CN217158114U - Press suitable for base plate powder packaging equipment - Google Patents

Press suitable for base plate powder packaging equipment Download PDF

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Publication number
CN217158114U
CN217158114U CN202221088951.5U CN202221088951U CN217158114U CN 217158114 U CN217158114 U CN 217158114U CN 202221088951 U CN202221088951 U CN 202221088951U CN 217158114 U CN217158114 U CN 217158114U
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China
Prior art keywords
movable platen
sensor
substrate powder
press
screw rod
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CN202221088951.5U
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Chinese (zh)
Inventor
胡火根
黄晔
黄明玖
吴成胜
郑天勤
方唐利
汪祥国
何豪佳
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Anhui Naike Equipment Technology Co ltd
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Anhui Naike Equipment Technology Co ltd
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Abstract

The utility model provides a press suitable for base plate powder encapsulation equipment relates to semiconductor technology field. The press suitable for the substrate powder packaging equipment comprises a rack, a driving mechanism, a screw rod, a movable platen, a lower die, an upper die, a sensor and a grating ruler, wherein the driving mechanism is arranged on the rack; the screw rod is rotatably arranged on the frame and is connected to the driving mechanism; the movable platen is in threaded fit with the plurality of screw rods; the lower die is arranged at the top of the movable platen; the upper die is arranged on the top of the frame and is opposite to the lower die; the sensor is arranged on the frame; the grating ruler is arranged on the movable platen and corresponds to the sensor, and the sensor is used for monitoring the grating ruler so as to determine the thickness of the plastic package corresponding to the position of the grating ruler. The press suitable for the substrate powder packaging equipment can perform dynamic compensation according to the real-time plastic packaging state, so that the product subjected to plastic packaging is uniformly compressed, and the probability of flash is reduced.

