CN110907665B - Lean against controllable integrated circuit package test seat of degree - Google Patents
Lean against controllable integrated circuit package test seat of degree Download PDFInfo
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- CN110907665B CN110907665B CN201911162405.4A CN201911162405A CN110907665B CN 110907665 B CN110907665 B CN 110907665B CN 201911162405 A CN201911162405 A CN 201911162405A CN 110907665 B CN110907665 B CN 110907665B
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- plate
- groove
- side wall
- lifting
- limiting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Abstract
The invention discloses an integrated circuit packaging test seat with controllable abutting degree.A swing groove is respectively formed at the left end and the right end of the lower side wall of an upper limiting groove; the probe supporting plate is arranged in the lower limiting groove in a lifting manner; a plurality of probes which are uniformly distributed are formed on the upper end surface of the probe supporting plate; the probe vertically penetrates through the lower side wall of the upper limiting groove; the encapsulation limiting plate is vertically sleeved on the four lifting guide pillars; the encapsulation limiting plate is arranged in the upper limiting groove in a lifting manner, and a plurality of suction nozzles which are uniformly distributed are arranged on the lower end face of the encapsulation limiting plate; the lower part of the lifting guide post is sleeved with a pressure spring; the left end surface and the right end surface of the packaging limit plate are respectively hinged with an upper hinged plate; the lower end of the upper hinged plate is hinged with a lower hinged plate; the lower ends of the pair of lower hinged plates are hinged between the front side wall and the rear side wall of the swing groove on the corresponding side; the lower side wall of the upper limiting groove is in threaded connection with a limiting screw rod.
Description
Technical Field
The invention relates to the field of integrated circuit packaging test, in particular to an integrated circuit packaging test seat with controllable abutting degree.
Background
The semiconductor element is processed into a semiconductor chip package, such as a BGA package, through a series of packaging processes, and the processed semiconductor chip package is subjected to an electrical inspection process before being provided to a customer; in the electrical inspection process, the electrical characteristics of the semiconductor chip package are inspected using the test socket. Here, the test socket is a device that electrically connects the direct loop of each semiconductor element to the test instrument.
The pressurized package test socket in the prior art is composed of an upper cover, a side support, a lower chassis, a fixing screw, a fixing disc, a pressurizing disc and a socket pin (i.e. a probe). In practice, first, the fixing plate with the socket pins (i.e., the probes) is connected to the lower chassis via fixing screws. Side supports that secure the package from the sides are also connected to the lower chassis. The package is placed over the lower tray through between the side supports.
In practical engineering, the pressure type package test socket with the structure applies pressure to the pressure plate in order to make the package contact with the socket needle (namely the probe); since this process is a manual operation, a certain amount of pressure cannot be applied to the pressurizing plate, and an excessive pressure is often applied to more firmly contact the package and the socket pin (i.e., the probe), which may cause a problem of relatively large abrasion of the socket pin (i.e., the probe).
Disclosure of Invention
The invention aims to solve the technical problem of large probe abrasion caused by overlarge force application in the operation of the existing equipment, and provides an integrated circuit packaging test seat with controllable abutting degree.
The technical scheme for solving the technical problems is as follows: an integrated circuit packaging test seat with controllable abutting degree comprises a rectangular support seat and a limiting test device; the center of the upper end surface of the supporting seat is formed with a rectangular groove-shaped upper limiting groove, and the center of the lower end surface of the supporting seat is formed with a rectangular groove-shaped lower limiting groove; the upper limiting groove is arranged in a left-right penetrating manner; swing grooves are respectively formed at the left end and the right end of the lower side wall of the upper limiting groove; the limiting test device comprises a probe supporting plate and a packaging limiting plate; the probe supporting plate is arranged in the lower limiting groove in a lifting manner; a plurality of probes which are uniformly distributed are formed on the upper end surface of the probe supporting plate; the probe vertically penetrates through the lower side wall of the upper limiting groove, and the upper end of the probe exceeds the lower side wall of the upper limiting groove; four lifting guide columns which are vertically upward are formed on the upper side wall and the lower side wall of the upper limiting groove; the encapsulation limiting plate is vertically sleeved on the four lifting guide pillars; the encapsulation limiting plate is arranged in the upper limiting groove in a lifting manner, and a plurality of suction nozzles which are uniformly distributed are arranged on the lower end face of the encapsulation limiting plate; the lower part of the lifting guide post is sleeved with a pressure spring; the upper end of the pressure spring is fixed on the upper end face of the lower end face of the packaging limit plate, and the lower end of the pressure spring is fixed on the lower side wall of the upper limit groove; the left end surface and the right end surface of the packaging limit plate are respectively hinged with an upper hinged plate; the lower end of the upper hinged plate is hinged with a lower hinged plate; the lower ends of the pair of lower hinged plates are hinged between the front side wall and the rear side wall of the swing groove on the corresponding side; the pair of lower hinged plates are arranged in bilateral symmetry; a limit screw is screwed on the lower side wall of the upper limit groove; the pair of limiting screws are positioned on two sides of the pair of lower hinged plates and are arranged symmetrically left and right; when the encapsulation limiting plate is located at the uppermost end, the encapsulation limiting plate is located above the supporting seat.
