CN110045159B - Get test seat of BGA encapsulation of material convenient - Google Patents
Get test seat of BGA encapsulation of material convenient Download PDFInfo
- Publication number
- CN110045159B CN110045159B CN201910438604.7A CN201910438604A CN110045159B CN 110045159 B CN110045159 B CN 110045159B CN 201910438604 A CN201910438604 A CN 201910438604A CN 110045159 B CN110045159 B CN 110045159B
- Authority
- CN
- China
- Prior art keywords
- pair
- swing
- groove
- supporting plates
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
Abstract
The invention discloses a BGA (ball grid array) packaged test seat convenient for taking and placing materials.A probe support plate is elastically arranged in a lower limit groove in a lifting manner; a plurality of probes are formed on the upper end surface of the probe supporting plate; the probe vertically penetrates through the lower side wall of the upper limiting groove; a pair of side supporting plates are synchronously lifted and arranged in the upper limiting groove; the end close to the upper end surfaces of the side supporting plates is respectively formed with a limited position placing groove; a pair of swing supporting plates which are symmetrically arranged front and back are respectively formed at the ends far away from the upper end surfaces of the pair of side supporting plates; a cylindrical swing guide rod arranged in the front-back direction is formed between the swing support plates; a swing center rod is formed at the lower end of the swing cover plate; the swing center rod is pivoted at the lower ends of the front side wall and the rear side wall of the swing avoidance groove at the corresponding side; the swing cover plate is formed with a long-hole-shaped sliding guide groove which is arranged in a penetrating way from front to back; the swing guide rod penetrates through the sliding guide groove in the front-back direction and is arranged in the sliding guide groove in a sliding mode. The BGA packaging machine enables operators to conveniently take and place BGA packages, is high in production efficiency and stable in test.
Description
Technical Field
The invention relates to the field of integrated circuit packaging test, in particular to a BGA packaging test base convenient for taking and placing materials.
Background
The semiconductor element is processed into a semiconductor chip package, such as a BGA package, through a series of packaging processes, and the processed semiconductor chip package is subjected to an electrical inspection process before being provided to a customer; in the electrical inspection process, the electrical characteristics of the semiconductor chip package are inspected using the test socket. Here, the test socket is a device that electrically connects the direct loop of each semiconductor element to the test instrument.
During the test, operating personnel places the BGA encapsulation at detecting the inslot, then carries out the lateral wall, takes out the BGA encapsulation at last from detecting the inslot, because the encapsulation is limited with the clearance size that detects between the lateral wall in groove, so operating personnel gets puts the BGA encapsulation very not convenient, has influenced the efficiency of test like this.
Disclosure of Invention
The invention aims to solve the technical problem that the BGA package is inconvenient to take and place by an operator of the existing equipment, and provides a BGA package testing seat convenient to take and place materials.
The technical scheme for solving the technical problems is as follows: a BGA package test seat convenient for taking and placing materials comprises a rectangular support seat and a test taking and placing device; the center of the upper end surface of the supporting seat is formed with a rectangular groove-shaped upper limiting groove, and the center of the lower end surface of the supporting seat is formed with a rectangular groove-shaped lower limiting groove; swing avoidance grooves are formed in the upper ends of the left side wall and the right side wall of the upper limiting groove respectively; the test material taking and placing device comprises a probe supporting plate, a pair of side supporting plates and a pair of swing cover plates; the probe supporting plate is elastically arranged in the lower limiting groove in a lifting way; a plurality of probes are formed on the upper end surface of the probe supporting plate; the probe vertically penetrates through the lower side wall of the upper limiting groove from bottom to top; when the probe supporting plate is positioned at the uppermost end, the upper end of the probe exceeds the lower side wall of the upper limiting groove; a pair of side supporting plates are synchronously lifted and arranged in the upper limiting groove; the end close to the upper end surfaces of the side supporting plates is respectively formed with a limited position placing groove; when a pair of side supporting plates are positioned at the uppermost end, the lower side wall of the limiting and placing groove is positioned above the supporting seat; a pair of swing supporting plates which are symmetrically arranged front and back are respectively formed at the ends far away from the upper end surfaces of the pair of side supporting plates; a cylindrical swing guide rod arranged in the front-back direction is formed between the swing support plates; a swing center rod is formed at the lower end of the swing cover plate; the swing center rod is pivoted at the lower ends of the front side wall and the rear side wall of the swing avoidance groove at the corresponding side; the swing cover plate is formed with a long-hole-shaped sliding guide groove which is arranged in a penetrating way from front to back; the swing guide rod penetrates through the sliding guide groove in the front-back direction and is arranged in the sliding guide groove in a sliding manner; when the pair of side supporting plates are positioned at the lowest end, the pair of swinging cover plates are positioned in a horizontal state and abut against the upper end surface of the BGA package positioned in the limiting and placing groove; when a pair of side supporting plates are positioned at the uppermost end, a pair of swinging cover plates are positioned at two sides of the far side walls of a pair of limiting and placing grooves.
