CN110901255B - Anti-counterfeit card with asymmetric structure and its manufacturing method - Google Patents
Anti-counterfeit card with asymmetric structure and its manufacturing method Download PDFInfo
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- CN110901255B CN110901255B CN201911326781.2A CN201911326781A CN110901255B CN 110901255 B CN110901255 B CN 110901255B CN 201911326781 A CN201911326781 A CN 201911326781A CN 110901255 B CN110901255 B CN 110901255B
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- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000010410 layer Substances 0.000 claims abstract description 212
- 239000002131 composite material Substances 0.000 claims abstract description 65
- 239000002344 surface layer Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000011241 protective layer Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000010329 laser etching Methods 0.000 claims abstract description 22
- 239000011247 coating layer Substances 0.000 claims abstract description 18
- 239000002086 nanomaterial Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000000576 coating method Methods 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 31
- 125000005587 carbonate group Chemical group 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 17
- 238000003848 UV Light-Curing Methods 0.000 claims description 6
- 238000001723 curing Methods 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 6
- 238000013007 heat curing Methods 0.000 claims description 2
- 238000004049 embossing Methods 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 description 11
- 238000007731 hot pressing Methods 0.000 description 6
- 238000001029 thermal curing Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000012792 core layer Substances 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/20—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof characterised by a particular use or purpose
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
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- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/328—Diffraction gratings; Holograms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
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- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
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- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/405—Marking
- B42D25/43—Marking by removal of material
- B42D25/435—Marking by removal of material using electromagnetic radiation, e.g. laser
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- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
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- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
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- B42D25/455—Associating two or more layers using heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
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- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
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- B42D25/46—Associating two or more layers using pressure
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Abstract
本发明提供一种非对称结构的防伪证卡，其可以在确保实现防伪证卡表面的整版的全息防伪图像的基础上，降低单面防伪证卡的成本。其包括：基层、激光刻蚀层；在两个激光刻蚀层远离基层的一侧分别设置第一复合表层、第二复合表层；第一复合表层包括承载基材层、设置结构支撑层；在结构支撑层上压印形成的全息微纳结构，在全息微纳结构所在结构面上覆盖透明且折射率＞1.8的氧化物膜构成的介质镀膜层，最后设置保护层；保护层、结构支撑层材质相同，其材质的热膨胀系数与基层、激光刻蚀层、承载基材层的材质的热膨胀系数的差异值为[+30%,‑30%]；第二复合表层包括：承载基材层、基底层。同时本发明还公开了一种非对称结构的防伪证卡的制作方法。
The invention provides an anti-counterfeit card with an asymmetric structure, which can reduce the cost of a single-sided anti-counterfeit card on the basis of ensuring the full-page holographic anti-counterfeit image on the surface of the anti-counterfeit card. It includes: a base layer and a laser-etched layer; a first composite surface layer and a second composite surface layer are respectively arranged on the side of the two laser-etched layers away from the base layer; the first composite surface layer includes a bearing substrate layer and a structural support layer; The holographic micro-nano structure formed by embossing on the structural support layer is covered with a dielectric coating layer composed of a transparent oxide film with a refractive index > 1.8 on the structural surface where the holographic micro-nano structure is located, and finally a protective layer is provided; protective layer, structural support layer The material is the same, and the difference between the thermal expansion coefficient of the material and the thermal expansion coefficient of the base layer, laser etching layer, and bearing substrate layer is [+30%, -30%]; the second composite surface layer includes: bearing substrate layer, basal layer. Simultaneously, the invention also discloses a method for making an anti-counterfeit card with an asymmetric structure.
Description
技术领域technical field
本发明涉及防伪证卡制作技术领域，具体为一种非对称结构的防伪证卡与制作方法。The invention relates to the technical field of anti-counterfeit card production, in particular to an anti-counterfeit card with an asymmetric structure and a production method.
