CN110945635B

CN110945635B - Wire bonding device

Info

Publication number: CN110945635B
Application number: CN201880048605.4A
Authority: CN
Inventors: 小作贵义
Original assignee: Shinkawa Ltd
Current assignee: Shinkawa Ltd
Priority date: 2017-05-24
Filing date: 2018-05-24
Publication date: 2024-05-10
Anticipated expiration: 2038-05-24
Also published as: JP6787611B2; WO2018216772A1; CN110945635A; TW201901891A; TWI677068B; JPWO2018216772A1

Abstract

The wire bonding apparatus (1) includes a capillary (6) and a chamber unit (4) forming an inert gas region (S1) around the capillary (6). The chamber unit (4) has a right chamber block (11R), a left chamber block (11L), and a movable mechanism (15) for relatively moving the right chamber block (11R) with respect to the capillary tube (6). The movable mechanism (15) switches between a first state in which the right chamber block (11R) and the left chamber block (11L) surround the periphery of the capillary tube (6) and a second state in which a part of the periphery of the capillary tube (6) is opened by moving the right chamber block (11R).

Description

Wire bonding device

Technical Field

The present invention relates to a wire bonding apparatus.

Background

When bonding wires to electrodes of a semiconductor chip, ball bonding (ball bonding) is performed. In ball bonding, the tip of the wire, which protrudes from the tip of the capillary, is first melted. A free air ball is formed by the melting. Then, the airless ball is pressed against the electrode. The free air balloon is a molten metal and is therefore relatively easily oxidized. Oxidation of the free air ball may be a cause of poor connection with the electrode.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2007-294975

Patent document 2: U.S. patent application publication No. 2007/0251980

Disclosure of Invention

Problems to be solved by the invention

For example, patent document 1 and patent document 2 disclose techniques for suppressing oxidation of the airless ball. In the technique, gas is supplied toward the vicinity of the junction region where the free air ball is formed. When the oxidization of the free air ball is suppressed by supplying the gas, it is desirable to retain the gas by physically surrounding the junction region as much as possible. On the other hand, from the viewpoint of workability, it is desirable to secure a working space without disposing physical component parts in a region where work such as part replacement is performed. Therefore, the securing of good joining quality conflicts with the improvement of workability. As a result, a technique that can achieve both securing of the joining quality and improvement of the workability is desired.

The invention provides a wire bonding device which can ensure good bonding quality and improve workability.

Technical means for solving the problems

The present invention provides a wire bonding apparatus for bonding wires to electrodes provided on a semiconductor chip, comprising a capillary for bonding wires to the electrodes, and a chamber for forming an inert gas region around the capillary, wherein the chamber has a first chamber portion, a second chamber portion different from the first chamber portion, and a movable portion for relatively moving at least one of the first chamber portion and the second chamber portion with respect to the capillary, the movable portion is configured to switch between a first configuration in which the first chamber portion and the second chamber portion surround the periphery of the capillary and a second configuration in which a part of the periphery of the capillary is opened by moving at least one of the first chamber portion and the second chamber portion, and at least one of the first chamber portion and the second chamber portion includes a gas supply portion for forming the inert gas region.

According to the apparatus, the movable portion moves at least one of the first chamber portion and the second chamber portion. As a result, the second mode is switched to the first mode. In the first mode, the capillary is surrounded by the first chamber portion and the second chamber portion. Therefore, the inert gas is easily retained around the capillary. As a result, the oxidation of the free air balloon can be suppressed. The movable portion moves at least one of the first chamber portion and the second chamber portion in opposite directions. As a result, the first mode is switched to the second mode. The second configuration opens a portion of the circumference of the capillary. As a result, a work space can be ensured. Therefore, according to the apparatus, workability can be improved. Thus, the wire bonding apparatus can improve the workability of wire bonding while ensuring good bonding quality.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, a wire bonding apparatus is provided that can achieve both securing of good bonding quality and improvement of workability.

Drawings

Fig. 1 is a perspective view showing a first embodiment of the wire bonding apparatus according to the present embodiment.

Fig. 2 is a perspective view showing the movable arm in an exploded manner.

Fig. 3 is a plan view showing the left and right chamber blocks.

Fig. 4 is a front view showing the left and right chamber blocks.

Fig. 5 is a perspective view showing an inert gas region.

Fig. 6 is a perspective view showing a second embodiment of the wire bonding apparatus.

