CN110940260B - Grid array device flatness detection tool and detection method - Google Patents
Grid array device flatness detection tool and detection method Download PDFInfo
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- CN110940260B CN110940260B CN201911341040.1A CN201911341040A CN110940260B CN 110940260 B CN110940260 B CN 110940260B CN 201911341040 A CN201911341040 A CN 201911341040A CN 110940260 B CN110940260 B CN 110940260B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/28—Measuring arrangements characterised by the use of mechanical techniques for measuring roughness or irregularity of surfaces
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Abstract
The invention relates to a flatness detection tool and a flatness detection method for a grid array device, and belongs to the technical field of flatness detection of grid array devices. The method of the invention determines the standard measurement size by combing the height of the welding terminal of the device, determines the measurement size according to the measurement requirement of flatness, and adopts a superposition method to measure through a tool, and the measurement method comprises the following steps: the method has the advantages of simple and easy operation, effective measurement in place, capability of avoiding the damage of the device guide leg and solving the problem of poor welding caused by poor flatness of the welding terminal of the device.
Description
Technical Field
The invention relates to a flatness detection tool and a flatness detection method for a grid array device, and belongs to the technical field of flatness detection of grid array devices.
Background
The grid array device comprises two packaging forms, namely a columnar grid array form and a ball grid array form, and is widely used in the field of electronic product manufacturing because the grid array device is suitable for the conditions of larger size and more I/O (the number of pins of an input end and an output end). Meanwhile, the number of I/O is large, the density is high, the flatness of the pins of the grid array device must be measured, and the detection requirement is that when the flatness of each pin of the device is less than or equal to 0.1mm, good welding quality can be formed, otherwise, the quality problem of non-welding can occur. Because the welding quality problem that the plane degree is bad causes often can't avoid, and the quality is detected through X light and CT to the solder joint quality after the welding, often can appear not forming the wet condition of soldering tin between welded terminal and pad.
The existing detection method comprises the following steps: visual inspection was performed using a feeler gauge. The grid array device is placed on a marble platform and is detected by using a feeler gauge, and the method has the conditions of difficult operation, easy damage to device guide legs and incomplete detection.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the defects of the prior art are overcome, and a grid array device flatness detection tool and a detection method are provided.
The technical solution of the invention is as follows:
a flatness detection tool for a grid array device comprises a reference tool, a measurement tool A, a measurement tool B and a lead screw; the screw rod can drive the measuring tool A to move up and down;
the reference tool is a hollow cylinder with a flat plate at the top end; the top end plate of the reference tool is provided with a plurality of through holes, the number of the through holes on the top end plate of the reference tool is the same as the number of the welding columns on the columnar grid array CG717 device, the diameter of the through holes on the top end plate of the reference tool is larger than that of the welding columns on the columnar grid array CG717 device, the optimal diameter is 0.9mm, the distance between the through holes on the top end plate of the reference tool is consistent with the distance between the welding columns on the columnar grid array CG717 device, and the reference tool is made of stainless steel materials; the total thickness of the reference tool is 2mm, and the thickness of a top flat plate of the reference tool is 1 mm;
the measuring tool A is a flat plate with a plurality of through holes, the number of the through holes in the measuring tool A is the same as that of welding columns on a columnar grid array CG717 device, the diameter of the through holes in the measuring tool A is larger than that of the welding columns on the columnar grid array CG717 device, the preferred diameter is 0.9mm, the distance between the through holes in the measuring tool A is consistent with the distance between the welding columns on the columnar grid array CG717 device, and the measuring tool A is made of stainless steel materials; the thickness of the measuring tool A is 0.1 mm;
the measuring tool B is the same as the measuring tool A;
a grid array device flatness detection method, the said grid array device is a cylindrical grid array CG717 device, the ceramic body thickness of the cylindrical grid array CG717 device is 2mm, 717 welding columns altogether, the height of the welding column is 2.1mm-2.3mm, the diameter of the welding column is 0.51mm-0.57mm, the welding column is welded on the pad of the device body, the diameter of the pad is 1.4mm, the height of the welding spot is 0.6-0.8mm, the interval between the welding columns is 0.72mm, the material of the welding column is that the copper tape twines the high lead tin (80Pb 20S); the planeness of each pin is required to be less than or equal to 0.1mm, namely the size difference between the highest point and the lowest point of 717 pins of the device is 0.1mm, so that the requirement can be met;
the method comprises the following steps:
(1) firstly, sleeving a reference tool on a columnar grid array CG717 device, and enabling a welding column on the columnar grid array CG717 device to penetrate through a through hole on the reference tool;
(2) sleeving a measurement tool A above a flat plate at the top end of a reference tool, wherein welding column positions on a columnar grid array CG717 device correspond to through holes in the measurement tool A one by one, the welding columns on the columnar grid array CG717 device are exposed, and the measurement tool A is driven by a lead screw to move upwards, so that the top end of the welding column at the lowest point is flush with the upper surface of the measurement tool A;
(3) the measuring tool B is sleeved on the measuring tool A, the through holes in the measuring tool A correspond to the through holes in the measuring tool B one to one, if the welding columns on the columnar grid array CG717 device are not exposed, the welding columns on the columnar grid array CG717 device meet welding requirements, and if the welding columns on the columnar grid array CG717 device are exposed, the welding columns on the columnar grid array CG717 device do not meet the welding requirements.