背景技术Background technique
当今社会中，以二代身份证为代表的各类卡式证件被大量应用于身份认证、快捷支付和门禁管理等领域。这些证卡因其功能所需，在证卡本身附加防伪图像、签注信息等功能，从而达到安全使用的目的。证卡制作过程中，会通过设置不同的结构层，在相应的结构层上通过嵌入全息微纳结构、激光刻蚀签注等方式实现对应的功能需求。不同的结构层会采用不同材质的薄膜，再通过胶粘、热压、冷压等工序制作成型。通常的结构层包括作为支撑的基层、实现防伪功能、签注功能的功能层、最外层的保护层。In today's society, various card-type documents represented by second-generation ID cards are widely used in fields such as identity authentication, fast payment, and access control management. Due to their functional requirements, these cards are added with functions such as anti-counterfeiting images and endorsement information on the card itself, so as to achieve the purpose of safe use. In the card production process, different structural layers will be set, and the corresponding functional requirements will be realized by embedding holographic micro-nano structures and laser etching endorsements on the corresponding structural layers. Films of different materials are used for different structural layers, and then formed by gluing, hot pressing, cold pressing and other processes. The usual structural layer includes a base layer as a support, a functional layer for realizing anti-counterfeiting functions and endorsement functions, and an outermost protective layer.
现有技术中，通过光栅结构、3D彩色透镜技术等微纳技术在防伪证卡的表面上实现不同的防伪图像，为了增加防伪图像的图像亮度，使用户更容易通过肉眼分别证卡的真伪，大部分技术人员使用硫化锌作为全息防伪结构的介质镀膜层；然而硫化锌无法与相邻结构层进行分子级别的融合，为了确保证卡的层间结合力，只能采用胶粘的方式把介质镀膜层和其相邻的结构层结合，所以，现有技术中的大部分的全息防伪图像是无法全面覆盖证卡的正面、反面的全面积。In the prior art, different anti-counterfeit images are realized on the surface of the anti-counterfeit card through micro-nano technologies such as grating structure and 3D color lens technology. , most technicians use zinc sulfide as the dielectric coating layer of the holographic anti-counterfeiting structure; however, zinc sulfide cannot be fused with the adjacent structural layer at the molecular level. In order to ensure the interlayer bonding force of the card, it can only be glued The dielectric coating layer is combined with its adjacent structural layer, so most of the holographic anti-counterfeiting images in the prior art cannot fully cover the entire area of the front and back of the card.
为了使防伪图像尺寸不受限，有技术人员改进了介质镀膜层，可以实现证卡表面的整版防伪图像。但是在制作证卡的时候，因为要经过热压、冷压的工序，不同材质的薄膜因为基材热膨胀系数的差异性，会在层压的冷却后，在证卡内部会产生一定的内应力；特别是改进后的全面积的介质镀膜层，会在功能层上引起较大的内应力的变化，所以为了防止证卡发生翘曲，通常在基层两侧设置的结构层是对称设置的。In order to make the size of the anti-counterfeit image unlimited, some technicians have improved the dielectric coating layer, which can realize the full-page anti-counterfeit image on the surface of the card. However, when making cards, due to the process of hot pressing and cold pressing, the films of different materials will have a certain internal stress inside the card after cooling due to the difference in the thermal expansion coefficient of the base material. ; Especially the improved full-area dielectric coating layer will cause a large change in internal stress on the functional layer, so in order to prevent the card from warping, the structural layers usually set on both sides of the base layer are symmetrically set.
但是，在实际应用中，由于成本、防伪等工艺要求，有一些证卡只需要实现单面防伪图像的功能，使用现有的技术，只能在基层的两侧对称的设置结构层来实现单侧防伪的功能，这样证卡的成本就会非常高。However, in practical applications, due to cost, anti-counterfeiting and other technological requirements, some cards only need to realize the function of anti-counterfeiting images on one side. Side anti-counterfeiting function, so the cost of the card will be very high.
