CN110933868A - PTH welding method for bending type positioning pin foot - Google Patents
PTH welding method for bending type positioning pin foot Download PDFInfo
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- CN110933868A CN110933868A CN201911385128.3A CN201911385128A CN110933868A CN 110933868 A CN110933868 A CN 110933868A CN 201911385128 A CN201911385128 A CN 201911385128A CN 110933868 A CN110933868 A CN 110933868A
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- positioning pin
- solder paste
- bending type
- pth
- hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application discloses a PTH welding method of a bending type positioning pin, which comprises the steps of covering a layer of solder paste on one side of the hole wall of an insertion hole of the bending type positioning pin; inserting the bending type positioning pin foot into one side with the solder paste in the insertion hole; wave soldering is carried out on the bending type positioning pin foot, solder paste on the hole wall is melted into molten tin, the molten tin which upwelles is converged with the molten tin on the hole wall, and the upper portion of the part, in close contact with the insertion hole, of the bending position of the bending type positioning pin foot is filled. The PTH welding method of above-mentioned pin foot is fixed a position to bending type that this application provided can be abundant gushes upward with the acceleration PTH tin water, improves the phenomenon of the little tin of welding, improves the welding yield, reduces inspection cost of maintenance.
Description
Technical Field
The invention belongs to the technical field of circuit welding, and particularly relates to a PTH welding method for a bending type positioning pin.
Background
The formula USB interface is cut straightly to side is the USB external interface that is general in the server product, is responsible for the adaptation demand of the external equipment of server product the great majority, and this is the important part of server mainboard, and this kind of formula USB is cut straightly to side can frequently be pulled out in the use and inserted, so the welding type of material is the PTH welding usually, except signal pin, material body metal casing has 3 big bending type card pin formulas location to consolidate the pin. In the using process of the element, 3 large positioning pins of the element need to pass through three positioning holes on a PCB, and then welding is completed through wave soldering, but as the positioning pins of the element are bending type clamp pins, in order to enhance the fixing strength after the material is plugged, the matching tolerance of the size design of the plug-in hole is very small, that is, as shown in fig. 1, fig. 1 is a schematic diagram of PTH welding of the existing bending type positioning pin pins, it can be seen that a USB bending type positioning clamp pin101 is inserted into a corresponding PCB hole 102, when the product after the plug-in is welded through wave soldering, as the bending of the clamp pin is clung to the hole wall, the welding molten tin 103 can not smoothly surge upwards, the hole wall of the plug-in hole is mostly OPS or ENIG, the surface material of the plug-in hole can be welded only by chemical reaction with the molten tin, so that the shadow area 104 of the USB clamp pin can generate obvious tin lack phenomenon, and the existing PTH welding process can not meet the tin soldering requirement of, a great deal of manpower is required to perform post-welding inspection and maintenance.
Disclosure of Invention
In order to solve the problems, the invention provides the PTH welding method of the bending type positioning pin foot, which can fully accelerate the solder upwelling of the PTH, improve the phenomenon of soldering tin shortage, improve the welding yield and reduce the inspection and maintenance cost.
The invention provides a PTH welding method for a bending type positioning pin, which comprises the following steps:
covering a layer of solder paste on one side of the hole wall of the bending type positioning pin insertion hole;
inserting the bending type positioning pin foot into one side with the solder paste in the insertion hole;
wave soldering is carried out on the bending type positioning pin foot, solder paste on the hole wall is melted into molten tin, the molten tin which upwelles is converged with the molten tin on the hole wall, and the upper portion of the part, in close contact with the insertion hole, of the bending position of the bending type positioning pin foot is filled.
Preferably, in the above-mentioned PTH soldering method using a bendable positioning pin, before one side of a hole wall of an insertion hole of the bendable positioning pin is covered with a layer of solder paste, the method further includes:
and printing additional solder paste on the bending type positioning pin insertion holes, melting the additional solder paste, and enabling molten tin generated by melting to flow to the hole walls under the action of gravity to form the solder paste covering the hole walls.
Preferably, in the above-mentioned PTH welding method for the bent positioning pin, an additional solder paste is printed on the upper surface of the bent positioning pin insertion hole by using a steel plate.
Preferably, in the PTH welding method for the bendable positioning pin, before printing solder paste on the upper surface of the bendable positioning pin insertion hole using a steel plate, the method further includes:
and an additional arc-shaped hole with a preset width is formed in the position, corresponding to the bending type positioning pin inserting hole, on the steel plate.
Preferably, in the PTH welding method using the bent positioning pin, the preset width is 0.3 mm.
Preferably, in the PTH welding method for the bent positioning pin, the wave soldering is performed on the bent positioning pin at 260 to 280 ℃.
Preferably, in the PTH soldering method using the bent pin positioning pin, when SMT reflow is performed at 227-250 ℃, the additional solder paste is melted, and solder water generated by the melting flows to the hole wall under the action of gravity to form the solder paste covering the hole wall.
According to the PTH welding method for the bending type positioning pin foot provided by the invention, the solder paste layer is covered on one side of the hole wall of the insertion hole of the bending type positioning pin foot, the bending type positioning pin foot is inserted into one side with the solder paste in the insertion hole, then wave soldering is carried out on the bending type positioning pin foot, the solder paste on the hole wall is melted into the molten tin, the molten tin which uprushes up is converged with the molten tin on the hole wall, the bending position of the bending type positioning pin foot is filled above the tight contact part of the insertion hole, the solder paste and the tin material of the wave soldering are the same, and the solder paste and the tin material of the wave soldering are easier to be fused at the moment of the molten tin uprushing, so that the solder uprushing of the PTH can be sufficiently accelerated, the phenomenon of little tin soldering is improved, the soldering yield is improved, and the inspection and maintenance cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic diagram of a prior art PTH weld of a bent positioning pin;
fig. 2 is a schematic diagram of a PTH welding method for a bending type positioning pin provided in the present application;
FIG. 3 is a schematic view of solder paste covering the hole wall of the bending type positioning pin insertion hole;
FIG. 4 is a schematic view of the bent positioning pin inserted into the hole;
FIG. 5 is a schematic view of wave soldering of a folded positioning pin;
fig. 6 is a schematic view of printing additional solder paste on top of the bendable positioning pin insertion holes.
Detailed Description
The core of the invention is to provide the PTH welding method of the bending type positioning pin foot, which can fully accelerate the solder upwelling of the PTH, improve the phenomenon of soldering less tin, improve the welding yield and reduce the inspection and maintenance cost.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of a PTH welding method for a bending type positioning pin foot provided by the present application is shown in fig. 2, where fig. 2 is a schematic view of the PTH welding method for a bending type positioning pin foot provided by the present application, and the method includes the following steps:
s1: covering a layer of solder paste on one side of the hole wall of the bending type positioning pin insertion hole;
it should be noted that, referring to fig. 3, fig. 3 is a schematic diagram of covering the hole wall of the bending type positioning pin insertion hole with solder paste, and it can be seen that the hole wall of the bending type positioning pin insertion hole 201 is covered with solder paste 202, where only a part of the hole wall needs to be covered with solder paste, the side is the side where the bent portion contacts with the hole wall, and other portions where the bent portion does not contact with the hole wall do not need to be covered with solder paste.
S2: inserting the bending type positioning pin into one side with the solder paste in the insertion hole;
specifically, referring to fig. 4, fig. 4 is a schematic diagram after the bending type positioning pin is inserted into the hole, and it can be seen that the bending portion of the bending type positioning pin is in contact with the solder paste at the side where the bending type positioning pin 203 is inserted into the insertion hole 201 and has the solder paste, that is, at the left side in fig. 4.
S3: and performing wave-soldering on the folded and bent positioning pin, melting the solder paste on the hole wall into molten tin, converging the molten tin which upwells with the molten tin on the hole wall, and filling the upper part of the part, in close contact with the insertion hole, of the bent position of the bent positioning pin.
Specifically, referring to fig. 5, fig. 5 is a schematic view of wave soldering a double-bent positioning pin, and it can be seen that at this time, the solder paste 203 on the hole wall is melted at the high temperature of wave soldering, and the upwelling solder 204 merges with the solder slowly melted on the hole wall, as shown by the arrow in fig. 5, which is the direction of the upwelling solder 204, and although the upwelling solder cannot pass through the portion where the bent position and the insertion hole are in close contact, the upwelling solder can pass around from the side of the portion and reach the upper portion of the contact portion because the contact portion is only a small portion. Because molten tin that melts on the lateral wall is same material with the tin that upwells, consequently can the better realization of the two fuse to more easily fill the top of bending position and patchhole in close contact with position, this position just no longer appears because of the shadow that can't weld and lead to, this has just improved welded quality, thereby can reduce the cost of reprocessing.
According to the above description, in the embodiment of the PTH welding method for the bending type positioning pin provided by the present application, since a layer of solder paste is firstly covered on one side of the hole wall of the insertion hole of the bending type positioning pin, the bending type positioning pin is inserted into the insertion hole on the side having the solder paste, then the wave soldering is performed on the bending type positioning pin, the solder paste on the hole wall is melted into molten tin, the molten tin rushing up is merged with the molten tin on the hole wall, the bending position of the bending type positioning pin and the upper side of the close contact part of the insertion hole are filled, it can be seen that the solder paste is the same as the tin material of the wave soldering, and the two are more easily fused in the moment of the molten tin rushing up, so that the molten tin rushing up can be sufficiently accelerated, the phenomenon of soldering with less tin is improved, the welding yield is improved, and the inspection and.
In a specific embodiment of the above-mentioned PTH welding method for bending type positioning pin, before one side of the hole wall of the insertion hole of the bending type positioning pin is covered with a layer of solder paste, the method may further include:
and printing extra solder paste on the bending type positioning pin insertion holes, melting the extra solder paste, and enabling molten tin generated by melting to flow to the hole walls under the action of gravity to form the solder paste covering the hole walls.
Specifically, referring to fig. 6, fig. 6 is a schematic diagram of printing additional solder paste on the upper surface of the bending type positioning pin insertion hole, which is a relatively easy-to-operate manner of manufacturing solder paste covering the hole wall, that is, as shown in fig. 6, the additional solder paste 205 is printed on the upper surface of the bending type positioning pin insertion hole 201, that is, in addition to the solder paste manufactured according to the normal flow, the additional solder paste 205 is added here, and when the solder paste is subjected to the subsequent SMT flow, the additional solder paste 205 melts at a high temperature and flows down onto the hole wall under the action of gravity, so as to form the solder paste 202 covering the hole wall. Of course, this is only one way of making the solder paste on the hole wall, and other ways may be actually selected according to actual needs, and are not limited here.
In another embodiment of the above-mentioned PTH welding method of bending type location pin foot, can utilize the steel sheet to print extra tin cream on the pin foot patchhole of bending type location, it should be noted that, the steel sheet is used commonly now to scribble the tin cream, therefore can open more suitable holes on the basis of current steel sheet, print this kind of extra tin cream, improve tin through steel sheet printing tin cream, only need to print to plug-in components hole outside hole ring and mend tin, utilize the characteristic that the tin cream melts the infiltration of SMT welding process, the tin cream coating welding that will print is in the outside of the easy few tin of bending type card pin foot welding, the technology is more mature like this, the cost is lower, and realize coating simultaneously with the tin cream of other positions, the preparation efficiency is higher.
In another specific embodiment of the above-mentioned PTH welding method for bending type positioning pin, before printing solder paste on the bending type positioning pin insertion hole by using a steel plate, the method may further include:
an extra arc-shaped hole with preset width is formed in the position, corresponding to the bending type positioning pin inserting hole, on the steel plate, the preset width is positively correlated with the quantity of solder paste to be printed, the width of a required hole can be calculated in advance through the quantity of the solder paste, the preset width is 0.3mm, and other widths can be selected according to actual needs without limitation.
In an embodiment of the above PTH soldering method for the bent positioning pin, the bent positioning pin is subjected to wave soldering at 260-280 ℃, preferably 275 ℃, so that when the solder water of wave soldering overflows, the solder paste on the hole wall is the same as the solder material of the wave soldering, the solder paste and the solder material of the wave soldering are fused at the moment that the solder water overflows, the upward thrust of the solder water of the wave soldering continuously acts on the soldering hole wall in the molten state, and the solder can smoothly extend upwards, thereby achieving the sufficient soldering tin effect.
In another preferred embodiment of the above PTH soldering method for bending and positioning pin, when SMT reflow is performed at 227-250 ℃, additional solder paste is melted, and solder water generated by melting flows to the hole wall under the action of gravity to form solder paste covering the hole wall.
In conclusion, the method can be applied to the side-vertical direct-insertion type USB interface of the server product, and can be applied to the improvement scheme of the PTH tinning effect of all the bent positioning card pins in an expanded manner, so that the production yield of the product is improved, and the labor input and the maintenance cost are reduced.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. The utility model provides a PTH welding method of pin foot is fixed a position to bending type which characterized in that includes:
covering a layer of solder paste on one side of the hole wall of the bending type positioning pin insertion hole;
inserting the bending type positioning pin foot into one side with the solder paste in the insertion hole;
wave soldering is carried out on the bending type positioning pin foot, solder paste on the hole wall is melted into molten tin, the molten tin which upwelles is converged with the molten tin on the hole wall, and the upper portion of the part, in close contact with the insertion hole, of the bending position of the bending type positioning pin foot is filled.
2. The PTH soldering method for the bendable positioning pin according to claim 1, wherein before covering one side of the hole wall of the bendable positioning pin insertion hole with a layer of solder paste, the method further comprises:
and printing additional solder paste on the bending type positioning pin insertion holes, melting the additional solder paste, and enabling molten tin generated by melting to flow to the hole walls under the action of gravity to form the solder paste covering the hole walls.
3. The PTH soldering method for the bendable positioning pin according to claim 2, wherein an additional solder paste is printed on the holes for inserting the bendable positioning pin by using a steel plate.
4. The PTH soldering method for the bendable positioning pin according to claim 3, wherein the method further comprises, before printing solder paste on the bendable positioning pin insertion hole using a steel plate:
and an additional arc-shaped hole with a preset width is formed in the position, corresponding to the bending type positioning pin inserting hole, on the steel plate.
5. The PTH welding method for bendable positioning pin feet of claim 4, wherein the predetermined width is 0.3 mm.
6. The PTH soldering method for the bent positioning pin foot according to claim 5, wherein the wave soldering is performed on the bent positioning pin foot at 260 to 280 ℃.
7. The PTH soldering method for the bendable positioning pin foot according to claim 2, wherein the additional solder paste is melted when SMT reflow is performed at 227-250 degrees Celsius, and solder water generated by the melting flows to the hole wall under the action of gravity to form solder paste covering the hole wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911385128.3A CN110933868B (en) | 2019-12-28 | 2019-12-28 | PTH welding method for bending type positioning pin foot |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911385128.3A CN110933868B (en) | 2019-12-28 | 2019-12-28 | PTH welding method for bending type positioning pin foot |
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| CN110933868A true CN110933868A (en) | 2020-03-27 |
| CN110933868B CN110933868B (en) | 2021-01-22 |
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Citations (7)
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| JPH01266788A (en) * | 1988-04-18 | 1989-10-24 | Nec Corp | Method of repairing disconnection of small diameter through-hole of printed wiring board |
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| JPH08181407A (en) * | 1994-12-27 | 1996-07-12 | Sony Corp | Printed wiring board and its manufacturing method |
| JP2000307232A (en) * | 1999-04-20 | 2000-11-02 | Fujitsu Ten Ltd | Soldering method |
| TW200509762A (en) * | 2003-07-02 | 2005-03-01 | Toshiba Corp | Electronic component mounting method, substrate manufacturing apparatus, and circuit board |
| CN107592751A (en) * | 2017-09-18 | 2018-01-16 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and preparation method thereof, contact pin component, mobile terminal |
| CN208079503U (en) * | 2018-04-20 | 2018-11-09 | 杭州临安鹏宇电子有限公司 | A kind of single-sided circuit board |
-
2019
- 2019-12-28 CN CN201911385128.3A patent/CN110933868B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01266788A (en) * | 1988-04-18 | 1989-10-24 | Nec Corp | Method of repairing disconnection of small diameter through-hole of printed wiring board |
| JPH0494591A (en) * | 1990-08-10 | 1992-03-26 | Cmk Corp | Manufacture of printed circuit board having through hole |
| JPH08181407A (en) * | 1994-12-27 | 1996-07-12 | Sony Corp | Printed wiring board and its manufacturing method |
| JP2000307232A (en) * | 1999-04-20 | 2000-11-02 | Fujitsu Ten Ltd | Soldering method |
| TW200509762A (en) * | 2003-07-02 | 2005-03-01 | Toshiba Corp | Electronic component mounting method, substrate manufacturing apparatus, and circuit board |
| CN107592751A (en) * | 2017-09-18 | 2018-01-16 | 广东欧珀移动通信有限公司 | A kind of circuit board assemblies and preparation method thereof, contact pin component, mobile terminal |
| CN208079503U (en) * | 2018-04-20 | 2018-11-09 | 杭州临安鹏宇电子有限公司 | A kind of single-sided circuit board |
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| CN110933868B (en) | 2021-01-22 |
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