Preferably, a U-shaped encapsulation limiting frame with a forward opening is formed on the lower end face of the encapsulation limiting plate; when the packaging limit plate is positioned at the uppermost end, the packaging limit frame is positioned above the supporting seat; the four lifting guide columns are respectively positioned at the left side and the right side of the packaging limit frame.
Preferably, the distance between the hinge points at the two ends of the lower hinge plate is the same as the distance between the hinge points at the two ends of the upper hinge plate.
Preferably, the side walls of the pair of swing grooves adjacent to each other are inclined from the inside to the outside from the bottom to the top; when the packaging limit plate is positioned at the uppermost end; the lower hinge plate is obliquely arranged and abuts against the inclined side wall of the corresponding side of the swinging groove.
Preferably, the left end face and the right end face of the supporting seat are formed with lifting driving grooves; a regular hexagon lifting driving block is formed at the lower end of the limiting screw rod; the lifting driving block is positioned in the lifting driving groove on the corresponding side; the upper end of the limit screw is formed with a hemispherical limit supporting block.
Preferably, a lower sealing cover plate is fixed on the lower end surface of the supporting seat through a pair of screws; a rectangular groove-shaped lower lifting groove is formed in the center of the upper end face of the lower sealing cover plate; a lower lifting threaded rod is pivoted on the lower side wall of the lower lifting groove; the lower end of the lower lifting threaded rod exceeds the lower end surface of the supporting seat and is formed with a lower driving block; the lower end surface of the probe supporting plate is formed with a U-shaped lower lifting driving frame matched with the lower lifting groove; the horizontal part of the lower lifting driving frame is in threaded connection with the lower lifting threaded rod.
Preferably, the lower lifting guide columns are formed at the left end and the right end of the upper side wall of the lower limiting groove; the probe supporting plate is vertically sleeved on the lower lifting guide pillar.
Preferably, the lower driving block has a regular hexagon shape.
The invention has the beneficial effects that: by controlling the relative position between the spherical pins of the BGA package and the probes, the pressure is prevented from being overlarge, and the abrasion of the probes is reduced.
Drawings
FIG. 1 is a schematic structural view of a cross section of the present invention;
fig. 2 is a schematic structural view of a cross section of the present invention in operation.
In the figure, 10, a support seat; 100. an upper limiting groove; 101. a swing groove; 102. a lifting driving groove; 103. a lower limiting groove; 104. a lower lifting guide post; 11. a lower sealing cover plate; 110. a lower lifting groove; 12. a lifting guide post; 20. a limit testing device; 21. a probe support plate; 211. a lower lifting driving frame; 22. a lower lifting threaded rod; 221. a lower drive block; 23. a probe; 24. encapsulating the limiting plate; 241. packaging the limiting frame; 25. a suction nozzle; 26. a pressure spring; 27. an upper hinge plate; 28. a lower hinge plate; 29. a limit screw; 291. and limiting support blocks.
Detailed Description
As shown in fig. 1 and fig. 2, an ic package testing socket with controllable abutting degree comprises a rectangular supporting seat 10 and a limit testing device 20; an upper limiting groove 100 in a rectangular groove shape is formed in the center of the upper end face of the supporting seat 10, and a lower limiting groove 103 in a rectangular groove shape is formed in the center of the lower end face; the upper limiting groove 100 penetrates left and right; swing grooves 101 are respectively formed at the left end and the right end of the lower side wall of the upper limiting groove 100; the limit testing device 20 comprises a probe supporting plate 21 and a packaging limit plate 24; the probe supporting plate 21 is arranged in the lower limit groove 103 in a lifting manner; a plurality of probes 23 which are uniformly distributed are formed on the upper end surface of the probe supporting plate 21; the probe 23 vertically passes through the lower side wall of the upper limiting groove 100 and the upper end exceeds the lower side wall of the upper limiting groove 100; four vertically upward lifting guide columns 12 are formed on the upper and lower side walls of the upper limiting groove 100; the encapsulation limit plate 24 is vertically sleeved on the four lifting guide pillars 12; the encapsulation limit plate 24 is arranged in the upper limit groove 100 in a lifting manner, and a plurality of suction nozzles 25 which are uniformly distributed are arranged on the lower end face of the encapsulation limit plate 24; the lower part of the lifting guide post 12 is sleeved with a pressure spring 26; the upper end of the compression spring 26 is fixed on the lower end face of the encapsulation limit plate 24, and the lower end is fixed on the lower side wall of the upper limit groove 100; the left and right end surfaces of the packaging limit plate 24 are respectively hinged with an upper hinged plate 27; the lower end of the upper hinge plate 27 is hinged with a lower hinge plate 28; the lower ends of the pair of lower hinge plates 28 are hinged between the front and rear side walls of the swing grooves 101 on the corresponding sides; the pair of lower hinge plates 28 are arranged bilaterally symmetrically; the lower side wall of the upper limiting groove 100 is screwed with a limiting screw 29; a pair of limit screws 29 are positioned on both sides of the pair of lower hinge plates 28 and are arranged in bilateral symmetry; when the packing retainer plate 24 is at the uppermost end, the packing retainer plate 24 is located above the support stand 10.
As shown in fig. 1 and 2, a u-shaped encapsulation limiting frame 241 with a forward opening is formed on the lower end surface of the encapsulation limiting plate 24; when the encapsulation limiting plate 24 is at the uppermost end, the encapsulation limiting frame 241 is located above the supporting seat 10; the four lifting guide pillars 12 are respectively located at the left and right sides of the packaging limit frame 241.
As shown in FIGS. 1 and 2, the distance between the hinge points at the two ends of the lower hinge plate 28 is the same as the distance between the hinge points at the two ends of the upper hinge plate 27.
As shown in fig. 1 and 2, the side walls of the pair of swing grooves 101 adjacent to each other are inclined from the inside to the outside from the bottom to the top; when the encapsulating limit plate 24 is positioned at the uppermost end; the lower hinge plate 28 is disposed obliquely and abuts against the inclined side wall of the corresponding side of the swing groove 101.
As shown in fig. 1 and 2, the left and right end faces of the support base 10 are formed with lifting driving grooves 102; a regular hexagonal lifting driving block is formed at the lower end of the limiting screw 29; the lifting driving block is positioned in the lifting driving groove 102 on the corresponding side; a hemispherical limit support block 291 is formed at the upper end of the limit screw 29.
As shown in fig. 1 and 2, a lower cover plate 11 is fixed to the lower end surface of the support base 10 by a pair of screws; a rectangular groove-shaped lower lifting groove 110 is formed in the center of the upper end face of the lower sealing cover plate 11; a lower lifting threaded rod 22 is pivoted on the lower side wall of the lower lifting groove 110; the lower end of the lower lifting threaded rod 22 exceeds the lower end surface of the supporting seat 10 and is formed with a lower driving block 221; a U-shaped lower lifting driving frame 211 matched with the lower lifting groove 110 is formed on the lower end surface of the probe supporting plate 21; the horizontal part of the lower elevation driving bracket 211 is screwed to the lower elevation screw rod 22.
As shown in fig. 1 and 2, lower lifting guide posts 104 are formed at the left and right ends of the upper side wall of the lower limiting groove 103; the probe supporting plate 21 is vertically sleeved on the lower lifting guide post 104.
As shown in fig. 1 and 2, the lower driving block 221 has a regular hexagonal shape.
The working principle of the integrated circuit packaging test seat with controllable abutting degree is as follows:
initial state: the encapsulation limit plate 24 is positioned above the supporting seat 10; the packaging limit frame 241 is positioned above the supporting seat 10; a pair of lower hinge plates 28 are obliquely arranged, and the upper ends are far away from each other and the lower ends are close to each other;
during testing, according to the thickness of the package, the height of the pair of limiting screws 29 is synchronously adjusted, then the package is inserted into the package limiting frame 241 from front to back with the spherical pins facing downwards until the rear end of the package abuts against the transverse part of the rear side of the package limiting frame 241, then the suction nozzle 25 generates suction force, the package is limited in the package limiting frame 241, then the package limiting plate 24 is manually pressed downwards until the pair of lower hinged plates 28 abut against the upper ends of the limiting screws 29 on the corresponding sides of the column respectively, at this time, the packaged spherical pins are just contacted with the probes 23, so that the pressure transmitted to the probes 23 by the packaged spherical pins cannot be too large, and the abrasion of the probes 23 is reduced.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description herein, since various changes and modifications can be made in the details of the embodiment and the application range according to the spirit of the present invention.