发明内容Contents of the invention
为了解决现有技术中无法同时兼顾实现整版全息防伪图像、降低单侧证卡的成本的问题，本发明提供一种非对称结构的防伪证卡，其可以在确保实现防伪证卡表面的整版的全息防伪图像的基础上，降低单面防伪证卡的成本。同时本发明还公开了一种非对称结构的防伪证卡的制作方法。In order to solve the problem in the prior art that the full-page holographic anti-counterfeit image cannot be simultaneously realized and the cost of one-sided card is reduced, the present invention provides an anti-counterfeit card with an asymmetric structure, which can realize the full-page anti-counterfeit card surface. Based on the holographic anti-counterfeiting image of the version, the cost of single-sided anti-counterfeiting cards is reduced. Simultaneously, the invention also discloses a method for making an anti-counterfeit card with an asymmetric structure.
本发明的技术方案是这样的：一种非对称结构的防伪证卡，其包括：作为主要支撑结构的基层，所述基层两侧分别对称的设置一个与所述基层材质相同的激光刻蚀层，其特征在于：所述基层的材质为聚碳酸酯或PETG；在两个所述激光刻蚀层远离所述基层的一侧分别设置第一复合表层、第二复合表层；The technical solution of the present invention is as follows: an anti-counterfeit card with an asymmetric structure, which includes: a base layer as the main support structure, and a laser etching layer with the same material as the base layer is symmetrically arranged on both sides of the base layer , characterized in that: the material of the base layer is polycarbonate or PETG; the first composite surface layer and the second composite surface layer are respectively arranged on the sides of the two laser etching layers away from the base layer;
所述第一复合表层、第二复合表层中，与所述激光刻蚀层临近的一侧分别设置与所述激光刻蚀层同材质的承载基材层；In the first composite surface layer and the second composite surface layer, the side adjacent to the laser-etched layer is respectively provided with a bearing substrate layer of the same material as the laser-etched layer;
所述第一复合表层中，在所述承载基材层的远离所述基层的一侧，设置结构支撑层；在所述结构支撑层上压印形成的全息微纳结构，在所述全息微纳结构所在结构面上覆盖透明且折射率＞1.8的氧化物膜构成的介质镀膜层，最后设置保护层；In the first composite surface layer, a structural support layer is provided on the side of the bearing base material layer away from the base layer; the holographic micro-nano structure formed by embossing on the structural support layer is formed on the holographic micro-nano structure. The structural surface where the nanostructure is located is covered with a dielectric coating layer composed of a transparent oxide film with a refractive index > 1.8, and finally a protective layer is provided;
所述第二复合表层包括：所述承载基材层、所述承载基材层远离所述基层的一侧设置基底层；The second composite surface layer includes: the bearing base material layer, a base layer is provided on the side of the bearing base material layer away from the base layer;
所述保护层、所述结构支撑层材质相同，采用含有碳酸酯链节的高分子化合物涂料，其材质的热膨胀系数与所述基层、所述激光刻蚀层、所述承载基材层的材质的热膨胀系数的差异值为[+30%,-30%]。The protective layer and the structural support layer are made of the same material, and a polymer compound coating containing carbonate chain links is used. The thermal expansion coefficient of the material is the same as that of the base layer, the laser etching layer, and the bearing substrate layer. The difference in the coefficient of thermal expansion is [+30%, -30%].
其进一步特征在于：It is further characterized by:
所述基底层包括：设置于所述承载基材层远离所述基层一侧的所述结构支撑层；The base layer includes: the structural support layer disposed on the side of the bearing substrate layer away from the base layer;
所述基底层包括：通过含有碳酸酯链节的高分子化合物涂料固化后形成的所述保护层；The base layer includes: the protective layer formed after the polymer compound coating containing carbonate chains is cured;
所述基底层包括：设置于所述承载基材层远离所述基层一侧的所述结构支撑层、设置在最外层的所述保护层；The base layer includes: the structural support layer arranged on the side of the bearing substrate layer away from the base layer, and the protective layer arranged on the outermost layer;
所述含有碳酸酯链节的高分子化合物涂料为UV光固化/热固化涂料；The polymer compound coating containing carbonate chain link is UV photocuring/thermal curing coating;
所述承载基材层的厚度为50µm ~200µm，所述结构支撑层的厚度为0.5 µm ~20µm；所述保护层的厚度为0.5µm ~20µm；所述介质镀膜层的厚度为30 nm ~400nm。The thickness of the bearing substrate layer is 50µm-200µm, the thickness of the structural support layer is 0.5µm-20µm; the thickness of the protective layer is 0.5µm-20µm; the thickness of the dielectric coating layer is 30nm-400nm .
