CN210181085U - Wafer anti-slipping structure for probe station - Google Patents

Wafer anti-slipping structure for probe station Download PDF

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Publication number
CN210181085U
CN210181085U CN201920882104.8U CN201920882104U CN210181085U CN 210181085 U CN210181085 U CN 210181085U CN 201920882104 U CN201920882104 U CN 201920882104U CN 210181085 U CN210181085 U CN 210181085U
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support arm
wafer
probe station
arm
slipping
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CN201920882104.8U
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Chinese (zh)
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Chao Chen
陈超
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Wuxi Xinweiyang Technology Co Ltd
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Wuxi Xinweiyang Technology Co Ltd
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Abstract

The utility model belongs to the technical field of wafer test equipment, a wafer antiskid play structure for probe station is disclosed, its technical scheme main points are including first support arm and the second support arm that sets up in pairs, first support arm and spool box elevating system's upper surface rigid coupling, the second support arm offsets with the framework bottom surface of wafer casket, and second support arm one end is articulated with first support arm, is equipped with the third support arm between the other end and the first support arm, the third support arm is located the wafer entry one end of wafer casket, has and can effectively prevent that the wafer from slipping out in the wafer casket, avoids the wafer to collide with the effect in the frame.

Description

Wafer anti-slipping structure for probe station
Technical Field
The utility model relates to a wafer test equipment's technical field, in particular to wafer antiskid play structure for probe station.
Background
The probe station is one of the main devices for testing integrated circuits, and is used in conjunction with a tester to test uncut wafers.
Chinese patent No. CN203414540U discloses a full-automatic integrated IC and LED testing system, which includes a probe station module and a testing machine module, wherein the probe station module includes a wafer box lifting mechanism for conveying wafers, a wafer bearing mechanism for moving the wafers to a testing position, and a wafer loading mechanism for transferring the wafers from the wafer box lifting mechanism to the wafer bearing mechanism, the testing machine module includes a probe card and a testing machine connected to each other, the probe card is matched with the wafer bearing mechanism and placed above the wafer bearing mechanism, the testing machine is connected to the wafer bearing mechanism, the wafer bearing mechanism further includes a wafer bearing table, a first power device and a second power device, the first power device linearly drives the wafer bearing table, and the second power device rotationally drives the wafer bearing table.
The chinese patent publication No. CN208806233U discloses a wafer cassette, which includes a supporting portion and a frame body. The frame body is connected with the bearing part and is provided with a wafer inlet. The bearing part is positioned right below the wafer inlet. The frame body comprises a plurality of upper end portions surrounding the wafer inlet, wherein each upper end portion extends and tapers towards the direction far away from the bearing portion, so that the top end of each upper end portion does not form a horizontal plane.
The two opposite side walls of the frame body of the wafer box are provided with grooves in pairs, one end of each groove is communicated with the wafer inlet, the other end of each groove extends to the bearing part, and each pair of grooves can be used for placing a wafer.
In the actual use process, the wafer box lifting mechanism, the wafer loading mechanism and the wafer bearing mechanism in the probe station are matched with each other, the wafer is taken out from the wafer box, the wafer is conveyed and positioned, and the wafer is sent back to the wafer box after the test is finished. The series of actions all need to be driven by mechanical structures such as a motor, a lead screw and a gear, and meanwhile, small-amplitude vibration of the probe station is inevitably caused. When vibration is transmitted to the cassette and the wafers therein, it is easy to move the wafers in the cassette, and the wafers partially protrude from the wafer inlet. At this time, the cassette lifting mechanism drives the wafer cassette to lift, and the part of the wafer protruding from the wafer inlet hits on the frame of the probe station, which may cause the wafer to break.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wafer antiskid goes out structure for probe station has and can effectively prevent that the wafer from slipping out in the wafer casket, avoids the wafer to collide with the advantage in the frame.
The above technical purpose of the present invention can be achieved by the following technical solutions:
the utility model provides a wafer antiskid goes out structure for probe station, includes first support arm and the second support arm that sets up in pairs, first support arm and spool box elevating system's upper surface rigid coupling, the second support arm offsets with the framework bottom surface of wafer casket, and second support arm one end is articulated with first support arm, is equipped with the third support arm between the other end and the first support arm, the third support arm is located the wafer entry one end of wafer casket.