Fig. 7 is a side view showing a second embodiment of the wire bonding apparatus.

Description of symbols

1: Wire bonding device

2: Base unit

3: Capillary unit

4: Chamber unit

4L: left chamber unit

4R: right chamber unit

6: Capillary tube

7: Capillary arm

7A: left side surface

7D: bottom surface

7B: right side surface

7C: front end face

8L: left arm

8R: right arm

9: Gas supply unit

9L: left gas supply part

9La: left gas supply hole

9Lb: left gas supply pipe

9R: right gas supply part

9Ra: first right gas supply hole

9Rc: second right gas supply hole

11: Chamber chamber

11L: left chamber block

11La: front end

11Lb: bottom surface

11R: right chamber block

12: Fixing arm

12A: connecting hole

13: Movable arm

13A: base end

13B: front end

13H: insertion hole

14: Bolt

14A: shaft portion

14B: head part

15: Movable mechanism

16A: through hole

17: Bolt mechanism

18: A first adsorption part

19: A second adsorption part

21: First buffer part

22: Second buffer part

A1 to A4, AR: an axis line

D1: in the up-down direction

D2: in the front-rear direction

D3: left-right direction

M1 to M6: first to sixth magnets

P1: a first surrounding surface

P2: second surrounding surface

P3: third surrounding surface

P2a: right surrounding surface

P2b: left surrounding surface

S1: inert gas region

S2: working space

Detailed Description

Hereinafter, a method for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same components are denoted by the same reference numerals, and repetitive description thereof will be omitted.

The wire bonding apparatus 1 shown in fig. 1 wire bonds electrodes of a semiconductor chip or substrate. The wire bonding apparatus 1 includes a base unit 2 (base portion), a capillary unit 3, and a chamber unit 4. The wire bonding apparatus 1 includes other components such as a housing, a control device, and a feeder, but these components are omitted in the following description and drawings.

The wire bonding apparatus 1 holds the wire in such a manner as to protrude slightly from the capillary unit 3. In the holding state, an airless Ball (Free Air Ball) is formed at the front end of the projected wire bonding. Then, the wire bonding apparatus 1 performs ball bonding. Specifically, the capillary unit 3 is used to press the airless ball against the electrode of the semiconductor chip. The wire is bonded to the electrode by the above operation.

Here, when ball bonding is performed, a free air ball is formed at the tip of the wire bonding as described above. The airless ball is, for example, molten copper. Therefore, the airless ball is easily oxidized. Therefore, the wire bonding apparatus 1 adopts the closed configuration (first configuration) as shown in fig. 1, in other words, the wire bonding apparatus 1 of the closed configuration forms the inert gas region S1. The inert gas region S1 is a region in which oxidation of the free air ball is suppressed by the chamber unit 4. The chamber unit 4 blows an inert gas (for example, nitrogen gas) toward the area where the air-free balloon is disposed to form an inert gas area S1 (see fig. 1 and 6). Further, the chamber unit 4 physically encloses the area to which the inert gas is blown. Thus, inert gas remains in the enclosed region. As a result, the inert gas region S1 can be maintained well.

The specific configuration of the wire bonding apparatus 1 will be described below. In the description of the wire bonding apparatus 1, for convenience of description, a vertical direction D1 (predetermined direction), a front-rear direction D2 (first direction), and a left-right direction D3 (second direction) are used. These directions are opposite directions as viewed from an operator who operates the wire bonding apparatus 1. For example, the up-down direction D1 may be also referred to as a direction along the vertical direction or an extending direction of the capillary 6 described later. The front-rear direction D2 is a direction from the wire bonding apparatus 1 toward the operator, and the operator side is referred to as "front" and the apparatus side is referred to as "rear". The left-right direction D3 may be also referred to as a direction orthogonal to the up-down direction D1 and the front-back direction D2, respectively. In addition, the "right" and "left" described herein are "right" and "left" for convenience of description. The "right" and "left" coincide with the "right" and "left" when viewed from an operator standing on the front surface of the wire bonding apparatus 1.

The base unit 2 is a base body supporting the capillary unit 3 and the chamber unit 4. The base unit 2 maintains a predetermined position during the period in which the wire bonding apparatus 1 is operating. The capillary unit 3 and the chamber unit 4 are provided to be movable with respect to the base unit 2. For example, the capillary unit 3 moves back and forth in the up-down direction D1.