Preferably, the pair of swing guide rods is positioned above the left and right sides of the pair of side support plates; when the pair of side supporting plates are positioned at the lowest end, the lower end surfaces of the pair of swinging cover plates abut against the upper end surfaces of the pair of side supporting plates.
Preferably, the left end and the right end of the lower side wall of the upper limiting groove are respectively fixed with a plurality of lifting cylinders which are uniformly fixed back and forth; and a pair of side supporting plates are respectively fixed at the upper ends of the piston rods of the lifting cylinders at the corresponding sides.
Preferably, the number of the lifting cylinders is at least one.
Preferably, a lower sealing cover plate is fixed on the lower end surface of the supporting seat through a pair of screws; a plurality of uniformly distributed pressure springs are fixed on the lower end face of the probe supporting plate; the lower end of the pressure spring abuts against the upper end face of the lower sealing cover plate.
Preferably, the pair of screw heads are countersunk.
Preferably, the lower ends of the left and right side walls of the lower limiting groove are respectively formed with a lifting guide groove; a plurality of vertically arranged lifting guide rods are respectively formed on the upper side wall of the lifting guide groove; lifting guide blocks are respectively formed at the lower parts of the left end face and the right end face of the probe supporting plate; the lifting guide block is vertically sleeved on the lifting guide rod on the corresponding side.
The invention has the beneficial effects that: the BGA package is convenient to take and place by operators, the production efficiency is high, and the test is stable.
Drawings
FIG. 1 is a schematic cross-sectional view of a picked and placed BGA package of the present invention;
fig. 2 is a schematic structural view of a cross section in an operating state of the present invention.
In the figure, 10, a support seat; 100. an upper limiting groove; 101. swinging the avoidance groove; 102. a lower limiting groove; 103. a lifting guide groove; 104. a lifting guide rod; 11. a lower sealing cover plate; 20. testing the material taking and placing device; 21. a lifting cylinder; 22. side supporting plates; 220. a limiting and placing groove; 221. swinging the support plate; 222. a swing guide bar; 23. swinging the cover plate; 231. swinging the central rod; 24. a probe support plate; 241. a lifting guide block; 25. a probe; 26. and (5) pressing a spring.
Detailed Description
As shown in fig. 1 and 2, a BGA package test socket with convenient material taking and placing comprises a rectangular support base 10 and a test material taking and placing device 20; an upper limiting groove 100 in a rectangular groove shape is formed in the center of the upper end face of the supporting seat 10, and a lower limiting groove 102 in a rectangular groove shape is formed in the center of the lower end face; swing avoiding grooves 101 are respectively formed at the upper ends of the left and right side walls of the upper limiting groove 100; the test material taking and placing device 20 comprises a probe supporting plate 24, a pair of side supporting plates 22 and a pair of swing cover plates 23; the probe supporting plate 24 is elastically arranged in the lower limit groove 102 in a lifting way; a plurality of probes 25 are formed on the upper end surface of the probe supporting plate 24; the probe 25 vertically penetrates through the lower side wall of the upper limiting groove 100 from bottom to top; when the probe supporting plate 24 is at the uppermost end, the upper end of the probe 25 exceeds the lower sidewall of the upper limiting groove 100; a pair of side supporting plates 22 are synchronously lifted and arranged in the upper limiting groove 100; the end close to the upper end surfaces of the side supporting plates 22 is respectively formed with a limited position placing groove 220; when the pair of side supporting plates 22 are at the uppermost end, the lower side wall of the position-limiting placing groove 220 is positioned above the supporting seat 10; a pair of swing supporting plates 221 which are symmetrically arranged front and back are respectively formed at the ends far away from the upper end surfaces of the pair of side supporting plates 22; a cylindrical swing guide 222 is formed between the swing support plates 221 in the front-rear direction; a swing center rod 231 is formed at the lower end of the swing cover plate 23; the swing center bar 231 is pivoted at the lower ends of the front and rear side walls of the swing avoidance groove 101 at the corresponding side; the swing cover plate 23 is formed with a long hole shaped sliding guide groove 230 which is arranged through the front and the back; the swing guide bar 222 passes through the sliding guide groove 230 in the front-rear direction and is slidably disposed in the sliding guide groove 230; when the pair of side supporting plates 22 are at the lowest end, the pair of swinging cover plates 23 are in a horizontal state and abut against the upper end surface of the BGA package positioned in the limiting and placing groove 220; when the pair of side supporting plates 22 are positioned at the uppermost ends, the pair of swing cover plates 23 are positioned at both sides of the pair of position-limiting seating grooves 220, which are far away from the side walls.
