CN110907667B - Synchronous close contact type integrated circuit packaging test seat - Google Patents
Synchronous close contact type integrated circuit packaging test seat Download PDFInfo
- Publication number
- CN110907667B CN110907667B CN201911162495.7A CN201911162495A CN110907667B CN 110907667 B CN110907667 B CN 110907667B CN 201911162495 A CN201911162495 A CN 201911162495A CN 110907667 B CN110907667 B CN 110907667B
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- CN
- China
- Prior art keywords
- supporting plate
- probe
- lifting
- end surface
- seat
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Abstract
The invention discloses a synchronous approach contact type integrated circuit packaging test seat, which comprises a cuboid-shaped support seat and an approach test device, wherein the support seat is provided with a plurality of contact holes; a lifting test slot is formed on the upper end surface of the supporting seat; the approach testing device comprises an upper supporting plate, a lower supporting plate and a probe supporting plate; the upper supporting plate is positioned above the lower supporting plate and is synchronously far away from or close to the lower supporting plate; the lower end surface of the upper supporting plate is provided with a plurality of suction nozzles; the probe supporting plate is arranged below the lower supporting plate in a lifting manner; a plurality of probes which are uniformly distributed are formed on the upper end surface of the probe supporting plate; the probe vertically penetrates through the lower supporting plate from bottom to top, and the upper end of the probe exceeds the upper end face of the lower supporting plate; when the upper support plate is at the uppermost end, the lower support plate is at the lowermost end and the upper support plate is located above the support base. The invention controls the contact state of the spherical pins of the BGA package and the probe by controlling the extension of the upper end of the probe, thereby preventing overlarge pressure and reducing the abrasion of the probe.
Description
Technical Field
The invention relates to the field of integrated circuit packaging test, in particular to a synchronous close contact type integrated circuit packaging test seat.
Background
The semiconductor element is processed into a semiconductor chip package, such as a BGA package, through a series of packaging processes, and the processed semiconductor chip package is subjected to an electrical inspection process before being provided to a customer; in the electrical inspection process, the electrical characteristics of the semiconductor chip package are inspected using the test socket. Here, the test socket is a device that electrically connects the direct loop of each semiconductor element to the test instrument.
The pressurized package test socket in the prior art is composed of an upper cover, a side support, a lower chassis, a fixing screw, a fixing disc, a pressurizing disc and a socket pin (i.e. a probe). In practice, first, the fixing plate with the socket pins (i.e., the probes) is connected to the lower chassis via fixing screws. Side supports that secure the package from the sides are also connected to the lower chassis. The package is placed over the lower tray through between the side supports.
In practical engineering, the pressure type package test socket with the structure applies pressure to the pressure plate in order to make the package contact with the socket needle (namely the probe); since this process is a manual operation, a certain amount of pressure cannot be applied to the pressurizing plate, and an excessive pressure is often applied to more firmly contact the package and the socket pin (i.e., the probe), which may cause a problem of relatively large abrasion of the socket pin (i.e., the probe).
Disclosure of Invention
The invention aims to solve the technical problem of large probe abrasion caused by overlarge force application in the operation of the existing equipment, and provides a synchronous close contact type integrated circuit packaging test seat.
The technical scheme for solving the technical problems is as follows: a synchronous approach contact type integrated circuit packaging test seat comprises a cuboid supporting seat and an approach test device; a lifting test slot is formed on the upper end surface of the supporting seat; the approach testing device comprises an upper supporting plate, a lower supporting plate and a probe supporting plate; the upper supporting plate is positioned above the lower supporting plate and is synchronously far away from or close to the lower supporting plate; the lower end surface of the upper supporting plate is provided with a plurality of suction nozzles; the probe supporting plate is arranged below the lower supporting plate in a lifting manner; a plurality of probes which are uniformly distributed are formed on the upper end surface of the probe supporting plate; the probe vertically penetrates through the lower supporting plate from bottom to top, and the upper end of the probe exceeds the upper end face of the lower supporting plate; when the upper support plate is at the uppermost end, the lower support plate is at the lowermost end and the upper support plate is located above the support base.