Description

Press suitable for base plate powder packaging equipment
Technical Field
The utility model relates to the field of semiconductor technology, particularly, relate to a press suitable for base plate powder encapsulation equipment.
Background
The plastic package of the semiconductor chip can not be separated from the plastic package press, and the stability of the stress structure of the plastic package press is of great importance.
The structure of the conventional plastic packaging press is as follows: the ball screw is fixed on the lifting seat, the lifting seat is fixed with the crank pin shaft mechanism, the servo motor is fixed on the press base, the servo motor drives the ball screw, the ball screw drives the lifting seat to move up and down, the lifting seat drives the whole crank pin shaft mechanism to move, and then the movable platen is driven to move up and down along four guide posts, the plastic package die assembly process of the upper die and the lower die is completed, wherein the upper die is fixed on the top plate, and the lower die is fixed on the movable platen.
However, because the movable bedplate is driven to move up and down by the ball screw through the crank pin shaft, the plastic package area of the tabletop is stressed unevenly; in addition, dynamic compensation can not be carried out according to the real-time plastic package state; the probability of uneven pressure and flash of the plastic-packaged product is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a press suitable for base plate powder encapsulation equipment, it can carry out dynamic compensation according to real-time plastic envelope state, and the product pressurized that makes the plastic envelope come out is even, reduces the probability of flash.
The embodiment of the utility model is realized like this:
the utility model provides a press suitable for base plate powder encapsulation equipment, the press suitable for base plate powder encapsulation equipment includes:
a frame;
the driving mechanism is arranged on the rack;
the screw rod is rotatably arranged on the rack and is connected to the driving mechanism;
the movable bedplate is in threaded fit with the screw rods;
the lower die is arranged at the top of the movable platen;
the upper die is arranged at the top of the rack and is opposite to the lower die;
the sensor is arranged on the frame;
and the grating ruler is arranged on the movable platen and corresponds to the sensor, and the sensor is used for monitoring the grating ruler so as to determine the thickness of the plastic package corresponding to the position of the grating ruler.
In an alternative embodiment, the lead screw is connected to the movable platen in a nut-in-line fashion.
Therefore, the nut on the screw rod and the movable bedplate are installed in an embedded mode through the screw rod nut, and the movable bedplate moves up and down more stably and reliably.
In an optional implementation mode, the movable platen is of a cuboid structure, the number of the grating rulers is four, the four grating rulers are respectively installed at four corners of the movable platen, each grating ruler corresponds to one sensor, and the four sensors respectively monitor the thickness of the four corners of the plastic package.
In an alternative embodiment, the number of the screw rods is four, and four screw rods are connected at four corner positions of the movable platen.
Therefore, the movable bedplate is driven to move up and down by the four motors and the four screw rods, the structure is stable, and the die assembly stress is more uniform.
In an alternative embodiment, the frame comprises:
a base;
the connecting seat is connected to the top of the base, a bearing seat is arranged at the top of the connecting seat, and the screw rod is supported on the bearing seat;
the side plate is connected to the top of the connecting seat;
the top plate is connected to the top of curb plate, and the bottom surface at the top plate is connected to the last mould.
In an alternative embodiment, the drive mechanism comprises:
the motor is arranged on the base;
the speed reducer is arranged on the connecting seat and connected with an output shaft of the motor;
the shaft coupling is installed on the connecting seat and is connected with the speed reducer, and the lead screw is connected on the shaft coupling.
In an alternative embodiment, the press adapted for use in a substrate powder encapsulation apparatus further comprises:
the sliding rail fixing seat is arranged on the rack;
the linear guide rail is arranged on the slide rail fixing seat;
and the sliding block is arranged on the movable bedplate and is in sliding fit with the linear guide rail.
Therefore, the linear guide rails fixed on the two sides of the movable bedplate ensure the accuracy of up-and-down motion.
In an alternative embodiment, one slide rail fixing seat is respectively arranged on two opposite sides of each side plate.
In an alternative embodiment, one sensor is mounted on each slide mount.
In an alternative embodiment, the press adapted for use in a substrate powder encapsulation apparatus further comprises:
and the controller is electrically connected with the motors and is used for independently controlling the operation of each motor.
Therefore, the four motors are independently controlled by the controller, fine dynamic compensation can be carried out on the table board according to the change of the real-time plastic package state, and qualified products can be obtained through plastic package.
The embodiment of the utility model provides a beneficial effect suitable for press of base plate powder encapsulation equipment includes:
1. a plurality of screw rods are in threaded fit with the movable platen, and the movable platen is driven to move up and down by the plurality of screw rods, so that the movable platen is uniformly stressed, the uniformity of applying pressure to the plastic package is improved, and the plastic package quality is improved;
2. the upper and lower positions of the movable platen are monitored by using the sensor and the grating ruler, so that the thickness of the plastic package corresponding to the position of the grating ruler can be monitored, the thickness of each part of the plastic package is monitored, dynamic compensation is carried out according to the real-time plastic package state, the product subjected to plastic package is uniformly compressed, and the probability of flash is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a press suitable for a substrate powder packaging apparatus according to an embodiment of the present invention;