Through adopting above-mentioned technical scheme, second support arm one end is articulated with first support arm, blocks into the third support arm between the other end of second support arm and first support arm, makes the wafer casket framework of placing on the second support arm slope, and the wafer entry end is lifted up, receives the skew normal position of vibrations when the wafer, and it slides to the wafer entry dorsad under the action of gravity to can prevent effectively that the wafer from slipping out in the wafer casket, avoid the wafer to collide with in the frame.
Furthermore, the dovetail groove has been seted up towards the upper surface of third support arm one end to first support arm, and the dovetail groove sets up along the length direction of first support arm, the third support arm sets up along vertical direction, and third support arm bottom slides and sets up in the dovetail groove, and the top offsets with the lower surface of second support arm.
Through adopting above-mentioned technical scheme, make the third support arm slide in the dovetail, adjust the position of third support arm, can change the inclination of second support arm, and then adjust the inclination of framework, under the circumstances of guaranteeing that the wafer does not follow the internal roll-off of framework, the last piece mechanism of being convenient for absorbs the wafer.
Furthermore, a limiting groove is formed in the lower surface of the second support arm, and the limiting groove is formed in the length direction of the second support arm.
Through adopting above-mentioned technical scheme, set up the spacing groove at the lower surface of second support arm, with the cooperation of third support arm top, make the third support arm can keep steadily vertical, prop up the second support arm.
Furthermore, a sawtooth head is hinged to the top end of the third support arm and abuts against the bottom of the limit groove, sawteeth are arranged on one side, back to the third support arm, of the sawtooth head, and sawteeth are correspondingly arranged on the bottom of the limit groove.
Through adopting above-mentioned technical scheme, when the third support arm propped the second support arm, sawtooth head and sawtooth portion interlock avoided the third support arm top to slide in the guide way.
Further, waist type groove has been seted up towards the lower surface of third support arm one end to the second support arm, and waist type groove sets up along the length direction of second support arm, the third support arm sets up along vertical direction, third support arm bottom and first support arm rigid coupling, and third support arm top cover is equipped with the nut, and the waist type inslot is worn to locate on the top, the nut offsets with the lower surface of second support arm.
By adopting the technical scheme, the nut is screwed to change the position of the nut on the third support arm, so that the inclination angle of the second support arm can be changed, and in the process, the top end of the third support arm slides in the kidney-shaped groove.
Furthermore, two one side that the second support arm carried on the back mutually is equipped with the curb plate respectively, the curb plate sets up along vertical direction, wears to be equipped with fastening screw on the curb plate, fastening screw and curb plate screw-thread fit, the lateral wall of the directional framework of fastening screw.
By adopting the technical scheme, the fastening screw rod is screwed to move towards the side wall of the frame body and tightly press the side wall of the frame body, and the frame body can be better fixed on the second supporting arm by utilizing the friction force between the fastening screw rod and the side wall of the frame body, so that the frame body is not easy to slide down from the second supporting arm.
Furthermore, one end of the second support arm, which faces away from the third support arm, is provided with a limit baffle, and the limit baffle abuts against one side of the frame body, which faces away from the wafer inlet.
Through adopting above-mentioned technical scheme, limit baffle offsets with the frame one side that the wafer entry was dorsad, prevents that the frame from gliding down from the second support arm.
Furthermore, a cross beam is arranged between the second supporting arms to be connected.
Through adopting above-mentioned technical scheme, set up the crossbeam, when making two second support arms synchronous motion, also enable it to share pressure each other.
To sum up, the utility model discloses following beneficial effect has:
1. the wafer can be effectively prevented from sliding out of the wafer box, and the wafer is prevented from colliding with the rack;
2. the frame body can be stably placed on the second support arm and is not easy to slide down from the second support arm.
Drawings
FIG. 1 is a schematic view of the overall structure of embodiment 1;
FIG. 2 is a schematic view showing the connection between the second support arm and the third support arm in example 1;
fig. 3 is a schematic view of the connection relationship between the second support arm and the third support arm in embodiment 2.
