JP2806711B2 - IC wire bonder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC wire bonder, and more particularly to a wire clamper for an ultrasonic wedge bonder.

[0002]

2. Description of the Related Art As shown in a front view of FIG. 6, a side view of FIG. 7, an enlarged view of a tip portion of FIG. 8, and a bottom view of FIG. That is, the wire clamp surface 12 at the tip of the clamper 1 is flat. The clamping force on the bonding wire 3 depends on the spring force of the clamp spring 13 attached between the pair of right and left clampers. Also,
A cylinder 2 that opens the wire clamper to the left and right is attached to one of the clampers 1. By driving the cylinder 2, a pair of left and right clampers open and close left and right about the upper rotation axis. The wire clamper can move up and down along the linear way bearing 6, and the bonding wire 3 passes through the wire clamper and is connected to the IC element and the lead inside the IC case by the bonding tool 5 attached to the ultrasonic vibrator 4. Is ultrasonically bonded.

[0003]

In this conventional wire clamper, the bonding wire is held by being clamped from the left and right on a flat clamping surface. Therefore, when the left and right clampers are opened during the wire bonding, the bonding wire is removed. There is a problem that the bonding wire comes off from the clamp surface due to slack or vibration.

[0004]

According to the present invention, there is provided an IC wire bonder comprising: a hollow cylindrical wire supply portion for preventing a bonding wire from coming off a clamp surface of a wire clamper;
The bonding wire provided at the lower end of the wire supply section
A collet-shaped clamp portion equally divided into two or more for clamping, a coil spring for generating a clamp load on the bonding wire, a guide having a tapered hole into which the clamp portion is inserted, and a wire supply And a cylinder for moving the part in the wire clamper main body and opening and closing the clamp part by the tapered hole.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a front view of one embodiment of the present invention, FIG. 2 is a side view thereof, FIG. 3 is a partially enlarged cross-sectional view of FIG. 1, and FIGS. 4 and 5 are bottom views of the tip of the clamp portion of FIG.

A wire clamper mechanism for an IC wire bonder according to the present embodiment is configured such that a bonding wire 3 is passed in the axial direction of a hollow cylindrical wire supply unit 11 and a tip end of a clamp unit 8 provided at a lower end of the wire supply unit 11. Has a circular arc surface identical to the outer shape of the bonding wire 3, a coil spring 10 and a guide 9 having a tapered hole are mounted in the wire clamper body 7, and the wire supply portion 11 is elastically The inside of the wire clamper main body 7 can be moved.

In the operation of the present embodiment, the spring force of the coil spring 10 is transmitted from the guide 9 having a tapered hole fixed to the wire clamper body 7 to the outer tapered portion of the clamp portion 8 integrated with the wire supply portion 11, This force acts as a wire clamping force on the wire clamping surface 12 when the clamp portion 8 is closed. The clamp portion 8 has a collet chuck structure divided into a plurality of equal parts. For example, the clamp part 8 may be divided into two parts as shown in FIG. 4 or four parts as shown in FIG. Further, during wire bonding connection, the wire supply unit 11 is moved in the traveling direction of the bonding wire 3 by the driving force of the cylinder 2 to form a gap in the taper surface between the guide 9 and the clamp unit 8, and the wire clamp surface 12 is formed. Opens to reduce the clamping force.

[0008]

As described above, according to the present invention, the clamp portion at the tip of the hollow cylindrical wire supply portion 11 is provided with a collet.
The bonding structure prevents the bonding wire 3 from coming off the wire clamp surface.

[Brief description of the drawings]

FIG. 1 is a front view of one embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a partially enlarged sectional view of FIG. 1;

FIG. 4 is a bottom view of the distal end of the clamp unit shown in FIG. 3;

FIG. 5 is a bottom view of another example of the distal end of the clamp unit in FIG. 3;

FIG. 6 is a front view of a wire clamper in a conventional IC wire bonder.

FIG. 7 is a side view of FIG. 6;

FIG. 8 is a partially enlarged view of FIG. 6;

FIG. 9 is a bottom view of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Clamper 2 Cylinder 3 Bonding wire 4 Ultrasonic transducer 5 Bonding tool 6 Linear way bearing 7 Wire clamper main body 8 Clamp part 9 Guide 10 Coil spring 11 Wire supply part 12 Wire clamp surface 13 Clamp spring

Claims (1)

(57) [Claims] 1. A IC bonder for connecting the IC element and the IC casing inner lead at the bonding wire, a hollow cylindrical wire supply part bonding wire passes through the axis, is provided at the lower end of the wire feed portion and co <br/> cmdlet shaped clamping portions, the guide having a tapered hole that the clamping part is inserted, Bonn depressing the guide
To generate a clamp load on the wire
An IC wire bonder comprising: a wire clamper including a coil spring and a cylinder that moves the wire supply unit and opens and closes a clamp unit with the tapered hole.