate is positioned at the shielding station, the powder blocking plate releases the blocking of the solder powder, the solder powder falling from the discharge port falls onto the pattern surface of the base band, and a section of the pattern surface is provided with a solder powder layer;
step 2), powder scraping: passing the base band added with the powder in the step 1 through a forming die orifice to enable the forming die orifice to scrape the solder powder with the thickness exceeding the preset thickness on the pattern surface;
step 3), hot melting: and (3) enabling the base band subjected to powder scraping in the step (2) to pass through a hot melting device, melting the solder powder layer on the pattern surface in the hot melting device, and cooling and condensing the solder powder layer on the pattern surface on the base band after the base band is discharged from the hot melting device to form a flat solder section.
The utility model has the advantages that: the utility model discloses ingenious utilization baseband when removing, cooperation drive assembly drives the powder baffle and is sheltering from the reciprocating motion between station and the powder station, make solder powder spaced descending that falls in the hopper to the decorative pattern face of baseband, and strike off the solder powder that exceeds predetermined thickness through the shaping die orifice, make the solder powder layer on the decorative pattern face be in predetermined thickness, the solder powder melting that will be located on the decorative pattern face by hot melting device again is on the decorative pattern face, go out hot melting device after-cooling and form and level the solder section, with this for leveling the solder section with the packing of decorative pattern groove interval nature on the decorative pattern face, realize high efficiency, the production sectional type photovoltaic solder strip of high accuracy, greatly reduced manufacturing cost, improve market competitiveness, and simple structure is novel, the fault rate is low, and is suitable for the volume production.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a schematic view of a segmented photovoltaic solder strip manufacturing system of the present invention;
FIG. 2 is a schematic diagram showing the cooperation of the hopper, the powder baffle, the driving assembly and the base belt in the sectional photovoltaic solder strip manufacturing system of the present invention;
FIG. 3 is a schematic front view of a forming die in the sectional photovoltaic solder strip manufacturing system of the present invention;
FIG. 4 is a schematic top view of a forming die in a system for manufacturing a segmented photovoltaic solder strip according to the present invention;
fig. 5 is a schematic diagram of the sectional photovoltaic solder strip of the present invention.
In the figure: 1. an annealing device;
2. a soldering flux trough;
3. 3-1 parts of solder powder adding device, 3-11 parts of hopper, 3-2 parts of discharge port, 3-3 parts of powder baffle, 3-4 parts of driving component, 3-41 parts of forming die, 3-42 parts of scraping plate, 3-5 parts of supporting plate, 3-51 parts of protective sleeve, 3-6 parts of opening and a recovery tank;
4. a hot melting device;
5. a marking device;
6. an electroplating device;
7. a winding device;
8. 8-1 parts of base band, 8-2 parts of flat solder section, 8-3 parts of light reflecting section and marking points.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic drawings, which illustrate the basic structure of the invention only in a schematic way, and thus show only the components that are relevant to the invention, and the directions and references (e.g., upper, lower, left, right, etc.) may be used only to help describe the features in the drawings. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the claimed subject matter is defined only by the appended claims and equivalents thereof.
Example 1
As shown in fig. 1, a manufacturing system of a sectional photovoltaic solder strip includes a solder powder adding device 3 and a hot melting device 4 sequentially arranged along a moving direction of a base strip 8, wherein one surface of the base strip 8 having a pattern groove is a pattern surface, and the pattern surface of the base strip 8 faces upward;
the solder powder adding device 3 is provided with a hopper 3-1 for containing solder powder, a powder blocking plate 3-2 arranged between a discharge port 3-11 of the hopper 3-1 and a base band 8, a forming die opening 3-4 and a driving assembly 3-3, wherein the hopper 3-1 is positioned above the base band 8, the discharge port 3-11 of the hopper is opposite to the pattern surface of the base band 8, the driving assembly 3-3 is used for driving the powder blocking plate 3-2 to reciprocate between a shielding station and a powder adding station, the powder blocking plate 3-2 blocks the solder powder at the discharge port 3-11 from reaching the pattern surface of the base band 8 when the powder blocking plate 3-2 is positioned at the shielding station, and the powder blocking plate 3-2 releases the blocking of the solder powder when the powder blocking plate 3-2 is positioned at the shielding station;
the forming die opening 3-4 is positioned between the hot melting device 4 and the powder baffle 3-2 and is used for scraping solder powder with the thickness exceeding the preset thickness on the pattern surface;
the hot melting device 4 is used for melting the solder powder on the pattern surface.
The driving assembly 3-3 in the embodiment can adopt a motor or an air cylinder, when the driving assembly 3-3 adopts the motor, the output end of the motor is in transmission connection with the powder baffle plate 3-2, the motor drives the powder baffle plate 3-2 to rotate from the powder adding station to the shielding station, and then the shielding station rotates to the powder adding station, so that the circulation is realized; when the driving assembly 3-3 adopts the air cylinder, the output end of the air cylinder is in transmission connection with the powder baffle plate 3-2, the air cylinder drives the powder baffle plate 3-2 to move from the powder adding station to the shielding station, and then the powder baffle plate returns to the powder adding station from the shielding station, so that circulation is realized.
The forming die opening 3-4 comprises a scraping plate 3-41 and a supporting plate 3-42, the scraping plate 3-41 is positioned above the base band 8, the supporting plate 3-42 is positioned below the base band 8 and supports the base band 8, the scraping plate 3-41 is obliquely arranged along the length direction of the base band 8, and an included angle A between the scraping plate 3-41 and the length direction of the base band 8 is an acute angle;
the channels with certain height are formed between the scrapers 3-41 and the supporting plates 3-42, so that only a solder powder layer with preset thickness can pass through the base belt 8, and the redundant solder powder can be scraped off from the base belt 8 by the scrapers 3-41, so that the solder powder layer on the base belt 8 is ensured to be in the preset thickness, the forming precision is improved, and the obliquely arranged scrapers 3-41 can scrape the redundant solder powder to the side of the base belt 8 so as to avoid the solder powder from being scraped to the light reflecting section 8-2 of the base belt 8.
A protective sleeve 3-5 is arranged below the powder baffle 3-2, the base belt 8 penetrates through the protective sleeve 3-5, and an opening 3-51 is formed in the position, opposite to the discharge hole 3-11 of the hopper 3-1, of the upper surface of the protective sleeve 3-5; the length of the opening 3-51 on the protective sleeve 3-5 is slightly larger than that of the flat solder section 8-1, and the protective sleeve 3-5 is arranged, so that solder powder falling from the discharge port 3-11 of the hopper 3-1 can only reach the pattern surface of the base band 8 through the opening 3-51 of the protective sleeve 3-5, and the solder powder is prevented from falling to the part outside the flat solder section 8-1 of the pattern surface.
A recovery tank 3-6 for collecting solder powder is arranged below the base band 8, and the recovery tank 3-6 is opposite to the powder baffle 3-2; so that the solder powder falling out of the powder baffle 3-2 and the base band 8 can be collected for recycling.
The forming die opening 3-4 is opposite to the recovery groove 3-6; so that the solder powder scraped off by the molding dies 3-4 can be collected for recycling.
The base band 8 is soaked in the soldering flux trough 2 in advance and then reaches the solder powder adding device 3; after the base band 8 passes through the soldering flux trough 2, a certain amount of soldering flux can be adhered to the surface of the base band, and subsequent solder powder can stay on the pattern surface.
The device also comprises an annealing device 1, wherein the base band 8 reaches the soldering flux trough 2 after being annealed by the annealing device 1 in advance; after the base band 8 is continuously annealed by the annealing device 1, the yield strength is greatly reduced, the base band has the characteristic of super softness, hidden cracking and fragment risks in welding are effectively reduced, and the reliability of the assembly is improved.
The base band 8 passes through the hot melting device 4 and then reaches the marking device 5; the marking device 5 marks a marking point 8-3 at the starting point of each flat solder segment 8-1 so as to facilitate the use and identification of a subsequent customer.