Preferably, the lower end surface of the upper support plate is formed with a U-shaped encapsulation limit frame with a forward opening; when the upper supporting plate is positioned at the uppermost end, the packaging limiting frame is positioned above the supporting seat; the four lifting guide columns are respectively positioned at the left side and the right side of the packaging limit frame.
Preferably, horizontal moving grooves in the left and right directions are formed in the upper parts of the front and rear side walls of the lifting test groove respectively; a pair of movable supporting plates which are symmetrically arranged left and right are arranged in the horizontal moving groove; the left and right movable supporting plates are synchronously far away or close to each other; cylindrical front and rear central columns are respectively formed between the pair of movable supporting plates on the right side of the pair of movable supporting plates on the left side; a plurality of upper hinge rods which are uniformly distributed from front to back are respectively hinged on the left end surface and the right end surface of the upper supporting plate; a plurality of lower hinge rods which are uniformly distributed front and back are respectively hinged on the left end surface and the right end surface of the lower supporting plate; one ends of the upper hinge rod and the lower hinge rod, which are close to each other, are rotatably arranged on the front and rear central columns; the distance between the rotating central shaft of the front central column and the rotating central shaft of the rear central column is the same as that between the hinge central shafts of the upper hinge rod and the lower hinge rod.
Preferably, the horizontal driving rods are respectively pivoted between the left side wall and the right side wall of the horizontal moving groove; the left part and the right part of the horizontal driving rod are provided with external threads with opposite rotation directions; a pair of movable supporting plates in the same horizontal moving groove are in threaded connection with different external thread parts of the horizontal driving rod; the left end of the horizontal driving rod penetrates through the left end face of the supporting seat and is fixed with a lifting driven gear; a lifting driving gear is pivoted on the left end surface of the supporting seat; the lifting driving gear is meshed with the pair of lifting driven gears; a cylindrical lifting handle is formed on the left end face of the lifting driving gear; the rotation central axis of the lifting handle is not collinear with the rotation central axis of the lifting driving gear.
Preferably, the number of the upper hinge rods is at least two; the number of the lower hinge rods is at least two.
Preferably, the left end and the right end of the probe supporting plate vertically penetrate through and are pivoted with adjusting screws; the adjusting screw is screwed on the lower end face of the lower supporting plate; an adjusting driven gear is formed at the lower end of the adjusting screw rod; the center of the lower end surface of the probe supporting plate is pivoted with an adjusting driving gear; the adjusting driving gear is meshed with the pair of adjusting driven gears; a rotary driving block is formed in the center of the lower end face of the adjusting driving gear; adjusting windows for adjusting the distance between the lower supporting plate and the probe supporting plate are formed in the front side wall and the rear side wall of the lifting test groove respectively.
Preferably, the rotary driving block has a regular hexagon shape.
The invention has the beneficial effects that: the contact state of the spherical pins of the BGA package and the probes is controlled by controlling the extension of the upper ends of the probes, so that overlarge pressure is prevented, and the abrasion of the probes is reduced.
Drawings
FIG. 1 is a schematic structural view of a cross section of the present invention;
fig. 2 is a schematic structural view of a cross section of the present invention in operation.
In the figure, 10, a support seat; 100. lifting the test slot; 101. a horizontal moving tank; 102. adjusting the window; 20. approaching the testing device; 21. an upper support plate; 211. packaging the limiting frame; 212. an upper hinge rod; 22. a suction nozzle; 23. a lower support plate; 231. a lower hinge rod; 24. moving the support plate; 241. a front and rear central column; 25. a horizontal drive rod; 251. a lifting driven gear; 26. a lifting driving gear; 261. a lifting handle; 27. a probe support plate; 271. adjusting the screw rod; 272. adjusting the driven gear; 28. a probe; 29. adjusting the driving gear; 291. the driving block is rotated.
