CN110954558A - Differential dark field microscopic defect detection device and method for transparent material - Google Patents
Differential dark field microscopic defect detection device and method for transparent material Download PDFInfo
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Abstract
The invention discloses a differential dark field microscopic defect detection device and method for a transparent material, wherein the device comprises a dark field illumination unit, a shelter, an imaging unit and a microscope objective, wherein the dark field illumination unit comprises a light source and an illumination lens; the light source, the illuminating lens, the shielding object and the microscope objective are sequentially arranged on a coaxial light path; the imaging unit comprises a spectroscope, a first cylindrical lens, a first CCD, a second cylindrical lens and a second CCD, light beams emitted from the microscope objective can be divided into 2 beams through the spectroscope, one beam is imaged on the first CCD through the first cylindrical lens, and the other beam is imaged on the second CCD through the second cylindrical lens. The first CCD imaging surface is positioned behind the focus, the second CCD imaging surface is positioned in front of the focus, and the distances from the imaging surfaces of the first CCD imaging surface and the second CCD imaging surface to the focus surface are equal. The invention can use the differential axial light intensity analysis method to carry out three-dimensional detection on the defects of the detected sample, can provide an effective means for detecting the defects on the surface and inside of the transparent material in industrial production and scientific research, and has the advantages of high axial resolution, easy realization and the like.
Description
Technical Field
The invention relates to the field of material detection, in particular to a differential dark field microscopic defect detection device and method for a transparent material.
Background
Accurate measurement of the three-dimensional morphology of surface and internal defects of transparent optical materials is one of the keys to obtaining high quality, low defect optical elements. Dark field scattering imaging can obtain high contrast defect imaging effect by separating illuminating background light from defect scattering light. The annular aperture dark field microscopic imaging method proposed by Liu Qian et al adopts a shelter to eliminate the influence of direct illuminating light so as to realize the surface and internal defects of the transparent material, has the advantages of high contrast defect imaging, simple structure, low cost, convenient adjustment, wide material thickness adaptability and the like, and has wide application prospect in the defect detection of the transparent material.
For a particular defect, due to defocusing and scattering effects, axial scanning of the defect can obtain a series of scattered light spots with different blurring degrees. How to rapidly and accurately acquire defect three-dimensional distribution information from a series of dark field scattering images is the key of defect three-dimensional reconstruction. The annular aperture dark field microscopic imaging method adopts a plane detection mode, utilizes the limited focal depth of the microscope objective lens, and determines the position of a focal plane by an axial light intensity analysis method to reconstruct three-dimensional distribution. For a particular defect, due to defocusing and scattering effects, axial scanning of the defect can obtain a series of scattered light spots with different blurring degrees. The spot at the focal plane is the smallest and the intensity is the highest, so by calculating the peak of the axial intensity curve, the position of the focal plane can be determined. However, the axial light intensity curve has the problems of slow signal change at the peak value, low sensitivity to defocusing amount, easy influence of noise and the like, so that the positioning accuracy is low, and the axial resolution of the measuring system is influenced.
Disclosure of Invention
The invention provides a differential dark field microscopic defect detection device and method of a transparent material, aiming at the problem of low axial resolution of an annular aperture dark field microscopic imaging method.
The invention is realized by the following technical scheme:
a differential dark-field microscopic defect detection device for a transparent material comprises a dark-field illumination unit, a shelter, an imaging unit and a microscope objective, wherein the dark-field illumination unit comprises a light source and an illumination lens; the imaging unit comprises a spectroscope, a first cylindrical lens, a first CCD, a second cylindrical lens and a second CCD, and the light source, the illuminating lens, the shielding object and the microscope objective are sequentially arranged on a coaxial light path; the light beam emitted from the microscope objective can be divided into 2 beams by a beam splitter, one beam is imaged on a first CCD through a first cylindrical lens, and the other beam is imaged on a second CCD through a second cylindrical lens. When the detection device in the scheme is adopted for detection, the detected sample made of the transparent material is arranged between the illuminating lens and the shielding object, and the direct illuminating light emitted by the light source irradiates the shielding object after passing through the illuminating lens and the detected sample. If the detected sample has defects, the defect scattered light enters the hole of the microscope objective which is not shielded by the shielding object and then is emitted from the microscope objective, and the emitted light beam is divided into a light beam A and a light beam B by the spectroscope. The light beam A passes through the first cylindrical lens and then is imaged on the first CCD, and the light beam A passes through the second cylindrical lens and then is imaged on the second CCD. The detection device of the scheme adopts a differential dark field microscopic defect detection mode to provide detection, the light intensity curves obtained by the front focus detector and the rear focus detector are subjected to differential subtraction, and the axial position when the differential curve is 0 is searched, namely the focal plane position corresponding to the defect. The method utilizes the part with the highest sensitivity of the axial response curve to realize precise zero-crossing trigger measurement, and can improve the axial resolution of defect detection.
Preferably, the imaging surface of the first CCD is located behind the focus, and the imaging surface of the second CCD is located in front of the focus. The distances from the imaging surfaces of the first CCD and the second CCD to the focal plane are equal and are offset.
As a further improvement of the present invention, the differential dark-field microscopic defect detecting apparatus for transparent materials further includes a displacement mechanism, and the displacement mechanism can drive the sample to be detected to move between the illumination lens and the shielding object. So, during the detection, the sample under test is installed on displacement mechanism, and displacement mechanism drives the sample under test and removes between lighting lens and shelter from thing 6 and test, the control of being convenient for more.
Preferably, the displacement mechanism is located between the illumination lens and the shielding object, and the direction in which the displacement mechanism drives the sample to be measured to move is parallel to the optical axis of the coaxial optical path.
Preferably, the size of the shield is smaller than the aperture size of the microscope objective, that is, the shield cannot completely shield the light incident hole of the microscope objective in the light path, and the light scattered by the defect can partially enter the light incident hole of the microscope objective.
The invention also provides a differential dark-field microscopic defect detection method of the transparent material, which utilizes the differential dark-field microscopic defect detection device of the transparent material to detect, and the method comprises the following steps:
s1: mounting a tested sample on a displacement mechanism between an illumination lens and a microscope objective;
s2: adjusting a tested sample to enable the region of interest of the tested sample to enter the imaging field of the microscope objective, and setting the speed of the displacement mechanism, the CCD sampling frequency of the first CCD and the second CCD and the sampling duration of the first CCD and the second CCD;
s3: and simultaneously starting the displacement mechanism, the first CCD and the second CCD to enable the detected sample to move at a uniform speed along the direction of the optical axis, and simultaneously acquiring the images of the detected sample before and after the focus scattered by the defect dark field.
Further, the differential dark-field microscopic defect detection method for the transparent material further comprises the following steps:
s4: the method comprises the following steps of performing three-dimensional reconstruction on the defects of a detected sample by using a differential axial light intensity analysis method, wherein the specific implementation method of the step comprises the following steps: and respectively extracting an axial light intensity curve a obtained by shooting by a first CCD and an axial light intensity curve b obtained by shooting by a second CCD, which correspond to the same position of the defect, and calculating the corresponding optical axis direction position when a-b is equal to 0, wherein the position is the focal plane of the defect.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1. the detection device adopts a differential dark field microscopic defect detection mode to provide detection, performs differential subtraction on light intensity curves obtained by a front focus detector and a rear focus detector, and finds an axial position when the differential curve is 0, namely the focal plane position of the corresponding defect; the part with the highest sensitivity of the axial response curve can be utilized to realize precise zero-crossing trigger measurement and improve the axial resolution.
2. The detection method adopts a differential dark field microscopic defect detection method, utilizes the part with the highest sensitivity of an axial response curve to realize precise zero-crossing trigger measurement, and can obtain axial resolution which is improved by 2 times compared with the traditional peak value analysis method.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a differential dark-field microscopic defect detecting apparatus for transparent material according to the present invention.
FIG. 2 is a flowchart of a differential dark-field microscopic defect detection method of transparent material in example 2 of the present invention.
Labels in the figure and corresponding part names:
1-light source, 2-lighting lens, 3-tested sample, 4-defect, 5-displacement mechanism, 6-shelter, 7-microscope objective, 8-spectroscope, 9-first cylindrical lens, 10-first CCD, 11-second cylindrical lens, 12-second CCD, and 13-offset.
Detailed Description
Accurate measurement of the three-dimensional morphology of surface and internal defects of transparent optical materials is one of the keys to obtaining high quality, low defect optical elements. For a specific defect in the prior art, due to the defocusing and scattering effects, a series of scattering light spots with different fuzzy degrees can be obtained by axially scanning the defect. How to rapidly and accurately acquire defect three-dimensional distribution information from a series of dark field scattering images is the key of defect three-dimensional reconstruction. The annular aperture dark field microscopic imaging method adopts a plane detection mode, utilizes the limited focal depth of the microscope objective lens, and determines the position of a focal plane by an axial light intensity analysis method to reconstruct three-dimensional distribution. For a particular defect, due to defocusing and scattering effects, axial scanning of the defect can obtain a series of scattered light spots with different blurring degrees. The spot at the focal plane is the smallest and the intensity is the highest, so by calculating the peak of the axial intensity curve, the position of the focal plane can be determined. However, the axial light intensity curve has the problems of slow signal change at the peak value, low sensitivity to defocusing amount, easy influence of noise and the like, so that the positioning accuracy is low, and the axial resolution of the measuring system is influenced. Based on the defects of the measuring method, the invention researches and develops a differential dark-field microscopic defect detecting device and method for the transparent material.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to one of ordinary skill in the art that: it is not necessary to employ these specific details to practice the present invention. In other instances, well-known structures, circuits, materials, or methods have not been described in detail so as not to obscure the present invention.