FIG. 2 is a top view of the movable platen of FIG. 1;
FIG. 3 is a schematic view of the A-side of the movable platen tilted;
fig. 4 is a schematic view of the F-angle tilt of the movable platen.
Icon: 100-a press adapted for use in a substrate powder encapsulation apparatus; 1-a screw rod; 2-bearing seat; 3-a frame; 31-a base; 32-a connecting seat; 33-side plate; 34-a top plate; 4-a drive mechanism; 41-a motor; 42-a speed reducer; 43-a coupling; 5-a movable bedplate; 6-lower die; 7-upper die; 8-a sensor; 9-grating ruler; 10-a slide rail fixing seat; 11-a linear guide rail; 12-a slide block.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are absolutely horizontal or hanging, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1, the present embodiment provides a press 100 suitable for a substrate powder encapsulating apparatus, where the press 100 suitable for the substrate powder encapsulating apparatus includes a frame 3, a driving mechanism 4, a screw rod 1, a bearing seat 2, a movable platen 5, a lower die 6, an upper die 7, a sensor 8, a grating ruler 9, a slide rail fixing seat 10, a linear guide rail 11, a slider 12, and a controller (not shown in the figure).
Wherein, the driving mechanism 4 is arranged on the frame 3; the screw rod 1 is rotatably arranged on the frame 3 and is connected to the driving mechanism 4; the movable platen 5 is in threaded fit with the screw rod 1; the lower die 6 is arranged at the top of the movable platen 5; the upper die 7 is arranged at the top of the frame 3 and is opposite to the lower die 6; the sensor 8 is arranged on the frame 3; the grating ruler 9 is installed on the movable platen 5 and is arranged corresponding to the sensor 8, and the sensor 8 is used for monitoring the grating ruler 9 so as to determine the thickness of the plastic package corresponding to the position of the grating ruler 9. Therefore, the plurality of screw rods 1 are in threaded fit with the movable platen 5, the movable platen 5 is driven to move up and down by the plurality of screw rods 1, the movable platen 5 is uniformly stressed, the uniformity of applying pressure to the plastic package is improved, and the plastic package quality is improved; and the sensor 8 and the grating ruler 9 are used for monitoring the upper position and the lower position of the movable platen 5, so that the thickness of the plastic package corresponding to the grating ruler 9 can be monitored, the thickness of each part of the plastic package can be monitored, dynamic compensation is carried out according to the real-time plastic package state, the product subjected to plastic package is uniformly compressed, and the probability of flash is reduced.
Preferably, after the screw rod 1 is subjected to force analysis and calculation to determine a fixed point, the screw rod 1 is connected to the movable platen 5 in a nut embedded mode.
The movable platen 5 is of a cuboid structure, the number of the grating rulers 9 is four, the four grating rulers 9 are respectively installed at four corners of the movable platen 5, each grating ruler 9 corresponds to one sensor 8, and the four sensors 8 respectively monitor the thickness of four corners of the plastic package.
Correspondingly, the number of the screw rods 1 is four, and the four screw rods 1 are connected to four corners of the movable bedplate 5.
Specifically, the frame 3 comprises a base 31, a connecting seat 32, a side plate 33 and a top plate 34, the connecting seat 32 is connected to the top of the base 31, a bearing seat 2 is arranged on the top of the connecting seat 32, and the screw rod 1 is supported on the bearing seat 2; the side plate 33 is connected to the top of the connecting seat 32; the top plate 34 is attached to the top of the side plate 33, and the upper die 7 is attached to the bottom surface of the top plate 34.
The drive mechanism 4 includes a motor 41, a speed reducer 42, and a coupling 43. Four motors 41 are mounted on the base 31; the speed reducer 42 is installed on the connecting seat 32 and connected with the output shaft of the motor 41; the coupling 43 is installed on the connecting seat 32 and connected with the speed reducer 42, and the screw rod 1 is connected on the coupling 43. A controller is electrically connected to the motors 41 for individually controlling the operation of each motor 41.
The slide rail fixing seat 10 is arranged on the frame 3; the linear guide rail 11 is arranged on the slide rail fixing seat 10; the slide block 12 is mounted on the movable platen 5 and is in sliding fit with the linear guide 11. Preferably, one slide rail fixing seat 10 is respectively installed on two opposite sides of each side plate 33, and one sensor 8 is installed on each slide rail fixing seat 10.
In this way, the movable platen 5 is connected to the side plate 33 through the linear guide rail 11, the slider 12 and the slide rail fixing seat 10, the base 31, the connecting seat 32, the side plate 33 and the top plate 34 are connected into a whole, the screw rod 1 penetrates through the bearing seat 2, the bearing seat 2 is fixed on the connecting seat 32, and the shaft end of the screw rod 1 is connected with the shaft end of the speed reducer 42 through the coupler 43. The motor 41 and the speed reducer 42 are arranged at the bottom of the connecting seat 32, so that the stability and reliability of the whole up-and-down motion can be ensured; the linear guide rails 11 fixed on the two sides of the movable bedplate 5 ensure the accuracy of up-and-down movement; the position of the screw rod 1 arranged on the movable bedplate 5 is determined by stress analysis and calculation, so that the stress uniformity is ensured.
When a product is plastically packaged (when the mold is closed), the four motors 41 are respectively and independently controlled by a main control program of the controller, and corresponding sensors 8 are connected into the control program in the surface area and the corner area of the movable bedplate 5. When the condition that the thickness of plastic package of a certain surface area or an angle area does not meet the requirement is detected, the sensor 8 feeds back a signal to the controller, the controller controls the corresponding motor 41, and the motor 41 drives the screw rod 1 fixed on the movable bedplate 5 to move up and down to perform dynamic compensation, wherein the dynamic compensation comprises surface compensation and angle compensation.
Referring to fig. 2, the top surface of the movable platen 5 may be divided into a-plane, B-plane, C-plane, D-plane, E-angle, F-angle, G-angle, and H-angle. The four screw rods 1 are respectively an I screw rod 1, an II screw rod 1, an III screw rod 1 and an IV screw rod 1.