Preferably, the pair of swing guides 222 is located above the left and right sides of the pair of side support plates 22; when the pair of side support plates 22 are at the lowermost end, the lower end surfaces of the pair of swing cover plates 23 abut against the upper end surfaces of the pair of side support plates 22.
Preferably, a plurality of lifting cylinders 21 are respectively fixed at the left end and the right end of the lower side wall of the upper limiting groove 100; a pair of side support plates 22 are fixed to the upper ends of the piston rods of the elevating cylinders 21 on the respective sides, respectively.
Preferably, the number of the lifting cylinders 21 is at least one.
Preferably, a lower cover plate 11 is fixed to the lower end surface of the support base 10 by a pair of screws; a plurality of uniformly distributed compression springs 26 are fixed on the lower end face of the probe supporting plate 24; the lower end of the compression spring 26 abuts against the upper end face of the lower gland plate 11.
Preferably, the pair of screw heads are countersunk.
Preferably, the lower ends of the left and right side walls of the lower limiting groove 102 are respectively formed with a lifting guide groove 103; a plurality of vertically arranged lifting guide rods 104 are respectively formed on the upper side walls of the lifting guide grooves 103; lifting guide blocks 241 are respectively formed at the lower parts of the left and right end surfaces of the probe supporting plate 24; the lifting guide block 241 is vertically sleeved on the lifting guide rod 104 on the corresponding side.
Get the operation principle of the BGA packaged test socket of convenient blowing:
the initial state is shown in fig. 2: a pair of side supporting plates 22 are arranged at the lowest end, and a pair of swing cover plates 23 are arranged in a horizontal state;
in operation, the pair of side supporting plates 22 are lifted up synchronously, in the process, the pair of swing cover plates 23 are changed from a horizontal state to an inclined state, when the pair of side supporting plates 22 are at the uppermost end, the pair of swing cover plates 23 are positioned at both sides of the far side walls of the pair of position-limiting and placing grooves 220, then the ball pins of the BGA package are placed downwards in the pair of position-limiting and placing grooves 220, and then the pair of side supporting plates 22 are lowered synchronously, in the process, the pair of swing cover plates 23 are changed from an inclined state to a horizontal state, the upper ends of the probes 25 firstly collide with the ball pins of the BGA package, but at this time, the pair of inclined swing cover plates 23 restrict the BGA package from moving upwards to separate from the pair of position-limiting and placing grooves 220, under the action of the compression springs 26, the upper ends of the probes 25 always maintain the state of colliding with the ball pins of the BGA package, when the pair of side supporting plates 22 are, in this way it is possible to carry out the test,
in the process, the BGA package is convenient to take and place by operators, the production efficiency is high, and the test is stable.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description herein, since various changes and modifications can be made in the details of the embodiment and the application range according to the spirit of the present invention.