Detailed Description
As shown in fig. 1 and fig. 2, a synchronous proximity contact type ic package testing socket includes a rectangular parallelepiped supporting base 10 and a proximity testing device 20; a lifting test slot 100 is formed on the upper end face of the support seat 10; the proximity testing device 20 comprises an upper support plate 21, a lower support plate 23 and a probe support plate 27; the upper support plate 21 is positioned above the lower support plate 23 and both are synchronously far away or close to each other; a plurality of suction nozzles 22 are arranged on the lower end surface of the upper support plate 21; the probe supporting plate 27 is arranged below the lower supporting plate 23 in a lifting way; a plurality of probes 28 which are uniformly distributed are formed on the upper end surface of the probe supporting plate 27; the probe 28 vertically penetrates through the lower support plate 23 from bottom to top and the upper end of the probe exceeds the upper end face of the lower support plate 23; when the upper support plate 21 is uppermost, the lower support plate 23 is lowermost and the upper support plate 21 is located above the support base 10.
As shown in fig. 1 and fig. 2, a u-shaped sealing and limiting frame 211 with a forward opening is formed on the lower end surface of the upper support plate 21; when the upper supporting plate 21 is at the uppermost end, the packaging limiting frame 211 is located above the supporting seat 10; the four lifting guide pillars 12 are respectively located at the left and right sides of the packaging limit frame 211.
As shown in fig. 1 and 2, horizontal moving grooves 101 are formed in the upper portions of the front and rear side walls of the elevating test groove 100 in the left-right direction; a pair of movable supporting plates 24 which are arranged in a left-right symmetrical mode are arranged in the horizontal moving groove 101 in a moving mode; the left and right movable support plates 24 are moved away from or toward each other in synchronization; cylindrical front and rear center posts 241 are respectively formed between the pair of movable support plates 24 on the right side of the pair of movable support plates 24 on the left side; a plurality of upper hinge rods 212 which are uniformly distributed from front to back are respectively hinged on the left end surface and the right end surface of the upper supporting plate 21; a plurality of lower hinge rods 231 which are uniformly distributed from front to back are respectively hinged on the left end surface and the right end surface of the lower supporting plate 23; one ends of the upper hinge rod 212 and the lower hinge rod 231 close to each other are rotatably arranged on the front and rear central columns 241; the central axis of rotation of the front and rear central pillars 241 is the same as the interval between the central axes of hinge of the upper hinge rod 212 and the lower hinge rod 231.
As shown in fig. 1 and 2, a horizontal driving rod 25 is pivoted between the left and right side walls of the horizontal moving groove 101; the left part and the right part of the horizontal driving rod 25 are provided with external threads with opposite rotation directions; a pair of movable support plates 24 in the same horizontal moving groove 101 are screwed on different external thread parts of the horizontal driving rod 25; the left end of the horizontal driving rod 25 passes through the left end face of the supporting seat 10 and is fixed with a lifting driven gear 251; a lifting driving gear 26 is pivoted on the left end surface of the supporting seat 10; the elevation driving gear 26 is engaged with a pair of elevation driven gears 251; a cylindrical lifting handle 261 is formed on the left end surface of the lifting driving gear 26; the rotation center axis of the lift knob 261 is not collinear with the rotation center axis of the lift drive gear 26.
As shown in fig. 1 and 2, the number of the upper hinge rods 212 is at least two; the number of the lower hinge bars 231 is at least two.
As shown in fig. 1 and 2, the left and right ends of the probe supporting plate 27 vertically penetrate through and are pivoted with adjusting screws 271; the adjusting screw 271 is screwed on the lower end surface of the lower support plate 23; an adjusting driven gear 272 is formed at the lower end of the adjusting screw 271; the center of the lower end surface of the probe supporting plate 27 is pivoted with an adjusting driving gear 29; the adjustment driving gear 29 is meshed with a pair of adjustment driven gears 272; a rotary driving block 291 is formed at the center of the lower end surface of the adjusting driving gear 29; adjustment windows 102 for adjusting the distance between the lower support plate 23 and the probe support plate 27 are formed in the front and rear side walls of the elevating test slot 100, respectively.