In the figure, 1, a first support arm; 2. a second support arm; 3. a third support arm; 4. a cross beam; 5. a cassette lifting mechanism; 6. a frame body; 11. a dovetail groove; 21. a limiting groove; 22. a serration; 23. a waist-shaped groove; 24. a side plate; 25. fastening a screw rod; 26. a limit baffle; 31. a serrated head; 32. and a nut.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1:
a wafer anti-slipping-out structure for a probe station is shown in figure 1 and comprises a first support arm 1, a second support arm 2 and a third support arm 3 which are arranged on two sides below a wafer box frame body 6 in pairs, wherein the first support arm 1, the second support arm 2 and the third support arm 3 are in the same vertical plane.
As shown in fig. 1, the first support arm 1 is fixed on the upper surface of the cassette lifting mechanism 5 along the horizontal direction and points to the wafer inlet of the wafer cassette. The second supporting arm 2 is abutted against the bottom surface of the frame body 6 to lift the frame body 6 upwards, and one end of the second supporting arm, which is back to the wafer inlet, is hinged with the first supporting arm 1. The third supporting arm 3 is arranged along the vertical direction, supported between the first supporting arm 1 and the second supporting arm 2, and located at one end of the wafer inlet.
The third supporting arm 3 supports the second supporting arm 2, so that one end of the second supporting arm facing to the wafer inlet is tilted upwards, and the frame body 6 placed on the second supporting arm 2 is also tilted, so that the wafer slides towards the wafer inlet after being deflected, and cannot slide out of the wafer inlet.
As shown in figure 1, a cross beam 4 is lapped between the two second supporting arms 2, and two ends of the cross beam 4 are respectively fixedly connected with the two second supporting arms 2 so as to enable the two supporting arms to move synchronously.
As shown in fig. 1, two side plates 24 are respectively and fixedly connected to the opposite sides of the two second support arms 2, and the two side plates 24 are parallel to the two side walls of the frame body 6. The fastening screw 25 is inserted into the side plate 24, is in threaded engagement with the side plate 24, and is perpendicular to the side wall of the frame 6.
The tightening screw 25 is screwed so as to press against the side wall of the frame 6, and the frame 6 is fixed to the second support arm 2 by the friction between the two.
As shown in fig. 1, a limit baffle 26 is fixedly arranged at an end of the second support arm 2 opposite to the third support arm 3, and the limit baffle 26 is perpendicular to the second support arm 2 at an axis and abuts against the back side of the frame body 6 to prevent the frame body 6 from sliding down from the second support arm 2.
As shown in fig. 2, a dovetail groove 11 is formed on an upper surface of one end of the first support arm 1 facing the third support arm 3, and the dovetail groove 11 is arranged along a length direction of the first support arm 1. The lower surface of the second support arm 2 facing one end of the third support arm 3 is provided with a limit groove 21, and the limit groove 21 is arranged along the length direction of the second support arm 2. The bottom end of the third supporting arm 3 is arranged in the dovetail groove 11 in a sliding mode, and the top end of the third supporting arm is arranged in the limiting groove 21 in a sliding mode.
By adjusting the position of the third support arm 3, the inclination angles of the second support arm 2 and the frame 6 can be changed.
As shown in fig. 2, the sawtooth head 31 is rotatably connected to the top end of the third support arm 3, and the rotation axis thereof is perpendicular to the plane where the second support arm 2 and the third support arm 3 are located. The sawtooth head 31 abuts against the bottom of the limiting groove 21, sawteeth are arranged on the side of the sawtooth head, which faces away from the third supporting arm 3, and correspondingly, the sawtooth part 22 is arranged on the bottom of the limiting groove 21 and is meshed with the sawtooth head 31.
The specific implementation process comprises the following steps:
the third support arm 3 is engaged between the second support arm 2 and the first support arm 1, and the cassette frame 6 placed on the second support arm 2 is tilted so that the wafer inlet end is lifted. When the wafer is vibrated and deviated from the original position, the wafer slides back to the wafer inlet under the action of gravity and is not easy to slide out of the wafer box.
Example 2:
as shown in fig. 3, a waist-shaped groove 23 is formed in a lower surface of the second support arm 2 facing one end of the third support arm 3, and the waist-shaped groove 23 is disposed along a length direction of the second support arm 2. The bottom end of the third supporting arm 3 is fixedly connected with the first supporting arm 1, and the top end penetrates into the waist-shaped groove 23 and can slide in the waist-shaped groove 23.
As shown in fig. 3, the nut 32 is sleeved on the top of the third support arm 3, is in threaded fit with the third support arm 3, and abuts against the lower surface of the second support arm 2.
The specific implementation process comprises the following steps:
the inclination angles of the second support arm 2 and the frame 6 can be adjusted by screwing the nut 32 and changing its position on the third support arm 3. In the process, the top end of the third supporting arm 3 slides in the kidney-shaped groove 23.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

Claims (8)

1. The utility model provides a wafer antiskid structure of going out for probe station which characterized in that: including first support arm (1) and second support arm (2) that set up in pairs, the upper surface rigid coupling of first support arm (1) and spool box elevating system (5), second support arm (2) offsets with framework (6) bottom surface of wafer casket, and second support arm (2) one end is articulated with first support arm (1), is equipped with third support arm (3) between the other end and first support arm (1), third support arm (3) are located the wafer entry one end of wafer casket.
2. The wafer anti-slipping-out structure for the probe station as claimed in claim 1, wherein: dovetail (11) have been seted up towards the upper surface of third support arm (3) one end in first support arm (1), and dovetail (11) set up along the length direction of first support arm (1), vertical direction setting is followed in third support arm (3), and third support arm (3) bottom slides and sets up in dovetail (11), and the top offsets with the lower surface of second support arm (2).
3. The wafer anti-slipping-out structure for the probe station as claimed in claim 2, wherein: the lower surface of the second supporting arm (2) is provided with a limiting groove (21), and the limiting groove (21) is arranged along the length direction of the second supporting arm (2).
4. The wafer anti-slipping-out structure for the probe station as claimed in claim 3, wherein: third support arm (3) top articulates there is sawtooth head (31), sawtooth head (31) offset with the tank bottom of spacing groove (21), and sawtooth head (31) one side of third support arm (3) dorsad is equipped with the sawtooth, the tank bottom correspondence of spacing groove (21) is equipped with sawtooth portion (22).
5. The wafer anti-slipping-out structure for the probe station as claimed in claim 1, wherein: waist type groove (23) have been seted up towards the lower surface of third support arm (3) one end to second support arm (2), and waist type groove (23) set up along the length direction of second support arm (2), vertical direction setting is followed in third support arm (3), third support arm (3) bottom and first support arm (1) rigid coupling, and third support arm (3) top cover is equipped with nut (32), and the top is worn to locate in waist type groove (23), nut (32) offset with the lower surface of second support arm (2).
6. The wafer anti-slipping-out structure for the probe station as claimed in claim 1, wherein: two one side that second support arm (2) carried on the back mutually is equipped with curb plate (24) respectively, curb plate (24) are along vertical direction setting, wear to be equipped with fastening screw (25) on curb plate (24), fastening screw (25) and curb plate (24) screw-thread fit, the lateral wall of the directional framework (6) of fastening screw (25).
7. The wafer anti-slipping-out structure for the probe station as claimed in claim 1, wherein: one end, back to the third supporting arm (3), of the second supporting arm (2) is provided with a limiting baffle (26), and the limiting baffle (26) is abutted to one side, back to the wafer inlet, of the frame body (6).
8. The wafer anti-slipping-out structure for the probe station as claimed in claim 1, wherein: and a cross beam (4) is arranged between the second supporting arms (2) and connected with each other.
CN201920882104.8U 2019-06-12 2019-06-12 Wafer anti-slipping structure for probe station Active CN210181085U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920882104.8U CN210181085U (en) 2019-06-12 2019-06-12 Wafer anti-slipping structure for probe station

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920882104.8U CN210181085U (en) 2019-06-12 2019-06-12 Wafer anti-slipping structure for probe station

Publications (1)

Publication Number Publication Date
CN210181085U true CN210181085U (en) 2020-03-24

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CN201920882104.8U Active CN210181085U (en) 2019-06-12 2019-06-12 Wafer anti-slipping structure for probe station

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823441A (en) * 2022-06-28 2022-07-29 深圳市星国华先进装备科技有限公司 Wafer anti-slipping protection device and method for transmission mechanism of probe testing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114823441A (en) * 2022-06-28 2022-07-29 深圳市星国华先进装备科技有限公司 Wafer anti-slipping protection device and method for transmission mechanism of probe testing machine

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