The capillary unit 3 has a capillary 6 and a capillary arm 7. The capillary 6 is wire-bonded to an electrode of the semiconductor chip. The capillary tube 6 is a cylindrical member extending in the up-down direction D1. The upper end of the capillary 6 is detachably held by a capillary arm 7. The capillary tube 6 has a through hole extending from the upper end side to the lower end side, and an opening is provided at the lower end of the capillary tube 6. And inserting a wire into the through hole. The capillary 6 is configured not shown in the drawings to switch between a state of holding wire bonding and a state of releasing wire bonding. The capillary arm 7 connects the capillary 6 with the base unit 2. The capillary arm 7 is a cantilever beam elongated in the front-rear direction D2. The rear end of the capillary arm 7 is coupled to the base unit 2 so as to be movable back and forth in the up-down direction D1. The tip of the capillary arm 7 detachably holds the upper end of the capillary 6.

The chamber unit 4 has a left chamber unit 4L and a right chamber unit 4R. One of the left chamber unit 4L and the right chamber unit 4R is relatively movable with respect to the other. Specifically, the left chamber unit 4L is fixed with respect to the base unit 2. That is, the left chamber unit 4L does not perform any movement. On the other hand, the right chamber unit 4R is relatively movable with respect to the base unit 2. In other words, the right chamber unit 4R is relatively movable with respect to the left chamber unit 4L fixed to the base unit 2.

The left chamber unit 4L includes a left arm 8L, a left gas supply portion 9L (second supply portion), and a left chamber block 11L (second chamber portion). The base end side of the left arm 8L is fixed with respect to the base unit 2. A left chamber block 11L is fixed to the front end side of the left arm 8L.

The right chamber unit 4R has a right arm 8R, a right gas supply portion 9R (first supply portion), and a right chamber block 11R (first chamber portion). In the present embodiment, the left chamber block 11L and the right chamber block 11R constitute the chamber 11. Thus, the left chamber block 11L and the right chamber block 11R are different from each other. The left gas supply unit 9L and the right gas supply unit 9R constitute a gas supply unit 9.

The base end side of the right arm 8R is fixed with respect to the base unit 2. The right chamber block 11R is fixed with respect to the front end side of the right arm 8R. The right arm 8R has a fixed arm 12 and a movable arm 13. The base end of the fixing arm 12 is fixed with respect to the base unit 2. The movable arm 13 is coupled to the fixed arm 12. The movable arm 13 has an L-shape. The base end 13a of the movable arm 13 is rotatably coupled to the fixed arm 12. The right chamber block 11R is fixed with respect to the front end 13b of the movable arm 13. That is, the movable arm 13 rotates with respect to the fixed arm 12, whereby the right chamber block 11R moves relatively with respect to the left chamber block 11L.

As shown in fig. 2, the movable arm 13 is coupled to the fixed arm 12 by a bolt 14. The shaft portion 14a of the bolt 14 is inserted into the insertion hole 13h of the movable arm 13. The distal end of the shaft portion 14a is screwed into the coupling hole 12a of the fixed arm 12. As a result, the movable arm 13 is sandwiched between the head 14b of the bolt 14 and the fixed arm 12. The diameter of the shaft portion 14a is slightly smaller than the inner diameter of the insertion hole 13h. Thus, the movable arm 13 can be smoothly rotated with respect to the bolt 14. The coupling hole 12a, the insertion hole 13h, and the bolt 14 constitute a movable mechanism 15 (movable portion).

Furthermore, the right chamber unit 4R may also have a latch mechanism 17 as needed. The latch mechanism 17 maintains the position of the movable arm 13. Specifically, the position of the right chamber block 11R in the closed configuration (first configuration, refer to fig. 1) is maintained, and the position of the right chamber block 11R in the open configuration (second configuration, refer to fig. 6) is maintained. The latch mechanism 17 has a first suction portion 18 and a second suction portion 19.

The first suction unit 18 has a first magnet M1 and a second magnet M2. When the wire bonding apparatus 1 is in the closed state, the first suction portion 18 maintains the position of the right chamber block 11R. That is, the first suction portion 18 maintains the position of the movable arm 13 with respect to the fixed arm 12. The maintenance is based on the attractive force between the first magnet M1 and the second magnet M2. Therefore, when a force in the opposite direction larger than the attractive force is applied to the movable arm 13, the state in which the position of the right chamber block 11R is maintained is released.

The second adsorbing portion 19 has a first magnet M1 and a third magnet M3. When the wire bonding apparatus 1 is in the open state, the second suction portion 19 maintains the position of the right chamber block 11R. That is, the second suction portion 19 maintains the position of the movable arm 13 with respect to the fixed arm 12. The maintenance is based on the attractive force between the first magnet M1 and the third magnet M3. Therefore, when a force in the opposite direction larger than the attractive force is applied to the movable arm 13, the state in which the position of the right chamber block 11R is maintained is released.

While the wire bonding apparatus 1 is running, various parts mechanically move in the wire bonding apparatus 1. According to the first suction portion 18, the position of the right chamber block 11R can be suppressed from being deviated due to vibration or the like caused by movement of these components. Therefore, the inert gas region S1 can be maintained appropriately during the period in which the wire bonding apparatus 1 is operating.

According to the second suction portion 19, the position of the right chamber block 11R can be maintained when the worker replaces the capillary tube 6. For example, even when the operator touches the movable arm 13 by mistake, the position of the right chamber block 11R can be maintained continuously.

The latch mechanism 17 may further have a first buffer 21 and a second buffer 22.

The first buffer portion 21 attenuates the potential of the movable arm 13 when switching from the open state to the closed state. Therefore, the movable arm 13 can be suppressed from striking the fixed arm 12. Specifically, when the state is switched from the open state to the closed state, the movable arm 13 is held by the first suction portion 18 after the potential is weakened by the first buffer portion 21. Similarly, the second buffer 22 attenuates the potential of the movable arm 13 when switching from the closed state to the open state. Specifically, when the state is switched from the closed state to the open state, the movable arm 13 is held by the second suction portion 19 after the potential is weakened by the second buffer portion 22.

The first buffer 21 has a fourth magnet M4 and a fifth magnet M5. The fourth magnet M4 is disposed on the movable arm 13. The fifth magnet M5 is disposed on the fixed arm 12. When the closed state is set, the fourth magnet M4 and the fifth magnet M5 face each other. That is, the first buffer portion 21 functions immediately before the transition to the closed state is completed. The first buffer 21 reduces the potential of the movable arm 13 by repulsive force generated by the fourth magnet M4 and the fifth magnet M5. Therefore, the same poles of the fourth magnet M4 and the fifth magnet M5 face each other.

The second buffer 22 has a fourth magnet M4 and a sixth magnet M6. The sixth magnet M6 is disposed on the fixed arm 12. When the open state is set, the fourth magnet M4 and the sixth magnet M6 face each other. That is, the second buffer portion 22 functions immediately before the transition to the open state is completed. The homopolar faces of the fourth magnet M4 and the sixth magnet M6 face each other.

Next, the left chamber block 11L and the right chamber block 11R will be described in detail.

As shown in fig. 3, the left chamber block 11L has a third surrounding surface P3 and a left gas supply hole 9La. The left chamber block 11L is disposed on the left side of the capillary tube 6. The front end 11La of the left chamber block 11L is located further rearward than the front end surface 7c of the capillary arm 7. That is, the left chamber block 11L partially surrounds the left side face 7a of the capillary arm 7. The portion facing the left side surface 7a of the capillary arm 7 is a third peripheral surface P3. The third peripheral surface P3 may also be referred to as a surface orthogonal to the left-right direction D3.

As shown in fig. 4, the chamber plate 16 is mounted to the bottom surface 11Lb of the left chamber block 11L. The chamber plate 16 is provided with a through hole 16a through which the capillary tube 6 is inserted. The chamber plate 16 extends from the third peripheral surface P3 toward a right chamber block 11R described later. The chamber plate 16 is located below the bottom surface 7d of the capillary arm 7 when the capillary arm 7 is located at the lowermost position. That is, the chamber plate 16 covers the bottom surface 7d of the capillary arm 7.

As shown in fig. 3 again, the left gas supply hole 9La has a discharge opening formed in the third surrounding surface P3. The left gas supply hole 9La ejects the inert gas supplied from the left gas supply pipe 9Lb from the discharge opening. The axis A2 of the discharge opening of the left gas supply hole 9La intersects with the axis A1 of the capillary 6.

The right chamber block 11R has a first surrounding surface P1, a second surrounding surface P2, a first right gas supply hole 9Ra, and a second right gas supply hole 9Rc. The right chamber block 11R is disposed on the right side of the capillary tube 6. The right chamber block 11R spans from the right side face 7b to the front end face 7c of the capillary arm 7 to enclose the capillary arm 7. The portion facing the right side surface 7b of the capillary arm 7 is a first surrounding surface P1, and the portion facing the distal end surface 7c of the capillary arm 7 is a second surrounding surface P2.

The first surrounding surface P1 may also be referred to as a surface that faces the third surrounding surface P3 and is orthogonal to the left-right direction D3. The second peripheral surface P2 may also be referred to as a surface intersecting the front-rear direction D2. The second surrounding plane P2 includes a right surrounding plane P2a and a left surrounding plane P2b. The right surrounding plane P2a continues to the first surrounding plane P1. The left surrounding plane P2b continues to the right surrounding plane P2a. The angle between the right surrounding surface P2a and the left surrounding surface P2b is about 90 degrees, and the boundary portion between the right surrounding surface P2a and the left surrounding surface P2b may intersect the front-rear direction D2 passing through the axis A1. Therefore, the right surrounding surface P2a faces the right side of the distal end surface 7c of the capillary arm 7. The left surrounding surface P2b faces the left side of the distal end surface 7c of the capillary arm 7. A gap is provided between the front end of the left surrounding surface P2b and the front end 11La of the left chamber block 11L.

The first right gas supply hole 9Ra has a discharge opening formed in the second surrounding surface P2. The first right gas supply hole 9Ra ejects the inert gas from the discharge opening toward the capillary 6. The first right gas supply hole 9Ra discharges the inert gas supplied from the right gas supply pipe 9Rb from the discharge opening. An axis A3 of the discharge opening of the first right gas supply hole 9Ra passes through the axis A1.

The second right gas supply hole 9Rc has a discharge opening formed in the lower surface of the right chamber block 11R. The second right gas supply hole 9Rc ejects inert gas from the discharge opening. The second right gas supply hole 9Rc discharges the inert gas supplied from the right gas supply pipe 9Rd from the discharge opening. When the axis A4 of the second right gas supply hole 9Rc is viewed in plan, the axis A4 intersects with the axis A2 of the left gas supply hole 9La and the axis A3 of the first right gas supply hole 9Ra on the axis A1.

The operation of the wire bonding apparatus 1 will be described below. The wire bonding apparatus 1 can switch between a closed configuration (see fig. 1) and an open configuration (see fig. 6 and 7). When wire bonding is performed, the wire bonding apparatus 1 is set to a closed configuration. On the other hand, when the operator performs some operation on the wire bonding apparatus 1, the wire bonding apparatus 1 is set to an open state. The operations may include inspection operations or maintenance operations. For example, as an example of the operation, a work of replacing the capillary tube 6 or the like can be cited. The switching may be performed by, for example, an operator manually moving the movable arm 13.

In the closed configuration and the open configuration, the positions of the right chamber blocks 11R are different from each other. On the other hand, in the closed configuration and the open configuration, the positions of the left chamber blocks 11L are the same as each other. Further, the position of the capillary 6 is not limited in the closed state and the open state.

As shown in fig. 5, when the wire bonding apparatus 1 is in a closed state, the inert gas region S1 is formed. That is, the closed state may be referred to as a state for forming the inert gas region S1. In terms of the function, the inert gas region S1 is a region in which oxidation of the free air ball is suppressed. In addition, when the structure is described, the inert gas region S1 is a region surrounded by at least the left chamber block 11L and the right chamber block 11R.

Specifically, the inert gas region S1 is a space surrounded by the third surrounding surface P3, the chamber plate 16, the first surrounding surface P1, the right surrounding surface P2a, and the left surrounding surface P2 b. That is, the inert gas region S1 is a region surrounded by five surfaces. The position of the right chamber block 11R to surround the periphery of the capillary tube 6 as described is referred to as a first position. Therefore, when the right chamber block 11R is located at the first position, a part of the right chamber block 11R (a part of the first surrounding surface P1 and the second surrounding surface P2) is located further forward than the capillary tube 6. Further, when the free air balloon is formed, the capillary arm 7 is disposed above the free air balloon (see fig. 4). Therefore, if the bottom surface 7d of the capillary arm 7 is added, the inert gas area S1 may be referred to as an area surrounded by six surfaces.