Throughout the specification, reference to "one embodiment," "an embodiment," "one example," or "an example" means: the particular features, structures, or characteristics described in connection with the embodiment or example are included in at least one embodiment of the invention. Thus, the appearances of the phrases "one embodiment," "an embodiment," "one example" or "an example" in various places throughout this specification are not necessarily all referring to the same embodiment or example. Furthermore, the particular features, structures, or characteristics may be combined in any suitable combination and/or sub-combination in one or more embodiments or examples. Further, those of ordinary skill in the art will appreciate that the illustrations provided herein are for illustrative purposes and are not necessarily drawn to scale. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the description of the present invention, it is to be understood that the terms "front", "rear", "left", "right", "upper", "lower", "vertical", "horizontal", "high", "low", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the scope of the present invention.
[ example 1 ]
As shown in fig. 1, the differential dark-field microscopic defect detecting apparatus for a transparent material of the present embodiment includes a light source 1, an illumination lens 2, a displacement mechanism 5, a shield 6, a microscope objective 7, a beam splitter 8, a first tube mirror 9, a first CCD10, a second tube mirror 11, and a second CCD 12. The light source 1 and the lighting lens 2 form a dark field lighting unit; the spectroscope 8, the first tube mirror 9, the first CCD10, the second tube mirror 11, and the second CCD12 constitute an imaging unit, and in this embodiment, a differential imaging unit, and the specific connection method thereof is: the light source 1, the illuminating lens 2, the shielding object 6 and the microscope objective 7 are sequentially arranged on a coaxial light path, and the sample 3 to be detected is arranged between the illuminating lens 2 and the shielding object 6 during use. The tested sample 3 is close to the imaging surface of the microscope objective 7. The measured sample 3 is mounted on the displacement mechanism 5, the displacement mechanism 5 is located between the illumination lens 2 and the shielding object 6, and the moving direction of the displacement mechanism 5 is parallel to the optical axis of the coaxial optical path, so that the displacement mechanism 5 can drive the measured sample 3 to move between the illumination lens 2 and the shielding object 6, and the direction in which the displacement mechanism 5 drives the measured sample 3 to move is also parallel to the optical axis of the coaxial optical path. The dimensions of the shield 6 are smaller than the aperture of the microscope objective 7.
The sample 3 to be measured is generally a transparent material. The direct illumination emitted by the light source 1 is irradiated on the shielding object 6 after passing through the illumination lens 2 and the tested sample 3. If the detected sample 3 has the defect 4, the scattered light of the defect 4 enters a hole of the microscope objective 7 which is not blocked by the blocking object 6 and then is emitted from the microscope objective 7, and the emitted light beam is divided into a light beam A and a light beam B through the spectroscope 8. The light beam A passes through the first barrel mirror 9 and is imaged on the first CCD10, and the light beam B passes through the second barrel mirror 11 and is imaged on the second CCD 12. The imaging surface of the first CCD10 is positioned at the back of focus, the imaging surface of the second CCD12 is positioned at the front of focus, the distances from the imaging surfaces to the focus surfaces of the two are equal, and the distances are offset 13.
The displacement mechanism in this embodiment is a commonly used moving device in the prior art, for example, but not limited to, a transport line, a transmission device, etc., and it only needs to drive the sample 3 to be measured to move between the illumination lens 2 and the shielding object 6, and the structure thereof is not described in detail in this embodiment.
[ example 2 ]
In this embodiment, a differential dark-field microscopic defect detection method for a transparent material is provided, and the method uses the differential dark-field microscopic defect detection device for the transparent material in embodiment 1 for detection, and the detection method is shown in fig. 2, and specifically includes the following steps:
the first step is as follows: starting a differential dark field microscopic defect detection device of a transparent material;
the second step is that: mounting the tested sample 3 on a displacement mechanism 5 between an illumination lens 2 and a microscope objective 7;
the third step: adjusting the tested sample 3 to enable the region of interest of the tested sample 3 to enter the imaging field of the microscope objective 7, and setting the speed of the displacement mechanism 5, the CCD sampling frequency of the first CCD10, the sampling time length of the first CCD, the CCD sampling frequency of the second CCD12 and the sampling time length of the second CCD 12;
the fourth step: simultaneously starting the displacement mechanism 5, the first CCD10 and the second CCD12 to enable the detected sample 3 to move at a uniform speed along the optical axis direction, and simultaneously acquiring the images after and before the focus scattered by the defect dark field of the detected sample 3 by the first CCD10 and the second CCD 12;
the fifth step: and (3) performing three-dimensional reconstruction on the defects of the detected sample 3 by using a differential axial light intensity analysis method.