一种非对称结构的防伪证卡的制作方法，其包括如下步骤：A method for making an anti-counterfeiting card with an asymmetric structure, comprising the following steps:
S1：首先准备基层；S1: Prepare the base layer first;
S2：制作第一复合表层；S2: making the first composite surface layer;
S3：制作第二复合表层；S3: making the second composite surface layer;
S4：把所述第一复合表层、第一激光刻蚀层、所述基层、第二激光刻蚀层、所述第二复合表层自上而下依次叠放后进行加热层压、然后再冷压以形成单侧有防伪标记的新式防伪证卡；S4: Laminate the first composite surface layer, the first laser-etched layer, the base layer, the second laser-etched layer, and the second composite surface layer sequentially from top to bottom, heat and laminate, and then cool Press to form a new anti-counterfeiting card with anti-counterfeiting marks on one side;
其特征在于：It is characterized by:
步骤S2中，制作所第一复合表层的步骤包括：In step S2, the step of making the first composite surface layer comprises:
S2-1：设置所述承载基材层；S2-1: setting the carrier substrate layer;
S2-2：在所述承载基材层远离所述基层一侧表面设置结构支撑层；S2-2: setting a structural support layer on the surface of the bearing base material layer away from the base layer;
S2-3：在所述结构支撑层远离所述基层一侧表面通过压印做出所述全息微纳结构；S2-3: making the holographic micro-nano structure by embossing on the surface of the structural support layer away from the base layer;
S2-4：在所述全息微纳结构所在的结构面上，全局的覆盖致密氧化物形成所述介质镀膜层；S2-4: On the structural surface where the holographic micro-nano structure is located, globally cover the dense oxide to form the dielectric coating layer;
S2-5：最后涂布含有碳酸酯链节的高分子化合物涂料固化形成所述保护层。S2-5: Finally, the polymer compound paint containing carbonate chains is coated and cured to form the protective layer.
其进一步特征在于：It is further characterized by:
步骤S3中，制作所述第二复合表层的步骤包括：In step S3, the step of making the second composite surface layer includes:
S3-1：设置所述承载基材层；S3-1: setting the carrier substrate layer;
S3-2：在所述承载基材层远离所述基层一侧表面设置结构支撑层；S3-2: setting a structural support layer on the surface of the bearing base material layer away from the base layer;
步骤S3中，制作所述第二复合表层的步骤包括：In step S3, the step of making the second composite surface layer includes:
S3-1：设置所述承载基材层；S3-1: setting the carrier substrate layer;
S3-2：在所述承载基材层远离所述基层一侧表面设置结构支撑层；S3-2: setting a structural support layer on the surface of the bearing base material layer away from the base layer;
S3-3：在所述结构支撑层之上，涂布含有碳酸酯链节的高分子化合物涂料固化形成所述保护层；S3-3: on the structural support layer, coating a polymer compound coating containing carbonate chain segments and curing to form the protective layer;
步骤S3中，制作所述第二复合表层的步骤包括：In step S3, the step of making the second composite surface layer includes:
S3-1：设置所述承载基材层；S3-1: setting the carrier substrate layer;
S3-2：在所述承载基材层远离所述基层一侧表面之上，涂布含有碳酸酯链节的高分子化合物涂料固化形成所述保护层。S3-2: On the surface of the bearing substrate layer away from the base layer, coating a polymer compound coating containing carbonate chain segments and curing to form the protective layer.