According to this closed form, the inert gas can be enclosed in the region surrounded by the third surrounding surface P3, the chamber plate 16, the first surrounding surface P1, the right surrounding surface P2a, the left surrounding surface P2b, and the bottom surface 7d of the capillary arm 7. Therefore, the inert gas can be left in the inert gas region S1, and thus oxidation of the free air ball can be suitably suppressed.

As shown in fig. 6 and 7, when the wire bonding apparatus 1 is opened, a working space S2 is formed. That is, when the function is described, the open state is a state for forming the working space S2. That is, in the open state, a region (i.e., the working space S2) which is not blocked by the solid part is formed between the operator and the tip of the capillary arm 7. The open state is a state in which the right chamber block 11R is separated from the capillary arm 7, when the structure is described. The separated position is the second position of the right chamber block 11R.

The position of the right chamber block 11R in each axis direction is more specifically described. First, in the up-down direction D1, the right chamber block 11R is located above the tip of the capillary arm 7 and the capillary 6. Then, in the front-rear direction D2, the right chamber block 11R is located further rearward than the front end of the capillary arm 7 and the capillary 6. The position is between the front end of the capillary arm 7 and the capillary 6 and the base unit 2. Further, in the right-left direction D3, the right chamber block 11R is separated to the right side from the tip of the capillary arm 7 and the capillary 6.

When the closed state is switched to the open state, the right chamber block 11R moves obliquely rightward and rearward with respect to the front end of the capillary arm 7. The right chamber block 11R is separated from the capillary arm 7 by a movable mechanism 15. The axis AR of the bolt 14 of the movable mechanism 15 is orthogonal to the front-rear direction D2, and is inclined with respect to the up-down direction D1 and the left-right direction D3, respectively. For example, the axis AR of the bolt 14 is inclined 45 degrees with respect to the left-right direction D3. In addition, the axis AR is arranged between the capillary 6 and the base unit 2.

In the second position, the right side surface 7b and the front end surface 7c of the capillary arm 7 are opened. That is, the operator can visually recognize the front end surface 7c side of the capillary arm 7 from the front. Further, the operator can perform the replacement work of the capillary tube 6 by entering from the right side surface 7b side of the capillary arm 7. At this time, the right chamber block 11R is located above the front end face 7c of the capillary arm 7. As a result, the operator can enter from right to left with respect to the right surface 7b of the capillary arm 7. Therefore, workability can be further improved.

According to the wire bonding apparatus 1 of the present embodiment, the movable mechanism 15 moves the left chamber block 11L, thereby switching from the open configuration to the closed configuration. In the closed configuration, the capillary 6 is surrounded by the left chamber block 11L and the right chamber block 11R. Therefore, the inert gas can be retained around the capillary 6. As a result, the oxidation of the free air balloon can be suppressed. The movable mechanism 15 moves the left chamber block 11L in the opposite direction, and thereby switches from the closed state to the open state. The open configuration opens a part of the periphery of the capillary 6. As a result, the working space S2 can be ensured. Therefore, the workability of wire bonding can be improved. Thus, the wire bonding apparatus 1 can achieve both securing of good bonding quality and improvement of workability.

The wire bonding apparatus 1 has a capillary 6, a left chamber block 11L, and a base unit 2 supporting the left chamber block 11L. The capillary tube 6 moves back and forth in the up-down direction D1 with respect to the base unit 2. The left chamber block 11L is fixed relative to the base unit 2. The right chamber block 11R is moved in a manner separated from the capillary tube 6 by a movable mechanism 15. According to the constitution, there is no need to change the position of the left chamber block 11L. Therefore, the wire bonding apparatus 1 can be made simpler in construction while improving workability of wire bonding while ensuring good bonding quality.

The gas supply unit 9 includes a left gas supply unit 9L provided in the left chamber block 11L, and a right gas supply unit 9R provided in the right chamber block 11R. According to the above configuration, a preferable inert gas region S1 can be formed around the capillary 6.

The capillary 6 is attached to the tip of the capillary arm 7, and the tip of the capillary arm 7 extends in the left-right direction D3 orthogonal to the front-rear direction D2 of the capillary 6. The left chamber block 11L has a third peripheral surface P3 intersecting the left-right direction D3, and the left-right direction D3 is orthogonal to the up-down direction D1 and the front-rear direction D2. The right chamber block 11R may have a first surrounding surface P1 facing the third surrounding surface P3 through the capillary 6, and a second surrounding surface P2 intersecting the front-rear direction D2.

The right chamber block 11R has a first surrounding surface P1 and a second surrounding surface P2. That is, in the closed configuration, the right chamber block 11R surrounds the periphery of the capillary tube 6 more widely than the left chamber block 11L having the third surrounding surface P3. In the open state, the right chamber block 11R is disposed at a position distant from the capillary 6. Then, around the capillary 6, the region surrounded by the first surrounding surface P1 and the second surrounding surface P2 is opened. Therefore, a relatively wide range is opened around the capillary 6. As a result, a wide working space S2 can be ensured. Thus, the workability of wire bonding can be further improved.

The right chamber block 11R is capable of switching between a first position forming a closed state and a second position forming an open state by the movable mechanism 15. The second position is located further to the rear than the capillary 6. According to the above configuration, the right chamber block 11R in the open state is disposed at a position distant from the capillary 6. Therefore, a wide working space S2 can be ensured. As a result, workability of wire bonding can be further improved.

The second position is located further above the capillary 6. According to the above configuration, the right chamber block 11R in the open state is disposed at a position further away from the capillary 6. Therefore, a wide working space S2 can be ensured. As a result, workability of wire bonding can be further improved.

The present invention has been described in detail with reference to the embodiments thereof. The present invention is not limited to the embodiments. The present invention can be variously modified within a range not departing from the gist thereof.

In the above embodiment, the left chamber block 11L is fixed and the right chamber block 11R is movable. For example, the left chamber block 11L may be movable in addition to the right chamber block 11R.

In the embodiment, the gas supply portion 9 is provided in both the left chamber block 11L and the right chamber block 11R. For example, the gas supply unit 9 may be provided only in either one of the left chamber block 11L and the right chamber block 11R.

In the embodiment, the second position of the right chamber block 11R is set to be diagonally right and above with respect to the capillary 6 and to the rear of the capillary 6. The second position of the right chamber block 11R is not limited to the above-described arrangement as long as it is a position where a part of the distal ends of the capillary 6 and the capillary arm 7 can be opened.

Claims

1. A wire bonding apparatus for bonding wires to electrodes provided on a semiconductor chip, the wire bonding apparatus comprising:

a capillary bonding the wire bond to the electrode;

A chamber forming an inert gas region around the capillary; and

A base portion supporting the capillary tube and the chamber; and is also provided with

The chamber has: a first chamber portion including an envelope surface; a second chamber portion that is different from the first chamber portion and includes a surrounding surface different from the surrounding surface; a chamber plate including a through hole provided in one of the first chamber portion and the second chamber portion and through which the capillary tube is inserted; and a movable portion for relatively moving at least one of the first chamber portion and the second chamber portion with respect to the capillary tube,

At least one of the first chamber portion and the second chamber portion includes a gas supply portion to form the inert gas region, an

The movable portion is configured to switch between a first state in which the periphery of the capillary tube is surrounded by the chamber plate, the surrounding surface of the first chamber portion, and the surrounding surface of the second chamber portion, and a second state in which a part of the periphery of the capillary tube is opened by relatively moving one of the first chamber portion and the second chamber portion with respect to the other,

The capillary tube moves back and forth in a predetermined direction relative to the base portion,

The second chamber portion is fixed relative to the base portion,

The first chamber portion is moved in a manner separated from the capillary by the movable portion,

The first chamber part is configured to switch a first position forming the first form and a second position forming the second form to each other by the movable part, and

The second location is located further rearward than the capillary tube.

2. The wire bonding apparatus according to claim 1, wherein the gas supply portion comprises: a first supply unit provided in the first chamber unit; and a second supply unit provided in the second chamber unit.

3. The wire bonding apparatus according to claim 1 wherein the capillary is mounted to a front end portion of a capillary arm that is elongated in a first direction orthogonal to an extending direction of the capillary,

The first chamber part has a first surrounding surface orthogonal to the extending direction and the first direction of the capillary tube, and a second surrounding surface intersecting the first direction, and

The second chamber portion has a third surrounding surface facing the first surrounding surface through the capillary tube.

4. The wire bonding apparatus of claim 1 wherein the second location is located above the capillary.

5. The wire bonding apparatus of claim 1 further comprising a base portion supporting the capillary and the chamber,

The second chamber portion is fixed relative to the base portion,

The chamber plate is disposed in the second chamber portion.