CN110931927A - Double-stop-band filter and manufacturing method thereof - Google Patents
Double-stop-band filter and manufacturing method thereof Download PDFInfo
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- CN110931927A CN110931927A CN201911397194.2A CN201911397194A CN110931927A CN 110931927 A CN110931927 A CN 110931927A CN 201911397194 A CN201911397194 A CN 201911397194A CN 110931927 A CN110931927 A CN 110931927A
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- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
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- H01P1/203—Strip line filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
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Abstract
The invention discloses a double-stop-band filter and a manufacturing method thereof. The double-stop-band filter comprises at least one silicon cavity resonance unit, the silicon cavity resonance unit comprises a bottom metal layer, a high-resistance silicon medium layer and a top metal layer which are sequentially arranged, a plurality of through holes are formed in the edge of each silicon cavity resonance unit, the through holes penetrate through the bottom metal layer, the high-resistance silicon medium layer and the top metal layer, metal deposition layers are formed on the inner side surfaces of the through holes, the double-stop-band filter further comprises at least one groove line type double-stop-band resonator, the groove line type double-stop-band resonator comprises a first groove line and a second groove line which are formed in the top metal layer, the first groove line and the second groove line penetrate through the top metal layer, and one end of the second groove line is communicated with the. The double-stop-band filter and the manufacturing method thereof provided by the invention solve the problems that the conventional double-stop-band filter has a large volume and has poor out-of-band rejection degree, and multi-chip integration is difficult to realize.
Description
Technical Field
The embodiment of the invention relates to the technical field of filter circuits, in particular to a double-stop-band filter and a manufacturing method thereof.
Background
The filter plays an important role in frequency-selective filtering in radio frequency and microwave systems, and particularly, the filter can enable an electric signal with a certain frequency to pass through and block other frequencies. The main performance indexes of the filter include insertion loss, bandwidth, out-of-band selectivity, circuit size and the like, and the key design difficulty of the filter is to improve the out-of-band rejection and miniaturize the circuit.
The traditional filter comprises a cavity filter, an LC filter and a plane filter, wherein the cavity filter is formed by integrally cutting metal, the LC filter is formed by combining an inductor, a capacitor and a resistor, the plane filter is made of a transmission line and a PCB (printed circuit board), the problems of large size, difficulty in interconnection and integration with multiple chips and the like exist, and the development of the filter in the aspect of a miniaturized chip filter is influenced.
Disclosure of Invention
The invention provides a double-stop-band filter and a manufacturing method thereof, and aims to solve the problems that the conventional filter is large in size and poor in out-of-band rejection degree, and multi-chip integration is difficult to realize.
In a first aspect, an embodiment of the present invention provides a dual stop band filter, including:
the silicon cavity resonance unit comprises a bottom metal layer, a high-resistance silicon medium layer and a top metal layer which are sequentially arranged; the edge of each silicon cavity resonance unit is provided with a plurality of through holes; the through hole penetrates through the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer; a metal deposition layer is formed on the inner side surface of the through hole;
the resonator comprises a top metal layer, at least one slot line type double-stop-band resonator and at least one slot line type double-stop-band resonator, wherein the slot line type double-stop-band resonator comprises a first slot line and a second slot line which are formed on the top metal layer; the first groove line and the second groove line penetrate through the top metal layer, and one end of the second groove line is communicated with the midpoint of the first groove line.
Optionally, the dual stop band filter includes a plurality of silicon cavity resonance units; the silicon cavity resonance units are arranged in a matrix; and two adjacent silicon cavity resonance units in the same row share one slot line type double-stopband resonator.
Optionally, the double-stop-band filter includes N rows of the silicon cavity resonance units, where N is greater than or equal to 3 and N is an odd number;
the 2i-1 st slot-line type double-stop-band resonator and the 2i th slot-line type double-stop-band resonator in the same row are arranged in an axisymmetric manner, wherein the symmetry axis is a perpendicular bisector of a connecting line of the center of the 2i-1 st slot-line type double-stop-band resonator and the center of the 2i th slot-line type double-stop-band resonator, and i is an integer and is not less than 1 and not more than (N-1)/2.
Optionally, the dual-stop-band filter includes M rows of the silicon cavity resonance units, where M is greater than or equal to 2 and is an even number;
the slot line type double-stopband resonator is of an axisymmetric structure.
Optionally, the dual stop band filter further includes: the device comprises an input feed line slot, an output feed line slot, a first defect coupling slot and a second defect coupling slot; the input feed line slot and the first defect coupling slot are formed in a top metal layer of a head silicon cavity resonance unit of any row of silicon cavity resonance units; the output feed line slot and the second defect coupling slot are formed in a top metal layer of a last-position silicon cavity resonance unit of any row of silicon cavity resonance units;
the input feed line slot is communicated with the first defect coupling slot and is used for inputting a signal to be filtered into the double-stop-band filter;
the output feed line slot is communicated with the second defect coupling slot and is used for outputting a filtering signal formed by filtering the signal to be filtered;
the depth of the input feed line groove, the first defect coupling groove, the output feed line groove and the second defect coupling groove is equal to the thickness of the top metal layer.
Optionally, the first slot line is a U-shaped slot line, and the second slot line is any one of a linear slot line, an arc slot line, and a wave slot line.
Optionally, the dual stop band filter includes a silicon cavity resonance unit;
the dual stop band filter further comprises: an input feed line slot, an output feed line slot, a first defect coupling slot and a second defect coupling slot which are formed on a top metal layer of the silicon cavity resonance unit;
the input feed line slot is communicated with the first defect coupling slot and is used for inputting a signal to be filtered into the double-stop-band filter; the output feed line slot is communicated with the second defect coupling slot and is used for outputting a filtering signal formed by filtering the signal to be filtered;
the depths of the input feed line groove, the output feed line groove, the first defect coupling groove and the second defect coupling groove are equal to the thickness of the top metal layer.
Optionally, the thickness of bottom metal layer is D1, the thickness of top metal layer is D2, the thickness of high resistant silicon dielectric layer is D3, wherein, D1 is less than or equal to 10um, D2 is less than or equal to 10um, 200um is less than or equal to D3 is less than or equal to 500 um.
Optionally, the resistivity of the high-resistance silicon dielectric layer is R1, wherein R1 is greater than or equal to 3000 Ω/cm.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a dual stop-band filter, which is applicable to any one of the dual stop-band filters described in the first aspect, and includes:
respectively forming a bottom metal layer and a top metal layer on two sides of the high-resistance silicon medium layer, wherein the bottom metal layer, the high-resistance silicon medium layer and the top metal layer form a laminated structure;
the laminated structure comprises at least one silicon cavity resonance unit; forming a plurality of through holes at the edge of each silicon cavity resonance unit; the through hole penetrates through the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer;
forming a metal deposition layer on the inner side surface of the through hole;
forming at least one slot line type double-stop-band mode resonator on the top metal layer, wherein each slot line type double-stop-band resonator comprises a first slot line and a second slot line; the depth of the first groove line and the depth of the second groove line are equal to the thickness of the top metal layer, and one end of the second groove line is communicated with the midpoint of the second groove line.
According to the technical scheme provided by the embodiment of the invention, the silicon cavity resonance unit and the slot-line type double-stop-band resonator are arranged, one end of a second slot line of the slot-line type double-stop-band resonator is communicated with the middle point of a first slot line, so that transmission zero points are introduced into the slot-line type double-stop-band resonator on two sides of the filter passband of the double-stop-band filter, the out-of-band rejection degree of two sides of the passband of the double-stop-band filter is improved without increasing the circuit size, and the double-stop-band filter provided by the embodiment of the invention has small volume and small energy transmission loss, and is easy to integrate with a.
Drawings
Fig. 1 is a schematic structural diagram of a dual stop band filter according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view taken along line A-A of FIG. 1;
fig. 3 is a schematic structural diagram of another dual stop-band filter according to an embodiment of the present invention;
FIG. 4 is a waveform diagram of frequency versus amplitude of a filtered signal provided by an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another dual stop-band filter according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a conventional slot line resonator and a waveform diagram of an insertion loss thereof;
fig. 7 is a schematic structural diagram of a slot-line dual-stopband resonator according to an embodiment of the present invention and a waveform diagram of an insertion loss of the slot-line dual-stopband resonator;
fig. 8 is a schematic structural diagram of another dual stop band filter according to an embodiment of the present invention;
fig. 9 is a schematic flowchart illustrating a method for manufacturing a dual stop-band filter according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of a resonant unit with silicon cavities arranged in an array according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a dual stop band filter according to an embodiment of the present invention, and fig. 2 is a schematic sectional diagram of the dual stop band filter along a line a-a in fig. 1, as shown in fig. 1 and fig. 2, the dual stop band filter according to the embodiment of the present invention includes at least one silicon cavity resonance unit 11, and the silicon cavity resonance unit 11 includes a bottom metal layer 21, a high-resistance silicon dielectric layer 22, and a top metal layer 23, which are sequentially disposed. The edge of each silicon cavity resonance unit 11 is provided with a plurality of through holes 12, the through holes 12 penetrate through the bottom metal layer 21, the high-resistance silicon dielectric layer 22 and the top metal layer 23, and the inner side surfaces of the through holes 12 are formed with metal deposition layers. The dual-stop-band filter further comprises at least one slotline dual-stop-band resonator 13, wherein the slotline dual-stop-band resonator 13 comprises a first slotline 131 and a second slotline 132 which are formed on the top metal layer 23, the first slotline 131 and the second slotline 132 penetrate through the top metal layer 23, and one end of the second slotline 132 is communicated with the midpoint of the first slotline 131.
In which a through hole 12 is etched on a matrix formed by a bottom metal layer 21, a high-resistance silicon dielectric layer 22 and a top metal layer 23, and a metal deposition layer is formed on the inner surface of the through hole 12, thereby forming at least one silicon cavity resonance unit 11, for example, as shown in fig. 1, three silicon cavity resonance units 11 arranged in a line, which are a first silicon cavity resonance unit 111, a second silicon cavity resonance unit 112 and a third silicon cavity resonance unit 113, may be formed on the matrix formed by the bottom metal layer 21, the high-resistance silicon dielectric layer 22 and the top metal layer 23. Every silicon cavity resonance unit 11 be provided with through-hole 12 all around, the inboard surface of through-hole 12 is formed with metal deposition layer to form the silicon cavity that is used for the resonance, thereby make the electromagnetic wave outwards reveal away by the silicon cavity, energy transmission loss is little, makes double stop band filter have the advantage that the insertion loss is little. In addition, the through hole 12 may be a full through hole 122, or a half through hole 121, and adjacent edges of two adjacent silicon cavity resonance units 11 exist, and the adjacent edges of two adjacent silicon cavity resonance units 11 may share the through hole 12.
The dual-stop-band filter further comprises at least one slotline dual-stop-band resonator 13, wherein the slotline dual-stop-band resonator 13 comprises a first slotline 131 and a second slotline 132 formed in the top metal layer 23, and the first slotline 131 and the second slotline 132 penetrate through the top metal layer 23, and the dual-stop-band filter 1 further comprises two slotline dual-stop-band resonators 13, namely a first slotline dual-stop-band resonator 134 and a second slotline dual-stop-band resonator 135. The first slotline double-stopband resonator 134 is formed on the top metal layer 23 of the first silicon cavity resonance unit 111 and the second silicon cavity resonance unit 112, and the second slotline double-stopband resonator 135 is formed on the top metal layer 23 of the second silicon cavity resonance unit 112 and the second silicon cavity resonance unit 113. Wherein the depth of the first slot line 131 and the second slot line is equal to the thickness of the top metal layer 23. One end of the second slot line 132 is communicated with the midpoint of the first slot line 131, so that the slot line type double-stop-band resonator 13 introduces transmission zeros at two sides of the filter passband of the double-stop-band filter 1, thereby improving the out-of-band rejection degree of the two sides of the filter without increasing the size of the filter.
The double-stop-band filter in the embodiment can be processed and realized by adopting a micro-electro-mechanical processing technology, and the three-dimensional stacking structure and the circuit structure of the double-stop-band filter enable the double-stop-band filter to have a small volume and be easy to integrate with a semiconductor integrated circuit technology, thereby being beneficial to realizing the miniaturization and the chip formation of the filter and expanding the application range of the filter. Illustratively, the whole circuit of the dual-stop-band filter in this embodiment may have a length of 5mm, a width of 3mm, and a height of 0.4mm, so that it is known that the dual-stop-band filter in this embodiment has a very small volume, and is convenient for implementing on-chip integration.
According to the technical scheme provided by the embodiment of the invention, the silicon cavity resonance unit 11 and the slot-line type double-stop-band resonator 13 are arranged, one end of the second slot line 132 of the slot-line type double-stop-band resonator 13 is communicated with the middle point of the first slot line 131, transmission zero points are introduced into two sides of the filter pass band of the slot-line type double-stop-band resonator 13, the out-of-band rejection degree of two sides of the pass band of the double-stop-band filter is improved without increasing the circuit size, and the double-stop-band filter provided by the embodiment of the invention has small volume and small energy transmission loss, and is easy to integrate with a semiconductor integrated circuit process.
Fig. 3 is a schematic structural diagram of another dual-stop band filter according to an embodiment of the present invention, as shown in fig. 3, optionally, the dual-stop band filter according to the embodiment of the present invention includes a plurality of silicon cavity resonance units 11, the silicon cavity resonance units 11 are arranged in a matrix, and two adjacent silicon cavity resonance units 11 in the same row share a slot-line dual-stop band resonator 13.
Illustratively, as shown in fig. 3, the dual-stop-band filter 1 includes 6 silicon cavity resonance units 11 arranged in two rows and three columns, a sixth silicon cavity resonance unit 211, a seventh silicon cavity resonance unit 212, an eighth silicon cavity resonance unit 213, a ninth silicon cavity resonance unit 214, a tenth silicon cavity resonance unit 215, and an eleventh silicon cavity resonance unit 216, and the dual-stop-band filter 1 further includes four slot-line dual-stop-band resonators 13, which are a fourth slot-line dual-stop-band resonator 311, a fifth slot-line dual-stop-band resonator 312, a sixth slot-line dual-stop-band resonator 313, and a seventh slot-line dual-stop-band resonator 314, wherein the fourth slot-line dual-stop-band resonator 311 is formed on the top metal layer 23 of the sixth silicon cavity resonance unit 211 and the seventh silicon cavity resonance unit 212, and the fifth slot-line dual-stop-band resonator 312 is formed on the top metal layer 23, the bottom metal layer of the seventh silicon cavity resonance unit 212 and the eighth silicon cavity resonance unit 213, A sixth slot-line double-stopband resonator 313 is formed on the top metal layer 23 of the ninth silicon cavity resonance unit 214 and the tenth silicon cavity resonance unit 215, and a seventh slot-line double-stopband resonator 314 is formed on the top metal layer 23 of the tenth silicon cavity resonance unit 215 and the eleventh silicon cavity resonance unit 216.
With continued reference to fig. 1-3, the dual stop band filter provided by the embodiment of the present invention further includes an input feed line slot 14, an output feed line slot 16, a first defective coupling slot 15, and a second defective coupling slot 17. The input feed line slot 14 and the first defective coupling slot 15 are formed in the top metal layer 23 of the head silicon cavity resonant unit 11 of any row of silicon cavity resonant units 11, and the output feed line slot 16 and the second defective coupling slot 17 are formed in the top metal layer 23 of the last silicon cavity resonant unit 11 of any row of silicon cavity resonant units 11. The input feed line slot 14 is communicated with the first defect coupling slot 15 and is used for inputting the signal to be filtered into the double-stop-band filter 1, and the output feed line slot 16 is communicated with the second defect coupling slot 17 and is used for outputting the filtered signal after the filtering of the signal to be filtered is finished. The depths of the input feed line groove 14, the first defect coupling groove 15, the output feed line groove 16 and the second defect coupling groove 17 are equal to the thickness of the top metal layer 23.
Illustratively, as shown in fig. 1, the input feed line slot 14 and the first defective coupling slot 15 are formed on the top metal layer 23 of the head-located si cavity resonator unit 111 of the first row of si cavity resonator units 11, and the output feed line slot 16 and the second defective coupling slot 17 are formed on the top metal layer 23 of the last si cavity resonator unit 113 of the first row of si cavity resonator units 11. The dual-stop-band filter 1 is connected with an input feed line slot 14 and an output feed line slot 16 formed by an external system through a coplanar waveguide transmission slot, and the impedance of the input feed line slot 14 and the impedance of the output feed line slot 16 can be 50 Ω. The input feed line slot 14 is communicated with the first defect coupling slot 15 located in the same silicon cavity resonance unit 111, and the first defect coupling slot 15 is coupled with the silicon cavity resonance unit 111, so as to realize the connection between the input feed line slot 14 and the silicon cavity resonance unit 111, and the signal to be filtered is input into the dual-stop band filter through the input feed line slot 14, similarly, the output feed line slot 16 is connected with the silicon cavity resonance unit 113 through the second defect coupling slot 17 located in the same silicon cavity resonance unit 113, and is used for outputting the filtered signal after the filtering of the signal to be filtered is completed, the size of the first defect coupling slot 15 determines the coupling strength between the input feed line slot 14 and the silicon cavity resonance unit 111, the size of the second defect coupling slot 17 determines the coupling strength between the output feed line slot 16 and the silicon cavity resonance unit 113, specifically, the sizes of the first defect coupling slot 15 and the second defect coupling slot 17 are larger, the greater the coupling strength between the input feed line slot 14 and the silicon cavity resonance unit 111, the greater the coupling strength between the output feed line slot 16 and the silicon cavity resonance unit 113. The silicon cavity resonance unit 111 and the silicon cavity resonance unit 112 are coupled through the distance between the upper through hole 12 and the lower through hole 12 of the first slot line type double-stop-band resonator 134, and the coupling is smaller when the distance is larger; the silicon cavity resonance unit 112 and the silicon cavity resonance unit 113 are coupled through the distance between the upper and lower through holes 12 of the second slot line type double-stopband resonator 135, and the coupling is smaller when the distance is larger. Optionally, the slot line widths of the input feed line slot 14 and the output feed line slot 16 may be 88um, the gap between the two input feed line slots 14 may be 70um, the lengths of the first defective coupling slot 15 and the second defective coupling slot 17 may be 1.1mm, and the widths may be 0.22 mm.
In other embodiments, the positions of the input feed line slot 14, the output feed line slot 16, the first defective coupling slot 15 and the second defective coupling slot 17 may be adjusted, for example, referring to fig. 3, the input feed line slot 14 and the first defective coupling slot 15 are formed on the top metal layer 23 of the first silicon cavity resonant unit 211 of the first row of silicon cavity resonant units 11, and the output feed line slot 16 and the second defective coupling slot 17 are formed on the top metal layer 23 of the last silicon cavity resonant unit 216 of the second row of silicon cavity resonant units 11. Fig. 4 is a waveform diagram of frequency-amplitude of a filtering signal provided by an embodiment of the present invention, as shown in fig. 4, as can be seen from fig. 4, after a signal to be filtered is subjected to a filtering process of a dual-stop-band filter, an operating frequency band of an output filtering signal is 25-30GHz, an operating bandwidth is large, and a portion of a second curve S21 excluding the frequency band of 25-30GHz sharply drops, that is, signal amplitudes of filtering signals on two sides of the operating frequency band of the filtering signal sharply drop, it can be seen that an out-of-band of the filtering signal is steep, and an out-of-band rejection degree is high. The double-stop-band filter provided by the embodiment of the invention is provided with the three silicon cavity resonance units 11 of the first silicon cavity resonance unit 111, the second silicon cavity resonance unit 112 and the third silicon cavity resonance unit 113, and the two slot-line double-stop-band mode resonators 13 of the first slot-line double-stop-band resonator 134 and the second slot-line double-stop-band resonator 135, so that the transmission zero outside the pass band is increased, and the out-of-band rejection degree is improved.
With continued reference to FIG. 1, optionally, the dual stop band filter includes N columns of silicon cavity resonator cells 11, where N ≧ 3 and N is an odd number. The 2i-1 slot-line type double-stop-band resonator 13 and the 2i slot-line type double-stop-band resonator 13 in the same row are arranged in an axisymmetric manner, wherein the symmetry axis is a perpendicular bisector 41 of a connecting line between the center of the 2i-1 slot-line type double-stop-band resonator 13 and the center of the 2i slot-line type double-stop-band resonator 13, and i is an integer and is not less than 1 and not more than (N-1)/2.
Illustratively, as shown in fig. 1, the dual-stop-band filter includes 3 columns of silicon cavity resonator units 11, namely, a first silicon cavity resonator unit 111, a second silicon cavity resonator unit 112, and a third silicon cavity resonator unit 113, and a same row of a 1 st slot-line dual-stop-band resonator 134 and a 2 nd slot-line dual-stop-band resonator 135 are arranged in an axisymmetric manner, where the symmetry axis is a perpendicular bisector 41 between a center of the 1 st slot-line dual-stop-band resonator 134 and a center of the 2 nd slot-line dual-stop-band resonator 135, so as to ensure uniform coupling between the first silicon cavity resonator unit 111 and the second silicon cavity resonator unit 112, and between the second silicon cavity resonator unit 112 and the third silicon cavity resonator unit 113.
Fig. 5 is a schematic structural diagram of another dual-stop-band filter according to an embodiment of the present invention, as shown in fig. 5, optionally, the dual-stop-band filter includes M rows of silicon cavity resonant units 11, where M is greater than or equal to 2 and M is an even number, and the slot-line dual-stop-band resonator 13 is an axisymmetric structure.
Optionally, the slot-line dual-stop-band resonator 13 is symmetrical with respect to the symmetrical edge, and the adjacent edges of two adjacent silicon cavity resonance units 11 sharing one slot-line dual-stop-band resonator 13 are symmetrical edges. Illustratively, as shown in fig. 5, the dual-stop-band filter 1 includes 2 columns of silicon cavity resonance units 11, namely, a fourth silicon cavity resonance unit 114 and a fifth silicon cavity resonance unit 115, and further includes a third slot-line dual-stop-band resonator 136, where the third slot-line dual-stop-band resonator 136 is symmetric with respect to a symmetric side, and adjacent edges of the fourth silicon cavity resonance unit 114 and the fifth silicon cavity resonance unit 115 sharing the third slot-line dual-stop-band resonator 136 are symmetric sides. If the third slot-line dual-stop band resonator 136 is divided into a first part and a second part, the first part is located in the fourth silicon cavity resonator element 114, and the second part is located in the fifth silicon cavity resonator element 115. The fourth silicon cavity resonance unit 114 and the fifth silicon cavity resonance unit 115 share the third slot-line type double-stop-band resonator 136, the edges of the fourth silicon cavity resonance unit 114 and the fifth silicon cavity resonance unit 115 which are adjacent are used as symmetrical edges, and the third slot-line type double-stop-band resonator 136 is symmetrically arranged around the symmetrical edges, so that the first part and the second part are symmetrical around the symmetrical edges, which is beneficial to realizing the uniform coupling of the slot-line type double-stop-band mode resonator 13 and the silicon cavity resonance unit 11, and improving the filtering performance of the double-stop-band filter.
Optionally, the first slot line 131 is a U-shaped slot line, and the second slot line 132 is any one of a straight slot line, an arc slot line, and a wavy slot line.
Illustratively, the first slot line 131 is a U-shaped slot line, and the second slot line 132 is a wavy slot line, so that the slot line type dual-stop-band resonator 13 occupies a smaller area, and is convenient for implementing a miniaturized configuration of the dual-stop-band filter. In addition, the positions of the out-of-band transmission zeros at both sides of the dual-stop band filter can be adjusted by adjusting the lengths and widths of the first slot line 131 and the second slot line 132 of the slot line type dual-stop band resonator 13, so as to adjust the out-of-band rejection degree at both sides of the pass band of the dual-stop band filter. Wherein the length and width of the first slot line 131 determine the transmission zero position at a high frequency of the pass band, and the sum of the half length of the first slot line 131 and the length of the second slot line 132 and the widths of the first slot line 131 and the second slot line 132 determine the transmission zero position at a low frequency of the pass band. The first slot line 131 is a U-shaped slot line, and the second slot line 132 is a wave-shaped slot line, so that a larger length of the slot line can be obtained, and the resonant frequency adjustment range of the slot line type double-stopband resonator 13 is enlarged. For example, in the present embodiment, the total length of the first slotline 131 of the slotline type dual-stop band resonator 13 may be 2.02mm, the total length of the second slotline 132 may be 1.58mm, and the widths of the first slotline 131 and the second slotline 132 are both 0.02 mm.
Fig. 6 is a schematic structural diagram of a conventional slot line resonator and a waveform schematic diagram of insertion loss thereof, and as shown in fig. 6, the conventional slot line resonator includes 2U-shaped slot lines that are not connected, and it can be seen from the waveform schematic diagram of insertion loss that some slot line resonators can generate extra pole clutter at a low frequency of a pass band while increasing a low-frequency transmission zero, so that a dual-stop-band filter cannot be used. Fig. 7 is a schematic structural diagram of a slot-line type dual-stop-band resonator according to an embodiment of the present invention and a schematic waveform diagram of an insertion loss of the slot-line type dual-stop-band resonator, as shown in fig. 7, the slot-line type dual-stop-band resonator includes a U-shaped slot line and a linear slot line, and one end of the linear slot line is connected to a midpoint of the U-shaped slot line. It can be seen from the waveform diagram of the insertion loss that the slot line type dual-stop band resonator provided by the embodiment of the invention does not generate additional pole clutter at the low frequency of the pass band while increasing the transmission zero at the low frequency.
Optionally, the first slot line 131 is a U-shaped slot line, and the second slot line 132 is a linear slot line, so that the slot line type dual-stop-band resonator 13 is convenient to realize an axisymmetric structure, the slot line type dual-stop-band resonator 13 is favorable to realize uniform coupling between the slot line type dual-stop-band resonator 13 and the silicon cavity resonator unit 11, and the filtering performance of the dual-stop-band filter is improved.
Fig. 8 is a schematic structural diagram of another dual stop-band filter according to an embodiment of the present invention, as shown in fig. 8, the dual stop-band filter 1 may further include a silicon cavity resonant unit 11, and the dual stop-band filter 1 further includes an input feed slot 14, an output feed slot 16, a first defective coupling slot 15, and a second defective coupling slot 17 formed on a top metal layer 23 of the silicon cavity resonant unit 11. The input feed line slot 14 is communicated with the first defect coupling slot 15 and used for inputting a signal to be filtered into the double-stop-band filter, the output feed line slot 16 is communicated with the second defect coupling slot 17 and used for outputting a filtered signal after the signal to be filtered is filtered, and the depths of the input feed line slot 14, the output feed line slot 16, the first defect coupling slot 15 and the second defect coupling slot 17 are equal to the thickness of the top-layer metal layer. When the dual-stop-band filter 1 only includes one silicon cavity resonance unit 11, a slot-line dual-stop-band resonator 13 may be disposed only on the top metal layer 23 of the silicon cavity resonance unit 11, the slot-line dual-stop-band resonator 13 is located at the center of the silicon cavity resonance unit 11, and the slot-line dual-stop-band resonator 13 has an axisymmetric structure.
Optionally, the resistivity of the high-resistance silicon dielectric layer 22 is R1, wherein R1 is greater than or equal to 3000 Ω/cm.
Illustratively, the top metal layer 23 and the bottom metal layer 21 may be copper or gold, which has smaller metal loss, further reducing the insertion loss of the dual stop band filter.
With reference to fig. 2, optionally, the thickness of the bottom metal layer 21 is D1, the thickness of the top metal layer 23 is D2, and the thickness of the high-resistance silicon dielectric layer 22 is D3, wherein D1 is less than or equal to 10um, D2 is less than or equal to 10um, and D3 is less than or equal to 200um and less than or equal to 500 um.
The filtering frequency of the silicon cavity resonance unit 11 can be determined by controlling the shape and size of the silicon cavity resonance unit 11, and for example, the bottom metal layer 21 and the top metal layer 23 with a thickness of 10um and the high-resistance silicon dielectric layer 22 with a thickness of 400um can be adopted in the embodiment of the present invention. The silicon cavity resonance unit 11 may have a rectangular shape, and the length of the silicon cavity resonance unit 11 may be 3mm and the width may be 1.54 mm. In addition, the silicon cavity resonance unit 11 may also be square, circular or other polygonal shapes. By designing the proper shape and size of the silicon cavity resonance unit 11, the embodiment of the invention can obtain the double-stop-band filter with the required filtering frequency.
According to the double-stop-band filter provided by the embodiment of the invention, the silicon cavity resonance unit and the slot-line type double-stop-band resonator are arranged, so that the slot-line type double-stop-band resonator comprises the first slot line and the second slot line, and one end of the second slot line is communicated with the middle point of the first slot line, so that two transmission zeros can be generated, and the out-of-band rejection degree of two sides of the passband of the double-stop-band filter is improved while the circuit size is not increased. The width and the length of the first slot line determine out-of-band rejection of the high frequency of the passband, and the width and the length of the second slot line determine out-of-band rejection of the low frequency of the passband, so that the two transmission zeros are respectively adjustable, an extra pole cannot be generated at low frequency, extra clutter cannot be introduced, and low-frequency response is better. In addition, the slot line type double-stop-band resonator provided by the embodiment of the invention has smaller volume than the existing slot line type resonator adopting two independent slot lines, so that the circuit size is small, the extra chip area is not occupied, and the double-stop-band resonator is easy to carry out process integration with a semiconductor integrated circuit. The high-resistance silicon dielectric layer is adopted, so that the double-stop-band filter has the advantages of small volume, small insertion loss and low electromagnetic wave transmission loss when being used in millimeter wave bands.
Based on the same inventive concept, an embodiment of the present invention further provides a method for manufacturing a dual stop band filter, which is used to manufacture any one of the dual stop band filters provided in the above embodiments, and the explanation of the same or corresponding structure and terms as those in the above embodiments is not repeated herein, and fig. 9 is a schematic flow diagram of the method for manufacturing a dual stop band filter provided in the embodiment of the present invention, as shown in fig. 9, the method includes the following steps:
step S110, a bottom metal layer and a top metal layer are respectively formed on the lower side and the upper side of the high-resistance silicon dielectric layer, and the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer form a laminated structure.
Specifically, a bottom metal layer is formed on one surface of the high-resistance silicon dielectric layer by adopting a process of sputtering firstly and then electroplating, and then a top metal layer is formed on the other surface of the high-resistance silicon dielectric layer by adopting a process of sputtering firstly and then electroplating. And the laminated structure consisting of the bottom metal layer, the high-resistance silicon medium layer and the top metal layer is used as a matrix.
Step S120, the laminated structure comprises at least one silicon cavity resonance unit; forming a plurality of through holes at the edge of each silicon cavity resonance unit; the through hole penetrates through the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer.
At least one silicon cavity resonance unit is formed on a matrix consisting of the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer. Specifically, an etching process is adopted to form a through hole penetrating through the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer at the edge of the silicon cavity resonance unit, and illustratively, the through hole is etched from the top metal layer to the bottom metal layer by utilizing a micro-electromechanical dry etching technology to form an etching cavity.
Fig. 10 is a schematic structural diagram of a stacked structure of silicon cavity resonator units arranged in an array according to an embodiment of the present invention, as shown in fig. 10, after a stacked structure 2 including a bottom metal layer, a high-resistance silicon dielectric layer, and a top metal layer is formed, a plurality of silicon cavity resonator units 11 arranged in an array may be formed on the stacked structure 2, and through holes 12 penetrating through the stacked structure 2 are provided at a peripheral edge of the silicon cavity resonator units 11 arranged in an array, referring to fig. 10, the through holes may be full through holes 122 and/or half through holes 121.
And step S130, forming a metal deposition layer on the inner side surface of the through hole.
Wherein, a metal deposition layer may be formed on an inner side surface of the through hole by a sputtering, plating, or the like process to form a silicon cavity for resonance. After forming the metal deposition layer inside the through hole 12, at least one silicon cavity resonator 11 of the stacked structure 2 is cut along the edge through hole 12 to form the dual-stop band filter according to the embodiment of the present invention, for example, as shown in fig. 10, two silicon cavity resonators 11 may be cut from the stacked structure 2 to form the dual-stop band filter, and the dual-stop band filter includes two silicon cavity resonators 11. It is noted that when the cutting is performed along the edge via 12 along the silicon cavity resonator unit 11, the full via 122 is cut to form the half via 121.
Step S140, forming at least one slot line type double-stop-band mode resonator on the top metal layer, wherein each slot line type double-stop-band resonator comprises a first slot line and a second slot line; the depth of the first groove line and the depth of the second groove line are equal to the thickness of the top metal layer, and one end of the second groove line is communicated with the midpoint of the second groove line.
When the top metal layer 23 forms the slot line type double-stop-band resonator, an etching process is adopted, and the etching depth is the same as the thickness of the top metal layer 23. In this embodiment, if the dual-stop-band filter includes two silicon cavity resonance units, a slot-line dual-stop-band resonator may be disposed on a top metal layer on the two silicon cavity resonance units, and the slot-line dual-stop-band resonator is symmetrically disposed about adjacent edges of the two silicon cavity resonance units 11.
It should be noted that the through holes may be formed before forming the slot-line type dual-stop-band resonator, or the through holes may be etched after forming the slot-line type dual-stop-band resonator.
The manufacturing method of the double-stopband filter provided by the embodiment of the invention comprises the steps of respectively forming a bottom metal layer and a top metal layer on two sides of a high-resistance silicon medium layer to form a laminated structure, arranging through holes on the laminated structure, forming metal deposition layers on the inner side surfaces of the through holes to form silicon cavity resonance units for resonance, forming slotted double-stopband resonators on the top metal layer, wherein each slotted double-stopband resonator comprises a first slot line and a second slot line, and one end of each second slot line is communicated with the middle point of the first slot line. The double-stop-band filter manufactured by the manufacturing method of the double-stop-band filter provided by the embodiment of the invention can generate two transmission zeros outside the pass band of the double-stop-band filter, does not generate an extra pole at low frequency, has good low-frequency response, and has the advantages of small volume, small insertion loss, low electromagnetic wave transmission loss and easiness in process integration with a semiconductor integrated circuit.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A dual stop band filter, comprising:
the silicon cavity resonance unit comprises a bottom metal layer, a high-resistance silicon medium layer and a top metal layer which are sequentially arranged; the edge of each silicon cavity resonance unit is provided with a plurality of through holes; the through hole penetrates through the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer; a metal deposition layer is formed on the inner side surface of the through hole;
the resonator comprises a top metal layer, at least one slot line type double-stop-band resonator and at least one slot line type double-stop-band resonator, wherein the slot line type double-stop-band resonator comprises a first slot line and a second slot line which are formed on the top metal layer; the first groove line and the second groove line penetrate through the top metal layer, and one end of the second groove line is communicated with the midpoint of the first groove line.
2. The dual stop band filter of claim 1, wherein the dual stop band filter comprises a plurality of the silicon cavity resonating units; the silicon cavity resonance units are arranged in a matrix; and two adjacent silicon cavity resonance units in the same row share one slot line type double-stopband resonator.
3. The dual stop band filter of claim 2, wherein the dual stop band filter comprises N columns of the silicon cavity resonator units, wherein N ≧ 3 and N is an odd number;
the 2i-1 st slot-line type double-stop-band resonator and the 2i th slot-line type double-stop-band resonator in the same row are arranged in an axisymmetric manner, wherein the symmetry axis is a perpendicular bisector of a connecting line of the center of the 2i-1 st slot-line type double-stop-band resonator and the center of the 2i th slot-line type double-stop-band resonator, and i is an integer and is not less than 1 and not more than (N-1)/2.
4. The dual stop-band filter of claim 2, wherein the dual stop-band filter comprises M columns of the silicon cavity resonator units, wherein M ≧ 2 and M is an even number;
the slot line type double-stopband resonator is of an axisymmetric structure.
5. The dual stop band filter of claim 2, further comprising: the device comprises an input feed line slot, an output feed line slot, a first defect coupling slot and a second defect coupling slot; the input feed line slot and the first defect coupling slot are formed in a top metal layer of a head silicon cavity resonance unit of any row of silicon cavity resonance units; the output feed line slot and the second defect coupling slot are formed in a top metal layer of a last-position silicon cavity resonance unit of any row of silicon cavity resonance units;
the input feed line slot is communicated with the first defect coupling slot and is used for inputting a signal to be filtered into the double-stop-band filter;
the output feed line slot is communicated with the second defect coupling slot and is used for outputting a filtering signal formed by filtering the signal to be filtered;
the depth of the input feed line groove, the first defect coupling groove, the output feed line groove and the second defect coupling groove is equal to the thickness of the top metal layer.
6. The dual stop band filter of claim 1, wherein the first slot line is a U-shaped slot line, and the second slot line is any one of a straight slot line, an arc slot line, and an undulated slot line.
7. The dual stop-band filter of claim 1, wherein the dual stop-band filter comprises a silicon cavity resonator unit;
the dual stop band filter further comprises: an input feed line slot, an output feed line slot, a first defect coupling slot and a second defect coupling slot which are formed on a top metal layer of the silicon cavity resonance unit;
the input feed line slot is communicated with the first defect coupling slot and is used for inputting a signal to be filtered into the double-stop-band filter; the output feed line slot is communicated with the second defect coupling slot and is used for outputting a filtering signal formed by filtering the signal to be filtered;
the depths of the input feed line groove, the output feed line groove, the first defect coupling groove and the second defect coupling groove are equal to the thickness of the top metal layer.
8. The dual stop band filter of claim 1, wherein the bottom metal layer has a thickness of D1, the top metal layer has a thickness of D2, and the high-resistance silicon dielectric layer has a thickness of D3, wherein D1 is not less than 10um, D2 is not less than 10um, and D3 is not less than 200um is not less than 500 um.
9. The dual stop band filter of claim 1, wherein the high-resistance silicon dielectric layer has a resistivity of R1, wherein R1 is greater than or equal to 3000 Ω/cm.
10. A method for manufacturing a dual stop band filter, the method being applied to the dual stop band filter of any one of claims 1-9, comprising:
respectively forming a bottom metal layer and a top metal layer on the lower side and the upper side of the high-resistance silicon dielectric layer, wherein the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer form a laminated structure;
the laminated structure comprises at least one silicon cavity resonance unit; forming a plurality of through holes at the edge of each silicon cavity resonance unit; the through hole penetrates through the bottom metal layer, the high-resistance silicon dielectric layer and the top metal layer;
forming a metal deposition layer on the inner side surface of the through hole;
forming at least one slot line type double-stop-band mode resonator on the top metal layer, wherein each slot line type double-stop-band resonator comprises a first slot line and a second slot line; the depth of the first groove line and the depth of the second groove line are equal to the thickness of the top metal layer, and one end of the second groove line is communicated with the midpoint of the second groove line.
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| CN201911397194.2A CN110931927A (en) | 2019-12-30 | 2019-12-30 | Double-stop-band filter and manufacturing method thereof |
| PCT/CN2020/086922 WO2021134997A1 (en) | 2019-12-30 | 2020-04-26 | Filter and manufacturing method therefor |
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| CN201911397194.2A CN110931927A (en) | 2019-12-30 | 2019-12-30 | Double-stop-band filter and manufacturing method thereof |
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| WO2021134997A1 (en) * | 2019-12-30 | 2021-07-08 | 广东大普通信技术有限公司 | Filter and manufacturing method therefor |
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