As shown in fig. 1 and 2, the rotary drive block 291 has a regular hexagonal shape.
The working principle of the synchronous close contact type integrated circuit packaging test seat is as follows:
initial state: the upper supporting plate 21 is positioned at the uppermost end, and the lower supporting plate 23 is positioned at the lowermost end;
during testing, the distance between the lower support plate 23 and the probe support plate 27 is adjusted according to the thickness of the package, namely the extending amount of the probe 28 extending out of the lower support plate 23, then the upper support plate 21 and the lower support plate 23 are close to each other synchronously, so that when the upper support plate 21 and the lower support plate 23 are closest to each other, the spherical pin of the package is just contacted with the probe 28, the pressure transmitted to the probe 28 by the spherical pin of the package cannot be too large, and the abrasion of the probe 28 is reduced.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description herein, since various changes and modifications can be made in the details of the embodiment and the application range according to the spirit of the present invention.
Claims (6)
1. A synchronous approach contact type integrated circuit packaging test seat is characterized in that: comprises a rectangular supporting seat (10) and a proximity testing device (20); a lifting test slot (100) is formed on the upper end surface of the support seat (10); the approach testing device (20) comprises an upper supporting plate (21), a lower supporting plate (23) and a probe supporting plate (27); the upper supporting plate (21) is positioned above the lower supporting plate (23) and is synchronously far away from or close to the lower supporting plate; a plurality of suction nozzles (22) are arranged on the lower end surface of the upper support plate (21); the probe supporting plate (27) is arranged below the lower supporting plate (23) in a lifting way; a plurality of probes (28) which are uniformly distributed are formed on the upper end surface of the probe supporting plate (27); the probe (28) vertically penetrates through the lower support plate (23) from bottom to top, and the upper end of the probe exceeds the upper end face of the lower support plate (23); when the upper supporting plate (21) is positioned at the uppermost end, the lower supporting plate (23) is positioned at the lowermost end and the upper supporting plate (21) is positioned above the supporting seat (10);
horizontal moving grooves (101) in the left-right direction are formed in the upper parts of the front side wall and the rear side wall of the lifting test groove (100) respectively; a pair of movable supporting plates (24) which are arranged in a left-right symmetrical mode are arranged in the horizontal moving groove (101); the left and right movable support plates (24) are synchronously far away or close to each other; a cylindrical front and rear central column (241) is respectively formed between the pair of the moving support plates (24) on the right side of the pair of the moving support plates (24) on the left side; the left end surface and the right end surface of the upper supporting plate (21) are respectively hinged with a plurality of upper hinge rods (212) which are uniformly distributed front and back; a plurality of lower hinge rods (231) which are uniformly distributed from front to back are respectively hinged on the left end surface and the right end surface of the lower supporting plate (23); one ends of the upper hinge rod (212) and the lower hinge rod (231) close to each other are rotatably arranged on the front and rear central columns (241); the distance between the rotating central shaft of the front and rear central columns (241) and the hinge central shafts of the upper hinge rod (212) and the lower hinge rod (231) is the same.
2. The ic package test socket of claim 1, wherein: the lower end surface of the upper supporting plate (21) is formed with a U-shaped packaging limit frame (211) with a forward opening; when the upper supporting plate (21) is positioned at the uppermost end, the packaging limiting frame (211) is positioned above the supporting seat (10); the four lifting guide columns (12) are respectively positioned at the left side and the right side of the packaging limit frame (211).
3. The ic package test socket of claim 1, wherein: a horizontal driving rod (25) is respectively pivoted between the left side wall and the right side wall of the horizontal moving groove (101); the left part and the right part of the horizontal driving rod (25) are provided with external threads with opposite rotation directions; a pair of movable supporting plates (24) in the same horizontal moving groove (101) are screwed on different external thread parts of the horizontal driving rod (25); the left end of the horizontal driving rod (25) penetrates through the left end face of the supporting seat (10) and is fixed with a lifting driven gear (251); a lifting driving gear (26) is pivoted on the left end surface of the supporting seat (10); the lifting driving gear (26) is meshed with a pair of lifting driven gears (251); a cylindrical lifting handle (261) is formed on the left end face of the lifting driving gear (26); the rotation center axis of the lifting handle 261 is not collinear with the rotation center axis of the lifting drive gear 26.
4. The ic package test socket of claim 1, wherein: the number of the upper hinge rods (212) is at least two; the number of the lower hinge rods (231) is at least two.
5. The ic package test socket of claim 1, wherein: the left end and the right end of the probe supporting plate (27) vertically penetrate through and are pivoted with an adjusting screw rod (271); the adjusting screw rod (271) is screwed on the lower end surface of the lower supporting plate (23); an adjusting driven gear (272) is formed at the lower end of the adjusting screw rod (271); the center of the lower end surface of the probe supporting plate (27) is pivoted with an adjusting driving gear (29); the adjusting driving gear (29) is meshed with a pair of adjusting driven gears (272); a rotary driving block (291) is formed in the center of the lower end face of the adjusting driving gear (29); adjusting windows (102) for adjusting the distance between the lower support plate (23) and the probe support plate (27) are formed in the front side wall and the rear side wall of the lifting test slot (100).
6. The ic package test socket of claim 5, wherein: the rotary driving block (291) is in a regular hexagon shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911162495.7A CN110907667B (en) | 2019-11-25 | 2019-11-25 | Synchronous close contact type integrated circuit packaging test seat |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911162495.7A CN110907667B (en) | 2019-11-25 | 2019-11-25 | Synchronous close contact type integrated circuit packaging test seat |
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| Publication Number | Publication Date |
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| CN110907667A CN110907667A (en) | 2020-03-24 |
| CN110907667B true CN110907667B (en) | 2021-10-08 |
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| CN201911162495.7A Active CN110907667B (en) | 2019-11-25 | 2019-11-25 | Synchronous close contact type integrated circuit packaging test seat |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111398719A (en) * | 2020-04-10 | 2020-07-10 | Oppo（重庆）智能科技有限公司 | Test machine |
| CN112858840B (en) * | 2021-02-03 | 2023-05-05 | 北京华强天安送变电工程有限公司 | Test vehicle provided with cable tester |
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| CN110045160A (en) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | A kind of test bench that the top of BGA package picks and places |
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| US6982565B2 (en) * | 2003-03-06 | 2006-01-03 | Micron Technology, Inc. | Test system and test method with interconnect having semiconductor spring contacts |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5147213A (en) * | 1991-10-24 | 1992-09-15 | Minnesota Mining And Manufacturing Company | Zero insertion pressure test socket for pin grid array electronic packages |
| JP2003332011A (en) * | 2002-05-16 | 2003-11-21 | Yamaichi Electronics Co Ltd | Ic socket |
| CN1798979A (en) * | 2003-04-23 | 2006-07-05 | 株式会社爱德万测试 | Insert for electronic component-handling device, tray, and electronic component handling device |
| CN1574265A (en) * | 2003-06-14 | 2005-02-02 | 未来产业株式会社 | Device for seating semiconductor device in semiconductor test handler |
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Effective date of registration: 20210915 Address after: 221000 plant A9 and A10, fenghuangwan Electronic Information Industrial Park, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant after: Jiangsu AISI Semiconductor Technology Co.,Ltd. Address before: Room 1303, building B, Kangxin garden, 569 Wensan Road, Xihu District, Hangzhou City, Zhejiang Province Applicant before: HANGZHOU EZSOFT TECHNOLOGY Co.,Ltd. |
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