Claims (7)
1. The utility model provides a get test seat of BGA encapsulation of material convenient, its characterized in that: comprises a rectangular supporting seat (10) and a testing material taking and placing device (20); an upper limiting groove (100) in a rectangular groove shape is formed in the center of the upper end face of the supporting seat (10), and a lower limiting groove (102) in a rectangular groove shape is formed in the center of the lower end face; swing avoidance grooves (101) are respectively formed at the upper ends of the left side wall and the right side wall of the upper limiting groove (100); the test material taking and placing device (20) comprises a probe supporting plate (24), a pair of side supporting plates (22) and a pair of swing cover plates (23); the probe supporting plate (24) is elastically arranged in the lower limiting groove (102) in a lifting way; a plurality of probes (25) are formed on the upper end surface of the probe supporting plate (24); the probe (25) vertically penetrates through the lower side wall of the upper limiting groove (100) from bottom to top; when the probe supporting plate (24) is at the uppermost end, the upper end of the probe (25) exceeds the lower side wall of the upper limiting groove (100); a pair of side supporting plates (22) are synchronously arranged in the upper limiting groove (100) in a lifting way; the end close to the upper end surfaces of the side supporting plates (22) is respectively provided with a limited position placing groove (220); when a pair of side supporting plates (22) are positioned at the uppermost ends, the lower side wall of the limiting and placing groove (220) is positioned above the supporting seat (10); a pair of swing supporting plates (221) which are symmetrically arranged in front and back are respectively formed at the ends, far away from the upper end surfaces, of the pair of side supporting plates (22); a cylindrical swing guide rod (222) arranged in the front-back direction is formed between the swing support plates (221); a swinging central rod (231) is formed at the lower end of the swinging cover plate (23); the swing central rod (231) is pivoted at the lower ends of the front and rear side walls of the swing avoidance groove (101) at the corresponding side; a sliding guide groove (230) in a long hole shape is formed in the swing cover plate (23) in a penetrating way from front to back; the swing guide rod (222) passes through the sliding guide groove (230) in the front-back direction and is arranged in the sliding guide groove (230) in a sliding manner; when the pair of side supporting plates (22) are positioned at the lowest end, the pair of swinging cover plates (23) are in a horizontal state and abut against the upper end surface of the BGA package positioned in the limiting and placing groove (220); when the pair of side supporting plates (22) are positioned at the uppermost ends, the pair of swing cover plates (23) are positioned at two sides of the far side walls of the pair of limit placing grooves (220).
2. The BGA package test socket of claim 1, wherein: the pair of swing guide rods (222) are positioned above the left side and the right side of the pair of side supporting plates (22); when the pair of side supporting plates (22) are positioned at the lowest end, the lower end surfaces of the pair of swing cover plates (23) abut against the upper end surfaces of the pair of side supporting plates (22).
3. The BGA package test socket of claim 1, wherein: a plurality of lifting cylinders (21) which are uniformly fixed from front to back are respectively fixed at the left end and the right end of the lower side wall of the upper limiting groove (100); a pair of side supporting plates (22) are respectively fixed at the upper ends of the piston rods of the lifting cylinders (21) on the corresponding sides.
4. The BGA package test socket of claim 3, wherein: at least one lifting cylinder (21) is provided.
5. The BGA package test socket of claim 1, wherein: a lower sealing cover plate (11) is fixed on the lower end surface of the supporting seat (10) through a pair of screws; a plurality of uniformly distributed compression springs (26) are fixed on the lower end face of the probe supporting plate (24); the lower end of the pressure spring (26) abuts against the upper end face of the lower sealing cover plate (11).
6. The socket of claim 5, wherein the socket comprises: a pair of screw countersunk head sets up.
7. The BGA package test socket of claim 1, wherein: the lower ends of the left side wall and the right side wall of the lower limiting groove (102) are respectively formed with a lifting guide groove (103); a plurality of vertically arranged lifting guide rods (104) are respectively formed on the upper side wall of the lifting guide groove (103); lifting guide blocks (241) are respectively formed at the lower parts of the left end face and the right end face of the probe supporting plate (24); the lifting guide block (241) is vertically sleeved on the lifting guide rod (104) on the corresponding side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910438604.7A CN110045159B (en) | 2019-05-24 | 2019-05-24 | Get test seat of BGA encapsulation of material convenient |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910438604.7A CN110045159B (en) | 2019-05-24 | 2019-05-24 | Get test seat of BGA encapsulation of material convenient |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110045159A CN110045159A (en) | 2019-07-23 |
| CN110045159B true CN110045159B (en) | 2021-03-05 |