Claims (8)
1. An integrated circuit package test socket with controllable abutting degree, characterized in that: comprises a rectangular supporting seat (10) and a limit testing device (20); an upper limiting groove (100) in a rectangular groove shape is formed in the center of the upper end face of the supporting seat (10), and a lower limiting groove (103) in a rectangular groove shape is formed in the center of the lower end face; the upper limiting groove (100) penetrates left and right; swing grooves (101) are respectively formed at the left end and the right end of the lower side wall of the upper limiting groove (100); the limiting test device (20) comprises a probe supporting plate (21) and a packaging limiting plate (24); the probe supporting plate (21) is arranged in the lower limiting groove (103) in a lifting manner; a plurality of probes (23) which are uniformly distributed are formed on the upper end surface of the probe supporting plate (21); the probe (23) vertically penetrates through the lower side wall of the upper limiting groove (100) and the upper end of the probe exceeds the lower side wall of the upper limiting groove (100); four lifting guide columns (12) which are vertically upward are formed on the upper side wall and the lower side wall of the upper limiting groove (100); the encapsulation limit plate (24) is vertically sleeved on the four lifting guide pillars (12); the encapsulation limiting plate (24) is arranged in the upper limiting groove (100) in a lifting mode, and a plurality of suction nozzles (25) which are uniformly distributed are arranged on the lower end face of the encapsulation limiting plate (24); the lower part of the lifting guide post (12) is sleeved with a pressure spring (26); the upper end of a compression spring (26) is fixed on the lower end face of the packaging limit plate (24), and the lower end of the compression spring is fixed on the lower side wall of the upper limit groove (100); the left end surface and the right end surface of the packaging limit plate (24) are respectively hinged with an upper hinged plate (27); the lower end of the upper hinge plate (27) is hinged with a lower hinge plate (28); the lower ends of a pair of lower hinge plates (28) are hinged between the front side wall and the rear side wall of the swing groove (101) on the corresponding side; the pair of lower hinge plates (28) are arranged in bilateral symmetry; a limit screw (29) is screwed on the lower side wall of the upper limit groove (100); the pair of limiting screws (29) are positioned on two sides of the pair of lower hinged plates (28) and are arranged symmetrically left and right; when the packing limit plate (24) is positioned at the uppermost end, the packing limit plate (24) is positioned above the supporting seat (10).
2. The ic package testing socket according to claim 1, wherein the abutting degree is controllable by: the lower end surface of the encapsulation limit plate (24) is formed with a U-shaped encapsulation limit frame (241) with a forward opening; when the packaging limit plate (24) is positioned at the uppermost end, the packaging limit frame (241) is positioned above the supporting seat (10); the four lifting guide columns (12) are respectively positioned at the left side and the right side of the packaging limit frame (241).
3. The ic package testing socket according to claim 1, wherein the abutting degree is controllable by: the distance between the hinge points at the two ends of the lower hinge plate (28) is the same as the distance between the hinge points at the two ends of the upper hinge plate (27).
4. The ic package testing socket according to claim 1, wherein the abutting degree is controllable by: the side walls close to the pair of swing grooves (101) are obliquely arranged from inside to outside from bottom to top; when the packaging limit plate (24) is positioned at the uppermost end; the lower hinge plate (28) is disposed obliquely and abuts against the inclined side wall of the corresponding side of the swing groove (101).
5. The ic package testing socket according to claim 1, wherein the abutting degree is controllable by: lifting driving grooves (102) are formed in the left end face and the right end face of the supporting seat (10); a regular hexagon lifting driving block is formed at the lower end of the limiting screw rod (29); the lifting driving block is positioned in the lifting driving groove (102) on the corresponding side; the upper end of the limit screw (29) is formed with a hemispherical limit supporting block (291).
