It is a kind of to pick and place the test bench for expecting convenient BGA package
Technical field
The present invention relates to integrated circuit packing testing fields, and in particular to a kind of to pick and place the test for expecting convenient BGA package
Seat.
Background technique
Semiconductor element is processed to semiconductor chip packaging, such as BGA package by a series of encapsulation engineerings, processes
At semiconductor chip packaging, providing to passing through electric checking engineering before user;In above-mentioned electric checking engineering, utilize
The electrical characteristic of test jack inspection semiconductor chip packaging.Herein, test jack is directly returning each semiconductor element
The device on test equipment is electrically connected in road.
When test, operator is placed on BGA package in detection slot, side wall is then carried out, finally out of detection slot
BGA package is taken out, since the gap size between encapsulation and the side wall of detection slot is limited, so operator picks and places BGA package
It is not very convenient, the efficiency of test is affected in this way.
Summary of the invention
The purpose of the present invention is existing equipment operators to pick and place the technical problem of BGA package inconvenience, provides one kind and takes
The test bench of the convenient BGA package of blowing.
The technical scheme to solve the above technical problems is that a kind of pick and place the test bench for expecting convenient BGA package,
Support base and test including rectangular-shape take discharging device;The upper surface center of support base forms the upper limit of rectangle channel-shaped
Slot, lower end surface center form the lower limit slot of rectangle channel-shaped;The left and right sidewall upper end of upper limit position groove has been separately formed swing and has kept away
Allow slot;It includes probe supporting plate, a pair of of side support plate and a pair of of swing cover board that test, which takes discharging device,;Probe supporting plate elasticity liter
Drop is arranged in lower limit slot;The upper surface of probe supporting plate forms several probes;Probe passes vertically through the upper limit from bottom to top
The lower wall of position slot;When probe supporting plate is in the top, the upper end of probe is more than the lower wall of upper limit position groove;It is a pair of collateral
Fagging synchronization lifting is arranged in upper limit position groove;The close one end in the upper surface of a pair of of side support plate has been separately formed limit placement
Slot;When a pair of of side support plate is in the top, the lower wall for limiting resettlement groove is located at the top of support base;A pair of of side support plate
The separate one end in upper surface be separately formed symmetrically arranged swinging support plate before and after a pair;It is formed between swinging support plate
The columned pendulum guide rod of front-rear direction setting;The lower end for swinging cover board forms oscillation center bar;The pivot joint of oscillation center bar
In the front-rear side walls lower end of the swing escape groove of corresponding side;Swing cover sheet metal forming has front and back to lead through the sliding for long hole shape of setting
Slot;Pendulum guide rod front-rear direction is passed through to slide guide groove and slide setting and slided in guide groove;When a pair of of side support plate is in most
When lower end, a pair swings cover board and is in horizontality;When a pair of of side support plate is in the top, a pair swings cover board and is located at one
To the two sides of the separate side wall of limit resettlement groove.
As a preferred embodiment of the above technical solution, a pair of of pendulum guide rod is in the top of the left and right sides of a pair of of side support plate;
When a pair of of side support plate is in bottom, the lower end surface that a pair swings cover board abuts against the upper surface of a pair of of side support plate.
As a preferred embodiment of the above technical solution, it is uniform to be respectively fixed with several front and backs for the lower wall left and right ends of upper limit position groove
Fixed lifting cylinder;A pair of of side support plate is separately fixed at the upper end of the piston rod of the lifting cylinder of corresponding side.
As a preferred embodiment of the above technical solution, lifting cylinder is at least one.
As a preferred embodiment of the above technical solution, lower capping plate is fixed with by a pair of screws on the lower end surface of support base;It visits
Several equally distributed pressure springs are fixed on the lower end surface of needle support plate;The lower end of pressure spring abuts against the upper surface of lower capping plate.
As a preferred embodiment of the above technical solution, a pair of screws countersunk head is arranged.
As a preferred embodiment of the above technical solution, the left and right sidewall lower end of lower limit slot has been separately formed lifting guide groove;Lifting
Several lifting guide pillars being vertically arranged are separately formed on the upper side wall of guide groove;The left and right end face lower part of probe supporting plate respectively at
Type has lifting guide block;Lifting guide block is set in vertically on the lifting guide pillar of corresponding side.
The beneficial effects of the present invention are: operator picks and places BGA package conveniently, high production efficiency, stable testing.
Detailed description of the invention
The structural schematic diagram of section when Fig. 1 is pick-and-place BGA package of the invention;
The structural schematic diagram of section when Fig. 2 is working condition of the invention.
In figure, 10, support base;100, upper limit position groove;101, escape groove is swung;102, lower limit slot;103, guide groove is gone up and down;
104, lifting guide pillar;11, lower capping plate;20, test takes discharging device;21, lifting cylinder;22, side support plate;220, limit peace
Set slot;221, swinging support plate;222, pendulum guide rod;23, cover board is swung;231, oscillation center bar;24, probe supporting plate;
241, guide block is gone up and down;25, probe;26, pressure spring.