Family
ID=67283427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910438604.7A Expired - Fee Related CN110045159B (en) | 2019-05-24 | 2019-05-24 | Get test seat of BGA encapsulation of material convenient |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110045159B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110837038B (en) * | 2019-11-14 | 2021-10-08 | 江苏爱矽半导体科技有限公司 | SOP packaging test fixture with inclined plate capable of being horizontally moved and pressed to limit position |
| CN110931381B (en) * | 2019-12-11 | 2021-12-14 | 深圳市英赛尔电子有限公司 | Integrated circuit packaging testing device for continuous testing |
| CN110907805A (en) * | 2019-12-11 | 2020-03-24 | 杭州易正科技有限公司 | Integrated circuit packaging testing device of portable categorised ejection of compact |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202159077U (en) * | 2011-01-26 | 2012-03-07 | 微联解决方案株式会社 | BGA test socket adapter provided with guiding part for guiding ball terminal and styluses |
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105324672A (en) * | 2013-06-28 | 2016-02-10 | 惠康有限公司 | Socket device for testing semiconductor device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
| CN105353175A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | BGA packaging test socket |
| CN205656212U (en) * | 2016-05-19 | 2016-10-19 | 深圳市华科伟业电路科技有限公司 | Stiff and straight pin type test jig of PCB |
| CN106561084A (en) * | 2014-04-28 | 2017-04-12 | 黄东源 | Socket apparatus for semiconductor device test |
| CN107976618A (en) * | 2016-03-08 | 2018-05-01 | 赵令臣 | A kind of method of work of BGA package test jack |
| CN109307834A (en) * | 2018-11-15 | 2019-02-05 | 天津津航计算技术研究所 | A kind of BGA test jack of flexible connection |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018163087A (en) * | 2017-03-27 | 2018-10-18 | ルネサスエレクトロニクス株式会社 | Semiconductor device manufacturing method, semiconductor device inspection apparatus, and semiconductor device |
-
2019
- 2019-05-24 CN CN201910438604.7A patent/CN110045159B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202159077U (en) * | 2011-01-26 | 2012-03-07 | 微联解决方案株式会社 | BGA test socket adapter provided with guiding part for guiding ball terminal and styluses |
| CN105324672A (en) * | 2013-06-28 | 2016-02-10 | 惠康有限公司 | Socket device for testing semiconductor device |
| CN106561084A (en) * | 2014-04-28 | 2017-04-12 | 黄东源 | Socket apparatus for semiconductor device test |
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
| CN105353175A (en) * | 2015-11-22 | 2016-02-24 | 苏州光韵达光电科技有限公司 | BGA packaging test socket |
| CN107976618A (en) * | 2016-03-08 | 2018-05-01 | 赵令臣 | A kind of method of work of BGA package test jack |
| CN205656212U (en) * | 2016-05-19 | 2016-10-19 | 深圳市华科伟业电路科技有限公司 | Stiff and straight pin type test jig of PCB |
| CN109307834A (en) * | 2018-11-15 | 2019-02-05 | 天津津航计算技术研究所 | A kind of BGA test jack of flexible connection |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110045159A (en) | 2019-07-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110045159B (en) | Get test seat of BGA encapsulation of material convenient | |
| CN110045161B (en) | BGA packaged test socket | |
| CN110045160B (en) | Test seat that top of BGA encapsulation usefulness was got and is put | |
| CN105891626A (en) | High-reliability pressure-adjusting automatic testing apparatus for fingerprint module group | |
| CN108120942A (en) | A kind of LED driver automatic inspection line | |
| CN109164323B (en) | Automatic tester for testing PDU | |
| CN201819833U (en) | Compression-resistant testing machine for carton | |
| CN104990796B (en) | A kind of testing agency | |
| CN110931381B (en) | Integrated circuit packaging testing device for continuous testing | |
| CN208223337U (en) | Novel cross shaft detection device | |
| CN111128825A (en) | Lead frame material loading frame with automatic fixing function | |
| CN206321510U (en) | A kind of compression test machine | |
| CN110907805A (en) | Integrated circuit packaging testing device of portable categorised ejection of compact | |
| CN110824342A (en) | A test fixture for SOP encapsulation | |
| CN110824341B (en) | SOP packaging test fixture with lifting limit function | |
| CN212341375U (en) | Electronic chip detection device for processing workshop | |
| CN114675056B (en) | Semi-automatic BGA encapsulation test socket | |
| CN213161981U (en) | Device for testing working power of lock head of feedback type new energy electronic lock | |
| CN106841887A (en) | A kind of mechanism for testing of cell piece | |
| CN217877560U (en) | Chip packaging detection equipment | |
| CN208781064U (en) | A kind of test device of thermostat | |
| CN110976344A (en) | Integrated circuit packaging testing device capable of discharging from two sides | |
| CN217331459U (en) | Connector terminal retention test fixture | |
| CN205333796U (en) | No probe detecting system | |
| CN213516704U (en) | Plastic package food testing arrangement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: He Huahui Inventor before: Xu Jun |
|
| CB03 | Change of inventor or designer information | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210207 Address after: 510030 Room 203, No. 13, Manao Lane 2, Yuexiu District, Guangzhou City, Guangdong Province Applicant after: He Huahui Address before: Room 1303, building B, Kangxin garden, 569 Wensan Road, Xihu District, Hangzhou City, Zhejiang Province Applicant before: HANGZHOU EZSOFT TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210305 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |