JP2003058847A - Base material of ic card, image recording body, ic card, and method for manufacturing ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve chemical resistance, water resistance, curling and punching. SOLUTION: An electronic component 3 of prescribed thickness is arranged between 1st and 2nd sheet members 1, 2 and at least the 1st and 2nd sheet members 1, 2 and the electronic component 3 are constituted as laminated structure through a specific elastic epoxy adhesive having physical properties after hardning of elongation at break (%) of 50 to 500 and 2% elastic modulus (kgf/mm<2> ) of 0.01 to 10.0 kgf/mm<2> .

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact-type or non-contact type electronic or magnetic IC for storing personal information or the like which requires security such as forgery and alteration prevention.
The present invention relates to a card base material, an image recording body, an IC card, and an IC card manufacturing method.

[0002]

2. Description of the Related Art Conventionally, a magnetic card for recording data by a magnetic recording system has been widely used as an identification card (ID card), a credit card and the like. However, since data can be rewritten relatively easily with a magnetic card, tampering of the data is not sufficient, it is susceptible to external influences due to magnetism, data protection is not sufficient, and the recording capacity is small. There were problems such as. Therefore, in recent years, IC cards having a built-in IC chip have become popular.

The IC card reads / writes data from / to an external device through an electric contact provided on the surface or a loop antenna inside the card. The IC card has a larger storage capacity than the magnetic card, and the security is greatly improved. In particular, a non-contact type IC card that has an IC chip inside the card and an antenna for exchanging information with the outside and does not have an electrical contact outside the card is a contact type IC card having an electrical contact on the card surface. Compared to this, it is excellent in security and is being used for applications such as ID cards that require high data confidentiality and forgery / alteration protection.

As such an IC card, for example, the first
There is one in which the sheet member and the second sheet member are adhered to each other via an adhesive, and an IC module having an IC chip and an antenna is enclosed in the adhesive layer.

Generally, a hot-melt adhesive is used to bond the sheet members, but since the bonding processing temperature is the same as the softening temperature of the adhesive, when the card having heat resistance is prepared, the sheet member is heated at a high temperature. It will be necessary to attach them. However, when bonded at a high temperature, the first sheet member and the second sheet member are likely to warp the card substrate (hereinafter referred to as curl) due to heating, or an image receiving layer for image formation by thermal transfer on the card surface, etc. Layers are damaged when they are provided with layers that are susceptible to high temperature processing. Alternatively, there is a problem in that the card base material undergoes heat shrinkage or the like due to the bonding at a high temperature, and the card base material curls to deteriorate the dimensions and the positional accuracy at the time of bonding.

However, since the card base material is hard to curl because it is adhered at a low temperature, it is not damaged when the card surface is provided with a layer vulnerable to high temperature processing such as an image receiving layer for image formation by thermal transfer. Alternatively, the problems such as the heat shrinkage of the base material and the curling of the card because of the bonding at a low temperature and the deterioration of the size and the positional accuracy during bonding are solved.

Conventionally, as a moisture-curing type adhesive for bonding at low temperature, JP-A-2000-036026 and JP-A-200
0-2119855, as a photocurable adhesive
Although a method of laminating and bonding is disclosed, such as 316959 and JP-A-11-5964, the breaking elongation is high and the cutting property is poor.

[0008]

In the present invention, when a base material having a card size is prepared, a manufacturing method is, for example, a method in which a first sheet member and a second sheet member are adhered to each other with an adhesive, and laminated after adhesion. A method of molding the formed sheet base material into a card size is selected. As a method of molding into a card size, a punching method, a cutting method and the like are mainly selected.

Further, in the case of forming into a card size, if the breaking elongation of the adhesive is 500% or more, cutting failure occurs at the time of cutting. The poor cutting means that the adhesive adheres to the cutter or the metal blade used for cutting and cannot be punched into a card shape. If the breaking elongation of the adhesive is 50% or less, it is suitable for molding a card substrate, but the physical strength of the finished card itself deteriorates. Physical strength refers to twisting, bending, and bendability.

However, in the image recording body laminated with the low temperature adhesive of the prior art, the first sheet member and the second sheet member are laminated with the adhesive and the laminated card is chemically resistant. There were many things with poor water resistance. This is because chemicals or water permeates from the surface of the first or second sheet member and migrates to the adhesive layer remaining in the sheet base material, and the adhesiveness between the first sheet member and the second sheet member is affected by the chemicals and water. It caused problems such as lowering.

The present invention has been made in order to solve the above four problems, and has an IC card base material, an image recording body, and an IC card which are improved in chemical resistance, water resistance, curl property and punching property. And an IC card manufacturing method.

[0012]

In order to solve the above-mentioned problems and to achieve the object, the present invention has the following constitution.

According to a first aspect of the present invention, "an electronic component having a predetermined thickness is provided between the first sheet member and the second sheet member, and at least the first sheet member and the second sheet member are provided.
Of the sheet member and the electronic component, the physical properties of the resin after curing have a breaking elongation (%) of 50 to 500 and a 2% elastic modulus (k).
gf / mm ²⁾ IC card substrate, characterized in that intervening 0.01~10.0kgf / mm ² comprising a specific elastic epoxy adhesive having a lamination structure. ].

According to a second aspect of the invention, the viscosity of the specific elastic epoxy adhesive before curing is 100 at 23 ° C.
It is 0-35000 cps, It is characterized by the above-mentioned.
The IC card substrate described in. ].

The invention according to claim 3 is characterized in that it has a laminated structure prepared by coating or laminating the specific elastic epoxy adhesive at a temperature of 80 ° C. or lower. The IC card substrate described in. ].

According to a fourth aspect of the present invention, there is provided a "sublimation or heat diffusible dye image on one substrate of the IC card substrate according to any one of the first to third aspects by a thermal transfer recording system. An image recording body having an image receiving layer for receiving the image. ].

According to a fifth aspect of the present invention, "the IC card substrate according to any one of the first to third aspects or the image recording body according to the fourth aspect is cured by light or heat. An IC card characterized by being protected by a mold resin layer. ].

According to a sixth aspect of the invention, there is provided at least a release layer on the IC card substrate according to any one of the first to third aspects or the image recording body according to the fourth aspect. A method for manufacturing an IC card, which comprises thermally transferring a transfer foil formed on a support having a transparent resin layer at least once. ].

According to a seventh aspect of the invention, there is provided at least a release layer on the IC card substrate according to any one of the first to third aspects or the image recording body according to the fourth aspect. An IC card is characterized in that a transfer foil formed on a support having a transparent resin layer is thermally transferred at least once and then a light or thermosetting layer is provided. ].

The invention described in claim 8 is that "at least a release layer is provided on the IC card substrate according to any one of claims 1 to 3 or the image recording body according to claim 4. An IC card characterized in that after a transfer foil comprising a support having a transparent resin layer is thermally transferred at least once or more, a light or / and thermosetting layer is provided, and then exposed or heat-treated with an actinic ray. Production method. ].

The invention according to claim 9 is the IC card according to claim 5 or 7, wherein the personal information includes information such as a face image, an address, a name, and a date of birth. ].

The invention according to claim 10 is the "claim 5,
The IC card according to any one of claims 7 and 9, wherein an adhesive member having at least a specific elastic epoxy resin that can be adhered at 0 to 80 ° C has a longitudinal (MD) heat shrinkage rate at 150 ° C / 30 min. ) 1.2% or less, horizontal (TD)
The base material consisting of 0.5% or less of a white support at 0 to 80 ° C.
At least at a heating temperature of 0 to 80 ° C. after coating or bonding, and at a temperature of −10 ° C. to 70 ° C. for cooling. A method of manufacturing an IC card base material, which is characterized by being manufactured by a manufacturing process. ].

According to a tenth aspect of the present invention, "an electronic component having a predetermined thickness is provided between the first sheet member and the second sheet member, and at least the first sheet member and the second sheet member are provided. The sheet member and the electronic component are at 80 ° C. with an adhesive member at least containing a compound containing two or more epoxy groups in one molecule and a compound generating a cation at a temperature of 10 to 150 ° C. An IC card base material having a laminated structure formed by coating or laminating at the following temperatures. ].

The invention according to claim 12 is the "claim 11".
The image recording body, wherein the IC card substrate described in (1) above has an image receiving layer for receiving a sublimation or heat diffusible dye image in a thermal transfer recording system. ].

The invention described in claim 13 is the "claim 11".
An IC card characterized in that the IC card substrate according to claim 12 or the image recording body according to claim 12 is protected by a light or thermosetting resin layer. ].

The invention according to claim 14 is the "claim 11".
An IC characterized in that a transfer foil comprising a support having at least a release layer and a transparent resin layer is thermally transferred at least one or more times onto the IC card substrate according to claim 12 or the image recording body according to claim 12. Card manufacturing method. ].

The invention according to claim 15 is the "claim 11".
A transfer foil comprising a support having at least a releasing layer and a transparent resin layer is thermally transferred onto the IC card substrate according to claim 12 or the image recording body according to claim 12 at least one or more times, and then, light or thermosetting property is obtained. IC having a layer
card. ].

The invention according to claim 16 is the "claim 11".
A transfer foil comprising a support having at least a release layer and a transparent resin layer is thermally transferred onto the IC card base material according to claim 12 or the image recording body according to claim 12 at least one or more times, and then light or / and A method for manufacturing an IC card, comprising exposing and / or heat treating with an actinic ray after providing a thermosetting layer. ].

The invention according to claim 17 is characterized in that "personal information includes information such as face image, address, name, date of birth, and the like.
C card. ].

The invention according to claim 18 is the "claim 1
3, I according to any one of claims 15 and 17
An adhesive member containing at least a compound capable of adhering a cord at 0 to 80 ° C., containing two or more epoxy groups in one molecule, and a compound generating a cation at a temperature of 10 to 150 ° C. , A heat-shrinkage ratio at 150 ° C./30 min of 1.2% or less in the longitudinal direction (MD) and 0.5% or less in the transverse direction (TD) is applied to a substrate made of a white support at a heating temperature of 0 to 80 ° C. A step of working or laminating, and a step of promoting curing at a heating temperature of 0 to 80 ° C. after coating or laminating,
A method for manufacturing an IC card base material, which is produced by a manufacturing process including at least a step of laminating and cooling at a temperature of 70 ° C to 70 ° C. ].

The invention described in claim 19 is, "The IC card according to claim 9 or 17, wherein the IC card is watermark-printed. ].

According to the inventions of claims 1 to 19, chemical resistance, water resistance, curling property and punching property are improved.

[0033]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the IC card substrate, the image recording body, the IC card and the method for manufacturing the IC card of the present invention will be described in detail with reference to the drawings, but the present invention is not limited to this embodiment. .

FIG. 1 is a sectional view of an IC card substrate. I
The C card base material is provided with an electronic component 3 having a predetermined thickness between the first sheet member 1 and the second sheet member 2.
The electronic component 3 includes an antenna body 3a, an IC chip 3b, etc., and the IC module of the electronic component 3 has an inlet 4
Is equipped with. The inlet 4 is arranged between the first sheet member 1 and the second sheet member 2 and is laminated with the adhesives 5 and 6 interposed therebetween.

The image recording body has an image receiving layer for receiving a sublimation or heat diffusible dye image in the thermal transfer recording system on one of the substrates of the IC card substrate.

Further, in the IC card, the IC card substrate or the image recording body is protected by a light or thermosetting resin layer.

The IC card is manufactured by thermally transferring a transfer foil composed of a support having at least a releasing layer and a transparent resin layer onto the IC card base material or the image recording body at least once. In addition, after thermally transferring a transfer foil comprising a support having at least a release layer and a transparent resin layer onto an IC card substrate or an image recording body at least once, and after providing a light and / or thermosetting layer. , And / or heat treatment with actinic rays.

The IC card is manufactured by a manufacturing process including at least a step of applying or bonding an adhesive member, a step of promoting curing, and a step of cooling.

In this IC card, a transfer foil consisting of a support having at least a release layer and a transparent resin layer is thermally transferred onto an IC card base material or an image recording body at least once, and then the light or thermosetting property is set. Layers are provided. The IC card has face information, an address, a name, a date of birth and the like as personal information. [Sheet member] Examples of the sheet member include polyethylene terephthalate, polybutylene terephthalate, polyester resins such as polyethylene terephthalate / isophthalate copolymers, polyolefin resins such as polyethylene, polypropylene and polymethylpentene, polyvinyl fluoride, polyvinylidene fluoride, Polytetrafluoroethylene, ethylene-4 fluoroethylene copolymer, and other polyfluorinated ethylene resins, nylon 6, nylon 6.6 and other polyamides, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer, ethylene / Vinyl acetate copolymer, ethylene /
Vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymers such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl alcohol, biodegradable cellulose acetate, biodegradable poly Biodegradable resins such as caprolactone, cellulose triacetate, cellulosic resins such as cellophane, methyl polymethacrylate, ethyl polymethacrylate, ethyl polyacrylate, butyl polyacrylate,
Acrylic resin such as, polystyrene, polycarbonate, polyarylate, synthetic resin sheet such as polyimide,
Alternatively, the support may be a high-quality paper, thin paper, glassine paper, paper such as sulfuric acid paper, a single layer of metal foil, or a laminate of two or more layers thereof.

The thickness of the support of the present invention is 30 to 300 μm.
m is preferably 50 to 200 μm. If the thickness is 50 μm or less, heat shrinkage or the like occurs when the first sheet member and the second sheet member are attached, which is a problem.

In the present invention, the sheet member is 150
Thermal contraction rate at ℃ / 30min is 1.2 in length (MD)
% Or less, and the lateral (TD) is preferably 0.5% or less. When an adhesive is applied or produced from both surface sides of the first sheet member and the second sheet member, the support undergoes heat shrinkage due to temperature, and the subsequent cutting process and printing process The alignment was difficult.

However, an adhesive which adheres at a low temperature as in the present invention and a support having a heat shrinkage ratio at 150 ° C./30 min of 1.2% or less in the longitudinal direction (MD) and 0.5% or less in the transverse direction (TD). By using, it was possible to improve the conventional problems without shrinkage of the support.

In the present invention, a white pigment is mixed to improve the hiding property, and an annealing treatment is performed to reduce the heat shrinkage ratio.
It is preferable to use a support having a heat shrinkage ratio of 1.2% or less in the longitudinal direction (MD) and 0.5% or less in the transverse direction (TD) at 30 min. It was confirmed that when the length (MD) is 1.2% or more and the width (TD) is 0.5% or more, the above-mentioned post-processing becomes difficult due to the contraction of the support.

Further, an easy contact treatment may be carried out on the support for improving post-processing adhesion, and an antistatic treatment may be carried out for chip protection. Specifically, U2 series, U4 series, UL series manufactured by Teijin DuPont Films Ltd., Crisper G manufactured by Toyobo Co., Ltd.
The series, E00 series, E20 series, E22 series, X20 series, E40 series, and E60 series QE series manufactured by Toray Industries, Inc. can be preferably used.

The second sheet member may optionally be provided with an image receiving layer and a cushion layer for forming the face image of the card user. An image element is provided on the surface of the personal authentication card base, and an authentication identification image such as a face image, an attribute information image,
It may be provided with at least one selected from format printing, or may be a white card having no printed portion at all. <Image Receiving Layer> The image receiving layer formed on the surface of the support may be formed of a binder and various additives.

Since the image-receiving layer in the present invention forms a gradation information-containing image by a sublimation type thermal transfer system and a character information-containing image by a sublimation type thermal transfer system or a fusion type thermal transfer system, the sublimation dye is dyed. Property, or the dyeability of the sublimable dye and the adhesiveness of the hot-melt ink should be good. In order to impart such special properties to the image receiving layer, it is necessary to appropriately adjust the types of binders and various additives and their blending amounts, as described later.

The components forming the image receiving layer will be described in detail below.

As the binder for the image-receiving layer in the present invention, a generally known binder for sublimation-type thermal transfer recording image-receiving layer can be appropriately used. As the main binder, it is possible to use various binders such as vinyl chloride resin, polyester resin, polycarbonate resin, acrylic resin, polystyrene resin, polyvinyl acetal resin, polyvinyl butyral resin. May be added.

However, if there is a practical requirement for the image formed by the present invention (for example, the issued ID card is required to have a predetermined heat resistance), such requirement items should be satisfied. It is necessary to consider the type or combination of different binders. Taking heat resistance of an image as an example, if heat resistance of 60 ° C. or higher is required, Tg should be taken into consideration in consideration of bleeding of a sublimable dye.
It is preferable to use a binder having a temperature of 60 ° C. or higher.

When forming the image receiving layer, it may be preferable to contain, for example, a compound containing a metal ion, if necessary. Especially when the heat transfer compound reacts with the metal ion-containing compound to form a chelate.

Metals constituting the metal ion-containing compound
Examples of the ions include, for example, Group I and Group VIII of the periodic table.
And divalent and polyvalent metals belonging to
Al, Co, Cr, Cu, Fe, Mg, Mn, Mo, N
i, Sn, Ti, Zn, etc. are preferable, and particularly Ni, Cu,
Co, Cr, Zn and the like are preferable. These metal ions
The compound to be contained is an inorganic or organic salt of the metal.
And complexes of said metals are preferred. To give a specific example, N
i2⁺, Cu⁺, Co2⁺, Cr2⁺And Zn2 ⁺Contains
The complex represented by the following general formula is preferably used. [M (Q1) k (Q2) m (Q3) n] p⁺p (L
−) However, in the formula, M represents a metal ion, and Q1, Q2, Q3
Is a coordination capable of forming a coordinate bond with a metal ion represented by M.
Compound, and examples of these coordination compounds include
Coordination compound described in "Toh Kagaku (5) (Nankodo)"
You can choose from one. Particularly preferably, with a metal
Coordination with at least one amino group coordinatively bound
Compound, and more specifically, ethylene di
Min and its derivatives, glycinamide and its derivatives
Body, picolinamide and its derivatives.

L is a counter anion capable of forming a complex,
Examples thereof include inorganic compound anions such as Cr, SO4, and ClO4, benzenesulfonic acid derivatives, and organic compound anions such as alkylsulfonic acid derivative pairs. Particularly preferred are tetraphenylboron anion and its derivatives, and alkylbenzenesulfonic acid anion and its derivatives. is there. k represents an integer of 1, 2 or 3, m is 1,
2 or 0, and n represents 1 or 0, which are determined depending on whether the complex represented by the above general formula is tetradentate or hexadentate, or whether the complex of Q1, Q2 and Q3 Determined by the number of ligands. p represents 1, 2 or 3.

As this kind of metal ion-containing compound,
Mention may be made of those exemplified in US Pat. No. 4,987,049. When the metal ion-containing compound is added, the addition amount is 0.5.2 with respect to the image receiving layer.
0 g / m ² is preferable, and 1.15 g / m ² is more preferable.

Further, it is preferable to add a release agent to the image receiving layer. As the effective release agent, those which are compatible with the binder used are preferable, and specifically, modified silicone oil and modified silicone polymer are typical,
Examples thereof include amino-modified silicone oil, epoxy-modified silicone oil, polyester-modified silicone oil, acrylic-modified silicone resin, urethane-modified silicone resin and the like. Among them, the polyester-modified silicone oil prevents fusion with the ink sheet, but is particularly excellent in that it does not hinder the secondary processability of the image receiving layer. The secondary processability of the image receiving layer refers to the writing property with a magic ink, the laminating property which becomes a problem when protecting the formed image, and the like. In addition, fine particles such as silica are also effective as the release agent. When the secondary processability is not a problem, it is effective to use a curable silicone compound as a measure for preventing fusion. Ultraviolet ray curable silicone, reaction curable silicone and the like are available, and a great releasing effect can be expected.

In the image-receiving layer according to the present invention, an image-receiving layer coating solution prepared by dispersing or dissolving the forming components in a solvent is prepared, and the image-receiving layer coating solution is applied to the surface of the support and dried. It can be manufactured by the method.

The thickness of the image receiving layer formed on the surface of the support is generally about 1.50 μm, preferably about 2/10 μm.

In the present invention, a cushion layer or a barrier layer may be provided between the support and the image receiving layer. When the cushion layer is provided, noise can be reduced and an image corresponding to image information can be transferred and recorded with good reproducibility. <Cushion Layer> As a material for forming the cushion layer of the present invention, polyolefin is preferable. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-
Butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-hydrogenated isoprene-styrene block copolymer,
Those having flexibility and low thermal conductivity, such as polybutadiene and a photocurable resin layer, are suitable. Specifically, a cushion layer such as Japanese Patent Application No. 2001-16934 can be used.

The cushion layer referred to in the present invention means a) a role of alleviating unevenness when writing information on a card substrate,
b) It means a soft resin layer which is located between the IC and the image receiving layer for receiving an image and plays a role of reducing the influence of unevenness due to electronic parts such as an IC module.

The cushion layer is not particularly limited as long as it has any of a) a cushion layer between the outermost layer of the sheet member and the adhesive and b) a cushion layer between the image receiving layer and the electronic component. It is particularly preferable that the support is formed by coating or laminating on one surface or both surfaces of another support having substantially the same quality as the substrate. <Writing Layer> The writing layer is a layer that allows writing on the back surface of the ID card. As such a writing layer, for example, an inorganic fine powder such as calcium carbonate, talc, diatomaceous earth, titanium oxide or barium sulfate may be contained in a film of a thermoplastic resin (polyolefin such as polyethylene or various copolymers). Can be formed. It can be formed by the "writing layer" described in JP-A-1-205155. The writing layer is formed on the surface of the support on which the plurality of layers are not laminated. [Electronic component] The electronic component indicates an information recording member, and specifically, a user of the electronic card. And an IC chip for electrically storing the information of (1) and a coil-shaped antenna body connected to the IC chip. The IC chip is a memory only or a microcomputer in addition to the memory. In some cases, the electronic component may include a capacitor. The present invention is not limited to this and is not particularly limited as long as it is an electronic component necessary for the information recording member.

The IC module composed of electronic parts is
Although it has an antenna coil, when it has an antenna pattern, any method such as a conductive paste printing process, a copper foil etching process, or a winding welding process may be used. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. A conductive adhesive such as silver paste, copper paste, or carbon paste is used to bond the IC chip and the antenna pattern (EN-4 manufactured by Hitachi Chemical Co., Ltd.
000 series, Toshiba Chemical's XAP series, etc.)
Alternatively, a method using an anisotropic conductive film (Anisolum manufactured by Hitachi Chemical Co., Ltd.) or a method using solder bonding is known, but either method may be used.

Since the resin including the IC chip is placed in a predetermined position in advance and then the resin is filled, the joint portion is disengaged due to the shearing force due to the flow of the resin, or the surface of the surface is affected by the flow and cooling of the resin. An inlet is used in order to eliminate loss of smoothness and lack of stability. The inlet is
A resin layer is formed in advance on the substrate sheet, and a porous resin film, a porous foamable resin film, a flexible resin sheet, a porous resin sheet, or a porous resin film is formed in order to encapsulate the components in the resin layer. It is preferably used in the form of a resin sheet or a non-woven sheet. For example, Japanese Patent Application No. 11-10547
The method described in No. 6 etc. can be used.

For example, as the non-woven sheet member, there are mesh woven fabric such as non-woven fabric, plain weave, twill woven fabric and satin woven fabric. Also, moquette, plush velour, seal,
Velvet, woven fabric having a pile called suede, or the like can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohol,
Polyvinylidene chloride-based, polyvinyl chloride-based, acrylic such as polyacrylonitrile, acrylamide, methacrylamide, etc., polyvinylidene cyanide-based, polyfluoroethylene-based, polyurethane-based synthetic resins, silk, cotton, wool, cellulose-based, cellulose ester Examples of the fiber include natural fibers such as series, regenerated fibers (rayon, acetate), and one or a combination of two or more selected from aramid fibers. Among these fiber materials, rayon which is preferably polyamide type such as nylon 6 or nylon 66, acrylic type such as polyacrylonitrile, acrylamide or methacrylic acid, polyester type such as polyethylene terephthalate, cellulose type as regenerated fiber or cellulose ester type. And acetate and aramid fiber.

Since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip.

The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm. [Method of Providing Electronic Component with Predetermined Thickness Between First Sheet Member and Second Sheet Member] Predetermined electronic component between first sheet member and second sheet member of the present invention In order to provide the above, as a manufacturing method, a heat bonding method, an adhesive bonding method, an adhesive coating method and an injection molding method are known, but the bonding may be performed by any method. In addition, the first sheet member and the second sheet member may be subjected to format printing or information recording either before or after bonding, and offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, It can be formed by any method such as an inkjet method, a sublimation transfer method, an electrophotographic method, and a heat melting method.

In the method of manufacturing an electronic card of the present invention, an adhesive member that is a solid or a viscous substance at least at room temperature and softens at the time of heating is applied to the electronic component for the card to form the electronic component holder. A step, a step of disposing this electronic component holder on a substrate member, a step of disposing a surface member so as to cover the electronic component holder on the substrate member, and a predetermined pressure application. Substrate parts for temperature conditions,
And a step of attaching the electronic component holder and the surface member to each other.

The adhesive member that softens in the heated state of the solid or viscous material is formed by a method in which the adhesive itself is formed into a sheet shape and is provided, or an adhesive coating method in which the adhesive itself is heated or melted at room temperature. It is preferable to provide an adhesive on the base material and bond the adhesive surfaces together.

The temperature at which a predetermined electronic component can be bonded between the first sheet member and the second sheet member is preferably 80 ° C. or lower, more preferably 0 to 80 ° C., further preferably 20. The temperature is from 80 ° C to 80 ° C. In the production of the present invention, it is preferable to provide a cooling step after bonding to reduce warpage and the like of the support. Cooling temperature is 70 ℃
The following is preferable, and more preferably -10 to 7
The temperature is 0 ° C, more preferably 10 to 60 ° C.

At the time of bonding, it is preferable to perform heating and pressurization in order to improve the surface smoothness of the sheet base material and the adhesion of a predetermined electronic component between the first sheet member and the second sheet member. It is preferable to manufacture by a vertical pressing method, a laminating method, or the like. Further, in consideration of cracking of IC parts, it is preferable to avoid a roller which is close to line contact and to which an excessive bending force is applied even with a slight deviation, and to use a flat press type.
The heating is preferably 10 to 120 ° C., more preferably 3
It is 0 to 100 ° C. Pressurization is 0.1-300 kgf /
cm ² is preferred, more preferably 0.1-100 kg
f / cm ² . If the pressure is higher than this, the IC chip will be damaged. The heating and pressurizing time is preferably 0.1 to 18
It is preferably 0.1 to 120 seconds, more preferably 0 seconds.
If the time is longer than this, the manufacturing efficiency is reduced.

According to the method of manufacturing an electronic card of the present invention, the above-mentioned electronic component holder is applied, and in the bonding step, the member for the substrate and the electronic component holder are heated under a predetermined pressurizing and heating condition. Also, since the surface member is attached, the electronic component holder itself can be used as an adhesive to bond the substrate member, the electronic component holder, and the surface substrate with good reproducibility.

The laminated sheet or continuous coated laminating roll formed as a continuous sheet by the adhesive bonding method or the resin injection method is left in the time corresponding to the predetermined curing time of the adhesive, and then the authentication identification image or the bibliography is obtained. You may record matters,
After that, it may be molded into a predetermined card size. As a method for forming a predetermined card size, a punching method, a cutting method and the like are mainly selected. [Adhesive] <Elastic Epoxy Resin> As an elastic epoxy resin, for example, in order to obtain curability at low temperature, JP-A-63-6371.
As disclosed in No. 6, an epoxy resin composition comprising a combination of an epoxy resin and a mercaptan curing agent and an epoxy resin composition comprising a combination of a heterocyclic diamine curing agent have been used. Further, in order to obtain high strength, an epoxy resin composed of a combination with an aromatic polyamine curing agent has been used. In order to obtain work environment characteristics, adhesion to a support, and adhesion stability, JP-A-10-
No. 120764, an epoxy resin composition comprising a combination of a bisphenol type epoxy resin and (C) polyamidoamine, (D) aromatic modified amine, and (E) aliphatic modified polyamine as an amine-based curing agent. Is used. In addition, Japanese Patent Laid-Open No. 2000-229
In 927, an epoxy resin having a high curing rate, which is a combination of an epoxy resin and an amine imide compound-based curing agent, is obtained. JP-A-6-87190, JP-A-5-
No. 295272 describes using a specially modified silicone prepolymer as a curing agent, and discloses a material in which the flexibility of a resin is improved.

The elastic epoxy adhesive which can be used in the present invention is, for example, Cemedine Co., Ltd., Cemedine EP-001, Three Bond Co., Ltd., 395.
0 series, 3950, 3951, 3952, Bond MOS series manufactured by Konishi Co., Ltd., MOS07, MOS1
0, Toho Kasei Kogyo Co., Ltd. Ultite 1500 series, Ultite 1540 and the like are preferably used.

The film thickness of the adhesive is preferably 100 to 800 μm, more preferably 200, including the thickness of the electronic parts.
To 800 μm, and more preferably 250 to 700 μm.

The elastic epoxy resin in the present invention is
When the epoxy resin as the main component and the curing agent are mixed, the viscosity of the mixture at 23 ° C. is 1000 to 35000 cps.
Is preferable, and more preferably 3000 to 35
000 cps. If the viscosity is 1000 cps or less, the viscosity will be too low at the time of making the card, and the liquid will flow when applied, resulting in film thickness control and film thickness unevenness, which is a problem. Further, if the viscosity is 35,000 cps or higher, coating streaks are generated during the production and the smoothness of the card is deteriorated, which is a problem.

Since the coating streak may become a coating streak when bubbles are entrapped in the coating liquid itself due to the entrainment of air during mixing, in the present invention, the ultrasonic method, the heating method and the stirring method are devised. For example, it is preferable to remove the bubbles in advance and apply.

Elastic Epoxy Adhesive 5 Used in the Present Invention
Elongation at break (%) is 50 to 5 as a physical property of resin after being cured by 00 μm.
00 is preferable, and more preferably 50 to 400%. If it is 50% or less, the adhesive has a low elongation at break, and the performance of physical strength, twisting, bending, and flexibility of the finished card itself are deteriorated. The breaking elongation is 50
If it is 0% or more, a cutting failure occurs at the time of cutting during card molding, which causes a problem.

Elastic epoxy adhesive 5 used in this invention
The resin physical property after curing to 100 μm is 2% elastic modulus (kgf / mm
It is preferably 0.01~10kgf / mm ² in ^2), 10kgf / mm ² or more in that cause cutting failure during cutting, since it becomes a problem, more preferably, 0.01~8kgf / mm ² is more preferable.

Further, the elastic epoxy adhesive according to the present invention is manufactured by the manufacturing method, that is, 8 since the predetermined electronic component is provided between the first sheet member and the second sheet member described above.
It is preferable to apply or laminate at a temperature of 0 ° C. or less. By this method, excessive heat is not applied to manufacture, so that heat contraction can be reduced to the support or the card at the time of manufacture, and a good card can be produced. This curling property was a problem because the transportability in a machine was deteriorated when writing information on a card or when a protective layer was provided, but it could be improved by the present invention. <Thermal Cationic Adhesive> A compound containing two or more epoxy groups in one molecule, and an adhesive part containing at least a compound capable of generating cations at a temperature of 10 to 150 ° C. is specifically a thermocationic adhesive. Means that. [Compound containing two or more epoxy groups in one molecule] Epoxy type UV-curable prepolymer of type (mainly epoxy type) in which polymerization occurs by cationic polymerization, monomer has an epoxy group in one molecule Prepolymers containing two or more can be mentioned. Examples of such prepolymers include alicyclic polyepoxides, polyglycidyl esters of polybasic acids, polyglycidyl ethers of polyhydric alcohols, polyglycidyl ethers of polyoxyalkylene glycols, and polyglycidyl aromatic polyols. Examples thereof include ethers, hydrogenated compounds of polyglycidyl ethers of aromatic polyols, urethane polyepoxy compounds and epoxidized polybutadienes. These prepolymers can be used alone, or in addition,
It is also possible to use a mixture of two or more thereof.

The content of the above cationically polymerizable compound in the cationically polymerizable composition is preferably 1 to 97% by weight, more preferably 30 to 95% by weight. [Compound that Generates Cations at a Temperature of 10 to 150 ° C.]
The compound that generates a cation at a temperature of 10 to 150 ° C. refers to a thermal cation initiator. The thermal cationic initiator is preferably a cationic polymerization initiator, particularly 10 to 150 ° C.
Compounds that generate cations at the temperature are preferred. Specific examples thereof include aromatic onium salts. As the aromatic onium salt, a salt of a Group Va element of the periodic table, for example, a phosphonium salt (for example, triphenylphenacylphosphonium hexafluorophosphate), a salt of a Group VIa element, for example, a sulfonium salt (for example, triphenylsulfonium tetrafluoroborate). , Triphenylsulfonium hexafluorophosphate, tris (4-thiomethoxyphenyl) hexafluorophosphate, sulfonium and triphenylsulfonium hexisafluoroantimonate), and salts of Group VIIa elements such as iodonium salts (eg, diphenyliodonium chloride). Such)
Can be mentioned.

The use of such an aromatic onium salt as a cationic polymerization initiator in the polymerization of an epoxy compound is described in US Pat. Nos. 4,058,401 and 4,0.
69,055, 4,101,513 and 4,161,478. Also, Japanese Patent Laid-Open No. 2000-10271, functional materials (May 1995 V
ol. 13, No. 5 P. It is also possible to use the thermal acid generator described in 5 to 11).

Preferred cationic polymerization initiators include sulfonium salts of Group VIa elements. Among them, from the viewpoint of ultraviolet curability and storage stability of the ultraviolet curable composition, triarylsulfonium hexafluoroantimonate is preferable. Also, Photo Polymer Handbook (Photo Polymer Conversation Edition, Industrial Research Committee issue 1
989), pages 39 to 56, known photopolymerization initiators, and compounds described in JP-A-64-13142 and JP-A-2-4804 can be optionally used.

In the present invention, a compound capable of generating a cation at a temperature of 10 to 150 ° C. is preferable, but a temperature of 50 to 150 ° C. is more preferable from the viewpoint of handling the compound. It is more preferable that the temperature is lower because the temperature history of the support during production is lowered and the heat shrinkability of the support is improved.
Specifically, a temperature of 50 to 120 ° C is more preferable.

Specifically, San-Aid SI series manufactured by Sanshin Chemical Industry Co., Ltd., San-Aid SI-60L (thermal cation generation temperature 90 ° C.), SI-80L (thermal cation generation temperature 110 ° C.), SI-100L (thermal cation). (Generation temperature 120 ° C.), Midori Kagaku Co., Ltd., NDI105 (heat cation generation temperature 100 ° C.), NB-101 (heat cation generation temperature 110 ° C.) and the like can be used, and the solid content of the adhesive is 0.1 to 30. It is preferably added by weight%, more preferably 0.5 to 20% by weight.

The adhesive containing at least two compounds in one molecule containing epoxy groups and the compound containing at least a compound capable of generating cations at a temperature of 10 to 150 ° C. are used in the present invention. In order to provide a predetermined electronic component between the sheet member and the sheet member, it is preferable to apply or bond to the sheet member at a temperature of 80 ° C. or less. By this method, excessive heat is not applied to manufacture, so that heat contraction can be reduced to the support or the card at the time of manufacture, and a good card can be produced. This curling property was a problem because the transportability in a machine was deteriorated when writing information on a card or when a protective layer was provided, but it could be improved by the present invention.

The thickness of the adhesive is preferably 100 to 800 μm, more preferably 200, including the thickness of electronic components.
To 800 μm, more preferably 250 to 700 μm. <Materials that can be added to the adhesive> Materials that can be added to the adhesive include WAX, thermoplastic resin, inorganic fine particles, leveling agent, rubber elastic particles, thermoplastic elastomer, thermoplastic resin, adhesive, curing agent, and curing. It is also possible to mix a catalyst, a leveling agent, tabular particles, acicular particles, and other additives.

The tabular grains preferably have an aspect ratio of 2 or more. The aspect ratio here means the ratio of the diameter of a circle having the same area as the projected area of tabular grains and the distance between two parallel planes. In the present invention, the aspect ratio is preferably 2 or more and less than 100, particularly preferably 2 or more and less than 50. The tabular grains of the present invention have a thickness of 3.
It is preferably 0 micron or less, preferably 2.0 micron or less.

Specifically, tabular substances such as mica, talc, layered silicate, silver halide and the like can be used.

The tabular silica-based compound which is a tabular substance refers to a layered silicate containing an alkali, an alkaline earth metal, aluminum or the like, that is, a tabular silicate,
These include kaolin minerals, mica clay minerals, smectites and the like. Kaolin minerals include kaolinite, decite, nacrite, halloysite,
Examples include serpentine stones. Examples of mica clay minerals include pyrophyllite, talc, muscovite, swelling synthetic fluoromica, sericite, and chlorite. Examples of smectite include smectite, vermiculite, and swelling synthetic fluorine vermiculite. There are two types of smectites, natural products and synthetic products. Examples of natural products include montmorillonite and beidellite, which are obtained as clay called bentonite and acid clay. Examples of synthetic smectites include, for example:
Examples include Lucentite SWN (hereinafter referred to as STT-1) and Lucentite SWF (containing 2 to 5% by weight of fluorine) (hereinafter referred to as STT-2) manufactured by Coop Chemical Co., Ltd.

The tabular grains are thin film coatings that give mica reflectivity (high iris reflection) and are coated with a metal oxide or a metal sulfide that is transparent in the visible region and has a refractive index of 2.0 or more. , For example, Sb2S3, Fe2O3,
PbO, ZnSe, CdS, Bi2O3, TiO2, P
bCl2, CeO2, Ta2O5, ZnS, ZnO, C
dO, Nd2O3, Sb2O3, SiO and InO3
It may be a single layer coating or a two-layer coating.

“Iri” which can be mentioned as such a thing
"odin" is a stable inorganic scale pigment in which the surface of natural mica is coated with a metal oxide having a high refractive index such as titanium oxide or iron oxide, and a layer of titanium oxide having a high refractive index and mica having a low refractive index The light reflected at the boundary with the medium also gives the pearl luster.

The tabular silver halide is AgB
r, AgCl, AgClBr, AgClBrI, AgB
rI, AgClBrI, etc. can be used arbitrarily. These are disclosed in U.S. Pat. Nos. 4,439,520 and 4,42.
5,425, and 4,414,304, etc., and the desired tabular grains can be easily obtained. The tabular grains can be formed by epitaxially growing silver halide having a different composition on a specific surface site or by shelling.

The tabular grains used in the present invention are preferably used in a dry weight ratio of 0.10 to 0.90 with respect to the binder of the layer to be added, and particularly preferably 0.2 to
It is 0.8. Further, tabular grains and other fine particles may be used in combination. In addition, the surface of the tabular fine particles may be subjected to a treatment such as hydrophobization if necessary. Such tabular grains can be used as an ink by adding a vehicle and additives.

As the acicular particles, barium ferrite,
Hexagonal ferrite such as strontium ferrite can be mentioned. Further, it may be a fiber piece having a high elastic modulus such as aramid fiber.

If desired, other fine particles may be used in combination. As the other fine particles, various inorganic oxides, carbides, nitrides and borides are preferably used. For example, silica, alumina, titania, zirconia, barium titanate, aluminum titanate, strontium titanate, magnesium titanate, calcium titanate,
Examples thereof include zinc oxide, chromium oxide, cerium oxide, antimony oxide, tugsten oxide, tin oxide, tellurium oxide, manganese oxide, boron oxide, silicon carbide, boron carbide, titanium carbide, silicon nitride, titanium nitride and boron nitride.

Examples of the adhesive polymer include silicones such as a mixture of silicone rubber such as polydimethylsiloxane and polydiphenylsiloxane and silicone resin such as polysiloxane having a trimethylsilyl group or triphenylsilyl group; polyesters; polyurethane. Polyethers; Polycarbonates; Polyvinyl ethers; Polyvinyl chlorides; Polyvinyl acetates; Polyisobutylenes and other non-acrylic polymers, acrylic rubber, acrylonitrile / butadiene rubber (NBR), random styrene / Butadiene rubber, butyl rubber, isoprene rubber (IR), butadiene rubber (BR), ethylene / propylene rubber (EPM),
Using synthetic rubber polymers such as ethylene / propylene / diene rubber (EPDM), urethane rubber, styrene / isoprene / styrene block rubber (SIS), styrene / ethylene / butadiene / styrene block rubber (SEBS), styrene / butadiene block rubber Good. A resin having a low heat softening point, for example, an acrylic polymer having an alkyl acrylate having a low glass transition point as a main component is preferably used because the polymer alone can exhibit appropriate pressure-sensitive adhesiveness.

Examples of preferable adhesive acrylic polymers include homopolymers or copolymers of alkyl (meth) acrylate monomers in which the alkyl group has 1 to 14 carbon atoms, and more preferably the above alkyl A copolymer of a (meth) acrylate monomer and a vinyl monomer having an unsaturated bond copolymerizable with the alkyl (meth) acrylate monomer can be mentioned.

Examples of the alkyl (meth) acrylate monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate,
2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, isomyristyl (meth) acrylate, etc. can be illustrated.

The vinyl monomer is not particularly limited as long as it is a compound having an unsaturated bond which is copolymerizable with the alkyl (meth) acrylate monomer, and (meth) acrylic acid ester other than the alkyl (meth) acrylate, Vinyl acetate, styrene, vinyl chloride, ethylene, propylene, 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate,
ε-caprolactone (meth) acrylate, 2-acryloyloxyethyl (propyl) succinic acid, (meth) acrylonitrile, N-vinylpyrrolidone, isovoltanyl (meth) acrylate, N-acryloylmorpholine, benzyl (meth) acrylate, glycidyl (meth) ) Acrylate, N-vinylcaprolactone, N-vinylpiperidine, (meth) acrylic acid, rosin epoxy (meth) acrylate, rosin modified (meth) acrylate such as rosin ester (meth) acrylate. As rosin epoxy (meth) acrylate,
Examples thereof include reaction products of rosins and glycidyl (meth) acrylate, (meth) acrylic monomers having an alicyclic epoxy group with rosins, maleic anhydride, crotonic acid, and itaconic acid. From these, the average molecular weight Mw of the acrylic copolymer is 500 to 1,000,000.
Is preferable, and more preferably 10,000 to 100,000.
It is 0. <Measurement Method of Breaking Elongation and 2% Elastic Modulus> Resin breaking elongation (%) and 2% elastic modulus in this invention are 23 ° C. and 55% RH.
After applying the adhesive of the present invention for 300 hours or more under the conditions of, the data processing is carried out using Orientec Tensilon Universal Testing Machine RTA-100, and Tensilon multifunctional data processing TYPE MP-100 / 200S.
Ver. 44 was used for the measurement. The resin fixing means was fixed by an air chuck method. Cross head speed is 5 to 100 mm / min, RANGE is 5 to 100
%, The load can be selected from 0.1 to 500 kg, but in the evaluation of the present invention, the crosshead speed is 30
mm / min, RANGE 20%, load 100 kg
The evaluation was performed under the conditions.

When measuring the elongation at break and 2% elastic modulus of the adhesive, it is particularly difficult to prepare a single film, so PP
A 500 μm resin layer was formed on the release sheet, and a desired sample was prepared and measured. For the measurement, a 1 cm wide sample was fixed to an air chuck and a tensile test was performed.

The elongation at break was determined by the elongation at break from the elongation at break when the actinic ray-curable resin was pulled or broken. [Thermosetting Resin Layer] In the present invention, the thermosetting resin composition as the image recording body protective layer is, for example, an epoxy resin,
It is possible to use a mixture of polyester resin, acrylic resin and the like with a curing agent, a curing catalyst, a leveling agent, other additives and the like.

As the composition of the polyester resin, a composition mainly containing an aromatic dicarboxylic acid such as terephthalic acid or isophthalic acid as a dicarboxylic acid component and an aliphatic diol such as ethylene glycol or neopentyl glycol as a diol component is preferable. , These include aliphatic dicarboxylic acids such as adipic acid and azelaic acid, trivalent or higher carboxylic acids such as trimellitic acid and pyromellitic acid, and trivalent or higher valency such as trimethylolethane, trimethylolpropane and pentaerythritol. Those containing a small amount of alcohol or the like are more preferable because the melt fluidity and the crosslinking reactivity are improved.

The average degree of polymerization of the polyester resin is 5
Those in the range of -50 are preferred. If it is lower than this, sufficient strength cannot be obtained when it is made into a film, and if it is higher than this, crushing becomes difficult. Next, as the curing agent, when the terminal group of polyester is -OH type, there are an isocyanate compound and a melamine resin, for example, ε-caprolactam block isocyanate and methylated melamine. Examples of the -COOH type terminal group include epoxy resin and triglycidyl isocyanurate. [Photocurable resin layer] Specifically, the photocurable resin layer as the protective layer for the image recording material is made of a material having an addition polymerization property or a ring-opening polymerization property.
Radical-polymerizable compounds such as JP-A-7-159983
No. 7, Japanese Patent Publication No. 7-31399, Japanese Patent Application No. 7-231444
It may be a photocurable material using a photopolymerization (including heat-polymerizable) composition described in each publication such as Japanese Patent Application No. 7-231444. As the addition polysynthetic compound, a cationic polymerization type photocurable material is known, and recently, a cationic photopolymerization type photocurable material sensitized to a long wavelength region longer than visible light is also disclosed in, for example, JP-A-6- It is disclosed in Japanese Patent Publication No. 43633. A composition is disclosed in Japanese Patent Application Laid-Open No. 4-181944 as a photopolymerization material of hybrid type. Specifically, it is a photocurable layer containing any of the above-mentioned cationic initiator, cationically polymerizable compound, radical initiator, and radically polymerizable compound, and any photocurable layer is used for the purpose of the present invention. I don't mind. [Radical Polymerization Initiator] As the radical polymerization initiator,
Triazine derivatives described in JP-B-59-1281, JP-B-61-9621 and JP-A-60-60104, JP-A-59-1504 and JP-A-61-2.
Organic peroxides described in various publications such as 43807, JP-B-43-23684, JP-B-44-6413, JP-B-44-6413 and JP-B-47-1604, and U.S. Pat. Diazonium compounds described in US Pat. No. 2,848,328.
No. 2,852,379 and 2,940,85
No. 3, organic azide compounds described in each specification, JP-B-36-
22062, JP37-13109, JP38
-18015, Japanese Patent Publication No. 45-9610 and the like, ortho-quinone diazides described in Japanese Patent Publication No. 55-391.
62, JP-A-59-14023 and the like, and "Macromolecules,"
Various onium compounds described in Volume 10, page 1307 (1977), azo compounds described in JP-A-59-142205, JP-A-1-54440, European Patent 109,851, European Patents. 126th,
No. 712, etc., “Journal of Imaging Science” (J.Imag.Sci.) ”, Volume 30, p. 174 (1986), Japanese Patent Application No. 4- 56831 Specification and Japanese Patent Application No. 4-8
(Oxo) sulfonium organoboron complex described in Japanese Patent No. 9535, titanocene described in JP-A-61-151197, and "coordination chemistry.
Review (Coordination Chemist
ry Review) ", Vol. 84, Nos. 85-277
Page) (1988) and transition metal complexes containing a transition metal such as ruthenium described in JP-A-2-182701, 2,4,5 in JP-A-3-209477.
-Triarylimidazole dimer, carbon tetrabromide, organic halogen compounds described in JP-A-59-107344, and the like. These polymerization initiators are preferably contained in the range of 0.01 to 10 parts by weight with respect to 100 parts by weight of the compound having a radically polymerizable ethylenic unsaturated bond.

The photosensitive composition containing a radical-polymerizable compound contains, as a thermal polymerization initiator of a radical-polymerizable monomer, a known radical-polymerization initiator generally used in a polymer synthesis reaction by radical polymerization without particular limitation. Can be made. Here, the thermal polymerization initiator is a compound capable of generating a polymerizable radical by applying heat energy.

Examples of such a compound include 2,
2'-azobisisobutyronitrile, 2,2'-azobispropionitrile and other azobisnitrile compounds, benzoyl peroxide, lauroyl peroxide, acetyl peroxide,
T-Butyl perbenzoate, α-cumyl hydroperoxide, di-t-butyl peroxide, diisopropyl peroxydicarbonate, t-butyl peroxyisopropyl carbonate, peracids, alkyl peroxycarbamates, nitrosoaryl acylamines Such as organic peroxides such as potassium persulfate, potassium persulfate, ammonium persulfate, potassium perchlorate and the like, diazoaminobenzene, p-nitrobenzenediazonium, azobis-substituted alkanes, diazothioethers, arylazosulfones, etc. Azo or diazo compounds, nitrosophenyl urea, tetramethyl thiuram disulfide, diaryl disulfides, dibenzoyl disulfide, tetraalkyl thiuram disulfides, dialkyl xanthate disulfides Aryl sulfinic acids, arylalkyl sulfonic acids, it may be mentioned 1-alkanoic sulfinic acids and the like.

Particularly preferred among these are compounds which are excellent in stability at room temperature, have a high decomposition rate upon heating, and become colorless upon decomposition, and the initiator is usually used in all polymerizable compositions. 0.1 to 30% by weight is preferable, 0.5 to 20
A range of weight% is more preferable. [Radical Polymerization Photocurable Resin] The radical polymerizable compound contained in the radical polymerizable composition includes ordinary photopolymerizable compounds and thermopolymerizable compounds. The radical-polymerizable compound is a compound having a radical-polymerizable ethylenically unsaturated bond, and may be any compound as long as it has at least one radical-polymerizable ethylenically unsaturated bond in the molecule. , Oligomers,
Those having a chemical form such as a polymer are included. The radical-polymerizable compound may be used alone, or two or more kinds thereof may be used in combination at an arbitrary ratio in order to improve target properties.

Examples of the radically polymerizable compound having an ethylenically unsaturated bond include unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid and maleic acid, and salts and esters thereof.
Radical polymerizable compounds such as urethane, amide and anhydride, acrylonitrile, styrene, and various unsaturated polyesters, unsaturated polyethers, unsaturated polyamides and unsaturated urethanes can be mentioned.

Specifically, 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, butoxyethyl acrylate, carbitol acrylate, cyclohexyl acrylate, tetrahydrofurfuryl acrylate, benzyl acrylate, bis (4-acryloxypolyethoxyphenyl) propane, Neopentyl glycol diacrylate, 1,6-hexanediol diacrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, tetraethylene glycol diacrylate, polyethylene glycol diacrylate, polypropylene glycol diacrylate, pentaerythritol triacrylate. , Pentaerythritol tetraacrylate, Acrylic acid derivatives such as pentaerythritol tetraacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, oligoester acrylate, N-methylol acrylamide, diacetone acrylamide, epoxy acrylate, methyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate. , Lauryl methacrylate, allyl methacrylate, glycidyl methacrylate, benzyl methacrylate, dimethylaminomethyl methacrylate, 1,6-hexanediol dimethacrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, polypropylene glycol dimethacrylate, Trimethylol ethane trimethacrylate, trimethylol propane trimethacrylate, 2,2-bis (4-methacryloxy polyethoxy phenyl) methacrylamide derivatives such as propane, other, allyl glycidyl ether, diallyl phthalate,
Examples thereof include derivatives of allyl compounds such as triallyl trimellitate, and more specifically, Shinzo Yamashita, "Handbook of Crosslinking Agents", (1981, Taiseisha); Kiyomi Kato,
"UV / EB Curing Handbook (Raw Materials)" (1985)
Year, Polymer Society); Edited by Radtech, “UV / E”
Application and Market of B Curing Technology ", p. 79, (1989, CMC); Eiichiro Takiyama," Polyester Resin Handbook ", (1988, Nikkan Kogyo Shimbun), etc., or known in the industry. Radical polymerizable or crosslinkable monomers, oligomers and polymers can be used. The amount of the radically polymerizable compound added to the radically polymerizable composition is preferably 1 to 97% by weight,
More preferably, it is 30 to 95% by weight. [Acid-Crosslinking Photocurable Resin] The crosslinking agent used in the acid-crosslinking composition of the present invention is a compound that causes a crosslinking reaction by the acid generated from the specific compound of the present invention upon irradiation with actinic light or radiation. The cross-linking agent preferably used in this invention is a compound having two or more hydroxymethyl groups, alkoxymethyl groups, epoxy groups or vinyl ether groups in the molecule. Preferred are compounds in which these crosslinkable functional groups are directly bonded to the aromatic ring. Specific examples thereof include methylol melamine, resole resin, epoxidized novolac resin, and urea resin.
Further, compounds described in "Crosslinking Agent Handbook" (written by Shinzo Yamashita and Tosuke Kaneko, Taiseisha Co., Ltd.) are also preferable. In particular, a phenol derivative having two or more hydroxymethyl groups or alkoxymethyl groups in the molecule is preferable because the strength of the image area when an image is formed is good. Specific examples of such a phenol derivative include a resol resin.

However, these cross-linking agents are unstable to heat, and the storage stability after the image recording material is prepared is not so good. On the other hand, it has two or more hydroxymethyl groups or alkoxymethyl groups bonded to the benzene ring in the molecule and has a molecular weight of 1,200.
The following phenol derivatives have good stability during storage and are most preferably used in the present invention. The alkoxymethyl group preferably has 6 or less carbon atoms. Specifically, a methoxymethyl group, an ethoxymethyl group,
n-propoxymethyl group, isopropoxymethyl group, n
-Butoxymethyl group, isobutoxymethyl group, sec-
A butoxymethyl group and a t-butoxymethyl group are preferable.
Furthermore, an alkoxy-substituted alkoxymethyl group such as a 2-methoxyethoxymethyl group and a 2-methoxy-1-propoxymethyl group is also preferable. In particular,
JP-A-6-282067 and JP-A-7-64285
Examples thereof include compounds described in Japanese Patent Publication No. 632,003A1 and the like.

Other cross-linking agents preferably used in the present invention include aldehyde and ketone compounds. Preferred is a compound having two or more aldehydes or ketones in the molecule.

In the present invention, the crosslinking agent is used in an amount of 5 to 70% by weight, preferably 10 to 65% by weight, based on the total solid content of the image recording material. 5% by weight of crosslinking agent
If it is less than 70% by weight, the film strength of the image portion when an image is recorded is deteriorated, and if it exceeds 70% by weight, the stability during storage is not preferable. These crosslinking agents may be used alone or in combination of two or more kinds. [Cationic Polymerization Initiator] The initiator is preferably a cationic polymerization initiator, and specific examples thereof include aromatic onium salts. As the aromatic onium salt, a salt of a Group Va element of the periodic table, for example, a phosphonium salt (for example, triphenylphenacylphosphonium hexafluorophosphate), a salt of a Group VIa element, for example, a sulfonium salt (for example, triphenylsulfonium tetrafluoroborate). , Triphenylsulfonium hexafluorophosphate, tris (4-thiomethoxyphenyl) hexafluorophosphate, sulfonium and triphenylsulfonium hexisafluoroantimonate), and No. VII
A salt of a group a element such as an iodonium salt (eg, diphenyliodonium chloride) can be used.

The use of such an aromatic onium salt as a cationic polymerization initiator in the polymerization of an epoxy compound is described in US Pat. Nos. 4,058,401 and 4,058.
69,055, 4,101,513 and 4,161,478.

Preferred cation polymerization initiators include sulfonium salts of Group VIa elements. Among them, from the viewpoint of ultraviolet curability and storage stability of the ultraviolet curable composition, triarylsulfonium hexafluoroantimonate is preferable. Also, Photo Polymer Handbook (Photo Polymer Conversation Edition, Industrial Research Committee issue 1
989), pages 39 to 56, known photopolymerization initiators, and compounds described in JP-A-64-13142 and JP-A-2-4804 can be optionally used. [Cationic polymerization type photocurable resin] An epoxy type UV-curable prepolymer of a type (mainly epoxy type) in which polymerization is caused by cationic polymerization, and a monomer is a prepolymer containing two or more epoxy groups in one molecule. Can be mentioned. As such a prepolymer,
For example, alicyclic polyepoxides, polyglycidyl esters of polybasic acids, polyglycidyl ethers of polyhydric alcohols, polyglycidyl ethers of polyoxyalkylene glycols, polyglycidyl ethers of aromatic polyols, polyglycols of aromatic polyols. Examples thereof include hydrogenated compounds of glycidyl ethers, urethane polyepoxy compounds and epoxidized polybutadienes. These prepolymers may be used alone or in a mixture of two or more.

The content of the prepolymer having two or more epoxy groups in one molecule is preferably 70% by weight or more. As the cationically polymerizable compound contained in the cationically polymerizable composition, for example, the following (1) styrene derivative, (2) vinylnaphthalene derivative, (3) vinyl ethers, and (4) N-vinyl compounds may be used. Can be mentioned. (1) Styrene derivative For example, styrene, p-methylstyrene, p-methoxystyrene, β-methylstyrene, p-methyl-β-methylstyrene, α-methylstyrene, p-methoxy-β-
Methylstyrene etc. (2) Vinylnaphthalene derivative, for example, 1-vinylnaphthalene, α-methyl-1-vinylnaphthalene, β-methyl-1-vinylnaphthalene, 4
-Methyl-1-vinylnaphthalene, 4-methoxy-1-
(3) Vinyl ethers such as vinyl naphthalene, for example, isobutyl vinyl ether, ethyl vinyl ether, phenyl vinyl ether, p-methylphenyl vinyl ether, p-methoxyphenyl vinyl ether,
α-Methylphenyl vinyl ether, β-methyl isobutyl vinyl ether, β-chloroisobutyl vinyl ether, etc. (4) N-vinyl compounds such as N-vinylcarbazole, N-vinylpyrrolidone, N-vinylindole, N-vinylpyrrole, N-
Vinylphenothiazine, N-vinylacetanilide, N
-Vinylethylacetamide, N-vinylsuccinimide, N-vinylphthalimide, N-vinylcaprolactam, N-vinylimidazole and the like.

The content of the above-mentioned cationically polymerizable compound in the cationically polymerizable composition is preferably 1 to 97% by weight, more preferably 30 to 95% by weight. [Hybrid photo-curable resin layer] Hybrid type (combination of radical polymerizable type and cationic polymerization type)
When is used, the composition is disclosed in JP-A-4-181944. Specifically, any one of the above-mentioned cationic initiator, cationically polymerizable compound, radical-based initiator, and radically polymerizable compound may be included. It is preferable to use. [Photocurable Adhesive Additive] To be added as an additive for controlling the temperature at which a predetermined electronic component can be adhered between the first sheet member and the second sheet member of the present invention to 80 ° C. or less. Is more preferable. The addition amount is preferably 5 to 80% by weight, more preferably 10% by weight based on the total solid content of the photocurable adhesive layer.
Is about 70% by weight.

Examples of preferable adhesive acrylic polymers include homopolymers or copolymers of alkyl (meth) acrylate monomers in which the alkyl group has 1 to 14 carbon atoms, and more preferably the above alkyl A copolymer of a (meth) acrylate monomer and a vinyl monomer having an unsaturated bond copolymerizable with the alkyl (meth) acrylate monomer can be mentioned.

Examples of the alkyl (meth) acrylate monomer include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate,
2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, isomyristyl (meth) acrylate, etc. can be illustrated.

The vinyl monomer is not particularly limited as long as it is a compound having an unsaturated bond copolymerizable with the alkyl (meth) acrylate monomer, and a (meth) acrylic acid ester other than the alkyl (meth) acrylate, Vinyl acetate, styrene, vinyl chloride, ethylene, propylene, 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate,
ε-caprolactone (meth) acrylate, 2-acryloyloxyethyl (propyl) succinic acid, (meth) acrylonitrile, N-vinylpyrrolidone, isovoltanyl (meth) acrylate, N-acryloylmorpholine, benzyl (meth) acrylate, glycidyl (meth) ) Acrylate, N-vinylcaprolactone, N-vinylpiperidine, (meth) acrylic acid, rosin epoxy (meth) acrylate, rosin modified (meth) acrylate such as rosin ester (meth) acrylate. As rosin epoxy (meth) acrylate,
Examples thereof include reaction products of rosins and glycidyl (meth) acrylate, (meth) acrylic monomers having an alicyclic epoxy group with rosins, maleic anhydride, crotonic acid, and itaconic acid. From these, the average molecular weight Mw of the acrylic copolymer is 500 to 1,000,000.
Is preferable, and more preferably 10,000 to 100,000.
It is 0. [Other Additives to Photocurable Resin Layer] <Sensitizer> The photosensitive composition of the present invention is a composition in which various sensitizers are combined to obtain light from the ultraviolet to near infrared region. It is possible to obtain a polymerizable composition having an extremely high sensitivity to the above and having an extremely high sensitivity. Specific examples of the sensitizer in the present invention include unsaturated ketones represented by chalcone derivatives and dibenzalacetone, 1,2-diketone derivatives represented by benzyl and camphorquinone, benzoin derivatives, and fluorene. Derivative, naphthoquinone derivative, anthraquinone derivative, xanthene derivative,
Thioxanthene derivative, xanthone derivative, thioxanthone derivative, coumarin derivative, ketocoumarin derivative, cyanine derivative, styryl derivative, merocyanine derivative,
Polymethine dyes such as oxonol derivatives, acridine derivatives, azine derivatives, thiazine derivatives, oxazine derivatives, indoline derivatives, azulene derivatives, azurenium derivatives, squarylium derivatives, porphyrin derivatives,
Tetraphenylporphyrin derivative, triarylmethane derivative, tetrabenzoporphyrin derivative, tetrapyrazinoporphyrazine derivative, phthalocyanine derivative,
Tetraazaporphyrazine derivative, tetraquinoxalyloporphyrazine derivative, naphthalocyanine derivative, subphthalocyanine derivative, pyrylium derivative, thiopyrylium derivative, tetraphyllin derivative, annulene derivative,
Examples include spiropyran derivatives, spirooxazine derivatives, thiospiropyran derivatives, metal arene complexes, organic ruthenium complexes, and more specifically, Nobu Okawara et al., "Dye Handbook" (1986, Kodansha), Nobu Okawara et al. "The Chemistry of Functional Dyes" (1981, CMC), edited by Chuzaburo Ikemori, "Special Functional Materials" (19
1986, CMC), and the dyes and sensitizers described in Japanese Patent Application No. 7-108045 and the like, but are not limited to these, in addition, to the light in the ultraviolet to the near infrared region Examples thereof include dyes and sensitizers that exhibit absorption, and two or more kinds of these may be used in an arbitrary ratio as needed. <Polymerization accelerator, chain transfer agent, etc.> A polymerization accelerator and a chain transfer catalyst can be added to the photosensitive composition of the present invention. Specific examples thereof include amines such as N-phenylglycine, triethanolamine, N, N-diethylaniline, U.S. Pat. No. 4,414,312 and JP-A-64-1.
Thiols described in 3144, JP-A-2-291561
Disulfides described in U.S. Pat. No. 3,558,32
2, thiones described in JP-A No. 64-17048, o-acylthiohydroxamates and N-alkoxypyridine thiones described in JP-A-2-291560. <Polymerization Inhibitor> In the radical-polymerizable composition containing the radical-polymerizable compound, a photo-curable resin layer may contain a polymerization inhibitor for the purpose of preventing polymerization during storage of the liquid. Specific examples of the thermal polymerization inhibitor that can be added to the radically polymerizable composition include p-methoxyphenol, hydroquinone, alkyl-substituted hydroquinone, catechol and te.
Examples thereof include rt-butylcatechol and phenothiazine. These thermal polymerization inhibitors are added in the range of 0.001 to 5 parts by weight with respect to 100 parts by weight of the compound having a radically polymerizable ethylenically unsaturated bond. Preferably. <Antistatic Agent> As the antistatic agent, a cationic surfactant, an anionic surfactant, a nonionic surfactant,
In addition to polymeric antistatic agents, conductive fine particles, etc.
Chemical products of No. 0 ”, Kagaku Kogyo Nippo Co., Ltd., compounds described in p875-876 and the like. <Surfactant> Further, in the image forming layer of the image forming material of the present invention, JP-A No. 62-251740 and JP-A No. 3-251740.
Nonionic surfactants as described in JP-A-208514 and the like, or JP-A-59-121044.
And amphoteric surfactants such as those described in JP-A-4-13149 and the like can be added.

Further, surfactants such as silicone oil and silicone-alkylene oxide copolymer (for example, L-5410 commercially available from Union Carbide Co.), silicone-based activators such as those manufactured by Nippon Unicar, and silicone oil-containing Examples thereof include aliphatic epoxides and silicon-containing monoepoxides. It is also possible to use Si-based additives described in "New Silicone and Its Applications" issued by Toshiba Silicone Co., Ltd. in 1994, "Special Silicone Reagent Catalog" issued by Asmax Co., Ltd. in 1996, etc. The addition amount is preferably 0.001 to 1% by weight. <Resin> In addition to the adhesive polymer, polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolac resin, vinyl monomer such as styrene, paramethylstyrene, methacrylic acid ester, acrylic acid ester and cellulose type , Any other high-molecular polymer such as thermoplastic polyester and natural resin may be used in combination. In addition, in addition, Kiyoshi Akamatsu's supervision, "Practical Technology of New Photosensitive Resin," (CMC, 1987) and "10188 Chemical Products" pp. 657-767 (Kagaku Kogyo Nippo, 1988) You may use together the organic high molecular polymer of.

In the present invention, an unsaturated group-containing resin is particularly preferable, and is characterized in that it contains a group which can be polymerized by a radical or an acid, and the unsaturated group here means a glycidyl group, a (meth) acryloyl group, Represents a vinyl group and the like. Specifically, a resin having a structure shown below can be given. The content of these high molecular weight polymers in the photosensitive composition is preferably in the range of 1 to 70% by weight,
The range of 5 to 50% by weight is more preferable. <Coating Solvent> In the present invention, the coating solvent is not limited, and when a coating solvent is used, it is described in detail in “Solvent Handbook” published by Kodansha. There are no particular restrictions on the use of these organic solvents.

The photosensitive composition of the present invention further comprises an oxygen scavenger and reducing agent such as dyes, organic and inorganic pigments, phosphines, phosphonates and phosphites, antifoggants, antifading agents and antihalation agents according to the purpose. , Fluorescent whitening agents, colorants, bulking agents, plasticizers, flame retardants, antioxidants, UV absorbers, foaming agents, antifungal agents, additives that impart various properties such as magnetic substances, diluent solvents, etc. You may mix and use it. [Method of Forming Heat or Photocurable Resin Layer] When the heat or photocurable resin layer is formed on the image recording body, it is preferable to form it by a coating method or transfer foil.

When coating is selected as a method for protecting the image recording material, conventionally known methods such as spin coating, wire bar coating, dip coating, felt coating, air knife coating, spray coating, air spray coating, electrostatic coating are used. Methods such as air spray coating, roll coating blade coating and curtain coating are used. At this time, the coating amount varies depending on the application, but is, for example, 0.05 to 50.0 g as solid content.
A coating amount of / m2 is preferable. Although the apparent sensitivity increases as the coating amount decreases, the film characteristics and chemical resistance of the image forming layer decrease.

As a method for curing after coating, any method for generating an active electromagnetic wave can be used. For example,
Examples thereof include lasers, light emitting diodes, xenon flash lamps, halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, mercury lamps and electrodeless light sources. Preferably a xenon lamp,
Examples of the light source include halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, and mercury lamps. Can be used. [Active curing line] When a laser is used as a light source,
It is easy to reduce the exposure area to a very small size, and high-resolution image formation is possible. As a laser light source, any of an argon laser, a He-Ne gas laser, a YAG laser, a semiconductor laser and the like can be preferably used.

When photocuring is performed using actinic rays,
A means for stabilizing photocuring in a nitrogen stream under reduced pressure may be used. [Heat treatment] Heat energy can be applied, and as the means, an oven, a heat roller, a hot stamp, a thermal head, a laser beam, an infrared flash, a hot pen, etc. can be selected and used as appropriate.

For protection of the heat- or photo-curable resin layer of the present invention, a transparent protective layer ribbon or transparent protective foil formed by coating on a heat-resistant support such as a polyethylene terephthalate resin film is prepared in advance. Alternatively, it can be formed by thermal transfer using, for example, a thermal head or a thermal transfer roll. <General Description of Image Forming Method of Image Recording Body> The image recording body of the present invention is provided with an image element, and a substrate provided with at least one selected from an authentication identification image such as a face image, an attribute information image and format printing. It is formed on the image side or the printing surface side above.

The face image is usually a full-color image having gradation, and is produced by, for example, a sublimation-type thermal transfer recording system or a silver halide color photographic system. The character information image is composed of a binary image, and is produced by, for example, a fusion type thermal transfer recording system, a sublimation type thermal transfer recording system, a silver halide color photographic system, an electrophotographic system, an inkjet system or the like. In the present invention, it is preferable to record an authentication identification image such as a face image and an attribute information image by a sublimation thermal transfer recording system.

The attribute information is a name, address, date of birth, qualification, etc., and the attribute information is usually recorded as character information, and a melting type thermal transfer recording method is generally used. Format printing or information recording may be performed by any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, inkjet method, sublimation transfer method, electrophotographic method, heat melting method, etc. Can also be formed.

Further, for the purpose of preventing forgery / alteration, watermark printing, hologram, fine print, etc. may be adopted. The anti-counterfeiting / alteration layer is appropriately selected from printed matter, holograms, barcodes, matte patterns, fine prints, tint patterns, uneven patterns, etc. It is composed of a vapor deposition layer, a glass vapor deposition layer, a bead layer, an optical change element layer, a pearl ink layer, an adjacent piece pigment layer and the like. <Sublimation Image Forming Method> The sublimation-type thermal transfer recording ink sheet can be composed of a support and a sublimable dye-containing ink layer formed thereon. -Support-The support is not particularly limited as long as it has good dimensional stability and can withstand heat during recording with a thermal head, and any known support can be used. —Sublimable Dye-Containing Ink Layer— The sublimable dye-containing ink layer basically contains a sublimable dye and a binder.

Examples of the sublimable dye include cyan dye, magenta dye and yellow dye.

As the cyan dye, there is disclosed JP-A-59-7.
8896, 59-227948, and 60.
No. 24966, No. 60-53563, and No. 6
No. 0-130735, No. 60-131292, No. 60-239289, No. 61-19396.
No. 61-29293, No. 61-3129.
No. 2, gazette 61-31467, gazette 61-359.
94, 61-49893, 61-14.
No. 8269, No. 62-191191, No. 63.
-912288, 63-91287, and 6
Examples thereof include naphthoquinone dyes, anthraquinone dyes, and azomethine dyes described in JP-A-3-290793.

As the magenta dye, there is disclosed in JP-A-59-
No. 78896, No. 60-30392, and No. 60
-30394, 60-253595, 61-262190, 63-5992,
No. 63-205288, No. 64-159, and No. 6
Examples thereof include anthraquinone dyes, azo dyes, azomethine dyes, and the like described in each publication such as 4-63194.

As the yellow dye, JP-A-59-78 can be used.
No. 896, No. 60-27594, and No. 60-3.
No. 1560, No. 60-53565, No. 61-
Examples thereof include methine dyes, azo dyes, quinophthalone dyes, and anthrythothiazole dyes described in each of the publications such as 12394 and 63-122594.

Particularly preferred as the sublimable dye is a compound having an active methylene group of open or closed type, which is an oxidized product of p-phenylenediamine derivative or p-phenylenediamine derivative.
Azomethine dye obtained by coupling reaction with aminophenol derivative oxidant and indoaniline obtained by coupling reaction with phenol or naphthol derivative or p-phenylenediamine derivative oxidant or p-aminophenol derivative oxidant It is a pigment.

When a metal ion-containing compound is blended in the image receiving layer, a sublimable dye which reacts with the metal ion-containing compound to form a chelate is contained in the sublimable dye-containing ink layer. Is good. Examples of such a sublimable dye capable of forming a chelate include, for example, JP-A-59.
-78893, 59-109349, Japanese Patent Application No. 2-
No. 213303, No. 2-214719, No. 2-203
Cyan dyes, magenta dyes and yellow dyes which are capable of forming at least a bidentate chelate as described in JP-A No. 742 can be mentioned.

A preferred sublimable dye capable of forming a chelate can be represented by the following general formula.

X1-N = N-X2-G wherein X1 is necessary to complete an aromatic carbocycle or a heterocycle in which at least one ring is composed of 5 to 7 atoms. At least one of the adjacent carbon atoms, which represents a group of atoms and is bonded to an azo bond, is a carbon atom substituted with a nitrogen atom or a chelating group. X2
Represents an aromatic heterocycle or an aromatic carbocycle in which at least one ring is composed of 5 to 7 atoms. G represents a chelating group.

With respect to any of the sublimable dyes, the sublimable dye contained in the ink layer containing the sublimable dye may be any one of a yellow dye, a magenta dye, and a cyan dye if the image to be formed is a single color. It may be present, and depending on the color tone of the image to be formed, any two or more of the above three types of dyes or another sublimable dye may be included. The amount of the sublimable dye used is usually 1
It is 0.1 to 20 g, preferably 0.2 to 5 g per m ² .

The binder for the ink layer is not particularly limited, and conventionally known binders can be used. Further, various conventionally known additives can be appropriately added to the ink layer.

For the sublimation type thermal transfer recording ink sheet, an ink layer-forming coating liquid prepared by dispersing or dissolving the various components forming the ink layer in a solvent is prepared and coated on the surface of a support. It can be manufactured by working and drying. The thickness of the ink layer thus formed is usually
0.2 to 10 μm, preferably 0.3 to 3 μm
Is. [Watermark printing] Japanese Patent Laid-Open Nos. 7-150093 and 20
No. 00-37978, JP-A-1-43581, JP-A-9-193294 and the like may be used for the watermark printing. Specifically, each layer constituting the base material layer or the base material It is preferable to provide a hiding layer either between the layer and the image receiving layer or between the substrate layer and the writing layer. Watermark printing can be performed on the concealing layer, and by having the concealing layer on which the watermark is printed, forgery or alteration of the ID card material can be prevented.

The preferable hiding layer can be formed by incorporating a pigment into a resin such as polyolefin, vinyl chloride resin, ABS resin or the like. Examples of the pigment include titanium white, magnesium carbonate, zinc oxide, barium sulfate, silica, talc, clay, calcium carbonate and the like.

The hiding layer may be white to gray. White pigments are preferred in this invention. The white pigment may be contained in any of the layers constituting the base material layer in the above various aspects. For example, a white pigment can be added to the polyethylene layer or the polypropylene layer. Further, a white pigment can be blended in the biaxially stretched polyester film layer forming the composite layer or the biaxially stretched polyester film single layer as the base material layer. By blending the white pigment, it is possible to further improve the sharpness of the image formed in the subsequent step. The content of these white pigments in each layer is usually 0.5 to 50.0% by weight, preferably 5.0 to 40.0% by weight.

In each of the base material layers of the above embodiments, each layer constituting the base material layer may contain various additives as necessary and in order to improve various performances.
Any of the substrate layers of the above aspects, coating method, laminating method,
It can be formed by a conventionally known method such as a coextrusion method, a hot melt extrusion method, or a printing method. When the base material layer is formed by the laminating method, it is preferable to interpose an adhesive layer between the respective layers constituting the base material layer. [Pearl ink layer] As the scaly powder (hereinafter referred to as scaly pigment), a metal oxide having a refractive index of 2.0 or more, which is transparent in the visible range, as a thin film coating that gives mica reflectivity (high iris reflection) It is coated with metal sulfide, etc.
For example, Sb2S3, Fe2O3, PbO, ZnSe,
CdS, Bi2O3, TiO2, PbCl2, CeO
2, Ta2O5, ZnS, ZnO, CdO, Nd2O
3, a single layer coating of Sb2O3, SiO and InO3,
Alternatively, it is formed by coating two layers.

When the mica and the metal oxide film are combined, the difference in the refractive index between them is larger than 0.4, so that the incident white light is reflected in a large amount, and at the same time, the sub-side at the interface between the mica and the metal oxide film. Since it causes refraction, it becomes highly iris reflective,
It works to promote the discoloration effect more effectively.

At this time, by controlling the film thickness of the metal oxide film that coats the mica, it is possible to obtain a scaly pigment having a high rainbow reflectivity with an arbitrary color tone. The film thickness is preferably 10.10000 angstroms, and more preferably 200.5000 angstroms, since it provides high iris reflection in the visible range. Specifically, JP-A-6-145553
JP-A-8-209024, JP-A-8-26935.
No. 8, JP-A-10-101957, JP-A-11-27.
3932, JP-A-11-315219, JP-A-200
0-1628, JP 2000-44834, JP 1-
The pigments described in Japanese Patent No. 158077 can be used. Examples of commercially available scale pigments include "Iriodin" (trade name, manufactured by MERCK).

"Iriodin" is a stable inorganic scale pigment in which the surface of natural mica is coated with a metal oxide having a high refractive index such as titanium oxide and iron oxide, and is a titanium oxide layer having a high refractive index and a low refractive index. The light reflected at the boundary between the mica and the surrounding medium is what gives the pearl luster. In this "Iriodin", a specific color of the iris color can be emphasized by changing the film thickness of the coated titanium oxide. Such a scale pigment contains a vehicle and an additive in a mixture with a colorant. Add it to ink and use it.

The scale pigments used in the color change printing layer may be those described above as long as the scale pigments used in the reflective layer have different coherence. There are also gold type and silver type.

Hereinafter, embodiments of the transfer foil and the method for producing an image recording material of the present invention will be described with reference to the drawings, but the present invention is not limited to the description of the embodiments and the drawings. First, a first embodiment is shown in FIGS. 2 and 3, FIG. 2 is a schematic configuration diagram of an image recording medium producing apparatus, and FIG. 3 is a diagram showing a layer configuration of the image recording medium.

In the image recording medium producing apparatus of this embodiment, the card base material supplying section 10 and the information recording section 2 are provided at the upper position.
0 is arranged, the protection imparting part and / or the optical change element imparting part 40, the actinic ray curing layer imparting part and / or the actinic ray irradiating part 90 are disposed in the lower position to prepare a card as an image recording body, You can also create sheets.

In the card base material supply unit 10, a plurality of card base materials 50 preliminarily cut into a sheet shape for writing the personal information of the card user are stocked with the face for recording a face up. Has been done. In this example, the card substrate 5
0 is composed of a support 51 and an image receiving layer 52, and the card bases 50 are automatically supplied one by one from the card base supply unit 10 at a predetermined timing.

In the information recording section 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged corresponding to them. By heat transfer using a heat transfer sheet such as a yellow ribbon, a magenta ribbon, and a cyan ribbon, the card substrate 50
While the image is being moved, an image area 53 having a gradation such as a facial photograph of the card user is recorded in a predetermined area of the image receiving layer 52. Further, the character ribbon cassette 31 and the recording head 32 are arranged, and the thermal identification by the thermal transfer sheet such as the character ribbon, the authentication identification information 5 such as the name and the card issuing date.
4 is recorded and an image recording layer is formed.

A transfer foil cassette 41 is disposed in the protection imparting section and / or the optical change element imparting section 40, and a thermal transfer head 42 is disposed corresponding to the transfer foil cassette 41. The transparent protective transfer foil 64 and / or the optically variable element transfer foil 43 is thermally transferred to provide the transparent protective transfer layer 640 and / or the optically variable element transfer layer 430.

Thereafter, an actinic ray curable liquid is applied by the actinic ray curable layer applying section and / or the actinic ray irradiating section 90 and exposed by an actinic ray to obtain the layer structure of the image recording body having the structure shown in FIG. An actinic ray curing layer 650 is provided on the transparent protective transfer layer 640 and / or the optical change element transfer layer 430.

Next, a second embodiment is shown in FIGS. 4 and 5, FIG. 4 is a schematic configuration diagram of an image recording medium producing apparatus, and FIG. 5 is a diagram showing a layer configuration of the image recording medium.

In the image recording medium producing apparatus according to this embodiment, the card base material supplying section 10 and the information recording section 20 have the same structure, but the information recording section 20 is followed by a protection imparting section and / or an optical change element imparting section. The part 40 and the resin applying part 60 are arranged.

In the protection imparting section and / or the optical change element imparting section 40, the transparent protective transfer layer 640 and / or the optical change element transfer layer 430 are provided. In the resin applying section 60, the curable transfer foil 66 is thermally transferred onto the image recording body formed by the transparent protective transfer layer 640 and / or the optically variable element transfer layer 430 on the image receiving layer 52 to transfer the curable protective layer-containing transfer layer 660. Is provided.

Next, a third embodiment is shown in FIGS. 6 and 7, FIG. 6 is a schematic view of an image recording medium producing apparatus, and FIG. 7 is a diagram showing a layer structure of the image recording medium.

In the image recording medium producing apparatus of this embodiment, the card base material supplying section 10 and the information recording section 20 have the same structure, but the transparent protective layer and / or the optical change element transfer imparting section / or the resin layer imparting section. 70 is arranged.

In the transparent protective layer and / or the optical change element transfer applying section / or the resin layer applying section 70, the transfer cassette 7 is provided.
1 is arranged, and a thermal transfer head 72 is arranged corresponding to the transfer foil cassette 71. The curable resin layer-containing optical change element transfer foil 44 is transferred to provide the curable resin layer-containing optical change element transfer layer 440.

In the present invention, the transparent protective transfer foil is a transparent protective foil that protects an image, and the transparent protective layer is a transparent protective layer that protects an image. Further, the resin layer is a layer having a resin which defines the elongation at break and the coefficient of friction according to the present invention. The active cured resin layer is a part of the type of the resin layer, which is a preferred embodiment in the present invention, but may be limited to the resin layer in manufacturing as shown in FIGS. 1 and 2. The curable protective layer-containing optical change element layer refers to a layer in which the cured layer and the optical change element layer are integrated. The protective property imparting transfer foil means a transfer foil including at least one resin layer (preferably actinic ray curable resin).

Next, an embodiment of the transparent protective transfer foil 64 is shown in FIG. The transparent protective transfer foil 64 of FIG. 8A is composed of a transparent protective transfer layer 640 and a support 64b. The transparent protective transfer layer 640 includes a release layer 64a1, a transparent protective layer 64a2,
The transparent protective layer 64a2 is composed of the adhesive layer 64a3, the release layer 64a1 and the adhesive layer 64a3 are provided on both sides of the transparent protective layer 64a2, and the release layer 64a1 is adhered to the support 64b. Figure 8
The transparent protective transfer foil 64 of (b) is configured in the same manner as the transfer foil of FIG. 8 (a), but the transparent protective layer 64a2 and the adhesive layer 64a.
The intermediate layer 64a4 is provided between the intermediate layer 64a and the intermediate layer 3a. Figure 8
The transparent protective transfer foil 64 of (c) has the same structure as the transfer foil of FIG. 8B, but two transparent protective layers 64a2 are provided. The transparent protective transfer foil 64 of FIG. 8D has the same structure as the transfer foil of FIG. 8B, but a barrier layer 64a5 is provided between the transparent protective layer 64a2 and the intermediate layer 64a4.

The transparent protective transfer foil 64 is transferred by peeling the transparent protective transfer layer 640 from the support 43b.

An embodiment of the optical variable element transfer foil 43 is shown in FIG. The optical change element transfer foil 43 of FIG. 9A is composed of an optical change element transfer layer 430 and a support 43b, and the optical change element transfer layer 430 is composed of a release layer 43a1, an optical change element layer 43a2, and an adhesive layer 43a3. The release layer 43a1 and the adhesive layer 43a are formed on both sides of the optical change element layer 43a2.
3 is provided, and the release layer 43a1 is adhered to the support body 43b. The optically variable element transfer foil 43 of FIG.
The same structure as the transfer foil of (a), but with the adhesive layer 43a3
And the optical change element layer 43a2, the intermediate layer 43a4 is provided. The optical variable element transfer foil 43 of FIG. 9C is configured similarly to the transfer foil of FIG. 9B, but the barrier layer 43 is provided between the optical variable element layer 43a2 and the intermediate layer 43a4.
a5 is provided. The transfer foil of FIG. 9D is shown in FIG.
The release foil 43a1 has the same structure as the transfer foil of FIG.
And the optical change element layer 43a2 between the transparent protective layer 43a6
Is provided.

The optical variable element transfer foil 43 is transferred by peeling the optical variable element transfer layer 430 from the support 43b.

Next, an embodiment of the curable transfer foil 66 is shown in FIG. The curable transfer foil 66 of FIG. 10A is composed of a curable protective layer-containing transfer layer 660 and a support 66b,
The curable protective layer-containing transfer layer 660 includes a release layer 66a1, a cured layer 66a2, an intermediate layer 66a4, and an adhesive layer 66a3. The release layer 66a1 and the intermediate layer 66a4 are provided on both sides of the cured layer 66a2. 66a1 is adhered to the support 66b. The curable transfer foil 66 of FIG. 10B has the same structure as the transfer foil of FIG.
Two layers of a2 are provided. Curable transfer foil 6 of FIG. 10 (c)
6 has the same structure as the transfer foil of FIG. 10 (a), but has a barrier layer 66a between the adhesive layer 66a3 and the intermediate layer 63a4.
5 are provided.

In these curable transfer foils 66, the curable protective layer-containing transfer layer 660 is peeled off from the support 43b and transferred.

Next, an embodiment of the curable resin layer-containing optical change element transfer foil 44 is shown in FIG. The curable resin layer-containing optical change element transfer foil 44 of FIG. 11A is composed of a curable resin layer-containing optical change element transfer layer 440 and a support 44b, and the curable resin layer-containing optical change element transfer layer 440 is separated. Mold layer 44a1, cured layer 44a9, optical change element layer 44a
2, intermediate layer 44a4, barrier layer 44a5, adhesive layer 44
The release layer 44a1 is made of a3 and is adhered to the support 44b. The curable resin layer-containing optical change element transfer foil 44 of FIG. 11B has the same structure as that of the transfer foil of FIG. 11A, but does not have the intermediate layer 44a4.
The curable resin layer-containing optical change element transfer foil 44 of 1 (c) has the same structure as the transfer foil of FIG. 11 (a), but has no barrier layer 44a5.

The curable resin layer-containing optical change element transfer foil 44 is used as the curable resin layer-containing optical change element transfer layer 44.
0 is separated from the support 44b and transferred.

In the curable resin layer-containing optical change element transfer foil 44 of this embodiment, the curable resin layer-containing optical change element transfer layer 440 is transferred by peeling from the support 44b, and the curable resin layer-containing optical change film is transferred. The element transfer layer 440 has at least a release layer, a cured layer, an optical change element layer, an intermediate layer, and an adhesive layer, and is excellent in surface protection and surface abrasion resistance.

Further, it is preferable that at least the transparent protective layer located on the surface side of the image recording body with respect to the optical change element layer is an ultraviolet ray curable layer or an electron beam curable layer because of excellent surface protective property and surface abrasion durability.

Further, it is preferable that the optical change element layer is a hard coat layer or a vapor deposition layer having an uneven image because curing for preventing forgery / alteration is more likely to occur.

Further, it is preferable that at least one transparent protective layer is thermally transferred onto the entire surface of the card because of excellent surface protection and surface abrasion resistance.

Further, it is preferable that an antistatic agent is contained in either layer of the transparent protective transfer foil or the optical change element transfer foil, so that a card or sheet on which dust does not adhere can be prepared.

Further, it is preferable that the transfer surface which has been transferred first is subjected to the easy-adhesion processing of the transfer foil which is transferred later, because the adhesion is good.

In the transfer foil of this invention, an antistatic layer, a release layer, a transparent protective layer, an optical change element layer, a barrier layer,
At least one layer is preferably provided in the intermediate layer and the adhesive layer. The antistatic layer of the transfer foil contains an anionic polymer substance having excellent antistatic properties and / or conductive particles.

Next, the transfer foil material used in the present invention will be described in detail.

The transfer foil of the present invention preferably comprises a support having a release layer and a transparent resin layer, more preferably a release layer, a transparent resin layer, an intermediate layer, a barrier layer, a primer layer and an adhesive layer. It is preferably composed of at least one layer. In the case of the present invention, the IC chip can prevent forgery or the like, but it is also possible to provide an optical variable element layer for the purpose of visual discrimination. [Support for Transfer Foil] Examples of the support include polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene terephthalate / isophthalate copolymers, polyolefin resins such as polyethylene, polypropylene and polymethylpentene, polyvinyl fluoride, polyvinyl fluoride. Poly (vinyl fluoride), poly (tetrafluoroethylene), ethylene / tetrafluoroethylene copolymer, etc., polyfluorinated ethylene resin, polyamide such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer , Ethylene / vinyl acetate copolymer, ethylene /
Vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, cellulose triacetate, cellulosic resin such as cellophane, methyl polymethacrylate,
Acrylic resins such as ethyl polymethacrylate, ethyl polyacrylate, butyl polyacrylate, etc., polystyrene, polycarbonate, polyarylate, synthetic resin sheets such as polyimide, or fine paper, thin paper, glassine paper,
Examples include paper such as sulfuric acid paper and the like, single-layered bodies such as metal foils, and laminated bodies of two or more layers thereof. The thickness of the support of the present invention is 10 to 10.
200 μm It is preferably 15 to 80 μm. 10 μm
If it is below, the support will be broken at the time of transfer, which is a problem. In the specific release layer of the present invention, polyethylene terephthalate is preferred.

The support of the present invention may have irregularities if necessary. Examples of means for forming irregularities include kneading with a matting agent, sandblasting, hairline processing, matte coating, or chemical etching. In the case of matte coating, either an organic substance or an inorganic substance may be used. For example, as the inorganic substance, silica described in Swiss Patent No. 330,158, French Patent Nos. 1 and 2 are used.
Glass powder described in 96,995 etc., British Patent No. 1,1.
The alkaline earth metals or the carbonates such as cadmium and zinc described in No. 73,181 and the like can be used as a matting agent. Organic substances include US Pat. No. 2,322,0
Starch described in 37, Belgian Patent No. 625,451
No. 1 and British Patent No. 981,198 and the like, polyvinyl alcohol described in Japanese Patent Publication No. 44-3643 and the like, polystyrene or polymethacrylate described in Swiss Patent No. 330,158, US Patent No. Organic matting agents such as polyacrylonitrile described in US Pat. No. 3,079,257 and polycarbonate described in US Pat. No. 3,022,169 can be used. The method for applying the matting agent may be a method in which the matting agent is dispersed in the coating solution in advance and then applied, or a method in which the matting agent is sprayed after the application of the coating solution and before the completion of drying. When a plurality of types of matting agents are added, both methods may be used together. In the case of the uneven processing according to the present invention, it is possible to apply it to one or more of the transfer surface and the back surface. [Transfer foil release layer] As the release layer, a resin having a high glass transition temperature such as an acrylic resin, a polyvinyl acetal resin, a poly (vinyl butyral) resin, waxes, silicone oils, a fluorine compound, a polyvinylpyrrolidone resin having water solubility , Polyvinyl alcohol resin, Si modified polyvinyl alcohol, methyl cellulose resin, hydroxy cellulose resin, silicone resin, paraffin wax, acrylic modified silicone, polyethylene wax,
Resins such as ethylene vinyl acetate can be mentioned. In addition, polydimethylsiloxane and its modified products such as polyester modified silicone, acrylic modified silicone, urethane modified silicone, alkyd modified silicone, amino modified silicone, epoxy modified silicone, polyether modified silicone, etc. Oils and resins, or cured products thereof. Examples of other fluorine-based compounds include fluorinated olefins and perfluorophosphate ester-based compounds. Preferred olefin compounds include dispersions of polyethylene, polypropylene, etc., long-chain alkyl compounds such as polyethyleneimine octadecyl, etc. Of these release agents, those having poor solubility can be used by dispersing them.

When two transfer foils are transferred, a thermoplastic elastomer may be added. Specific examples of thermoplastic elastomers include styrene type (styrene block copolymer (SBC)), olefin type (TP), urethane type (T
PU), polyester type (TPEE), polyamide type (TPAE), 1,2-polybutadiene type, vinyl chloride type (T
PVC), fluorine-based, ionomer resin, chlorinated polyethylene, silicone-based, etc.
It is described in "12996 Chemical Products" (Chemical Industry Daily), etc., for the fiscal year.

The thermoplastic elastomer having a tensile elongation of 100% or more, which is preferably used in the present invention and comprises a block polymer of polystyrene and polyolefin, comprises styrene and a linear or branched saturated alkyl block having 10 or less carbon atoms. It refers to a thermoplastic resin (hereinafter also referred to as a thermoplastic resin S1). In particular, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene- which are block polymers having a polystyrene phase and a polyolefin hydrogenated phase.
Examples thereof include ethylene / butylene-styrene (SEBS), styrene-ethylene / propylene-styrene (SEPS), and styrene-ethylene / propylene (SEP) block polymers.

If necessary, a thermosetting resin layer may be used between the release layer of the present invention and the resin layer or the actinic ray curable layer. Specifically, polyester resin, acrylic resin, epoxy resin, xylene resin, guanamine resin, diallyl phthalate resin, phenol resin, polyimide resin, maleic acid resin, melamine resin, urea resin,
Examples thereof include polyamide resin and urethane resin.

The transparent resin layer of the transfer foil is composed of polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolac resin, styrene, paramethylstyrene, vinyl monomer such as methacrylic acid ester, acrylic acid ester and the like. Any other high-molecular polymer such as cellulose-based, thermoplastic polyester, and natural resin may be used in combination. Also, in addition, Kiyoshi Akamatsu supervised, "Practical technology of new photosensitive resin", (CMC, 1987)
Year) or “10188 chemical products” pp. 657-767 (Kagaku Kogyo Nippo Co., Ltd., 1988).

In the present invention, it is preferable to provide a light or / thermosetting layer with a transfer foil for the purpose of protecting the image recording material. The light or / thermosetting layer is not particularly limited as long as it is a material composed of the composition described above. The thickness of the transparent resin layer is preferably 0.3 to 50 μm, more preferably 0.
It is 3 to 30 μm, particularly preferably 0.3 to 20 μm.

The intermediate layer of the transfer foil is preferably composed of one or more intermediate layers. In some cases, it may be interposed as a primer layer or a barrier layer or the adhesion between the layers may be further improved.

For example, vinyl chloride resin, polyester resin, acrylic resin, polyvinyl acetal resin,
Polyvinyl butyral resin, polyvinyl alcohol,
Polycarbonate, cellulose resin, styrene resin, urethane resin, amide resin, urea resin, epoxy resin, phenoxy resin, polycaprolactone resin,
Polyacrylonitrile resin, SEBS resin, SEPS resin, and modified products thereof can be used.

Of the above-mentioned resins, preferred for the purpose of this invention are vinyl chloride resins, polyester resins,
These are acrylic resins, polyvinyl butyral resins, styrene resins, epoxy resins, urethane resins, urethane acrylate resins, SEBS resins, and SEPS resins.
These resins may be used alone or in combination of two or more.

As a concrete compound, a thermoplastic resin composed of a block polymer of polystyrene and polyolefin, polyvinyl butyral and the like are preferable. In the intermediate layer of the present invention, as a polyvinyl butyral resin having a degree of polymerization of 1000 or more, SLECH BH-3, BX-1, BX-2, BX-5, BX-5 manufactured by Sekisui Chemical Co., Ltd.
5, BH-S, Denka Butyral # 4000-2, # 5000-A, # 6000-EP manufactured by Denki Kagaku Kogyo Co., Ltd.
Etc. are commercially available. The thermosetting resin of polybutyral of the intermediate layer is not limited to the degree of polymerization before thermosetting and may be a resin having a low degree of polymerization, and an isocyanate curing agent or an epoxy curing agent can be used for thermosetting, and the thermosetting conditions Is 50 ~
90 ° C. for 1 to 24 hours is preferable. The thickness of the intermediate layer is 0.
1 to 1.0 μm is preferable. <Thermal Adhesive Resin> As the adhesive layer of the transfer foil, ethylene vinyl acetate resin, ethyne ethyl acrylate resin, ethylene acrylic acid resin, ionomer resin, polybutadiene resin, acrylic resin, polystyrene resin, polyester resin, Olefin resin, urethane resin, tackifier (eg phenol resin, rosin resin,
Terpene resin, petroleum resin, etc., and copolymers or mixtures thereof may be used.

Specifically, the urethane-modified ethylene ethyl acrylate copolymer is Hitec S-6254, S-6254B, S-312 manufactured by Toho Chemical Industry Co., Ltd.
9 and the like are commercially available, and as the polyacrylic acid ester copolymer, Jurimer AT-210 and AT manufactured by Nippon Pure Chemical Industries, Ltd.
-510, AT-613, plus size L-201, SR-102, SR-103, J manufactured by Mutsoh Chemical Co., Ltd.
-4 and the like are commercially available. The weight ratio of the urethane-modified ethylene ethyl acrylate copolymer and the polyacrylic acid ester copolymer is preferably 9: 1 to 2: 8, and the thickness of the adhesive layer is preferably 0.1 to 1.0 μm.

In some cases, an optical change element layer transfer layer can be provided for the purpose of preventing forgery / alteration. Optical change element (O
optical Variable Device: OV
D) is 1) a two-dimensional CG image of a diffraction grating such as a kinegram, which is characterized in that the image of a line image structure freely moves and changes such as movement, rotation, expansion, and reduction.
2) Something like Pixelgram, which has the feature that the image changes to positive and negative, 3) OSD (Optic)
A color that changes from gold to green, such as al Security Device, 4) LEAD (Long)
Lasting Economical Antico
py Device), in which the image image appears to change, 5) a stripe type OVD, 6) a metal foil, etc., Journal of the Printing Society of Japan (1998), Vol. 35, No. 6, P482-
Security may be maintained by using a paper material, a special printing technique, a special ink, etc. as described in P496. Holograms are particularly preferred in this invention.

The hologram used in the present invention is a relief hologram, Fresnel hologram, Fraunhofer hologram, lensless Fourier transform hologram, laser reproduction hologram such as image hologram, white reproduction hologram such as Lippmann hologram, rainbow hologram, color hologram, computer hologram. ,
A hologram display, a multi-flex hologram, a hologram flex stereogram, a holographic diffraction grating, etc. can be arbitrarily adopted.

The optically variable element layer can be formed, for example, by bonding a hologram sheet on the image receiving layer. A relief type hologram sheet can be used as the hologram sheet. The relief type hologram sheet is formed by stacking a hologram forming layer and a hologram curing layer on a support film in this order. Specifically, a hologram sheet is a resin layer that is solid at room temperature and has thermoformability on the surface of a support film such as a polyethylene terephthalate film, for example, a thermoplastic electron that is solid at room temperature. A line-curable resin layer (hologram forming layer) is formed, and a hologram master plate on which a hologram interference pattern is formed in an uneven shape is pressed and compressed, the uneven shape is transferred to a resin surface, and cured, Furthermore, a material having sufficient transparency on the uneven surface and large reflectivity at a certain angle and having a refractive index different from that of the hologram forming layer (for example, a vapor-deposited film of TiO 2, SiO 2, ZnS).
It can be obtained by forming a holographic cured layer of a thin film. A hologram whose image is reproduced by white light such as daylight or illumination light is also excellent in decorativeness because the hologram image can be observed even in a normal state. On the other hand, the type in which an image is reproduced by laser light is excellent in tampering detectability.

Further, according to the present invention, a bead-holding layer can be provided, and the bead-holding layer having the beads according to the present invention is recombined by imparting a phase difference to a part of human incident light,
It has a reflective substrate and transparent beads arranged on the substrate to enhance light components in a specific wavelength region by interference and to return colored light having a color tone different from that of the incident light in the incident light entering direction. The bead-holding layer having beads is formed by disposing a resin layer on a reflective substrate, and further arranging a large number of beads having a bead diameter of 10 to 60 μm, preferably 15 to 40 μm, which are made of glass or the like, on the surface side thereof. The optical refractive index of is 1.
6-2.1 are preferable and 1.7-2.0 are more preferable. The incident light entering from the outside travels into the beads, at least a part of which is reflected from the transparent beads through the resin layer to the reflective substrate, returns to the beads again, and travels to the outside. Since the surface of the beads protruding outward is a spherical surface,
Even if there is a slight change in the angle of incidence of the person, the same effect is produced, and the reflected light can be returned in the incident direction.

Next, in the present invention, a reflective layer can be provided, and the reflective layer of the present invention can be used as the reflective layer.
It is selected from at least a metal thin film, a metal oxide thin film, a light interference material and a light diffraction layer. The reflective layer is preferably provided by printing a paint containing a powder capable of expressing an interference color such as an interfering substance, a metal oxide, or mica in an arbitrary pattern.

Examples of metal oxides include titanium dioxide, iron oxide, low-order titanium oxide, zirconium oxide, silicon oxide, aluminum oxide, cobalt oxide, nickel oxide, cobalt titanate, and Li2CoTi3O8 or K.
Examples thereof include composite oxides such as NiTiOx, and mixtures of these metal oxides, but the metal oxides are not particularly limited as long as they are metal oxides capable of exhibiting an interference color. As the interference material layer, a metal film having an interference color obtained by oxidizing the surface of the metal film can be used. These metal films include a method of anodizing metal aluminum, metal titanium, a stainless steel film, etc., or a method of preparing a metal oxide capable of expressing an interference color by a sol-gel method and coating it or a metal capable of expressing an interference color. A method of applying an alkoxide to a metal film and thermally decomposing it, a vapor deposition operation method such as CVD or PVD, and the like can be used. [Method of Applying Transfer Foil on Image Recording Body] Transfer of the transfer foil to the material to be transferred is usually performed by a means such as a thermal head, a heat roller, a hot stamping machine or the like that can apply pressure while heating.

An image recording body, a manufacturing apparatus therefor and a manufacturing method therefor according to an embodiment of the present invention will be described below with reference to the drawings.

The thickness of the IC card base material in the present invention is not particularly limited, but is preferably 100 μm to 120 μm.
0 μm is preferable, and more preferably 200 μm to 100
0 μm, more preferably 200 μm to 900 μm
Is. The thickness of the IC card prepared from the IC card base material is not particularly limited, but is preferably 200 μm to 150 μm.
0 μm is preferable, and more preferably 250 μm to 120 μm.
0 μm, more preferably 300 μm to 1000 μm
m. <IC Card Base Material and Method of Making IC Card> FIG. 12 shows a first embodiment of a front sheet, FIG. 12 (a) is a sectional view of the front sheet, and FIG. 12 (b) is a front view of the front sheet. Figure 1
2C is a perspective view showing the configuration of an IC card using a front sheet. As shown in FIG. 12A, the card base material of the front sheet has a cushion layer, an image receiving layer, an information carrier layer, and a transparent resin layer laminated in this order on the base material, and an image is formed on the image receiving layer. . The information carrier layer is, as shown in FIG.
FIG. 22 shows an employee ID and a name, which is an aggregate of them.
Using the IC card substrate preparation sheet of (a), FIG. 12 (c)
An IC card as shown in is created.

FIG. 13 shows a second embodiment of the front sheet. FIG. 13 (a) is a sectional view of the front sheet, FIG. 13 (b) is a front view of the front sheet, and FIG. 13 (c) is the front sheet. Used I
It is a perspective view which shows the structure of a C card. As shown in FIG. 13A, the card base material of the front sheet is provided with watermark printing on the base material, and the cushion layer, the image receiving layer, the information carrier layer, and the transparent resin layer are sequentially provided on the base material. An image is formed on the image receiving layer by laminating. Four scale pigment layers are laminated on the information carrier layer, and a transparent resin layer is further laminated thereon. As shown in FIG. 13 (b), the information carrier layer represents an employee ID card and a name, and the IC card base material making sheet of FIG. An IC card as shown in is created.

FIG. 14 shows a third embodiment of the front sheet. FIG. 14 (a) is a sectional view of the front sheet, FIG. 14 (b) is a front view of the front sheet, and FIG. 14 (c) is the front sheet. Used I
It is a perspective view which shows the structure of a C card. As shown in FIG. 14A, the card base material of the front sheet is provided with watermark printing on the base material, and the cushion layer, the image receiving layer, the information carrier layer, and the transparent resin layer are sequentially provided on the base material. An image is formed on the image receiving layer by laminating. Three scale pigment layers are laminated on the information carrier layer. The information carrier layer is, as shown in FIG.
FIG. 22 shows an employee ID and a name, which is an aggregate of them.
FIG. 14C using the IC card substrate preparation sheet of FIG.
An IC card as shown in is created.

FIG. 15 shows the first embodiment of the back sheet, FIG. 15 (a) is a sectional view of the back sheet, and FIG. 15 (b) is a front view of the back sheet. As shown in FIG. 15A, the card base material of the back sheet has a remark layer and an information carrier layer sequentially laminated on the base material. The information carrier on the remarks layer is shown in Figure 1.
As shown in FIG. 5 (b), an IC card is created by using the IC card base material making sheet of FIG. 22 (b), which shows ruled lines, the issuer, the name of the issuer, and the additional items, and is composed of these.

FIG. 16 shows a second embodiment of the back sheet, FIG. 16 (a) is a sectional view of the back sheet, and FIG. 16 (b) is a front view of the back sheet. As shown in FIG. 16A, the card base material of the back sheet is provided with watermark printing on the base material, and the remark layer and the information carrier layer are sequentially laminated on the base material. As shown in FIG. 16 (b), the information carrier on the remarks layer shows a ruled line, an issuer, an issuer's name, and an additional item, and the IC card base of FIG. An IC card is created using the material creation sheet.

FIG. 17 is a diagram showing a watermark pattern. This watermark pattern is provided by watermark printing on the base material of the front sheet of FIGS. 13 and 14, and is also provided by watermark printing on the base material of the back sheet of FIG.

Next, FIGS. 18 and 19 show an IC card material prepared using a back sheet as the first sheet member and a front sheet as the second sheet member. FIG. 18 is a schematic view of an IC module made of a material for an IC card, in which an IC is mounted on an antenna body 3a of an antenna coil formed by winding a copper wire 5 times.
The chip 3b is joined to the IC module of the electronic component 3. This IC module can be used as the fixing layer of the present invention, but is preferably used as shown in FIG. 19 in view of the positional accuracy of the IC chip 3b.

FIG. 19 is a schematic view of the inlet of the IC module and the fixed layer. FIG. 19A shows a non-woven fabric type, in which the non-woven fabric 3c on which the print pattern is formed and the IC chip 3b are joined by bonding or the like.
The IC chip reinforcing plate 3d is placed on the upper and lower sides of the IC chip 3b.
It is a schematic diagram which interposes so as to cover 0% or more. It is also possible to use the IC card sheet "FT series" manufactured by Hitachi Maxell, Ltd.

FIG. 19B shows a printed circuit board type in which a printed circuit board 3e having a printed pattern and an IC chip 3b are joined by bonding or the like, and an IC chip reinforcing plate 3d is vertically attached to the IC chip 3b. Three
It is a schematic diagram which interposes so that b may be covered 50% or more. When a non-woven fabric sheet as shown in FIG. 19A, that is, a porous resin sheet is used, the impregnation property of the adhesive at the time of heating and laminating becomes good, and the adhesive property between the members becomes superior.

Next, an IC card base material producing apparatus as an embodiment will be described.

FIG. 20 is a schematic block diagram showing an IC card base material producing apparatus. In this IC card substrate producing apparatus, a long sheet-shaped first sheet member (back sheet) 1 having a thickness of 100 μm is provided in a first sheet member supply section A, and a long sheet-shaped sheet having a thickness of 100 μm is formed. The second sheet member (front sheet) 2 is arranged in the second sheet member supply section B. Second
The adhesive is supplied from the adhesive supply section C to the sheet member 2 of
The IC card material having a thickness of 250 μm shown in FIG. 19A or FIG. 19B is placed on the second sheet member 2 from the IC fixing member supply section D. An adhesive is supplied to the first sheet member 1 from the adhesive supply section E, and the first sheet member 1
Is sent to the pressure heating section F.

The second sheet member 2 is sent to the pressure heating section F by the second sheet member transport section G. Pressure heating part F
Then, by a heating or pressurizing roll (pressure 3 kg / cm ² ) between the first sheet member 1 and the second sheet member I
The C card material is sandwiched and stuck together to produce an IC card base plate. It is preferable that the IC card base material original plate is subjected to makeup cutting after the adhesive is sufficiently cured in the IC card base material transporting section H and the adhesion with the support is sufficiently performed. An IC card base material of 55 mm × 85 mm size could be obtained from the produced IC card base material original plate by a rotary cutter.

FIG. 21 is a schematic configuration diagram of another embodiment showing an IC card base material producing apparatus. In this IC card substrate producing apparatus, a long sheet-shaped first sheet member (back sheet) 1 having a thickness of 100 μm is provided in a first sheet member supply section A, and a long sheet-shaped sheet having a thickness of 100 μm is formed. The second sheet member (front sheet) 2 is arranged in the second sheet member supply section B. The adhesive is supplied to the second sheet member 2 from the adhesive supply section C, and the IC card material having a thickness of 250 μm shown in FIG. 19A or FIG. The sheet member 2 of FIG. An adhesive is supplied to the first sheet member 1 from the adhesive supply section E, and
The sheet member 1 is sent to the pressure heating unit F.

The adhesive supply section C and the adhesive supply section E are
The first liquid and the second liquid supplied from the first liquid supply unit and the second liquid supply unit are agitated and mixed in the mixing unit, and the defoaming unit removes air bubbles to supply the adhesive.

The second sheet member 2 is sent to the pressurizing and heating section F by the second sheet member conveying section G. Pressure heating part F
Then, by a heating or pressurizing roll (pressure 3 kg / cm ² ) between the first sheet member 1 and the second sheet member I
The C card material is sandwiched and stuck together to produce an IC card base plate. It is preferable that the IC card base material original plate is subjected to makeup cutting after the adhesive is sufficiently cured in the IC card base material transporting section H and the adhesion with the support is sufficiently performed. An IC card base material of 55 mm × 85 mm size could be obtained from the produced IC card base material original plate by a rotary cutter.

FIG. 22 is a perspective view of a front sheet or a back sheet used in the IC card base material producing apparatus shown in FIGS. 20 and 21.

23 and 24 are sectional views of the finished IC card substrate. FIG. 23 shows an IC card in which the adhesive layer 6, the inlet 4, the adhesive layer 5, and the first sheet member 1 are sequentially arranged on the second sheet member 2. FIG. 24 shows an adhesive layer 6 containing flat particles, an inlet 4, and a second sheet member 2 on the second sheet member 2.
An IC card in which the adhesive layer 5 containing tabular particles and the first sheet member 1 are sequentially arranged is shown.

[Examples] The present invention is described in detail below with reference to examples, but the embodiments of the present invention are not limited thereto. In the following, "part" means "part by weight". (Support) Support 1 A white support of U2L98W having a thickness of 100 μm manufactured by Teijin DuPont Films Ltd. was used as the front and back sheets. (Longitudinal (MD) with heat shrinkage of 150 ° C / 30min
0.35% and lateral (TD) -0.05%) Support 2 As a front sheet and a back sheet, an E20 white support having a thickness of E20 manufactured by Toray Industries, Inc. was used. (Heat shrinkage rate 150
1.3% in length (MD) and 0.3% in width (TD) at ° C / 30 min) <Preparation of first sheet member (back sheet 1)> Hereinafter, the present invention will be described in detail with reference to examples. However, the embodiment of the present invention is not limited to this. In the following, "part" means "part by weight". (Preparation of Writing Layer) On the backing sheet 100 μm of the support 1, a coating liquid for forming a first writing layer, a coating liquid for forming a second writing layer, and a coating liquid for forming a third writing layer having the following compositions were formed in this order. After coating and drying, each thickness is 5μm, 15μm, 0.2μm
To form a writing layer. <Coating liquid for forming the first writing layer> Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Japan Polyurethane Industry Co., Ltd .: Coronate HX] Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo] Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer> Polyester resin 4 parts [Toyobo Co., Ltd .: Vylonal MD1200] Silica 5 parts Titanium dioxide particles [Ishihara] Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Third writing layer forming coating liquid> Polyamide resin [Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts Obtained writing layer The center line average roughness was 1.34 μm. (Formation of Information Carrier Layer Consisting of Format Printing Layer on Writing Layer) Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as the printing ink. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. <Preparation of First Sheet Member (Back Sheet 2)> Hereinafter, the present invention will be described in detail with reference to Examples, but the embodiments of the present invention are not limited thereto. In the following, "part" means "part by weight". (Preparation of Writing Layer) On the backing sheet of 100 μm of the support 1, a first writing layer forming coating solution, a second writing layer forming coating solution and a third writing layer forming coating solution having the above composition are provided in this order. After coating and drying, each thickness is 5μm, 15μm, 0.2μm
To form a writing layer. (Formation of Information Carrier Layer Consisting of Format Printing Layer on Writing Layer) Format printing (ruled lines, issuer name, issuer telephone number) was performed by the offset printing method. UV ink was used as the printing ink. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. (Preparation of Watermark Printing) Watermark printing was performed by the gravure printing method. The print pattern is as shown in the watermark pattern diagram of FIG. The printing ink was an oil-based ink containing a white pigment. The film thickness was 2.0 μm. <Creation of first sheet member (back sheet 3) (comparative example)>
The procedure for producing the back sheet 1 is the same as that for the back sheet 1 except that the support described in the back sheet 1 is changed to the support 2. <Preparation of Second Sheet Member (Front Sheet)> (Preparation of Front Sheet 1) Front Cover 100 μm of Support 1
A second sheet member (front sheet 1) was formed by sequentially coating and drying a cushion layer, an image receiving layer, an information carrier layer, and a transparent resin layer made of the following composition on m. (Photocurable cushion layer) Film thickness 10 μm Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (manufactured by Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (manufactured by Shin-Nakamura Chemical Co., Ltd .: NK) Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts Actinic ray curable compound after application is 90 ° C / 30 sec.
And then photocured with a mercury lamp (300 mJ / cm ² ). (Image Receiving Layer) A first image receiving layer forming coating liquid and a second image receiving layer forming coating liquid having the following compositions are applied and dried in this order on the cushion layer to have respective thicknesses of 2.5 μm and 0.5 μm. To form an image receiving layer. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin 6 parts [Sekisui Chemical Co., Ltd .: S-REC BX-1] Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second Coating liquid for forming image-receiving layer> Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitec E1000] Urethane-modified ethylene acrylic acid copolymer 8 parts [Toho Chemical Industry Co., Ltd .: Hitec S6254] Methylcellulose [Shin-Etsu Chemical Kogyo Co., Ltd .: SM15] 0.1 part Water 90 parts (formation of information carrier consisting of format printing layer) Format printing (employee certificate, name) was performed on the image receiving layer by offset printing. UV ink was used as the printing ink. The UV irradiation condition during printing is 200 with a high pressure mercury lamp.
It was equivalent to mj. (Formation of transparent resin layer) A printing ink composed of the following composition was mixed by a roll mill to prepare a printing ink. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. (Transparent resin layer composition 1) Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dilocur 1173 (manufactured by Ciba Specialty Chemicals) 5 parts Trimethylolpropane acrylate 10 parts (preparation of front sheet 2) The support Front sheet 100 μm
A second sheet member (front sheet 2) was formed by sequentially coating and drying a cushion layer, an image receiving layer, an information carrier layer, a transparent resin layer, and a scaly pigment layer, each of which was composed of the following composition. (Cushion layer) Polypropylene (PP) was heat-melted at 200 ° C., and a cushion layer was provided on the support so as to have a thickness of 20 μm. (Image Receiving Layer) A first image receiving layer forming coating liquid, a second image receiving layer forming coating liquid and a third image receiving layer forming coating liquid having the following compositions are applied and dried in this order on the cushion layer, respectively. An image receiving layer was formed by laminating the layers to have a thickness of 0.2 μm, 2.5 μm, and 0.5 μm. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin 9 parts [Sekisui Chemical Co., Ltd .: Eslec BL-1] Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX] Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second image-receiving layer> Polyvinyl butyral resin 6 parts [Sekisui Chemical Co., Ltd .: S-REC BX-1] Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts < Third image-receiving layer forming coating liquid> Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitec E1000] Urethane-modified ethylene acrylic acid copolymer 8 parts [Toho Chemical Industry Co., Ltd .: Hitech S6254] Methylcellulose [ Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part water 90 parts (format print layer The Ranaru information carrying body forming) offset printing method on the image receiving layer, the format printing (of employee's ID card and name) was performed. UV ink was used as the printing ink. The UV irradiation condition during printing is 200 m with a high pressure mercury lamp.
It was equivalent to j. (Formation of transparent resin layer) A printing ink composed of the following composition was mixed by a roll mill to prepare a printing ink. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. (Transparent resin layer composition 1) Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dilocur 1173 (Ciba Specialty Chemicals) 5 parts Trimethylol propane acrylate 10 parts (formation layer formation of scale pigment layer) Printing inks composed of the composition were mixed by the method shown in the table to prepare printing inks. Printing was performed on the image receiving layer by the offset printing method.
The layers of printing ink were formed by continuous printing by offset printing so as to be laminated as described in the layer structure diagram of the image recording material. The film thickness was 2.1 μm.

The UV irradiation condition during printing is 2 with a high pressure mercury lamp.
It was equivalent to 00 mj. (Scale pigment layer composition 1) Iriodin 211 (manufactured by Merk) 45 parts Urethane acrylate oligomer 40 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts Trimethylol propane acrylate 10 parts (watermark printing) Gravure printing method Thus, watermark printing was performed on the surface of the support opposite to the side coated with the image receiving layer. The print pattern is the watermark pattern shown in FIG. The printing ink was an oil-based ink containing a white pigment. The film thickness was 2.0 μm. (Creation of front sheet 3) Front support sheet 100 μm
Then, a cushion layer, an image receiving layer, an information carrier layer, a transparent resin layer, and a scaly pigment layer, which are composed of the following compositions, are sequentially applied and dried to form a second sheet member (surface sheet 3). did. (Photocurable cushion layer) Film thickness 15 μm Urethane acrylate oligomer (Shin Nakamura Chemical Co., Ltd .: NK Oligo UA512) 55 parts Polyester acrylate (Toagosei Co., Ltd .: Aronix M6200) 15 parts Urethane acrylate oligomer (Shin Nakamura Chemical Co., Ltd .: NK Oligo UA4000) 25 parts Hydroxycyclohexyl phenyl ketone (Ciba Specialty Chemicals: Irgacure 184) 5 parts Methyl ethyl ketone 100 parts Actinic ray curable compound after application is 90 ° C / 30 sec.
And then photocured with a mercury lamp (300 mJ / cm ² ). (Image Receiving Layer) A first image receiving layer forming coating liquid and a second image receiving layer forming coating liquid having the following compositions are applied and dried in this order on the cushion layer to have respective thicknesses of 2.5 μm and 0.5 μm. To form an image receiving layer. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin 6 parts [Sekisui Chemical Co., Ltd .: S-REC BX-1] Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Second Coating liquid for forming image-receiving layer> Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitec E1000] Urethane-modified ethylene acrylic acid copolymer 8 parts [Toho Chemical Industry Co., Ltd .: Hitech S6254] Methylcellulose [Shin-Etsu Chemical Kogyo Co., Ltd .: SM15] 0.1 part water 90 parts (formation of information carrier consisting of format printing layer) Format printing (employee certificate, name) was performed on the image receiving layer by offset printing. UV ink was used as the printing ink. The UV irradiation condition during printing is 200 m with a high pressure mercury lamp.
It was equivalent to j. (Formation of transparent resin layer) A printing ink composed of the following composition was mixed by a roll mill to prepare a printing ink. Printing was performed on the image receiving layer by the offset printing method. The UV irradiation condition during printing was equivalent to 200 mj with a high pressure mercury lamp. (Transparent resin layer composition 1) Urethane acrylate oligomer 50 parts Aliphatic polyester acrylate oligomer 35 parts Dilocur 1173 (Ciba Specialty Chemicals) 5 parts Trimethylol propane acrylate 10 parts (formation layer formation of scale pigment layer) Printing inks composed of the composition were mixed by the method shown in the table to prepare printing inks. Printing was performed on the image receiving layer by the offset printing method.
The layer of printing ink was formed by continuous printing by offset printing so as to be laminated as described in the layer structure diagram of the image recording material. The film thickness was 2.9 μm. UV when printing
The irradiation condition was equivalent to 200 mj with a high pressure mercury lamp. (Scale pigment layer composition 1) Iriodin 211 (manufactured by Merk) 45 parts Urethane acrylate oligomer 40 parts Dirocure 1173 (manufactured by Ciba Specialty Chemicals) 5 parts Trimethylol propane acrylate 10 parts (watermark printing) Gravure printing method Thus, watermark printing was performed on the surface of the support opposite to the side coated with the image receiving layer. The print pattern is the watermark pattern shown in FIG. The printing ink was an oil-based ink containing a white pigment. The film thickness was 2.0 μm. (Preparation of Front Sheet 4 (Comparative Example 1) Same as preparation of Front Sheet 1 except that the support described in Front Sheet 1 was changed to Support 2. <IC card base material preparation> (IC card base material preparation) 1) Using the first sheet member (back sheet) and the second sheet member (front sheet) created above, the first sheet member (back sheet) is The sheet member supply unit and the second sheet member (front sheet) were installed in the second sheet member supply unit, and a card was manufactured under the following conditions to obtain a card base material.

1) After defoaming, the temperature of the adhesive supply section is 30 ° C.

2) Pressurization and heating roll conditions are as follows.
2 kg / cm ² , heating temperature is 60 ° C.

3) The conditions for the IC-mounted card base material conveying member are as follows:
Pressurization is 0.4 kg / cm ² , cooling temperature is 40 ° C. 4) Transport speed: 2 m / min 5) Use Elastic epoxy adhesive of the present invention: Ultoite 1540 set manufactured by Toho Kasei Kogyo Co., Ltd. (500 μm breaking elongation after curing 176) %, 2% elastic modulus 0.4%, viscosity 15000mp
The main agent was added to the A solution supply part using s), and the curing agent was added to the B solution supply part.

After confirming that the adhesive is cured, a roll cutter is used to make a decorative cut, and a 55 mm × 85 mm size I
A C card substrate was created. (IC Card Base Material Preparation 2) Using the first sheet member (back sheet) and second sheet member (front sheet) prepared above, the first sheet member (back sheet) The sheet) was installed in the first sheet member supply section, and the second sheet member (front sheet) was installed in the second sheet member supply section, and a card was manufactured under the following conditions to obtain a card base material.

1) After defoaming, the temperature of the adhesive supply part is 30 ° C.

2) Pressurization and heating roll conditions are as follows:
2 kg / cm ² , heating temperature is 60 ° C.

3) Conditions for the IC mounted card base material conveying member are as follows:
Pressurization is 0.4 kg / cm ² , cooling temperature is 40 ° C. 4) Transport speed: 2 m / min 5) Use Elastic epoxy adhesive of the present invention: ThreeBond Co., Ltd. ThreeBond 3950 set (500 μm breaking elongation 246% after curing, 2% elastic modulus 0.3%, viscosity 30000mp
The main agent was added to the first liquid supply unit using s), and the curing agent was added to the second liquid supply unit. Further, 3% by weight of iridione 211 manufactured by Merck Ltd. was added to the second liquid.

After confirming that the adhesive has hardened, a cosmetic cutting is performed with a roll cutter, and I of 55 mm × 85 mm size is cut.
A C card substrate was created. (IC Card Base Material Creation 3 (Comparative Example 3)) Using the above-prepared second sheet member (top sheet), the first sheet member (back sheet) is The first sheet member supply unit and the second sheet member (front sheet) were installed in the second sheet member supply unit, and a card was manufactured under the following conditions to obtain a card base material.

1) After defoaming, the temperature of the adhesive supply part is 30 ° C.

2) Pressurization and heating roll conditions are as follows:
2 kg / cm ² , heating temperature 100 ° C.

3) Conditions for the IC mounted card base material conveying member are as follows:
Pressurization is 0.4 kg / cm ² , cooling temperature is 90 ° C. 4) Conveyance speed: 2 m / min 5) Use comparative adhesive: Bond E set L manufactured by Konishi Co., Ltd. (500 μm breaking elongation after curing, 20%,
The main component was charged into the first liquid supply part using a 2% elastic modulus of 0.1% and the viscosity was 4000 mps), and the curing agent was added into the second liquid supply part.

[0223] After confirming that the adhesive has hardened, a roll cutter is used to make a decorative cut, and a 55 mm x 85 mm size I
A C card substrate was created. (IC Card Base Material Preparation 4 (Comparative Example 4)) Using the first sheet member (back sheet) and second sheet member (front sheet) prepared above, the IC card base material preparing apparatus of FIG. The sheet member (back sheet) was installed in the first sheet member supply unit, and the second sheet member (front sheet) was installed in the second sheet member supply unit, and a card was manufactured under the following conditions to obtain a card base material. .

1) After defoaming, the temperature of the adhesive supply part was 30 ° C.

2) Pressurization and heating roll conditions are as follows.
2 kg / cm ² , heating temperature 100 ° C.

3) Conditions for the IC mounted card base material conveying member are as follows:
Pressurization is 0.4 kg / cm ² , cooling temperature is 90 ° C. 4) Transport speed: 2 m / min 5) Use comparative example Adhesive: ThreeBond Co., Ltd. ThreeBond Main agent 2002H / Curing agent 2105F (500 μm breaking elongation after curing) 15%, 2% elastic modulus 0.05%,
The main component was charged into the first liquid supply part using a viscosity of 65,000 mps), and the curing agent was added into the second liquid supply part.

[0227] After confirming that the adhesive has hardened, a roll cutter is used to make a decorative cut, and an I of 55 mm x 85 mm size is cut.
A C card substrate was created. (IC Card Base Material Preparation 5) Using the first sheet member (back sheet) and the second sheet member (front sheet) prepared above, the first sheet member The sheet) was installed in the first sheet member supply section, and the second sheet member (front sheet) was installed in the second sheet member supply section, and a card was manufactured under the following conditions to obtain a card base material.

1) The temperature of the adhesive supply section is 30 ° C.

2) Pressurization and heating roll conditions are as follows.
2 kg / cm ² , heating temperature is 75 ° C.

3) The conditions for the IC mounted card base material conveying member are as follows:
Pressurization is 0.4 kg / cm ² , cooling temperature is 50 ° C. 4) Transport speed: 1 m / min 5) Use Thermosetting adhesive of the present invention: An adhesive compounded from the following compositions. Use The thermosetting adhesive composition of the present invention: 1) A compound containing two or more epoxy groups in one molecule-Celoxide 2021 (manufactured by Daicel Chemical Industries, Ltd.) Epoxy equivalent 128-140) 38 parts-Epolite 3002 (Kyoeisha) Chemical Co., Ltd.) 25 parts Epicoat # 828 (Okaka Shell Epoxy Co., Ltd.) Epoxy Equivalent 184-194) 30 parts 2) Compounds that generate cations at a temperature of 10 to 150 ° C. Thermal cation generating compound: Celoxide SI- 60 L (manufactured by Sanshin Chemical Industry Co., Ltd.) 7 parts An adhesive was added to the adhesive supply part of the above compound, and coating was performed under the above conditions. After confirming that the adhesive has hardened,
Cosmetic cutting was performed with a roll cutter to prepare a 55 mm × 85 mm size IC card base material. (IC Card Base Material Preparation 6 (Comparative Example 5)) Using the first sheet member (back sheet) and second sheet member (front sheet) prepared above, the IC card base material preparing apparatus of FIG. The sheet member (back sheet) was installed in the first sheet member supply unit, and the second sheet member (front sheet) was installed in the second sheet member supply unit, and a card was manufactured under the following conditions to obtain a card base material. .

1) The temperature of the adhesive supply part is 30 ° C.

2) Pressurization and heating roll conditions are as follows:
2 kg / cm ² , heating temperature is 75 ° C.

3) Conditions for the IC mounted card base material conveying member are as follows:
Pressurization is 0.4 kg / cm ² , cooling temperature is 50 ° C. 4) Conveyance speed: 1 m / min 5) Adhesive used: An adhesive composed of the following compositions. Use The thermosetting adhesive composition of the present invention: 1) A compound containing two or more epoxy groups in one molecule-Celoxide 2021 (manufactured by Daicel Chemical Industries, Ltd.) Epoxy equivalent 128-140) 38 parts-Epolite 3002 (Kyoeisha) Chemical Co., Ltd.) 25 parts, Epicoat # 828 (Okaka Shell Epoxy Co., Ltd.) epoxy equivalent 184-194) 30 parts 2) Photocation generating compounds, photocation generating compounds: TPS-1 (Midori Chemical Co., Ltd.) ) 7 parts The above compound was added to the adhesive supply part, and coating was performed under the above conditions. After confirming that the adhesive has hardened,
Cosmetic cutting was performed with a roll cutter to prepare a 55 mm × 85 mm size IC card base material. (IC Card Base Material Preparation 7 (Comparative Example 6)) Using the first sheet member (back sheet) and second sheet member (front sheet) prepared above, the IC card base material preparing apparatus of FIG.
The sheet member (back sheet) of the first sheet member supply section,
The second sheet member (front sheet) was installed in the second sheet member supply section and a card was manufactured under the following conditions to obtain a card base material.

1) The temperature of the adhesive supply section is 160 ° C.

2) Pressurization and heating roll conditions are as follows:
2 kg / cm ² , heating temperature is 120 ° C.

3) Conditions for the IC mounted card base material conveying member are as follows:
Pressurization is 0.4 kg / cm ² , cooling temperature is 50 ° C. 4) Transport speed: 1 m / min 5) Adhesive used: Aronmelt PPET-2403 (Hot melt adhesive manufactured by Toagosei Co., Ltd.) The above compound is supplied as an adhesive. Put the adhesive in the part and heat it,
Coating was carried out under the above conditions. After confirming that the adhesive has hardened, make a decorative cut with a roll cutter and make it 55 mm x 85
An mm-sized IC card substrate was created.

The evaluation results of the cards are shown in Table 1. In Examples 4 to 27, the punchability, chemical resistance, and water resistance were improved, and curling could be suppressed, as compared with Comparative Examples 7 to 18.

[0238]

[Table 1] [Creation of IC Card Base Material] Using the above prepared IC card base materials 1 to 7, an IC card was prepared by the following preparation method. <IC Card Making Method> The authentication identification image on the IC card substrate, the method for writing the attribute information image, and the method for forming the IC card surface protective layer were carried out as follows, and an IC card of 540 μm was made. (Preparation of sublimation-type thermal transfer recording ink sheet) A 6 μm-thick polyethylene terephthalate sheet having a back surface processed to prevent fusion is coated with a yellow ink layer-forming coating solution, a magenta ink layer-forming coating solution, and cyan. The ink layer forming coating liquid was provided so that each thickness was 1 μm, and three color ink sheets of yellow, magenta and cyan were obtained. <Yellow Ink Layer Forming Coating Liquid> Yellow dye (MS Yellow manufactured by Mitsui Toatsu Dye Co., Ltd.) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] Polymethylmethacrylate Modified polystyrene 1 part [Toagosei Kagaku Kogyo KK: Rededa GP-200] Urethane modified silicone oil 0.5 part [Dainichi Seika Kogyo KK: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts <Magenta Ink layer forming coating liquid> Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] polymethylmethacrylate modified Polystyrene 2 parts [Toagosei Chemical Industry Co., Ltd .: Rededa GP-200] Retan-modified silicone oil 0.5 parts [Dainichi Seika Kogyo KK: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution> Cyan dye (Kaya manufactured by Nippon Kayaku Co., Ltd.) Set blue 136) 3 parts Polyvinyl acetal 5.6 parts [Denka Butyral KY-24] manufactured by Denki Kagaku Kogyo Co., Ltd. Polymethyl methacrylate modified polystyrene 1 part [Toagosei Kagaku Kogyo: Rededa GP-200] Urethane-modified silicone oil 0.5 parts [Dainichi Seika Kogyo Co., Ltd .: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts (preparation of ink sheet for melt-type thermal transfer recording) Thickness which is processed to prevent fusion on the back surface A 6 μm thick polyethylene terephthalate sheet is coated with an ink layer-forming coating solution having the following composition. To obtain an ink sheet by coating and drying so as to 2 [mu] m. <Ink layer forming coating liquid> Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemical Co., Ltd .: EV40Y] Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries Co., Ltd .: Tamanor 521] 5 parts 90 parts of methyl ethyl ketone (formation of face image) The ink side of the ink sheet for sublimation type thermal transfer recording is superposed on the surface of the front sheet, and the thermal head is used to output 0.23 W / dot.
Pulse width 0.3-4.5 ms, dot density 16 dots /
By heating under a condition of mm, a human image having gradation in the image was formed on the image receiving layer. In this image, the dye and nickel in the image receiving layer form a complex. (Formation of Character Information) The ink side of the melt-type thermal transfer recording ink sheet is superposed on the surface of the front sheet, and the output is 0.5 W / dot from the ink sheet side by using a thermal head.
Character information was formed on the OP varnish by heating under the conditions of a pulse width of 1.0 msec and a dot density of 16 dots / mm.

As described above, the face image and the attribute information (Taro Konica, ID: 0123456789) are provided on the IC card substrate. <Method for forming protective layer on IC card substrate> [Synthesis example 1] "IC card surface protective layer-added resin synthesis example 1" 73 parts of methyl methacrylate, 15 parts of styrene, and methacrylic acid were placed in a three-necked flask under a nitrogen stream. 12 parts of acid and 50 parts of ethanol
0 part and 3 parts of α, α′-azobisisobutyronitrile were added, and the mixture was reacted in a nitrogen stream in an oil bath at 80 ° C. for 6 hours. Then, 3 parts of triethylammonium chloride,
1.0 part of glycidyl methacrylate was added and reacted for 3 hours to obtain a synthetic binder 1 of the intended acrylic copolymer. Mw. 17,000, acid value 32. [Example 1] "Production of transparent resin transfer foil 1" Polyethylene terephthalate (S-25) manufactured by Diafoil Hoechst Co., Ltd. was coated with the following formulation by wire bar coating on one side and dried, and Examples 1 to 3 were performed. To form a protective layer. (Release layer) Film thickness 0.5 μm Acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., Dinal BR-87) 5 parts Polyvinyl acetoacetal (SP value: 9.4) (Sekisui Chemical Co., Ltd., KS-1) 5 parts Methyl ethyl ketone 40 parts Toluene 50 parts were applied and dried at 90 ° C./30 sec. <Intermediate layer forming coating liquid> Film thickness 0.3 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 5 parts Tuftex M-1913 (Asahi Kasei) 3.5 parts Curing agent Polyisocyanate [Coronate HX Made in Japan Polyurethane] 1.5 parts Methyl ethyl ketone 20 parts Toluene 70 parts After coating, drying was carried out at 90 ° C./30 sec, and curing of the curing agent was carried out at 50 ° C. for 24 hours. <Barrier layer forming coating liquid> Film thickness 0.5 μm BX-1 (polyvinyl butyral resin) 4 parts [Sekisui Chemical Co., Ltd .: Eslec B series] Tuftex M-1913 (Asahi Kasei) 4 parts Curing agent Polyisocyanate [ Coronate HX made by Nippon Polyurethane] 2 parts Toluene 50 parts Methylethylketone 40 parts After coating, drying was performed at 70 ° C./30 sec. <Adhesive layer forming coating liquid> Film thickness 0.3 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitech S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts After application, it was dried at 70 ° C./30 sec.

A transparent resin transfer foil 1 composed of a release layer, an intermediate layer and an adhesive layer having the above composition was prepared.

Further, the transfer foil described in each of Examples and Comparative Examples having the transparent protective layer having the above-mentioned structure on the image receptor on which images and characters were recorded was heated to a surface temperature of 200 ° C. Transfer was performed by applying heat for 1.2 seconds at a pressure of 150 kg / cm ² using a heat roller having a diameter of 5 cm and rubber hardness of 85.

On the image receptor to which the transfer foil 1 was transferred, the ultraviolet-curable resin-containing coating liquid was applied by a gravure roll coater having a specific background pattern so that the coating amount was 20 g / m ² . The ultraviolet curable resin-containing coating liquid 1 was cured under curing conditions to form an ultraviolet curable protective layer.

Curing Conditions Light Irradiation Source 60 w / cm ² High Pressure Mercury Lamp Irradiation Distance 10 cm Irradiation Mode Optical Scanning at 3 cm / sec “UV Curing Resin-Containing Coating Liquid 1” Bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate 70 parts Bisphenol A glycidyl ether 10 parts 1,4-butanediol glycidyl ether 13 parts Triarylsulfonium fluoroantimony 7 parts [Example 2] "Preparation of actinic ray curable transfer foil 1" (release layer forming coating liquid) Film thickness 0.2 μm Polyvinyl alcohol (GL-05) (manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) 10 parts water 90 parts The release layer was applied under a drying condition of 90 ° C./30 sec. (Actinic ray curable compound) Film thickness 7.0 μm Shin-Nakamura Chemical Co., Ltd. A-9300 / Shin-Nakamura Chemical Co., Ltd. EA-1020 = 35/11. 75 parts Reaction initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts Actinic ray curable layer resin 1 48 parts Dainippon Ink Surfactant F-179 0.25 part Toluene 500 parts Actinic ray curable compound after coating is 90 ° C. / 30sec
And then photocured with a mercury lamp (300 mJ / cm ² ). <Intermediate layer forming coating solution> Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Made by Nippon Polyurethane] 1.5 parts 90 parts of methyl ethyl ketone After application, the curing agent was cured at 50 ° C. for 24 hours. <Adhesive layer forming coating liquid> Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol 45 parts After application, it was dried at 70 ° C./30 sec.

Further, a rubber having a diameter of 5 cm and heated to a surface temperature of 200 ° C. using the actinic ray-curable transfer foil 1 having the above-mentioned structure on the image receptor or transparent resin layer on which images and characters are recorded, and the scale-pigment-containing layer. Transfer was performed using a heat roller having a hardness of 85 at a pressure of 150 kg / cm ² for 1.2 seconds. The transfer method is Japanese Patent Application No. 11-184270.
The transfer device described in No. [Example 3] "Preparation of optical variable element transfer foil 1" (Release layer forming coating liquid) Film thickness 0.2 µm Polyvinyl alcohol (GL-05) (Nippon Gosei Kagaku KK) 10 parts Water 90 parts After coating, it was dried at 90 ° C./30 sec. (Optical conversion element layer) Film thickness 2 μm <Intermediate layer forming coating liquid> Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After application, drying was carried out at 90 ° C./30 sec. After application, the curing agent was cured at 50 ° C. for 24 hours. <Adhesive layer forming coating liquid> Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [manufactured by Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol After application, it was dried at 70 ° C./30 sec.

Further, a pressure of 150 kg was applied by using a heat roller having a diameter of 5 cm and a rubber hardness of 85, which was heated to a surface temperature of 200 ° C. by using the optical variable element transfer foil 1 having the above-mentioned structure on the image receptor on which images and characters were recorded. 1 / cm ²
Transfer was performed by applying heat for 2 seconds. The transfer system was the transfer device described in Japanese Patent Application No. 11-184270. <Evaluation of punchability> In order to obtain a plurality of personal authentication cards from a card assembly prepared by an IC card substrate preparation device, the card assembly is left for 5 days in an environment of 30 ° C / 60%, and then the card assembly is left. Punched out multiple personal authentication cards from.

The punching evaluation method is x: it cannot be formed on the card. Punching OK probability is 50% or less. Δ: Adhesive sagging occurred on the punched cross-section. ◯: Punching OK probability is 100%. <Evaluation of chemical resistance> The finished card was immersed in an IPA 50% solution for 1 day at a liquid temperature of 25 ° C., and the surface of the card was observed.
The evaluation was performed visually with the following evaluation items. ×: The image information has disappeared. Δ: 50% or more of image information is faint. ○: No change from the initial card. <Evaluation of Water Resistance> The finished card was immersed in tap water having a water temperature of 25 ° C. for 3 days, and the surface of the card was observed. The evaluation was performed visually with the following evaluation items. X: The transfer foil was peeled off and the protective layer was lost. Δ: Water bubbles appear on the surface of the card. ○: No change from the initial card. <Evaluation of Curling Property of IC Card Substrate> The maximum warpage height when each of the four corners of the finished IC card was pressed was measured. ×: Card maximum warpage height of 7 mm or more △; Card maximum warpage height of 4.0 mm or more to less than 7 mm ○; Card maximum warpage height of less than 4.0 mm

[0247]

As described above, the first to the first aspects are provided.
According to the invention described in 9, the chemical resistance, water resistance, curling property, and punching property can be improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an IC card substrate.

FIG. 2 is a schematic configuration diagram of an image recording body creating apparatus.

FIG. 3 is a diagram showing a layer structure of an image recording body.

FIG. 4 is a schematic configuration diagram of another embodiment of the image recording body creating apparatus.

FIG. 5 is a diagram showing a layer structure of another embodiment of the image recording body.

FIG. 6 is a schematic configuration diagram of another embodiment of the image recording body creating apparatus.

FIG. 7 is a diagram showing a layer structure of another embodiment of an image recording body.

FIG. 8 is a diagram showing an embodiment of a transparent protective transfer foil.

FIG. 9 is a diagram showing an embodiment of an optical variable element transfer foil.

FIG. 10 is a diagram showing an embodiment of a curable transfer foil.

FIG. 11 is a diagram showing an embodiment of a curable resin layer-containing optical change element transfer foil.

FIG. 12 is a diagram showing a first embodiment of a front sheet.

FIG. 13 is a diagram showing a second embodiment of a front sheet.

FIG. 14 is a diagram showing a third embodiment of a front sheet.

FIG. 15 is a diagram showing a first embodiment of a back sheet.

FIG. 16 is a diagram showing a second embodiment of a back sheet.

FIG. 17 is a diagram showing a watermark pattern.

FIG. 18 is a schematic diagram of an IC module of an IC card material.

FIG. 19 is a schematic diagram of an inlet of an IC module and a fixed layer.

FIG. 20 is a schematic configuration diagram showing an IC card base material producing apparatus.

FIG. 21 is a schematic configuration diagram of another embodiment showing an IC card base material producing apparatus.

FIG. 22 is a view showing an IC card base material producing sheet.

FIG. 23 is a cross-sectional view of an IC card base material.

FIG. 24 is a cross-sectional view of another embodiment of an IC card substrate.

[Explanation of symbols]

1 First sheet member 2 Second sheet member 3 electronic components 4 inlets 5,6 adhesive

Continued front page    F-term (reference) 2C005 MA11 MA14 MA19 NA09 PA04                       PA19 PA21 PA23 RA04 RA09                       RA10 SA14                 5B035 BA03 BB09 CA01 CA04                 5F061 AA02 BA05 CA22 DE03 DE04                       FA03

Claims (19)

[Claims] 1. An electronic component having a predetermined thickness is provided between a first sheet member and a second sheet member, and at least the first sheet member, the second sheet member and the electronic component are provided. The resin physical properties after curing have a breaking elongation (%) of 50 to 500 and a 2% elastic modulus (kgf / m).
m ² ) An IC card substrate having a laminated structure with a specific elastic epoxy adhesive of 0.01 to 10.0 kgf / mm ² interposed. 2. The specific elastic epoxy adhesive before curing 2
The IC card substrate according to claim 1, wherein the viscosity at 3 ° C is 1000 to 35000 cps. 3. The IC card base material according to claim 1, which has a laminated structure formed by coating or laminating the specific elastic epoxy adhesive at a temperature of 80 ° C. or lower. 4. An image-receiving layer for receiving a sublimation or heat-diffusible dye image in a thermal transfer recording system is provided on one of the substrates of the IC card substrate according to any one of claims 1 to 3. An image recording body characterized by. 5. The IC card substrate according to any one of claims 1 to 3 or the image recording body according to claim 4 is protected by a light or thermosetting resin layer. An IC card characterized by 6. A support having at least a release layer and a transparent resin layer on the IC card substrate according to any one of claims 1 to 3 or the image recording body according to claim 4. A method of manufacturing an IC card, characterized in that the above transfer foil is thermally transferred at least once. 7. A support having at least a release layer and a transparent resin layer on the IC card substrate according to any one of claims 1 to 3 or the image recording body according to claim 4. After heat-transferring the above transfer foil at least once,
An IC card provided with a light or thermosetting layer. 8. A support having at least a release layer and a transparent resin layer on the IC card substrate according to claim 1 or the image recording body according to claim 4. A method for producing an IC card, comprising the steps of: thermally transferring a transfer foil made of at least one or more times, providing a light or / and thermosetting layer, and then exposing or / and heat treating with actinic rays. 9. The IC card according to claim 5 or 7, wherein the personal information includes face image, address, name, date of birth and the like. 10. The IC card according to claim 5, 7, or 9, wherein an adhesive member having at least a specific elastic epoxy resin capable of adhering at 0 to 80 ° C. A base material composed of a white support having a heat shrinkage ratio of 1.2% or less in the longitudinal direction (MD) and 0.5% or less in the transverse direction (TD) at 30 min is coated or bonded at a heating temperature of 0 to 80 ° C. And a step of accelerating curing at a heating temperature of 0 to 80 ° C. after coating or laminating, and a step of laminating and cooling at −10 ° C. to 70 ° C. IC card base material manufacturing method. 11. An electronic component having a predetermined thickness is provided between a first sheet member and a second sheet member, and at least the first sheet member, the second sheet member and the electronic component are provided. , A compound containing two or more epoxy groups in one molecule, and a compound generating a cation at a temperature of 10 to 150 ° C. are applied at a temperature of 80 ° C. or lower through an adhesive member containing at least An IC card substrate having a laminated structure formed by pasting. 12. An image recording body, wherein the IC card substrate according to claim 11 has an image receiving layer for receiving a sublimation or heat diffusible dye image by a thermal transfer recording system. 13. An IC card characterized in that the IC card base material according to claim 11 or the image recording body according to claim 12 is protected by a light or thermosetting resin layer. 14. A transfer foil comprising a support having at least a release layer and a transparent resin layer on the IC card substrate according to claim 11 or the image recording body according to claim 12 at least once. A method for manufacturing an IC card, which is characterized by thermal transfer. 15. A transfer foil comprising a support having at least a release layer and a transparent resin layer, which is transferred onto the IC card substrate according to claim 11 or the image recording body according to claim 12 at least once. After that, an IC card is provided with a light or thermosetting layer. 16. A transfer foil comprising a support having at least a release layer and a transparent resin layer on the IC card substrate according to claim 11 or the image recording body according to claim 12 at least once or more. A method for producing an IC card, which comprises thermally transferring, then providing a light or / and thermosetting layer, and then exposing or heat treating with an actinic ray. 17. The IC card according to claim 13 or 15, wherein the personal information includes face image, address, name, date of birth and the like. (18) The IC card according to any one of (13), (15) and (17) can be adhered at 0 to 80 ° C, and contains two or more epoxy groups in one molecule. Compound and 10
The heat-shrinkage rate at 150 ° C./30 min of the adhesive member containing at least a compound that generates cations at a temperature of 150 ° C. to 1.2 ° C. in the longitudinal direction (MD) is 0.5% or less in the transverse direction (TD). The step of coating or laminating the base material composed of the white support of 0 to 80 ° C. at a heating temperature of 0 to 80 ° C., the step of accelerating the curing at a heating temperature of 0 to 80 ° C. after coating or laminating, A method of manufacturing an IC card base material, comprising: a step of laminating and cooling at 70 ° C .; 19. The IC card according to claim 9, wherein the IC card is watermark-printed.