Specific embodiment
As shown in Figure 1 and Figure 2, a kind of to pick and place the test bench for expecting convenient BGA package, the support base 10 including rectangular-shape
Discharging device 20 is taken with test;The upper surface center of support base 10 forms the upper limit position groove 100 of rectangle channel-shaped, lower end surface center
Form the lower limit slot 102 of rectangle channel-shaped;The left and right sidewall upper end of upper limit position groove 100, which has been separately formed, swings escape groove 101;
It includes probe supporting plate 24, a pair of of side support plate 22 and a pair of of swing cover board 23 that test, which takes discharging device 20,;Probe supporting plate 24
Elastic lifting is arranged in lower limit slot 102;The upper surface of probe supporting plate 24 forms several probes 25;Probe 25 from lower and
On pass vertically through the lower wall of upper limit position groove 100;When probe supporting plate 24 is in the top, the upper end of probe 25 is more than the upper limit
The lower wall of position slot 100;A pair of of 22 synchronization lifting of side support plate is arranged in upper limit position groove 100;A pair of of side support plate 22 it is upper
The close one end in end face has been separately formed limit resettlement groove 220;When a pair of of side support plate 22 is in the top, resettlement groove is limited
220 lower wall is located at the top of support base 10;One end that the upper surface of a pair of of side support plate 22 is separate has been separately formed a pair
The symmetrically arranged swinging support plate 221 in front and back;The columned swing of front-rear direction setting is formed between swinging support plate 221
Guide rod 222;The lower end for swinging cover board 23 forms oscillation center bar 231;The swing that oscillation center bar 231 is articulated in corresponding side is kept away
Allow the front-rear side walls lower end of slot 101;It swings and slides guide groove 230 through the long hole shape of setting before and after cover board 23 forms;It swings
222 front-rear direction of guide rod is passed through to slide guide groove 230 and slide setting and slided in guide groove 230;At a pair of of side support plate 22
When bottom, a pair swings cover board 23 and is in horizontality;When a pair of of side support plate 22 is in the top, a pair of of swing cover
Plate 23 is located at the two sides of the separate side wall of a pair of of limit resettlement groove 220.
As a preferred embodiment of the above technical solution, a pair of of pendulum guide rod 222 is in the left and right sides of a pair of of side support plate 22
Top;When a pair of of side support plate 22 is in bottom, the lower end surface that a pair swings cover board 23 abuts against a pair of of side support plate 22
Upper surface.
As a preferred embodiment of the above technical solution, the lower wall left and right ends of upper limit position groove 100 are respectively fixed with several front and backs
Uniformly fixed lifting cylinder 21;A pair of of side support plate 22 is separately fixed at the upper of the piston rod of the lifting cylinder 21 of corresponding side
End.
As a preferred embodiment of the above technical solution, lifting cylinder 21 is at least one.
As a preferred embodiment of the above technical solution, lower capping plate is fixed with by a pair of screws on the lower end surface of support base 10
11;Several equally distributed pressure springs 26 are fixed on the lower end surface of probe supporting plate 24;The lower end of pressure spring 26 abuts against lower capping
The upper surface of plate 11.
As a preferred embodiment of the above technical solution, a pair of screws countersunk head is arranged.
As a preferred embodiment of the above technical solution, the left and right sidewall lower end of lower limit slot 102 has been separately formed lifting guide groove
103;It goes up and down and is separately formed several lifting guide pillars 104 being vertically arranged on the upper side wall of guide groove 103;A left side for probe supporting plate 24
Right side lower part has been separately formed lifting guide block 241;Lifting guide block 241 is set in vertically on the lifting guide pillar 104 of corresponding side.
Pick and place the working principle for expecting the test bench of convenient BGA package:
Original state is as shown in Figure 2: a pair of of side support plate 22 is in bottom, and a pair swings cover board 23 and is in horizontal
State;
When work, a pair of of side support plate 22 is synchronous to be risen, and during this, a pair swings cover board 23 and becomes to incline from horizontality
Ramp-like state, when a pair of of side support plate 22 is in the top, a pair swings cover board 23 and is located at the separate of a pair of of limit resettlement groove 220
Side wall two sides, then the spherical pin of BGA package is placed on downward in a pair of of limit resettlement groove 220, then a pair of collateral
The synchronous decline of fagging 22, during this, a pair swings cover board 23 and becomes horizontality from heeling condition, and the upper end of probe 25 is first
It is contradicted with the spherical pin of BGA package, but the swing cover board 23 of a pair of angled state limits BGA package and moves up disengaging at this time
A pair of limit resettlement groove 220, under the action of pressure spring 26, the upper end of probe 25 is always maintained at and the spherical pin of BGA package
Conflict state, when a pair of of side support plate 22 is in bottom, a pair swings cover board 23 and is in horizontality and abuts against BGA
The upper surface of encapsulation can be tested in this way,
This process, operator pick and place BGA package conveniently, high production efficiency, stable testing.
The above content is only better embodiment of the invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to this hair
Bright limitation.