The base band 8 passes through the marking device 5 and then reaches the electroplating device 6; the surface of the base band 8 except the pattern surface is plated with 5-20um tin-lead solder plating, and the pattern surface is plated with 1-5um tin-lead solder plating.
The device further comprises a winding device 7, and the base band 8 reaches the winding device 7 after passing through the electroplating device 6.
The cross section of the welding strip in the embodiment is square, the pattern surface of the base strip 8 is pressed into continuous pattern grooves through a pattern roller, the base strip 8 can specifically adopt a copper base strip 8, and the base strip 8 sequentially passes through related devices of the manufacturing system at the moving speed of 100 plus 150 meters/minute under the action of the driving force of an external power mechanism; the solder powder in the hopper 3-1 is spherical tin-lead solder powder with the grain diameter of 25-45 μm.
The preparation method of the manufacturing system adopting the sectional type photovoltaic solder strip at least comprises the following steps:
step 1), annealing: continuously annealing the base band 8 pressed with the pattern grooves by an annealing device 1; the yield strength of the base band 8 is reduced, the ultra-soft characteristic is achieved, the hidden crack and fragment risks in welding are effectively reduced, and the reliability of the assembly is improved;
step 2), adding soldering flux: continuously passing the annealed base band 8 through a soldering flux trough 2 to adhere a certain amount of soldering flux; the subsequent solder powder can be stopped on the pattern surface;
step 3), adding powder: continuously passing the base band 8 added with the soldering flux through a soldering flux powder adding device 3 to add the soldering flux powder, enabling the pattern surface of the base band 8 to be upward, and keeping the soldering flux powder in the hopper 3-1 to continuously fall from a discharge port 3-11 of the hopper 3-1 to the pattern surface of the base band 8;
meanwhile, the driving assembly 3-3 drives the powder baffle 3-2 to move back and forth between the shielding station and the powder adding station, when the powder baffle 3-2 moves to the shielding station, the powder baffle 3-2 stops the solder powder at the discharge port 3-11 from reaching the pattern surface of the base band 8, so that a section of the solder powder on the pattern surface is not provided and is a light reflecting section 8-2; when the powder baffle 3-2 is positioned at the shielding station, the powder baffle 3-2 releases the blocking of the solder powder, the solder powder dropped from the discharge port 3-11 falls on the pattern surface of the base band 8, and a section of the pattern surface is provided with a solder powder layer;
step 4), powder scraping: passing the base band 8 after being powdered in the step 3 through a forming die opening 3-4, so that the forming die opening 3-4 scrapes off solder powder with a thickness exceeding the preset thickness on the pattern surface;
step 5), hot melting: the base band 8 after powder scraping in the step 2 passes through the hot melting device 4, the solder powder layer on the pattern surface is melted in the hot melting device 4, and after the base band 8 goes out of the hot melting device 4, the solder powder layer on the pattern surface is cooled and condensed on the base band 8 to form a flat solder section 8-1;
step 6), marking: continuously passing the base band 8 after passing through the hot melting device 4 through the marking device 5, and marking a marking point 8-3 at the starting point of each flat solder segment 8-1 by the marking device 5; so as to facilitate the identification of subsequent customer use;
step 7), electroplating: continuously passing the base band 8 after passing through the marking device 5 through an electroplating device 6, plating a tin-lead solder coating of 5-20um on the surface of the base band 8 except the pattern surface by the electroplating device 6, and plating a tin-lead solder coating of 1-5um on the pattern surface;
and 8) taking up, namely rolling the welding strip obtained after electroplating by using a collecting device to finish the preparation of the welding strip.
The pattern surface of the prepared sectional type reflective welding strip is provided with a plurality of repeating units along the length direction, and each repeating unit consists of a reflective section 8-2 and a flat welding material section 8-1; the upper surface of the light reflecting section 8-2 is provided with a pattern groove structure, the lower surface of the welding strip at the position corresponding to the light reflecting section 8-2 is flat and is welded on the front surface of the battery piece, so that the light is fully utilized for multiple times, and the output power of the assembly is increased; the upper surface and the lower surface of the part of the welding strip corresponding to the flat welding material section 8-1 are flat, and the welding strip is welded on the back surface of the battery plate and is in flat contact with the back electrode to form good ohmic contact;
the preparation method has the advantages that the base band 8 has high running speed and high productivity, the tin-lead solder powder can be recycled, the utilization rate can reach more than 98 percent, and the production cost is greatly reduced;
the flat solder section 8-1 of the sectional photovoltaic solder strip produced by the preparation method is formed by filling tin-lead solder powder, so that the reliability of welding is greatly improved, and the empty-void solder and series-reverse rate of customers are reduced.
The welding strip is subjected to online annealing treatment, has the characteristic of ultra-softness, effectively reduces hidden cracking and fragment risks in welding, and increases the reliability of the assembly.
The welding strip can directly use the traditional welding mode, does not increase the cost of single series welding, and is suitable for mass production.
The principle of the embodiment is as follows: when the base band 8 moves, the driving assembly 3-3 is matched to drive the powder baffle plate 3-2 to reciprocate between the shielding station and the powder adding station, so that the solder powder falling from the hopper 3-1 falls on the pattern surface of the base band 8 at intervals, the solder powder exceeding the preset thickness is scraped through the forming die opening 3-4, the solder powder layer on the pattern surface is in the preset thickness, the solder powder on the pattern surface is melted on the pattern surface through the hot melting device 4, and the smooth solder section 8-1 is formed after the solder powder is taken out of the hot melting device 4 and cooled, so that the pattern grooves on the pattern surface are filled into the smooth solder section 8-1 at intervals, the segmented photovoltaic solder band is produced at high efficiency and high precision, the production cost is greatly reduced, the structure is simple, the fault rate is low, and the photovoltaic solder band is suitable for mass production; wherein, the solder powder in the hopper 3-1 can continuously and automatically fall by the self weight.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (10)
1. The utility model provides a manufacturing system of sectional type photovoltaic solder strip which characterized in that: the hot melting device comprises a solder powder adding device (3) and a hot melting device (4) which are sequentially arranged along the moving direction of a base band (8), wherein one surface of the base band (8) with a pattern groove is a pattern surface, and the pattern surface of the base band (8) is upward;
the solder powder feeding device (3) is provided with a hopper (3-1) for containing solder powder, a powder baffle plate (3-2) arranged between a discharge port (3-11) of the hopper (3-1) and a base band (8), a forming die opening (3-4) and a driving assembly (3-3), wherein the hopper (3-1) is positioned above the base band (8), the discharge port (3-11) is opposite to the pattern surface of the base band (8), the driving component (3-3) is used for driving the powder baffle plate (3-2) to move back and forth between the shielding station and the powder adding station, when the powder baffle plate (3-2) is positioned at the shielding station, the powder baffle plate (3-2) stops the solder powder at the discharge port (3-11) from reaching the pattern surface of the base band (8), when the powder blocking plate (3-2) is positioned at the shielding station, the powder blocking plate (3-2) releases the blocking of the solder powder;
the forming die opening (3-4) is positioned between the hot melting device (4) and the powder baffle plate (3-2) and is used for scraping solder powder with a thickness exceeding a preset thickness on the pattern surface;
and the hot melting device (4) is used for melting the solder powder on the pattern surface.
2. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: the forming die opening (3-4) comprises a scraper (3-41) and a support plate (3-42), the scraper (3-41) is located above the base band (8), the support plate (3-42) is located below the base band (8) and supports the base band (8), the scraper (3-41) is obliquely arranged along the length direction of the base band (8), and an included angle A between the scraper (3-41) and the length direction of the base band (8) is an acute angle.
3. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: a protective sleeve (3-5) is arranged below the powder baffle (3-2), the base belt (8) penetrates through the protective sleeve (3-5), and an opening (3-51) is formed in the position, opposite to the discharge hole (3-11) of the hopper (3-1), of the upper surface of the protective sleeve (3-5).
4. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: a recovery tank (3-6) for collecting solder powder is arranged below the base belt (8), and the recovery tank (3-6) is opposite to the powder baffle plate (3-2).
5. The segmented photovoltaic solder strip manufacturing system of claim 4, wherein: the forming die opening (3-4) is opposite to the recovery groove (3-6).
6. The segmented photovoltaic solder strip manufacturing system of claim 1, wherein: the base band is characterized by further comprising a soldering flux trough (2) used for containing soldering flux, and the base band (8) is soaked in the soldering flux trough (2) in advance and then reaches the soldering flux powder adding device (3).
7. The segmented photovoltaic solder strip manufacturing system of claim 6, wherein: the flux soldering machine is characterized by further comprising an annealing device (1), wherein the base band (8) reaches the flux trough (2) after being annealed by the annealing device (1) in advance.
8. The segmented photovoltaic solder strip manufacturing system of claim 6, wherein: the hot melting device is characterized by further comprising a marking device (5), and the base tape (8) reaches the marking device (5) after passing through the hot melting device (4).
9. The segmented photovoltaic solder strip manufacturing system of claim 8, wherein: the base band marking device further comprises an electroplating device (6), and the base band (8) reaches the electroplating device (6) after passing through the marking device (5).
10. The segmented photovoltaic solder strip manufacturing system of claim 6, wherein: the device is characterized by further comprising a winding device (7), wherein the base band (8) reaches the winding device (7) after passing through the electroplating device (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922251084.7U CN210897324U (en) | 2019-12-16 | 2019-12-16 | Manufacturing system of sectional type photovoltaic solder strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922251084.7U CN210897324U (en) | 2019-12-16 | 2019-12-16 | Manufacturing system of sectional type photovoltaic solder strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210897324U true CN210897324U (en) | 2020-06-30 |
Family
ID=71321261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922251084.7U Active CN210897324U (en) | 2019-12-16 | 2019-12-16 | Manufacturing system of sectional type photovoltaic solder strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210897324U (en) |
-
2019
- 2019-12-16 CN CN201922251084.7U patent/CN210897324U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2016049980A1 (en) | High-efficiency heterogeneous photovoltaic welding strip, and preparation method and production line for conductive baseband | |
| CN103337483B (en) | A kind of ultrathin VSOP packaging part and production method thereof | |
| CN104868015A (en) | Solder strip shaping mechanism | |
| CN2786142Y (en) | Flat type convection plate for bell furnace stacking | |
| CN104511495B (en) | The processing method that a kind of thin-walled strip prepares square tube | |
| CN110957394A (en) | Manufacturing system and manufacturing method of sectional type photovoltaic solder strip | |
| CN103928351A (en) | Semi-conductor lead framework production process | |
| CN210897324U (en) | Manufacturing system of sectional type photovoltaic solder strip | |
| CN110640121A (en) | Grid continuous casting and coating production line | |
| CN100411750C (en) | Coating device | |
| CN104308465A (en) | Boxy hole rolling method for large-sized high-thermal-conductivity diamond/copper composite board | |
| CN210837788U (en) | Reflection of light solder strip and photovoltaic module | |
| CN201324764Y (en) | Machine unit for welding titanium steel tube with accurate plasma | |
| CN111223953A (en) | Reflective welding strip, photovoltaic module and preparation method | |
| CN110534593A (en) | System of processing, processing method and the application method of dereliction grid cell piece copper mesh | |
| CN205943779U (en) | Dress shell equipment of condenser | |
| CN215946223U (en) | Square welding strip rolling processing equipment | |
| CN211404515U (en) | Photovoltaic solder strip | |
| CN208752254U (en) | A kind of optical cable production cable cooling water circulation device | |
| CN212146838U (en) | Bakelite heat extraction press that machining efficiency is high | |
| CN114645234A (en) | Leveling equipment for improving surface quality of zinc-aluminum-magnesium coating band steel | |
| CN204596819U (en) | A kind of welding strip reshaping mechanism | |
| CN102873065A (en) | Online surface cleaning and protection liquid coating process of aluminum alloy high frequency welding pipes and for heat exchanger | |
| CN207120552U (en) | Photovoltaic coiled material automatic processing device | |
| CN208880032U (en) | A kind of Machine Design fixture to cool down |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |