CN208079503U - A kind of single-sided circuit board - Google Patents
A kind of single-sided circuit board Download PDFInfo
- Publication number
- CN208079503U CN208079503U CN201820574527.9U CN201820574527U CN208079503U CN 208079503 U CN208079503 U CN 208079503U CN 201820574527 U CN201820574527 U CN 201820574527U CN 208079503 U CN208079503 U CN 208079503U
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- hole
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- circuit board
- component
- feet
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Abstract
The utility model discloses a kind of single-sided circuit boards, belong to field of circuit boards, solve the problems, such as the insertion installation of prior art via inconvenience component's feet.It includes substrate layer, plurality of copper traces layer and soldermask layer from bottom to up, further include that the via for being used to be inserted into component's feet is directed through to substrate layer from soldermask layer, it is enclosed with very thin scolding tin on the inside of via, via upper end is extended outward pad, the via includes upper port and lower port, upper port cross section is bigger than lower port cross section, and the aperture of upper port is more than the diameter of component's feet；It is additionally provided with the first solder plate and the second solder plate, the first through hole being connected with scolding tin is offered on the first solder plate, the second through-hole being connected with scolding tin is offered on the second solder plate.The utility model facilitates pin to be inserted into and strengthens the firmness after welding to a certain extent.
Description
Technical field
The utility model is related to field of circuit boards, more particularly to a kind of single-sided circuit board.
Background technology
Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for permanent circuit are laid out lifting
It acts on.Mainly by pad（Metal aperture for welding component pin）, via（For connecting component's feet between each layer
Metal aperture）, mounting hole（For fixing printed circuit plate）, conducting wire（Electrical network copper film for connecting component's feet）,
Component, filling（For the deposited copper of earth cord network, it can effectively reduce impedance）Deng composition.
One-sided circuit board, part are concentrated wherein on one side, and conducting wire then concentrates on another side.One-sided circuit board mainly wraps
Include substrate layer, plurality of copper traces layer and soldermask layer.One-sided circuit board is largely used in radio, warming machine, freezer, washing machine
The equal business machine such as household appliances and the mechanical, electrical subcomponent of printer, vending machine, circuit, advantage is cheap.
Via on circuit board is usually the through-hole of cylinder, and through-hole is more slightly larger than the cross section of pin, it is more difficult to is aligned, not side
Just the insertion installation of component's feet.
Utility model content
It is inserted into the deficiency installed the purpose of the utility model is to overcome via inconvenience component's feet in the prior art,
And a kind of single-sided circuit board is provided, achieve the effect that component's feet is facilitated to be inserted into.
The above-mentioned technical purpose of the utility model technical scheme is that：
A kind of single-sided circuit board includes from bottom to up substrate layer, plurality of copper traces layer and soldermask layer, further includes straight from soldermask layer
The via for penetrating to substrate layer and being used to be inserted into component's feet is connect, is enclosed with very thin scolding tin on the inside of via, via upper end is outside
Side is extended that have pad, the via include upper port and lower port, and the upper port to lower port, aperture is gradually reduced.
Using above-mentioned technical proposal, by the aperture setting of upper port than lower port bigger, the pin of component is from via
It is inserted into without laborious alignment when upper port is inserted into, the diameter of the aperture ratio pin of the upper port of via is big, facilitates the insertion of pin；
And the diameter of the aperture ratio pin of lower port is slightly larger, when pin reach via lower port when, due to via lower end aperture compared with
Small, then one end of pin can be limited after entering via by via inner wall；The cross section of via is taper, from the upper end of via
Start, aperture is gradually reduced, and avoids some irregular via shapes so that via complex process when making.
Further preferably：The upper end of the via and the junction of soldermask layer are arc surface.
Using above-mentioned technical proposal, the pin after welding is melted fixation in soldered part, then presence is not soldered
Pin portions, this part outer force effect or carry during will produce shaking, if pad is too low, unwelded draws
Foot part may be in contact and rub with via upper end-face edge, may be generated abrasion to pin and is even broken；Setting circle
Reduce the degree that pin is destroyed after cambered surface.
Further preferably：It is provided with the first solder plate in the via, is offered for first device on first solder plate
The first through hole that part pin is inserted into；The first through hole extends to via inner wall.
Using above-mentioned technical proposal, the pin of component passes through the first of the first solder plate upper end after the progress of via upper end
Through-hole, and first through hole is to be connected with via sidewall, and via inner wall is skewed, when pin is inserted into, center of gravity was biased to
Hole inner wall side so that a pin part can be contacted with the scolding tin of via inner wall；When being welded to pin, pin not with via
The side that inner wall abuts is full of scolding tin, is will produce to pin so that the active force that pin and via inner wall abut, enhancing pin exist
Fixation in via.
Further preferably：It is provided with the second solder plate in the via, is offered for first device on second solder plate
The second through-hole that part pin is inserted into；Second through-hole extends to via inner wall；The first through hole and the second through-hole are vertical
It is connected on direction.
Using above-mentioned technical proposal, the second solder plate is added on the basis of the first solder plate, further by pin its
He is partly bonded on the scolding tin of via inner wall, further enhances fixation of the pin in via；Pin across first through hole and
It is not necessarily to overflexing when the second through-hole, need to be only inserted into along the scolding tin of via inner wall, operation readiness, reduction is wearing first
The possibility for the damage that pin generates when through-hole and the second through-hole.
Further preferably：The aperture of the first through hole and the second through-hole and component's feet diametric fit.
Using above-mentioned technical proposal, the circumferential movement of pin is limited, if the aperture of first through hole and the second through-hole is very big,
Even if first through hole and the second through-hole side are connected with via inner wall, it can not also ensure the scolding tin of pin and via inner wall when welding
It is fixed；And when the aperture of first through hole and the second through-hole and component's feet diametric fit, it can be bonded in via when pin passes through
The scolding tin of wall.
Further preferably：The lower port is provided with baffle at first through hole, and the baffle is fixed with substrate layer.
Using above-mentioned technical proposal, pin is prevented to be pierced by lower port, when pin is pierced by lower port, needs to have more trimming step
Suddenly so that installation steps increase.
Further preferably：It is provided with corrosion-resistant coating between the plurality of copper traces layer and soldermask layer.
Using above-mentioned technical proposal, the possibility that plurality of copper traces is corroded is reduced, the service life of circuit board is increased.
In conclusion the utility model has the advantages that, by up big and down small via, and via lower end aperture
Coordinate with leg diameter, prevents pin to be pierced by via while facilitating pin to enter, save and redundance pin is trimmed
The step of；First solder plate and the second solder plate are defined the insertion path of pin so that pin portions are bonded in via
Scolding tin.
Description of the drawings
Fig. 1 is the sectional view of the utility model.
In figure, 1, substrate layer；2, plurality of copper traces layer；3, soldermask layer；4, via；41, upper port；42, lower port；5, it welds
Tin；6, pad；7, the first solder plate；71, first through hole；8, the second solder plate；81, the second through-hole；9, erosion resistant coating；10, baffle.
Specific implementation mode
The utility model is described in further detail below in conjunction with attached drawing.
A kind of single-sided circuit board, as shown in Figure 1, including substrate layer 1, plurality of copper traces layer 2, erosion resistant coating 9 and preventing from bottom to up
Layer 3 further includes that the via 4 for being used for grafting component's feet is penetrated to soldermask layer 3 from substrate layer 1.Substrate layer 1 in the present embodiment
Using epoxy resin, plurality of copper traces layer 2 uses copper foil, erosion resistant coating 9 to use synthetic resin coating.
As shown in Figure 1, the junction of via 4 and soldermask layer 3 is arc-shaped setting；It is coated on 4 inner wall of via very thin
One layer of scolding tin 5；Via 4 includes upper port 41 and lower port 42, and upper port 41 is extended the pad 6 for having circular ring shape outward,
Pad 6 fixes the upper surface of erosion resistant coating 9, and the setting of soldermask layer 3 is in 6 outside of pad.
As shown in Figure 1, the aperture of via 4 is gradually reduced by upper port 41 to lower port 42, i.e., the cross section of via 4 is in cone
Shape；And the aperture of upper port 41 is more than the diameter of pin, facilitates the insertion of the pin of component.
As shown in Figure 1, being horizontally disposed in via 4 has the first solder plate 7, the first solder plate 7 to be welded and fixed with scolding tin 5, the
First through hole 71 is offered on one solder plate 7；The diameter of the aperture ratio component's feet of first through hole 71 is slightly larger, first through hole 71
5 face of scolding tin for extending partially into 4 inner wall of via, pin pass through first through hole 71 when can be abutted with scolding tin 5.
As shown in Figure 1, being horizontally disposed in via 4 has the second solder plate 8, the second solder plate 8 to be welded and fixed with scolding tin 5, the
The second through-hole 81 is offered on two solder plates 8, the diameter of the aperture ratio component's feet of the second through-hole 81 is slightly larger, the second through-hole 81
5 face of scolding tin for extending partially into 4 inner wall of via；Second solder plate 8 is set to 7 lower section of the first solder plate；71 He of first through hole
Second through-hole 81 is connected in the vertical direction, and component's feet reaches lower port after passing through first through hole 71 and the second through-hole 81
42, most of length of pin can be abutted with scolding tin 5.
As shown in Figure 1, lower port 42 is horizontally fixed with baffle 10 close to the side of the second through-hole 81,10 one end of baffle is fixed
In substrate layer 1.
The working condition of the present embodiment is as follows：The pin of component is inserted into from the upper port 41 of via 4, it is logical into crossing first
The lower port 42 for reaching via 4 behind hole 71 and the second through-hole 81 welds pin after being abutted with baffle 10.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability
Field technique personnel can as needed make the present embodiment the modification of not creative contribution after reading this specification, but
As long as all being protected by Patent Law in the right of the utility model.
Claims (7)
1. a kind of single-sided circuit board includes substrate layer from bottom to up（1）, plurality of copper traces layer（2）And soldermask layer（3）, further include from
Soldermask layer（3）It is directed through to substrate layer（1）Via for being inserted into component's feet（4）, via（4）Inside is enclosed with very thin
Scolding tin（5）, via（4）Upper end is extended outward pad（6）, which is characterized in that the via（4）Including upper port
（41）And lower port（42）, the upper port（41）To lower port（42）, aperture is gradually reduced.
2. a kind of single-sided circuit board according to claim 1, which is characterized in that the via（4）Upper port（41）With
Soldermask layer（3）Junction be arc surface.
3. a kind of single-sided circuit board according to claim 1, which is characterized in that the via（4）Inside it is provided with the first weldering
Tin piece（7）, first solder plate（7）On offer the first through hole being inserted into for component's feet（71）；The first through hole
（71）Extend to via（4）Inner wall.
4. a kind of single-sided circuit board according to claim 3, which is characterized in that the via（4）Inside it is provided with the second weldering
Tin piece（8）, second solder plate（8）On offer the second through-hole being inserted into for component's feet（81）；Second through-hole
（81）Extend to via（4）Inner wall；The first through hole（71）With the second through-hole（81）It is connected in the vertical direction.
5. a kind of single-sided circuit board according to claim 4, which is characterized in that the first through hole（71）With the second through-hole
（81）Aperture and component's feet diametric fit.
6. a kind of single-sided circuit board according to claim 5, which is characterized in that the lower port（42）Close to first through hole
（71）Place is provided with baffle（10）, the baffle（10）With substrate layer（1）It is fixed.
7. a kind of single-sided circuit board according to claim 1, which is characterized in that the plurality of copper traces layer（2）And soldermask layer
（3）Between be provided with erosion resistant coating（9）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820574527.9U CN208079503U (en) | 2018-04-20 | 2018-04-20 | A kind of single-sided circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820574527.9U CN208079503U (en) | 2018-04-20 | 2018-04-20 | A kind of single-sided circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208079503U true CN208079503U (en) | 2018-11-09 |
Family
ID=64044541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820574527.9U Active CN208079503U (en) | 2018-04-20 | 2018-04-20 | A kind of single-sided circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208079503U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248467A (en) * | 2019-06-12 | 2019-09-17 | 惠州市盈帆实业有限公司 | A kind of seamless composite circuit board of pressurized layer and preparation method thereof |
| CN110933868A (en) * | 2019-12-28 | 2020-03-27 | 浪潮商用机器有限公司 | PTH welding method for bending type positioning pin foot |
-
2018
- 2018-04-20 CN CN201820574527.9U patent/CN208079503U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248467A (en) * | 2019-06-12 | 2019-09-17 | 惠州市盈帆实业有限公司 | A kind of seamless composite circuit board of pressurized layer and preparation method thereof |
| CN110248467B (en) * | 2019-06-12 | 2021-08-13 | 惠州市盈帆实业有限公司 | Composite circuit board and preparation method thereof |
| CN110933868A (en) * | 2019-12-28 | 2020-03-27 | 浪潮商用机器有限公司 | PTH welding method for bending type positioning pin foot |
| CN110933868B (en) * | 2019-12-28 | 2021-01-22 | 浪潮商用机器有限公司 | PTH welding method for bending type positioning pin foot |
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