CN110945635A - Wire bonding device - Google Patents
Wire bonding device Download PDFInfo
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- CN110945635A CN110945635A CN201880048605.4A CN201880048605A CN110945635A CN 110945635 A CN110945635 A CN 110945635A CN 201880048605 A CN201880048605 A CN 201880048605A CN 110945635 A CN110945635 A CN 110945635A
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- wire bonding
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- chamber block
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- 239000011261 inert gas Substances 0.000 claims abstract description 31
- 239000007789 gas Substances 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 abstract description 15
- 230000003647 oxidation Effects 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/781—Means for controlling the bonding environment, e.g. valves, vacuum pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85053—Bonding environment
- H01L2224/85054—Composition of the atmosphere
- H01L2224/85075—Composition of the atmosphere being inert
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The wire bonding apparatus 1 includes a capillary 6 and a chamber unit 4 forming an inert gas region S1 around the capillary 6. The chamber unit 4 has a right chamber block 11R, a left chamber block 11L, and a movable mechanism 15 that relatively moves the right chamber block 11R with respect to the capillary 6. The movable mechanism 15 switches between a first mode in which the periphery of the capillary 6 is surrounded by the right chamber block 11R and the left chamber block 11L and a second mode in which the periphery of the capillary 6 is partially opened by moving the right chamber block 11R.
Description
Technical Field
The invention relates to a wire bonding device.
Background
When wire bonding is performed to the electrodes of the semiconductor chip, ball bonding (ball bonding) is performed. In ball bonding, the tip of a wire protruding from the tip of a capillary is first melted. Free air balls (free air balls) were formed by the melting. Then, the free air ball is pressed against the electrode. The free air balloon is a molten metal and is therefore relatively susceptible to oxidation. Oxidation of the free air ball may cause poor connection with the electrode.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2007-Asca 294975
Patent document 2: U.S. patent application publication No. 2007/0251980 specification
Disclosure of Invention
Problems to be solved by the invention
For example, patent documents 1 and 2 disclose techniques for suppressing oxidation of a free air balloon. In the technique, a gas is supplied toward the vicinity of a joint region where an empty balloon is formed. When the oxidation of the free air balloon is suppressed by supplying the gas, it is desirable to retain the gas by physically surrounding the joint area as much as possible. On the other hand, from the viewpoint of workability, it is desirable to secure a working space without arranging substantial constituent parts in an area where a work such as part replacement is performed. Therefore, the securing of good bonding quality and the improvement of workability are in conflict with each other. As a result, a technique capable of ensuring the bonding quality and improving the workability is desired.
The invention provides a wire bonding device which can ensure good bonding quality and improve the operability.
Means for solving the problems
The wire bonding device includes a capillary for wire bonding an electrode provided on a semiconductor chip, and a chamber for forming an inert gas region around the capillary, the chamber including a first chamber portion, a second chamber portion different from the first chamber portion, and a movable portion for relatively moving at least one of the first chamber portion and the second chamber portion with respect to the capillary, the movable portion switching between a first state in which the first chamber portion and the second chamber portion surround the capillary and a second state in which a part of the periphery of the capillary is opened by moving at least one of the first chamber portion and the second chamber portion, and at least one of the first chamber portion and the second chamber portion including a gas supply portion for forming the inert gas region.
According to the device, the movable portion moves at least one of the first chamber portion and the second chamber portion. As a result, the second form is switched to the first form. In the first mode, the first chamber part and the second chamber part surround the capillary. Therefore, the inert gas is easily retained around the capillary. As a result, oxidation of the free air balloon can be suppressed. The movable portion moves at least one of the first chamber portion and the second chamber portion in opposite directions. As a result, the first mode is switched to the second mode. The second configuration leaves a portion of the circumference of the capillary open. As a result, the working space can be secured. Therefore, according to the device, the workability can be improved. Thus, the wire bonding apparatus can ensure good bonding quality and improve the workability of wire bonding.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a wire bonding apparatus is provided which can ensure good bonding quality and improve workability.
Drawings
Fig. 1 is a perspective view showing a first embodiment of the wire bonding apparatus according to the present embodiment.
Fig. 2 is a perspective view showing the movable arm in an exploded manner.
Fig. 3 is a plan view showing the left and right chamber blocks.
Fig. 4 is a front view showing the left and right chamber blocks.
Fig. 5 is a perspective view showing an inert gas region.
Fig. 6 is a perspective view showing a second embodiment of the wire bonding apparatus.
Fig. 7 is a side view showing a second embodiment of the wire bonding apparatus.
Detailed Description
Hereinafter, a method for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are given to the same components, and redundant description is omitted.
The wire bonding apparatus 1 shown in fig. 1 bonds wires to electrodes of a semiconductor chip or substrate. The wire bonding device 1 includes a base unit 2 (base portion), a capillary unit 3, and a chamber unit 4. The wire bonding apparatus 1 includes other components such as a housing, a control device, and a feeder, but these components are omitted in the following description and drawings.
The wire bonding device 1 holds the wire in such a manner as to slightly protrude from the capillary unit 3. In the holding state, a Free Air Ball (Free Air Ball) is formed at the tip of the protruding wire. Then, the wire bonding apparatus 1 performs ball bonding. Specifically, the capillary unit 3 presses the free air ball against the electrode of the semiconductor chip. The wire bonding is performed to the electrode by the operation.
Here, when performing ball bonding, as described above, an air-free ball is formed at the tip of the wire. The free air ball is, for example, molten copper. Therefore, the free air balloon is easily oxidized. Therefore, wire bonding apparatus 1 adopts the closed form (first form) as shown in fig. 1, in other words, wire bonding apparatus 1 in the closed form forms inert gas region S1. The inert gas area S1 is an area where oxidation of the free air balloon is suppressed by the chamber unit 4. The chamber unit 4 blows an inert gas (e.g., nitrogen gas) to the area where the free air balloon is disposed, thereby forming an inert gas area S1 (see fig. 1 and 6). Further, the chamber unit 4 physically surrounds the area where the inert gas is blown. Thus, the inert gas remains in the enclosed region. As a result, the inert gas area S1 can be maintained well.
Hereinafter, a specific configuration of the wire bonding apparatus 1 will be described. In the explanation of the wire bonding apparatus 1, for convenience of explanation, the up-down direction D1 (predetermined direction), the front-back direction D2 (first direction), and the left-right direction D3 (second direction) are used. These directions are relative directions as viewed from an operator who operates the wire bonding apparatus 1. For example, the vertical direction D1 may be referred to as a direction along the vertical direction or an extending direction of the capillary 6 described later. The front-rear direction D2 is a direction from the wire bonding apparatus 1 toward the operator, and the operator side is "front" and the apparatus side is "rear". The left-right direction D3 may be referred to as a direction perpendicular to the up-down direction D1 and the front-rear direction D2, respectively. In addition, "right" and "left" are described herein as "right" and "left" for convenience of description. The "right" and "left" correspond to the "right" and "left" as viewed from the operator standing on the front of the wire bonding apparatus 1.
The base unit 2 is a base body that supports the capillary unit 3 and the chamber unit 4. The base unit 2 maintains a predetermined position while the wire bonding apparatus 1 is in operation. The capillary unit 3 and the chamber unit 4 are provided movably with respect to the base unit 2. For example, the capillary unit 3 reciprocates in the vertical direction D1.
The capillary unit 3 has a capillary 6 and a capillary arm 7. The capillary 6 is wire bonded to the electrode of the semiconductor chip. The capillary tube 6 is a cylindrical member extending in the vertical direction D1. The upper end of the capillary 6 is detachably held by a capillary arm 7. The capillary 6 has a through hole extending from the upper end side to the lower end side, and an opening is provided at the lower end of the capillary 6. And inserting a routing through the through hole. The capillary 6 is configured to switch between a state of holding the bonding and a state of releasing the bonding by a configuration not shown. The capillary arm 7 connects the capillary 6 with the base unit 2. The capillary arm 7 is a cantilever beam elongated in the front-rear direction D2. The rear end of the capillary arm 7 is connected to the base unit 2 so as to be movable back and forth in the vertical direction D1. The tip of the capillary arm 7 detachably holds the upper end of the capillary 6.