Referring to fig. 3, if the surface a of the movable platen 5 is tilted, that is, the plastic package does not reach the standard in the mold closing process, and the thickness of the surface a is too small, the controller controls the motor 41 to drive the lead screw 1I and the lead screw 1 II, so that the surface a of the movable platen 5 moves down to perform fine dynamic surface compensation, and the overall thickness of the plastic package is uniform.
Referring to fig. 4, if the F angle of the movable platen 5 is tilted, that is, the plastic package does not reach the standard in the mold closing process, and the thickness of the F angle is too small, the controller controls the motor 41 to drive the II screw 1, so that the F angle of the movable platen 5 moves down to perform fine dynamic surface compensation, and the overall thickness of the plastic package is uniform.
The beneficial effects of the press 100 suitable for the substrate powder packaging device provided by the embodiment include:
1. four motors 41 are used for driving the movable platen 5 to move up and down, the structure is stable, and the die assembly stress is more uniform;
2. the four motors 41 are independently controlled by the controller, and can carry out fine dynamic compensation on the table board according to the change of the real-time plastic package state, so that a qualified product is plastic packaged;
3. the nut on the screw rod 1 and the movable platen 5 are installed in a manner that the nut on the screw rod 1 is embedded, so that the movable platen 5 moves up and down more stably and reliably;
4. the motor 41 and the speed reducer 42 are arranged at the bottom of the connecting seat 32, so that the stability and reliability of the whole up-and-down motion can be ensured;
5. the linear guide rails 11 fixed on the two sides of the movable bedplate 5 ensure the accuracy of up-and-down movement;
6. the position of the screw rod 1 arranged on the movable bedplate 5 is determined by stress analysis and calculation, so that the stress uniformity is ensured.
The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A press suitable for a substrate powder encapsulating apparatus, comprising:
a frame (3);
the driving mechanism (4) is arranged on the rack (3);
the screw rod (1) is rotatably arranged on the rack (3) and is connected to the driving mechanism (4);
the movable bedplate (5) is in threaded fit with the screw rod (1);
the lower die (6) is arranged at the top of the movable platen (5);
the upper die (7) is arranged at the top of the rack (3) and is opposite to the lower die (6);
a sensor (8) mounted on the frame (3);
and the grating ruler (9) is installed on the movable platen (5) and is arranged corresponding to the sensor (8), and the sensor (8) is used for monitoring the grating ruler (9) so as to determine the thickness of the plastic package corresponding to the position of the grating ruler (9).
2. The press adapted for substrate powder encapsulation apparatus according to claim 1, wherein the lead screw (1) is connected to the movable platen (5) in a nut-in-line manner.
3. The press suitable for the substrate powder packaging equipment according to claim 1, wherein the movable platen (5) is of a rectangular parallelepiped structure, the number of the grating rulers (9) is four, four grating rulers (9) are respectively installed at four angular positions of the movable platen (5), each grating ruler (9) corresponds to one sensor (8), and the four sensors (8) respectively monitor the thickness of the plastic package at four angular positions.
4. The press suitable for substrate powder encapsulating apparatus according to claim 3, wherein the number of said lead screws (1) is four, and four of said lead screws (1) are connected at four corner positions of said movable platen (5).
5. Press suitable for substrate powder encapsulating apparatuses according to claim 1, characterized in that the frame (3) comprises:
a base (31);
the connecting seat (32) is connected to the top of the base (31), a bearing seat (2) is arranged on the top of the connecting seat (32), and the screw rod (1) is supported on the bearing seat (2);
a side plate (33) connected to the top of the connecting seat (32);
and the top plate (34) is connected to the top of the side plate (33), and the upper die (7) is connected to the bottom surface of the top plate (34).
6. The press suitable for substrate powder encapsulating apparatuses according to claim 5, wherein the drive mechanism (4) comprises:
a motor (41) mounted on the base (31);
a speed reducer (42) mounted on the connecting seat (32) and connected to an output shaft of the motor (41);
the coupling (43) is installed on the connecting seat (32) and connected with the speed reducer (42), and the screw rod (1) is connected to the coupling (43).
7. The press suitable for use in a substrate powder encapsulation apparatus of claim 5, further comprising:
the sliding rail fixing seat (10) is installed on the rack (3);
the linear guide rail (11) is installed on the slide rail fixing seat (10);
and the sliding block (12) is arranged on the movable bedplate (5) and is in sliding fit with the linear guide rail (11).
8. The press adapted for use in a substrate powder encapsulating apparatus according to claim 7, wherein one said slide mount (10) is mounted on each of opposite sides of each said side plate (33).
9. The press adapted for substrate powder encapsulating equipment according to claim 7, characterized in that one said sensor (8) is mounted on each said slide holder (10).
10. The press suitable for use in a substrate powder encapsulation apparatus of claim 6, further comprising:
a controller electrically connected to the motors (41), the controller for individually controlling the operation of each of the motors (41).
CN202221088951.5U 2022-05-07 2022-05-07 Press suitable for base plate powder packaging equipment Active CN217158114U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221088951.5U CN217158114U (en) 2022-05-07 2022-05-07 Press suitable for base plate powder packaging equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221088951.5U CN217158114U (en) 2022-05-07 2022-05-07 Press suitable for base plate powder packaging equipment

Publications (1)

Publication Number Publication Date
CN217158114U true CN217158114U (en) 2022-08-09

Family

ID=82664843

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202221088951.5U Active CN217158114U (en) 2022-05-07 2022-05-07 Press suitable for base plate powder packaging equipment

Country Status (1)

Country Link
CN (1) CN217158114U (en)

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