Advantageous effects
(1) The method of the invention determines the standard measurement size by combing the height of the welding terminal of the device, determines the measurement size according to the measurement requirement of flatness, and adopts a superposition method to measure through a tool, and the measurement method comprises the following steps: the method has the advantages of simple and easy operation, effective measurement in place, capability of avoiding the damage of the device guide leg and solving the problem of poor welding caused by poor flatness of the welding terminal of the device.
(2) The method can solve the problem of poor welding of the grid array device caused by insufficient flatness detection.
(3) The basic size of the height of the device pin is 2mm, namely the height of the device pin meets the requirement; the measurement height dimension is 0.1mm, namely the maximum difference between the highest point and the lowest point of the pin of the device. And a measuring method of nested superposition is adopted.
(4) The thickness of benchmark frock is 2mm, and this frock middle part is the fretwork design, and the fretwork degree of depth is 1mm, can effectively avoid the damage to the solder joint. According to the characteristics of the device, four corners are designed by adopting chamfers, and the flatness of the tool after installation can be ensured by supporting the four corners of the device; the diameter of the tool opening is 0.9mm, the height of a welding point of the pin welding column of the device is met, and the welding column of the device is prevented from being damaged.
Drawings
FIG. 1 is a schematic structural diagram of a reference fixture;
fig. 2 is a schematic structural diagram of the measurement tool.
Detailed Description
The invention is further illustrated by the following figures and examples.
Examples
As shown in fig. 1 and 2, a grid array device flatness detection tool includes a reference tool, a measurement tool a, a measurement tool B, and a lead screw; the screw rod can drive the measuring tool A to move up and down;
the reference tool is a hollow cylinder with a flat plate at the top end; the top end plate of the reference tool is provided with a plurality of through holes, the number of the through holes on the top end plate of the reference tool is the same as the number of the welding columns on the columnar grid array CG717 device, the diameter of the through holes on the top end plate of the reference tool is larger than that of the welding columns on the columnar grid array CG717 device, the optimal diameter is 0.9mm, the distance between the through holes on the top end plate of the reference tool is consistent with the distance between the welding columns on the columnar grid array CG717 device, and the reference tool is made of stainless steel materials; the total thickness of the reference tool is 2mm, and the thickness of a top flat plate of the reference tool is 1 mm;
the measuring tool A is a flat plate with a plurality of through holes, the number of the through holes in the measuring tool A is the same as that of welding columns on a columnar grid array CG717 device, the diameter of the through holes in the measuring tool A is larger than that of the welding columns on the columnar grid array CG717 device, the preferred diameter is 0.9mm, the distance between the through holes in the measuring tool A is consistent with the distance between the welding columns on the columnar grid array CG717 device, and the measuring tool A is made of stainless steel materials; the thickness of the measuring tool A is 0.1 mm;
the measuring tool B is the same as the measuring tool A;
a grid array device flatness detection method, the said grid array device is a cylindrical grid array CG717 device, the ceramic body thickness of the cylindrical grid array CG717 device is 2mm, 717 welding columns altogether, the height of the welding column is 2.1mm-2.3mm, the diameter of the welding column is 0.51mm-0.57mm, the welding column is welded on the pad of the device body, the diameter of the pad is 1.4mm, the height of the welding spot is 0.6-0.8mm, the interval between the welding columns is 0.72mm, the material of the welding column is that the copper tape twines the high lead tin (80Pb 20S); the planeness of each pin is required to be less than or equal to 0.1mm, namely the size difference between the highest point and the lowest point of 717 pins of the device is 0.1mm, so that the requirement can be met;
the method comprises the following steps:
(1) firstly, sleeving a reference tool on a columnar grid array CG717 device, and enabling a welding column on the columnar grid array CG717 device to penetrate through a through hole on the reference tool;
(2) sleeving a measurement tool A above a flat plate at the top end of a reference tool, wherein welding column positions on a columnar grid array CG717 device correspond to through holes in the measurement tool A one by one, the welding columns on the columnar grid array CG717 device are exposed, and the measurement tool A is driven by a lead screw to move upwards, so that the top end of the welding column at the lowest point is flush with the upper surface of the measurement tool A;
(3) the measuring tool B is sleeved on the measuring tool A, the positions of welding columns on the columnar grid array CG717 device correspond to the through holes in the measuring tool A one by one, if the welding columns on the columnar grid array CG717 device are not exposed, the welding columns on the columnar grid array CG717 device meet welding requirements, and if the welding columns on the columnar grid array CG717 device are exposed, the welding columns on the columnar grid array CG717 device do not meet the welding requirements.