6. The ic package testing socket according to claim 1, wherein the abutting degree is controllable by: a lower sealing cover plate (11) is fixed on the lower end surface of the supporting seat (10) through a pair of screws; a rectangular groove-shaped lower lifting groove (110) is formed in the center of the upper end face of the lower sealing cover plate (11); a lower lifting threaded rod (22) is pivoted on the lower side wall of the lower lifting groove (110); the lower end of the lower lifting threaded rod (22) exceeds the lower end surface of the support seat (10) and is formed with a lower driving block (221); a U-shaped lower lifting driving frame (211) matched with the lower lifting groove (110) is formed on the lower end surface of the probe supporting plate (21); the horizontal part of the lower lifting driving frame (211) is screwed on the lower lifting threaded rod (22).
7. The IC package testing socket with controllable abutting degree according to claim 1 or 6, wherein: lower lifting guide columns (104) are formed at the left and right ends of the upper side wall of the lower limiting groove (103); the probe supporting plate (21) is vertically sleeved on the lower lifting guide post (104).
8. The IC package testing socket according to claim 6, wherein: the lower driving block (221) is in a regular hexagon shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911162405.4A CN110907665B (en) | 2019-11-25 | 2019-11-25 | Lean against controllable integrated circuit package test seat of degree |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911162405.4A CN110907665B (en) | 2019-11-25 | 2019-11-25 | Lean against controllable integrated circuit package test seat of degree |
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| Publication Number | Publication Date |
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| CN110907665A CN110907665A (en) | 2020-03-24 |
| CN110907665B true CN110907665B (en) | 2021-10-22 |
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| CN201911162405.4A Active CN110907665B (en) | 2019-11-25 | 2019-11-25 | Lean against controllable integrated circuit package test seat of degree |
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| US5604443A (en) * | 1994-05-23 | 1997-02-18 | Tokyo Electron Limited | Probe test apparatus |
| JPH1114956A (en) * | 1997-06-23 | 1999-01-22 | Micronics Japan Co Ltd | Inspection stage for liquid crystal panel |
| WO2003089941A2 (en) * | 2002-04-16 | 2003-10-30 | Teradyne, Inc. | Semiconductor test system with easily changed interface unit |
| CN203602733U (en) * | 2013-09-06 | 2014-05-21 | 郑州发祥铝业有限公司 | Current distribution measuring tool of aluminium electrolysis cell |
| CN207067191U (en) * | 2017-08-14 | 2018-03-02 | 中国南方电网有限责任公司超高压输电公司天生桥局 | Rotatable Labor-saving isolator detecting support bar |
| CN109103757A (en) * | 2018-08-27 | 2018-12-28 | 温岭市玖鑫物联科技有限公司 | A kind of spark plug ambrose alloy electrode manufacturing method |
| CN208833801U (en) * | 2018-07-27 | 2019-05-07 | 深圳市仕科达精密设备技术有限公司 | Automatic die-locking device, pcb board test mould group and pcb board test equipment |
| CN110045160A (en) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | A kind of test bench that the top of BGA package picks and places |
| JP2019196937A (en) * | 2018-05-08 | 2019-11-14 | 山一電機株式会社 | Inspection socket |
-
2019
- 2019-11-25 CN CN201911162405.4A patent/CN110907665B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5604443A (en) * | 1994-05-23 | 1997-02-18 | Tokyo Electron Limited | Probe test apparatus |
| JPH1114956A (en) * | 1997-06-23 | 1999-01-22 | Micronics Japan Co Ltd | Inspection stage for liquid crystal panel |
| WO2003089941A2 (en) * | 2002-04-16 | 2003-10-30 | Teradyne, Inc. | Semiconductor test system with easily changed interface unit |
| CN203602733U (en) * | 2013-09-06 | 2014-05-21 | 郑州发祥铝业有限公司 | Current distribution measuring tool of aluminium electrolysis cell |
| CN207067191U (en) * | 2017-08-14 | 2018-03-02 | 中国南方电网有限责任公司超高压输电公司天生桥局 | Rotatable Labor-saving isolator detecting support bar |
| JP2019196937A (en) * | 2018-05-08 | 2019-11-14 | 山一電機株式会社 | Inspection socket |
| CN208833801U (en) * | 2018-07-27 | 2019-05-07 | 深圳市仕科达精密设备技术有限公司 | Automatic die-locking device, pcb board test mould group and pcb board test equipment |
| CN109103757A (en) * | 2018-08-27 | 2018-12-28 | 温岭市玖鑫物联科技有限公司 | A kind of spark plug ambrose alloy electrode manufacturing method |
| CN110045160A (en) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | A kind of test bench that the top of BGA package picks and places |
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