The differential axial light intensity analysis method in the fifth step can be realized by the following method: and respectively extracting an axial light intensity curve a obtained by shooting by the first CCD10 and an axial light intensity curve b obtained by shooting by the second CCD12, which correspond to the same position of the defect, calculating the corresponding position in the optical axis direction when a-b is 0, and obtaining the position, namely the focal plane of the defect.
In this embodiment, the first CCD10 constitutes a front-focus back-focus detector, and the second CCD12 constitutes a back-focus detector; the detection method in the embodiment adopts a differential dark field microscopic defect detection method, the light intensity curves obtained by the front focus detector and the back focus detector are subjected to differential subtraction, the axial position when the differential curve is 0 is found as the focal plane position of the corresponding defect, the part with the highest sensitivity of the axial response curve is utilized to realize precise zero-crossing trigger measurement, and the axial resolution which is 2 times higher than that of the traditional peak value analysis method can be obtained.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A differential dark-field microscopic defect detection device of transparent materials comprises a dark-field illumination unit, a shelter (6), an imaging unit and a microscope objective (7), wherein the dark-field illumination unit comprises a light source (1) and an illumination lens (2); the light source (1), the illuminating lens (2), the shielding object (6) and the microscope objective (7) are sequentially arranged on a coaxial light path; the imaging unit is characterized by comprising a spectroscope (8), a first cylindrical mirror (9), a first CCD (10), a second cylindrical mirror (11) and a second CCD (12), wherein a light beam emitted from the microscope objective (7) can be divided into 2 beams through the spectroscope (8), one beam is imaged on the first CCD (10) through the first cylindrical mirror (9), and the other beam is imaged on the second CCD (12) through the second cylindrical mirror (11).
2. The differential dark field microscopic defect detecting apparatus of claim 1, wherein the imaging plane of the first CCD (10) is located at the back of focus and the imaging plane of the second CCD (12) is located at the front of focus.
3. The differential dark field microscopic defect detecting device of claim 2, wherein the distances from the imaging planes of the first CCD (10) and the second CCD (12) to the focal plane are equal.
4. The differential dark-field microscopic defect detecting device of transparent material according to any one of claims 1 to 3, characterized by further comprising a displacement mechanism (5), wherein the displacement mechanism (5) can drive the tested sample (3) to move between the illumination lens (2) and the shielding object (6).
5. The differential dark-field microscopic defect detecting apparatus of claim 4, wherein the displacement mechanism (5) is located between the illumination lens (2) and the shutter (6).
6. The differential dark-field microscopic defect detecting device of claim 4, wherein the direction of the displacement mechanism (5) moving the sample (3) to be detected is parallel to the optical axis of the coaxial optical path.
7. The differential dark-field microscopic defect inspection apparatus of transparent material according to any of claims 1 to 3, wherein the size of the shield (6) is smaller than the aperture size of the microscope objective (7).
8. A method for differential dark-field microscopic defect inspection of a transparent material, wherein the inspection is performed by using the differential dark-field microscopic defect inspection apparatus of a transparent material according to any one of claims 4 to 6, the method comprising the steps of:
s1: a sample (3) to be measured is arranged on a displacement mechanism (5) between an illumination lens (2) and a microscope objective (7);
s2: adjusting a tested sample (3), enabling an interested area of the tested sample (3) to enter an imaging field of a microscope objective (7), and setting the speed of a displacement mechanism (5), the CCD sampling frequency of a first CCD (10) and a second CCD (12) and the sampling duration of the first CCD (10) and the second CCD (12);
s3: and simultaneously starting the displacement mechanism (5), the first CCD (10) and the second CCD (12) to enable the detected sample (3) to move at a uniform speed along the direction of an optical axis, and simultaneously acquiring the images of the detected sample in the dark field scattered by the defect of the detected sample, namely the image after the focus and the image before the focus by the first CCD (10) and the second CCD (12).
9. The differential dark-field microscopic defect inspection method of transparent material according to claim 8, further comprising the steps of:
s4: and (3) performing three-dimensional reconstruction on the defects of the detected sample by using a differential axial light intensity analysis method.
10. The method for differential dark-field microscopic defect inspection of transparent material as claimed in claim 9, wherein the step S4 is implemented by: and respectively extracting an axial light intensity curve a obtained by shooting by a first CCD and an axial light intensity curve b obtained by shooting by a second CCD, which correspond to the same position of the defect, and calculating the corresponding optical axis direction position when a-b is equal to 0, wherein the position is the focal plane of the defect.
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