Claims (7)
1. A method for detecting the flatness of a grid array device comprises the steps that a detection tool used in the method comprises a reference tool, a measurement tool A, a measurement tool B and a lead screw; the screw rod can drive the measuring tool A to move up and down;
the reference tool is a hollow cylinder with a flat plate at the top end; the top end plate of the reference tool is provided with a plurality of through holes, the number of the through holes on the top end plate of the reference tool is the same as the number of the welding columns on the columnar grid array CG717 device, the diameter of the through holes on the top end plate of the reference tool is larger than that of the welding columns on the columnar grid array CG717 device, the distance between the through holes on the top end plate of the reference tool is consistent with the distance between the welding columns on the columnar grid array CG717 device, the total thickness of the reference tool is 2mm, and the thickness of the top end plate of the reference tool is 1 mm;
the measuring tool A is a flat plate with a plurality of through holes, the number of the through holes in the measuring tool A is the same as that of welding columns on a columnar grid array CG717 device, the diameter of the through holes in the measuring tool A is larger than that of the welding columns on the columnar grid array CG717 device, the distance between the through holes in the measuring tool A is consistent with the distance between the welding columns on the columnar grid array CG717 device, and the thickness of the measuring tool A is 0.1 mm;
the measuring tool B is the same as the measuring tool A;
the method is characterized in that: the height of the welding column of the grid array device is 2.1mm-2.3 mm; the method comprises the following steps:
(1) sleeving a reference tool on the grid array device, and enabling a welding column on the grid array device to penetrate through a through hole on the reference tool;
(2) sleeving a measurement tool A above a flat plate at the top end of a reference tool, wherein the positions of welding columns on a grid array device correspond to through holes on the measurement tool A one by one, the welding columns on the grid array device are exposed, and the measurement tool A is driven by a lead screw to move upwards so that the top end of the welding column at the lowest point is flush with the upper surface of the measurement tool A;
(3) and sleeving the measurement tool B on the measurement tool A, wherein the through holes on the measurement tool A correspond to the through holes on the measurement tool B one by one, if the welding columns on the grid array device are not exposed, the welding columns on the grid array device meet the welding requirement that the planeness of each pin is less than or equal to 0.1mm, and if the welding columns on the grid array device are exposed, the welding columns on the grid array device do not meet the welding requirement that the planeness of each pin is less than or equal to 0.1 mm.
2. The method of claim 1, wherein the step of inspecting the flatness of the gate array device comprises: the grid array device is a columnar grid array CG717 device, the thickness of a ceramic body of the columnar grid array CG717 device is 2mm, and 717 welding columns are arranged in total.
3. The method of claim 1, wherein the step of inspecting the flatness of the gate array device comprises: the diameter of the welding column is 0.51mm-0.57 mm.
4. The method of claim 1, wherein the step of inspecting the flatness of the gate array device comprises: the welding column is welded on a welding disc of the device body, and the diameter of the welding disc is 1.4 mm.
5. The method of claim 1, wherein the step of inspecting the flatness of the gate array device comprises: the height of the welding spot is 0.6-0.8mm, and the space between the welding columns is 0.72 mm.
6. The method of claim 1, wherein the step of inspecting the flatness of the gate array device comprises: the welding column is made of copper strips wound with high lead tin.
7. The method of claim 1, wherein the step of inspecting the flatness of the gate array device comprises: the diameter of a through hole in a top flat plate of the reference tool is 0.9 mm; the material of benchmark frock is stainless steel material, and the diameter of through-hole on the measurement frock A is 0.9 mm.
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| CN1847784A (en) * | 2005-04-05 | 2006-10-18 | 华为技术有限公司 | Device pin coplanarity measuring method |
| CN202903096U (en) * | 2012-11-16 | 2013-04-24 | 无锡华润安盛科技有限公司 | Semiconductor chip pin testing tool |
| JP2015148481A (en) * | 2014-02-05 | 2015-08-20 | 株式会社 コアーズ | Flatness measuring device of bga and flatness measurement method of bga |
| CN206369526U (en) * | 2016-12-23 | 2017-08-01 | 东莞华程金属科技有限公司 | A kind of conducting metal product plane degree cubing |
| CN207197430U (en) * | 2017-09-26 | 2018-04-06 | 舟山润达电子有限公司 | The flatness detecting tool of surface labeling type electronic component pin |
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- 2019-12-23 CN CN201911341040.1A patent/CN110940260B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1847784A (en) * | 2005-04-05 | 2006-10-18 | 华为技术有限公司 | Device pin coplanarity measuring method |
| CN202903096U (en) * | 2012-11-16 | 2013-04-24 | 无锡华润安盛科技有限公司 | Semiconductor chip pin testing tool |
| JP2015148481A (en) * | 2014-02-05 | 2015-08-20 | 株式会社 コアーズ | Flatness measuring device of bga and flatness measurement method of bga |
| CN206369526U (en) * | 2016-12-23 | 2017-08-01 | 东莞华程金属科技有限公司 | A kind of conducting metal product plane degree cubing |
| CN207197430U (en) * | 2017-09-26 | 2018-04-06 | 舟山润达电子有限公司 | The flatness detecting tool of surface labeling type electronic component pin |
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