The chamber unit 4 has a left chamber unit 4L and a right chamber unit 4R. One of the left chamber unit 4L and the right chamber unit 4R is relatively movable with respect to the other. Specifically, the left chamber unit 4L is fixed with respect to the base unit 2. That is, the left chamber unit 4L does not make any movement. On the other hand, the right chamber unit 4R is relatively movable with respect to the base unit 2. In other words, the right chamber unit 4R is relatively movable with respect to the left chamber unit 4L fixed to the base unit 2.
The left chamber unit 4L has a left arm 8L, a left gas supply portion 9L (second supply portion), and a left chamber block 11L (second chamber portion). The base end side of the left arm 8L is fixed to the base unit 2. The left chamber block 11L is fixed to the front end side of the left arm 8L.
The right chamber unit 4R has a right arm 8R, a right gas supply portion 9R (first supply portion), and a right chamber block 11R (first chamber portion). In the present embodiment, the left and right chamber blocks 11L and 11R constitute the chamber 11. Therefore, the left and right chamber blocks 11L and 11R are different bodies from each other. The left gas supply unit 9L and the right gas supply unit 9R constitute a gas supply unit 9.
The base end side of the right arm 8R is fixed to the base unit 2. The right chamber block 11R is fixed with respect to the front end side of the right arm 8R. The right arm 8R has a fixed arm 12 and a movable arm 13. The base end of the fixing arm 12 is fixed to the base unit 2. The movable arm 13 is connected to the fixed arm 12. The movable arm 13 has an L-shape. The base end 13a of the movable arm 13 is rotatably coupled to the fixed arm 12. The right chamber block 11R is fixed with respect to the front end 13b of the movable arm 13. That is, the movable arm 13 rotates relative to the fixed arm 12, whereby the right chamber block 11R moves relative to the left chamber block 11L.
As shown in fig. 2, the movable arm 13 is coupled to the fixed arm 12 by a bolt 14. The shaft portion 14a of the bolt 14 is inserted through the insertion hole 13h of the movable arm 13. The tip of the shaft portion 14a is screwed into the coupling hole 12a of the fixing arm 12. As a result, the movable arm 13 is sandwiched between the head 14b of the bolt 14 and the fixed arm 12. The diameter of the shaft portion 14a is slightly smaller than the inner diameter of the insertion hole 13 h. The movable arm 13 can be smoothly rotated with respect to the bolt 14. The coupling hole 12a, the insertion hole 13h, and the bolt 14 constitute a movable mechanism 15 (movable portion).
Further, the right chamber unit 4R may also have a latch mechanism 17 as necessary. The latch mechanism 17 maintains the position of the movable arm 13. Specifically, the position of the right chamber block 11R in the closed state (first state, see fig. 1) is maintained, and the position of the right chamber block 11R in the open state (second state, see fig. 6) is maintained. The latch mechanism 17 includes a first suction portion 18 and a second suction portion 19.
The first suction unit 18 includes a first magnet M1 and a second magnet M2. When the wire bonding device 1 is in the closed state, the first absorption part 18 maintains the position of the right chamber block 11R. That is, the first suction part 18 maintains the position of the movable arm 13 with respect to the fixed arm 12. The maintenance is based on the attractive force between the first magnet M1 and the second magnet M2. Therefore, when a force in the opposite direction larger than the suction force is applied to the movable arm 13, the state in which the position of the right chamber block 11R is maintained is released.
The second attracting portion 19 includes a first magnet M1 and a third magnet M3. When the wire bonding apparatus 1 is in the open state, the second suction portion 19 maintains the position of the right chamber block 11R. That is, the second suction portion 19 maintains the position of the movable arm 13 with respect to the fixed arm 12. The maintenance is based on the attractive force between the first magnet M1 and the third magnet M3. Therefore, when a force in the opposite direction larger than the suction force is applied to the movable arm 13, the state in which the position of the right chamber block 11R is maintained is released.
While the wire bonding apparatus 1 is operating, various parts are mechanically moved in the wire bonding apparatus 1. According to the first suction portion 18, the position of the right chamber block 11R can be suppressed from being displaced due to vibration or the like caused by the movement of these components. Therefore, the inert gas area S1 can be maintained appropriately during the period in which the wire bonding apparatus 1 is operating.
According to the second adsorption part 19, when the operator replaces the capillary 6, the position of the right chamber block 11R can be maintained. For example, even when the operator erroneously touches the movable arm 13, the position of the right chamber block 11R can be continuously maintained.
The latch mechanism 17 may further have a first buffer portion 21 and a second buffer portion 22.
The first buffer 21 attenuates the potential of the movable arm 13 when switching from the open mode to the closed mode. Therefore, the movable arm 13 can be suppressed from colliding with the fixed arm 12. Specifically, when switching from the open mode to the closed mode, the movable arm 13 is held by the first suction part 18 after the momentum is weakened by the first buffer part 21. Similarly, the second buffer 22 attenuates the potential of the movable arm 13 when switching from the closed state to the open state. Specifically, when the self-closing mode is switched to the open mode, the movable arm 13 is held by the second suction portion 19 after the momentum is weakened by the second buffer portion 22.
The first buffer 21 includes a fourth magnet M4 and a fifth magnet M5. The fourth magnet M4 is disposed on the fixed arm 12. The fifth magnet M5 is disposed on the movable arm 13. When the closed state is established, the fourth magnet M4 and the fifth magnet M5 face each other. That is, the first buffer portion 21 functions immediately before the transition to the closed state is completed. The first buffer 21 reduces the force of the movable arm 13 by the repulsive force generated by the fourth magnet M4 and the fifth magnet M5. Therefore, the same poles of the fourth magnet M4 and the fifth magnet M5 face each other.
The second buffer 22 includes a fourth magnet M4 and a sixth magnet M6. The sixth magnet M6 is disposed on the fixed arm 12. When the open configuration is adopted, the fourth magnet M4 and the sixth magnet M6 face each other. That is, the second buffer portion 22 functions immediately before the transition to the open state is completed. The same poles of the fourth magnet M4 and the sixth magnet M6 face each other.
Next, the left and right chamber blocks 11L and 11R will be described in detail.
As shown in fig. 3, the left chamber block 11L has a third surrounding plane P3 and a left gas supply hole 9 La. The left chamber block 11L is disposed on the left side of the capillary 6. The front end 11La of the left chamber block 11L is located further rearward than the front end surface 7c of the capillary arm 7. That is, the left chamber block 11L partially surrounds the left side face 7a of the capillary arm 7. A portion opposed to the left side surface 7a of the capillary arm 7 is a third surrounding surface P3. The third enclosing plane P3 may also be referred to as a plane orthogonal to the left-right direction D3.
As shown in fig. 4, the chamber plate 16 is mounted to the bottom surface 11Lb of the left chamber block 11L. The chamber plate 16 is provided with a through hole 16a through which the capillary 6 is inserted. The chamber plate 16 extends from the third enclosing plane P3 toward the right chamber block 11R described later. The chamber plate 16 is located further below the bottom surface 7d of the capillary arm 7 when the capillary arm 7 is located lowermost. That is, the chamber plate 16 covers the bottom surface 7d of the capillary arm 7.
As shown again in fig. 3, the left gas supply hole 9La has a discharge opening formed in the third surrounding plane P3. The left gas supply hole 9La ejects the inert gas supplied from the left gas supply pipe 9Lb from the discharge opening. The axis a2 of the discharge opening of the left gas supply hole 9La intersects the axis a1 of the capillary 6.
The right chamber block 11R has a first surrounding plane P1, a second surrounding plane P2, a first right gas supply hole 9Ra, and a second right gas supply hole 9 Rc. The right chamber block 11R is disposed on the right side of the capillary 6. The right chamber block 11R surrounds the capillary arm 7 across from the right side face 7b to the front end face 7c of the capillary arm 7. A portion facing the right side surface 7b of the capillary arm 7 is a first surrounding surface P1, and a portion facing the distal end surface 7c of the capillary arm 7 is a second surrounding surface P2.
The first envelope surface P1 may also be referred to as a surface that faces the third envelope surface P3 and is orthogonal to the left-right direction D3. The second surrounding plane P2 may also be referred to as a plane intersecting the front-rear direction D2. The second enclosing plane P2 includes a right enclosing plane P2a and a left enclosing plane P2 b. The right enclosing plane P2a continues to the first enclosing plane P1. The left surrounding plane P2b continues to the right surrounding plane P2 a. The angle between the right enclosing plane P2a and the left enclosing plane P2b is about 90 degrees, and the boundary between the right enclosing plane P2a and the left enclosing plane P2b may intersect the front-rear direction D2 passing through the axis a 1. Therefore, the right surrounding surface P2a faces the right side of the distal end surface 7c of the capillary arm 7. The left surrounding surface P2b faces the left side of the distal end surface 7c of the capillary arm 7. A gap is provided between the front end of the left surrounding plane P2b and the front end 11La of the left chamber block 11L.
The first right gas supply hole 9Ra has a discharge opening formed in the second surrounding surface P2. The first right gas supply hole 9Ra ejects the inert gas from the discharge opening toward the capillary 6. The axis A3 of the discharge opening of the first right gas supply hole 9Ra passes through the axis a 1.
The second right gas supply hole 9Rc has a discharge opening formed in the lower surface of the right chamber block 11R. The second right gas supply hole 9Rc ejects the inert gas from the discharge opening. When the axis a4 of the second right gas supply hole 9Rc is viewed in plan, the axis a4 is on the axis a1 and intersects the axis a2 of the left gas supply hole 9La and the axis A3 of the first right gas supply hole 9 Ra.
The operation of the wire bonding apparatus 1 will be described below. The wire bonding apparatus 1 can switch between a closed state (see fig. 1) and an open state (see fig. 6 and 7). When wire bonding is performed, the wire bonding apparatus 1 is set to a closed state. On the other hand, when the worker performs some operations on the wire bonding apparatus 1, the wire bonding apparatus 1 is set to the open state. The operation may include an inspection job or a maintenance job. For example, the operation may be performed by replacing the capillary 6. The switching may be performed by, for example, an operator manually moving the movable arm 13.
The positions of the right chamber block 11R are different from each other in the closed configuration and the open configuration. On the other hand, the positions of the left chamber block 11L are the same in the closed configuration and the open configuration. Further, the position of the capillary 6 is not limited in the closed form and the open form.
As shown in fig. 5, when the wire bonding apparatus 1 is set to the closed state, the inert gas region S1 is formed. That is, the closed state may be referred to as a state for forming the inert gas region S1. To explain the function, the inert gas area S1 is an area where oxidation of the free air balloon is suppressed. In addition, in terms of the structure, the inert gas area S1 is an area surrounded by at least the left chamber block 11L and the right chamber block 11R.
Specifically, the inert gas region S1 is a space surrounded by the third surrounding surface P3, the chamber plate 16, the first surrounding surface P1, the right surrounding surface P2a, and the left surrounding surface P2 b. That is, the inert gas area S1 is an area surrounded by five surfaces. The position of the right chamber block 11R to surround the periphery of the capillary 6 as described is referred to as a first position. Therefore, when the right chamber block 11R is located at the first position, a part of the right chamber block 11R (a part of the first surrounding plane P1 and the second surrounding plane P2) is located on the more front side than the capillary tube 6. Further, when forming the free air ball, the capillary arm 7 is disposed above the free air ball (see fig. 4). Therefore, if the bottom surface 7d of the capillary arm 7 is added, the inert gas region S1 can be referred to as a region surrounded by six surfaces.
According to this closed form, the inert gas can be enclosed in the region surrounded by the third surrounding surface P3, the chamber plate 16, the first surrounding surface P1, the right surrounding surface P2a, the left surrounding surface P2b, and the bottom surface 7d of the capillary arm 7. Therefore, the inert gas can be left in the inert gas area S1, and therefore, the oxidation of the free air balloon can be suitably suppressed.
As shown in fig. 6 and 7, when the wire bonding apparatus 1 is in the open state, the working space S2 is formed. That is, the open state is a state for forming the working space S2, when the function is described. That is, in the open state, a region (i.e., the working space S2) not blocked by a physical part is formed between the operator and the distal end of the capillary arm 7. In terms of the structure, the open state is a state in which the right chamber block 11R is separated from the capillary arm 7. The separated position is the second position of the right chamber block 11R.
The position of the right chamber block 11R in each axis direction is explained more specifically. First, in the vertical direction D1, the right chamber block 11R is located above the tip of the capillary arm 7 and the capillary 6. Then, in the front-rear direction D2, the right chamber block 11R is located further on the rear side than the front end of the capillary arm 7 and the capillary 6. The position is between the front end of the capillary arm 7 and the capillary 6 and the base unit 2. Further, in the left-right direction D3, the right chamber block 11R is separated to the right side of the tip of the capillary arm 7 and the capillary 6.
When the self-closed state is switched to the open state, the right chamber block 11R moves obliquely rearward to the right with respect to the front end of the capillary arm 7. The right chamber block 11R is separated from the capillary arm 7 by a movable mechanism 15. The axis AR of the bolt 14 of the movable mechanism 15 is orthogonal to the front-rear direction D2, and is inclined with respect to the up-down direction D1 and the left-right direction D3, respectively. For example, the axis AR of the bolt 14 is inclined at 45 degrees with respect to the left-right direction D3. The axis AR is disposed between the capillary 6 and the base unit 2.
In the second position, the right side surface 7b and the distal end surface 7c of the capillary arm 7 are opened. That is, the operator can visually recognize the distal end surface 7c side of the capillary arm 7 from the front. Further, the operator can enter from the right side surface 7b side of the capillary arm 7 to perform the replacement operation of the capillary 6. At this time, the right chamber block 11R is located above the front end surface 7c of the capillary arm 7. As a result, the operator can enter the right side surface 7b of the capillary arm 7 from right to left. Therefore, the workability can be further improved.
According to the wire bonding apparatus 1 of the present embodiment, the movable mechanism 15 moves the left chamber block 11L to switch from the open state to the closed state. In the closed configuration, the capillary 6 is surrounded by a left chamber block 11L and a right chamber block 11R. Therefore, the inert gas can be retained around the capillary 6. As a result, oxidation of the free air balloon can be suppressed. Then, the movable mechanism 15 moves the left chamber block 11L in the opposite direction, thereby switching from the closed state to the open state. The open form opens a part of the periphery of the capillary 6. As a result, the working space S2 can be secured. Therefore, the workability of wire bonding can be improved. Thus, the wire bonding apparatus 1 can ensure good bonding quality and improve workability.
The wire bonding apparatus 1 has a capillary 6, a left chamber block 11L, and a base unit 2 supporting the left chamber block 11L. The capillary tube 6 reciprocates in the vertical direction D1 with respect to the base unit 2. The left chamber block 11L is fixed relative to the base unit 2. The right chamber block 11R is moved by the movable mechanism 15 so as to be separated from the capillary 6. According to the constitution, the position of the left chamber block 11L does not need to be changed. Therefore, the structure of the wire bonding apparatus 1 can be simplified while ensuring good bonding quality and improving workability of wire bonding.
The gas supply unit 9 includes a left gas supply unit 9L provided in the left chamber block 11L and a right gas supply unit 9R provided in the left chamber block 11L. With this configuration, a favorable inert gas region S1 can be formed around the capillary 6.
The capillary 6 is attached to the tip of the capillary arm 7, and the tip of the capillary arm 7 extends in the left-right direction D3 perpendicular to the front-back direction D2 of the capillary 6. The left chamber block 11L has a third enclosing plane P3 intersecting with a left-right direction D3, the left-right direction D3 being orthogonal to the up-down direction D1 and the front-rear direction D2. The right chamber block 11R may also have a first surrounding plane P1 that faces the third surrounding plane P3 across the capillary 6, and a second surrounding plane P2 that intersects the front-rear direction D2.
The right chamber block 11R has a first surrounding plane P1 and a second surrounding plane P2. That is, in the closed state, the right chamber block 11R surrounds the periphery of the capillary 6 wider than the left chamber block 11L having the third surrounding plane P3. In the open state, the right chamber block 11R is disposed at a position away from the capillary 6. Then, a region surrounded by the first surrounding surface P1 and the second surrounding surface P2 is opened around the capillary 6. Therefore, a relatively wide range is opened around the capillary 6. As a result, a wide working space S2 can be ensured. Therefore, the workability of wire bonding can be further improved.
The right chamber block 11R can be switched between a first position in which the closed state is formed and a second position in which the open state is formed by the movable mechanism 15. The second position is located further to the rear than the capillary 6. According to the above configuration, the right chamber block 11R in the open state is disposed at a position distant from the capillary 6. Therefore, a wide working space S2 can be ensured. As a result, the workability of wire bonding can be further improved.
The second position is located further above the capillary 6. According to the above configuration, the right chamber block 11R in the open state is disposed at a position further away from the capillary 6. Therefore, a wide working space S2 can be ensured. As a result, the workability of wire bonding can be further improved.
The present invention has been described in detail with reference to the embodiments thereof. However, the present invention is not limited to the above embodiment. The present invention can be variously modified within a range not departing from the gist thereof.
In the above embodiment, the left chamber block 11L is fixed and the right chamber block 11R is movable. For example, the left chamber block 11L may be movable in addition to the right chamber block 11R.
In the above embodiment, the gas supply portion 9 is provided in both the left chamber block 11L and the right chamber block 11R. For example, the gas supply unit 9 may be provided only in one of the left chamber block 11L and the right chamber block 11R.
In the embodiment, the second position of the right chamber block 11R is set diagonally right above the capillary 6 and behind the capillary 6. The second position of the right chamber block 11R is not limited to the above arrangement as long as it is a position where the capillary 6 and a part of the tip of the capillary arm 7 can be opened.
Description of the symbols
1: wire bonding device
2: base unit
3: capillary unit
4: chamber unit
4L: left chamber unit
4R: right chamber unit
6: capillary tube
7: capillary arm
7 a: left side surface
7 d: bottom surface
7 b: right side surface
7 c: front end face
8L: left arm
8R: right arm
9: gas supply unit
9L: left gas supply part
9 La: left gas supply hole
9 Lb: left gas supply pipe
9R: right gas supply part
9 Ra: first right gas supply hole
9 Rc: second right gas supply hole
11: chamber
11L: left chamber block
11 La: front end
11 Lb: bottom surface
11R: right chamber block
12: fixed arm
12 a: connecting hole
13: movable arm
13 a: base end
13 b: front end
13 h: plug-in hole
14: bolt
14 a: shaft part
14 b: head part
15: movable mechanism
16 a: through hole
17: bolt mechanism
18: first adsorption part
19: second adsorption part
21: a first buffer part
22: a second buffer part
A1-A4, AR: axial line
D1: up and down direction
D2: front-back direction
D3: left and right direction
M1-M6: first to sixth magnets
P1: first enclosing surface
P2: second surrounding noodles
P3: third surface of envelopment
P2 a: right surrounding surface
P2 b: left surrounding surface
S1: inert gas region
S2: working space
Claims (6)
1. A wire bonding apparatus for wire bonding electrodes provided on a semiconductor chip, comprising:
a capillary for bonding the wire to the electrode; and
a chamber forming an inert gas region around the capillary; and is
The chamber has a first chamber portion, a second chamber portion different from the first chamber portion, and a movable portion that relatively moves at least one of the first chamber portion and the second chamber portion with respect to the capillary,
at least one of the first chamber part and the second chamber part includes a gas supply part for forming the inert gas region, and
the movable portion switches between a first state in which the periphery of the capillary is surrounded by the first chamber portion and the second chamber portion and a second state in which at least one of the first chamber portion and the second chamber portion is moved to open a part of the periphery of the capillary.
2. The wire bonding device of claim 1, further comprising a base portion supporting the capillary and the chamber,
the capillary is reciprocated in a predetermined direction relative to the base portion,
the second chamber portion is fixed with respect to the base portion, and
the first chamber section is moved by the movable section so as to be separated from the capillary.
3. The wire bonding apparatus according to claim 1 or 2, wherein the gas supply portion comprises: a first supply part provided in the first chamber part; and a second supply part provided in the second chamber part.
4. The wire bonding device according to claim 2, wherein the capillary is mounted to a front end portion of a capillary arm, the front end portion of the capillary arm being elongated in a first direction orthogonal to an extending direction of the capillary,
the first chamber part has a first surrounding surface orthogonal to the extending direction of the capillary and the first direction, and a second surrounding surface intersecting the first direction, and
the second chamber portion has a third envelope surface facing the first envelope surface with the capillary interposed therebetween.
5. The wire bonding device of claim 2, wherein the first chamber portion utilizes the movable portion to switch a first position forming the first form and a second position forming the second form, and
the second position is located further to the rear than the capillary.
6. The wire bonding apparatus of claim 5 wherein the second location is located further above the capillary.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017102812 | 2017-05-24 | ||
| JP2017-102812 | 2017-05-24 | ||
| PCT/JP2018/020023 WO2018216772A1 (en) | 2017-05-24 | 2018-05-24 | Wire bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110945635A true CN110945635A (en) | 2020-03-31 |
| CN110945635B CN110945635B (en) | 2024-05-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880048605.4A Active CN110945635B (en) | 2017-05-24 | 2018-05-24 | Wire bonding device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6787611B2 (en) |
| CN (1) | CN110945635B (en) |
| TW (1) | TWI677068B (en) |
| WO (1) | WO2018216772A1 (en) |
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|---|---|---|---|---|
| JPS5994837A (en) * | 1982-11-24 | 1984-05-31 | Nec Corp | Device for wire bonding |
| DE19604287A1 (en) * | 1996-02-07 | 1997-08-14 | Fraunhofer Ges Forschung | Fluid applicator for end of wire in wire bonding apparatus |
| JP2008034811A (en) * | 2006-07-03 | 2008-02-14 | Shinkawa Ltd | Ball forming device in wire bonding device, and bonding device |
| CN101427359A (en) * | 2006-04-20 | 2009-05-06 | 株式会社海上 | Work clamp and wire bonding device |
| CN101996903A (en) * | 2009-08-13 | 2011-03-30 | 株式会社华祥 | Wire bonding apparatus |
| US20110073635A1 (en) * | 2008-06-10 | 2011-03-31 | Kulicke And Soffa Industries, Inc. | Gas delivery system for reducing oxidation in wire bonding operations |
| CN103975426A (en) * | 2011-08-16 | 2014-08-06 | 株式会社新川 | Wire bonding device |
| CN103999204A (en) * | 2012-02-07 | 2014-08-20 | 株式会社新川 | Wire bonding apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7628307B2 (en) * | 2006-10-30 | 2009-12-08 | Asm Technology Singapore Pte Ltd. | Apparatus for delivering shielding gas during wire bonding |
| JP4531084B2 (en) * | 2007-08-31 | 2010-08-25 | 株式会社新川 | Bonding apparatus and bonding method |
| JP5616739B2 (en) * | 2010-10-01 | 2014-10-29 | 新日鉄住金マテリアルズ株式会社 | Multilayer copper bonding wire bonding structure |
-
2018
- 2018-05-22 TW TW107117303A patent/TWI677068B/en active
- 2018-05-24 WO PCT/JP2018/020023 patent/WO2018216772A1/en active Application Filing
- 2018-05-24 JP JP2019520310A patent/JP6787611B2/en active Active
- 2018-05-24 CN CN201880048605.4A patent/CN110945635B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5994837A (en) * | 1982-11-24 | 1984-05-31 | Nec Corp | Device for wire bonding |
| DE19604287A1 (en) * | 1996-02-07 | 1997-08-14 | Fraunhofer Ges Forschung | Fluid applicator for end of wire in wire bonding apparatus |
| CN101427359A (en) * | 2006-04-20 | 2009-05-06 | 株式会社海上 | Work clamp and wire bonding device |
| JP2008034811A (en) * | 2006-07-03 | 2008-02-14 | Shinkawa Ltd | Ball forming device in wire bonding device, and bonding device |
| US20110073635A1 (en) * | 2008-06-10 | 2011-03-31 | Kulicke And Soffa Industries, Inc. | Gas delivery system for reducing oxidation in wire bonding operations |
| CN101996903A (en) * | 2009-08-13 | 2011-03-30 | 株式会社华祥 | Wire bonding apparatus |
| CN103975426A (en) * | 2011-08-16 | 2014-08-06 | 株式会社新川 | Wire bonding device |
| CN103999204A (en) * | 2012-02-07 | 2014-08-20 | 株式会社新川 | Wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6787611B2 (en) | 2020-11-18 |
| TW201901891A (en) | 2019-01-01 |
| CN110945635B (en) | 2024-05-10 |
| WO2018216772A1 (en) | 2018-11-29 |
| JPWO2018216772A1 (en) | 2020-04-23 |
| TWI677068B (en) | 2019-11-11 |
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