本发明提供的一种非对称结构的防伪证卡与制作方法，其通过在全息微纳结构上设置透明且折射率＞1.8的氧化物膜构成的介质镀膜层，通过一次成型的工序，实现证卡表面的整版防伪图像；因为介质镀膜层在热压过程中通过分子反应与其两侧的结构支撑层、保护层进行结合，产生的结合力非常大，所以可以支持整版的防伪图像，不会发生因介质镀膜层导致证卡的层间分离的问题发生；同时，介质镀膜层、材质为聚碳酸酯或PETG的承载基材、含有碳酸酯链节的高分子化合物涂料固化形成保护层和结构支撑层，三者的热膨胀系数非常接近：差异值范围为[+30%,-30%]，在制造环节中的热压、冷压过程中，产生的内应力非常接近，不会使整个卡发生翘曲；由这些结构层构成的第一复合表层、第二复合表层后，即便第一复合表层、第二复合表层的具体结构不同，经过热压、冷压的加工工序之后，也不会因为内应力的不同使卡片发生翘曲；即通过简化第二复合表层的结构达到降低防伪证卡成本的目的。The invention provides an anti-counterfeit card with an asymmetric structure and its production method, which is realized by setting a dielectric coating layer composed of a transparent oxide film with a refractive index > 1.8 on the holographic micro-nano structure, and through a one-time molding process. The full-page anti-counterfeiting image on the surface of the card; because the dielectric coating layer is combined with the structural support layer and protective layer on both sides through molecular reactions during the hot-pressing process, the resulting bonding force is very strong, so it can support the full-page anti-counterfeiting image. The problem of separation between layers of the card will occur due to the dielectric coating layer; at the same time, the dielectric coating layer, the carrier substrate made of polycarbonate or PETG, and the polymer compound coating containing carbonate chain links are cured to form a protective layer and The structural support layer, the thermal expansion coefficients of the three are very close: the difference range is [+30%, -30%], and the internal stress generated during the hot pressing and cold pressing in the manufacturing process is very close, which will not make the whole warping of the card; after the first composite surface layer and the second composite surface layer composed of these structural layers, even if the specific structures of the first composite surface layer and the second composite surface layer are different, after the processing procedures of hot pressing and cold pressing, they will not The card will be warped due to the difference in internal stress; that is, the cost of the anti-counterfeit card can be reduced by simplifying the structure of the second composite surface layer.
附图说明Description of drawings
图1为本发明的非对称结构的证卡的结构示意图；Fig. 1 is a structural schematic diagram of a card with an asymmetric structure of the present invention;
图2为第一复合表层的结构示意图；Fig. 2 is the structural representation of the first composite surface layer;
图3为第二复合表层的结构实施例一的示意图；Fig. 3 is the schematic diagram of the structure embodiment one of the second composite skin;
图4为第二复合表层的结构实施例二的示意图；Fig. 4 is the schematic diagram of the structure embodiment two of the second composite skin;
图5为第二复合表层的结构实施例三的示意图。Fig. 5 is a schematic diagram of a third structural embodiment of the second composite surface layer.
具体实施方式Detailed ways
一种非对称结构的防伪证卡，其包括：作为主要支撑结构的基层1，基层1包括起印刷证卡式样作用的印刷层、包含芯片9的芯层，印刷层和芯层都为不透明的白色，基层中的印刷层、芯层的材质都为聚碳酸酯或PETG；基层1两侧分别对称的设置一个与基层材质相同的激光刻蚀层：第一激光刻蚀层4-1、第二激光刻蚀层4-2，激光刻蚀层用来承载防伪证卡上的个人信息；在两个激光刻蚀层4-1和4-2远离基层的一侧分别设置第一复合表层2、第二复合表层3；第一复合表层2、第二复合表层3中，与激光刻蚀层临近的一侧分别设置与激光刻蚀层同材质，由聚碳酸酯或PETG构成的承载基材层5；承载基材层5用来保护激光刻蚀层，在使用过程中缓冲因弯折产生的弯折力对激光刻蚀层的损伤。An anti-counterfeiting card with an asymmetric structure, which includes: a base layer 1 as a main support structure, the base layer 1 includes a printing layer that plays the role of printing a card pattern, and a core layer containing a chip 9, and the printing layer and the core layer are opaque White, the materials of the printing layer and the core layer in the base layer are polycarbonate or PETG; a laser etching layer with the same material as the base layer is arranged symmetrically on both sides of the base layer 1: the first laser etching layer 4-1, the second laser etching layer Two laser etching layers 4-2, the laser etching layer is used to carry the personal information on the anti-counterfeiting card; the first composite surface layer 2 is respectively set on the side of the two laser etching layers 4-1 and 4-2 away from the base layer , the second composite surface layer 3; in the first composite surface layer 2 and the second composite surface layer 3, the sides adjacent to the laser etching layer are respectively provided with the same material as the laser etching layer, and are made of polycarbonate or PETG. Layer 5: The carrying substrate layer 5 is used to protect the laser-etched layer, and buffer the damage to the laser-etched layer due to the bending force generated by bending during use.
如图2所示，第一复合表层2中，基于承载基材层5，通过含有碳酸酯链节的高分子化合物涂料，如UV光固化/热固化涂料固化后构成结构支撑层6；在结构支撑层6上压印形成的全息微纳结构7，在全息微纳结构7所在结构面上覆盖透明且折射率＞1.8的氧化物膜构成的介质镀膜层8，在介质镀膜层8上通过含有碳酸酯链节的高分子化合物涂料，如：UV光固化/热固化涂料固化后形成的保护层10。As shown in Figure 2, in the first composite surface layer 2, based on the carrier substrate layer 5, the structural support layer 6 is formed after the polymer compound coating containing carbonate chain links, such as UV photocuring/thermal curing coating is cured; The holographic micro-nano structure 7 formed by embossing on the support layer 6 is covered with a dielectric coating layer 8 composed of a transparent oxide film with a refractive index > 1.8 on the structural surface of the holographic micro-nano structure 7. The polymer compound coating of the carbonate chain link, such as: the protective layer 10 formed after the UV light-curing/heat-curing coating is cured.
如图3所示，第二复合表层3包括：承载基材层5和基底层；基底层包括：基于承载基材层通过含有碳酸酯链节的高分子化合物涂料，如UV光固化/热固化涂料固化后构成结构支撑层6、设置在最外层的通过UV涂料固化后形成的保护层10；As shown in Figure 3, the second composite surface layer 3 includes: a load-bearing base material layer 5 and a base layer; After the coating is cured, the structural support layer 6 is formed, and the protective layer 10 arranged on the outermost layer is formed after the UV coating is cured;
如图4所示，第二复合表层3包括：承载基材层5和基底层；基底层包括：基于承载基材层通过UV光固化/热固化涂料固化后构成结构支撑层6；As shown in Figure 4, the second composite surface layer 3 includes: a carrier base layer 5 and a base layer; the base layer includes: a structural support layer 6 formed after the carrier base layer is cured by UV light curing/thermal curing coating;
如图5所以，第二复合表层3包括：承载基材层5和基底层；基底层包括：设置在最外层的通过UV光固化/热固化涂料固化后形成的保护层10；As shown in Fig. 5, the second composite surface layer 3 includes: a carrier substrate layer 5 and a base layer; the base layer includes: a protective layer 10 formed on the outermost layer after being cured by UV light curing/thermal curing coating;
因为保护层10、结构支撑层6的因为材质中的成分略有不同，所以透光性略有不同，根据加工具体的成本的要求、以及防伪证卡外观的具体要求不同，厂商可以选择不同的第二复合表层3的结构来实现；但是，无论第二复合表层3的结构如何设置，每个结构层的厚度限制如下：Because the composition of the protective layer 10 and the structural support layer 6 are slightly different, the light transmittance is slightly different. According to the specific requirements of processing costs and the specific requirements of the appearance of anti-counterfeiting cards, manufacturers can choose different materials. However, no matter how the structure of the second composite surface layer 3 is set, the thickness limit of each structural layer is as follows:
承载基材层的厚度为50µm ~200µm，结构支撑层的厚度为0.5µm ~20nm；保护层的厚度为0.5µm ~20µm；介质镀膜层的厚度为30 nm ~400nm；The thickness of the bearing substrate layer is 50µm ~ 200µm, the thickness of the structural support layer is 0.5µm ~ 20nm; the thickness of the protective layer is 0.5µm ~ 20µm; the thickness of the dielectric coating layer is 30 nm ~ 400nm;
通过对结构层厚度的控制，使每个结构层的薄膜在保证实现其功能的基础上，能保证在加工工序之后，结构不同的第一复合表层2和第二复合表层3整体产生的内应力相同，进而达到防止翘曲的目的。By controlling the thickness of the structural layer, the film of each structural layer can ensure the internal stress generated by the first composite surface layer 2 and the second composite surface layer 3 with different structures after the processing process on the basis of ensuring the realization of its function. The same, and then achieve the purpose of preventing warping.
第一复合表层2和第二复合表层3中的保护层10、结构支撑层6材质相同，采用含有碳酸酯链节的高分子化合物涂料，其材质的热膨胀系数与基层1、激光刻蚀层4-1和4-2、承载基材层5的材质的热膨胀系数的差异值[+30%,-30%]；非常接近热膨胀系数，在制造环节中的热压、冷压过程中，各个结构层产生的内应力非常接近；同时，保护层10、结构支撑层6都为UV固化涂料通过热固化和/或光固化而成的薄膜层，其与由聚碳酸酯或PETG构成的承载基材层5结合之后，硬度可以达到表面硬度达到4H~5H，可以达到防划伤、防刮伤的作用，提升了成卡的品质和成品率。The protective layer 10 and the structural support layer 6 in the first composite surface layer 2 and the second composite surface layer 3 are made of the same material, and a polymer compound coating containing carbonate chain links is used, and the thermal expansion coefficient of the material is the same as that of the base layer 1 and the laser etching layer 4. -1 and 4-2, the difference value of the thermal expansion coefficient of the material of the bearing substrate layer 5 [+30%, -30%]; very close to the thermal expansion coefficient, in the process of hot pressing and cold pressing in the manufacturing process, each structure The internal stress produced by the layer is very close; meanwhile, the protective layer 10 and the structural support layer 6 are all film layers formed by UV curing coatings through thermal curing and/or photocuring, and it is compatible with the carrier substrate made of polycarbonate or PETG After layer 5 is bonded, the hardness can reach a surface hardness of 4H~5H, which can achieve the effect of anti-scratch and anti-scratch, and improve the quality and yield of the finished card.
一种非对称结构的防伪证卡的制作方法，其包括如下步骤：A method for making an anti-counterfeiting card with an asymmetric structure, comprising the following steps:
S1：首先准备基层1；S1: First prepare the base layer 1;
S2：制作第一复合表层2：S2: making the first composite surface layer 2:
制作所第一复合表层2的步骤包括：The steps of making the first composite surface layer 2 include:
S2-1：设置承载基材层5；S2-1: setting the carrier substrate layer 5;
S2-2：在承载基材层5远离基层1一侧表面设置结构支撑层6；S2-2: setting a structural support layer 6 on the surface of the bearing substrate layer 5 away from the base layer 1;
S2-3：在结构支撑层6远离基层1一侧表面通过压印做出全息微纳结构7；S2-3: Make a holographic micro-nano structure 7 by embossing on the surface of the structural support layer 6 away from the base layer 1;
S2-4：在全息微纳结构7所在的结构面上，全局的填充氧化物形成介质镀膜层8；S2-4: On the structural surface where the holographic micro-nano structure 7 is located, globally fill the oxide to form a dielectric coating layer 8;
S2-5：最后涂布含有碳酸酯链节的高分子化合物涂料，如UV光固化/热固化涂料固化形成保护层10；S2-5: Finally, apply a polymer compound coating containing carbonate chain members, such as UV light curing/thermal curing coating curing to form a protective layer 10;
S3：制作第二复合表层3；S3: making the second composite surface layer 3;
S4：把第一复合表层2、第一激光刻蚀层4-1、基层1、第二激光刻蚀层4-2、第二复合表层3自上而下依次叠放后进行加热层压、然后再冷压以形成单侧有防伪标记的新式防伪证卡。S4: Laminate the first composite surface layer 2, the first laser-etched layer 4-1, the base layer 1, the second laser-etched layer 4-2, and the second composite surface layer 3 from top to bottom in sequence, and then perform heating lamination, Then it is cold-pressed to form a new anti-counterfeiting card with anti-counterfeiting marks on one side.
在制作第二复合表层23的时候，因为制作不同厚度的结构层需要在生产线上重新调整设备，所以制作者会根据不同的成本、工序要求选择适和的第二复合表层结构：When making the second composite surface layer 23, because the production of structural layers with different thicknesses requires readjustment of equipment on the production line, the producer will choose an appropriate second composite surface layer structure according to different costs and process requirements:
步骤S3中，制作如图4所示的第二复合表层3的步骤包括：In step S3, the step of making the second composite skin 3 as shown in Figure 4 comprises:
S3-1：设置承载基材层5；S3-1: setting the carrier substrate layer 5;
S3-2：在承载基材层5远离基层1一侧表面设置结构支撑层6；S3-2: setting a structural support layer 6 on the surface of the bearing substrate layer 5 away from the base layer 1;
步骤S3中，制作如图3所示的第二复合表层3的步骤包括：In step S3, the step of making the second composite skin 3 as shown in Figure 3 comprises:
S3-1：设置承载基材层5；S3-1: setting the carrier substrate layer 5;
S3-2：在承载基材层5远离基层一侧表面设置结构支撑层6；S3-2: setting a structural support layer 6 on the surface of the bearing substrate layer 5 away from the base layer;
S3-3：在结构支撑层6之上，涂布UV光固化/热固化涂料固化形成保护层10；S3-3: On the structural support layer 6, apply a UV light-curable/thermal-curable coating and cure to form a protective layer 10;
步骤S3中，制作制作如图3所示的第二复合表层3的步骤包括：In step S3, the step of making the second composite surface layer 3 as shown in Figure 3 comprises:
S3-1：设置承载基材层5；S3-1: setting the carrier substrate layer 5;
S3-2：在承载基材层5远离基层1一侧表面之上，涂布UV光固化/热固化涂料固化形成保护层10。S3-2: On the surface of the carrier substrate layer 5 away from the base layer 1 , apply a UV light-curable/heat-curable coating and cure to form a protective layer 10 .
采用本发明的技术方案中的非对称证卡结构实现的防伪证卡，无需改变核心的基层、激光刻蚀层的厚度，而是通过调整复合表层的结构来降低证卡的整体成本，同时通过材料本身的性能来使得卡结构应力均匀，不产生翘曲；经过试验，成品之后的非对称结构的防伪卡从水平刚性平台到卡凸起表面任何部分的最大距离（包括卡厚度）不大于0.5mm。The anti-counterfeiting card realized by adopting the asymmetric card structure in the technical solution of the present invention does not need to change the thickness of the core base layer and the laser etching layer, but reduces the overall cost of the card by adjusting the structure of the composite surface layer, and at the same time through The performance of the material itself makes the stress of the card structure uniform and does not cause warping; after testing, the maximum distance between the horizontal rigid platform and any part of the raised surface of the card (including the thickness of the card) of the anti-counterfeiting card with asymmetric structure after the finished product is not greater than 0.5 mm.
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