CN211402798U - Deep-line pattern layer film - Google Patents

Abstract

The utility model belongs to the technical field of optical lens, a dark line pattern rete is related to, include: a pattern protection layer; patterning the first side surface of the pattern protection layer to form a deep pattern layer; the dielectric layer is arranged on the surface of the deep-grain pattern layer; and the base layer is arranged on the surface of the medium layer. The utility model discloses the deep line figure rete that forms is applicable to the anti-fake field of certificate card, and its structure is the multilayer lamellar structure that top-down stacked arrangement according to fixed order. The deep-line pattern layer is printed with deep-line pattern structure information; the dielectric layer can enhance the reflectivity of the deep-grained pattern and can prevent the pattern from cracking in the laminating process; the bonding layer is firmly attached to the lower layer; and the base layer is used as a support of the whole laminated structure and is combined with the card body. The deep-pattern layer film can be firmly connected with the card body.

Description

Deep-line pattern layer film

Technical Field

The utility model belongs to the technical field of optical lens, a deep line pattern rete is related to.

Background

Compared with the holographic grating structure, the optical structure of the deep-line pattern has larger size and is generally processed by a high-precision machine tool. Depending on the reflection and diffraction principle of light, the three-dimensional light variable effect with bright silvery color can be presented under the light, and the three-dimensional light variable effect is very suitable for product decoration. Common deep-grain patterns comprise Fresnel lenses, white light relief patterns and the like, and are widely applied to the field of anti-counterfeiting packaging. The deep-line pattern has complex structural design, high processing difficulty and high processing cost, so the imitation difficulty is high. The special optical structure can not realize copy by using a scanning mode, plays a role in copy prevention and has a certain anti-counterfeiting function. However, the anti-counterfeiting decoration field of the identification card is limited by various factors and cannot be applied all the time. The main factors are: the optical structure depth of the deep-striped pattern is typically around 5um or even greater. The structure depth of the holographic pattern which is widely applied to the certificate card and processed by the hot pressing process is less than 2um at present, and the deeper structure inevitably has the problems of incomplete pattern transfer or pattern fission; the technology of the deep-line pattern in the field of packaging is difficult to be directly used for the anti-counterfeiting of the identification card. The film coating process generally adopted in the packaging industry mainly aims at paper materials and is not suitable for the application of plastic card body materials.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems, the utility model develops a deep-line pattern film suitable for certificate and card decoration and anti-counterfeiting and a manufacturing method thereof. The deep-line pattern layer film enables the deep-line pattern to be well applied to the certificate card by changing the film covering mode, the deep-line transfer process and other methods, so that the deep-line pattern layer film has a decoration effect and a certain anti-counterfeiting function.

The purpose of the utility model can be realized by the following technical proposal:

in one aspect, the present invention provides

A deep-line graphic layer film, comprising:

a pattern protection layer; patterning the first side surface of the pattern protection layer to form a deep pattern layer;

the dielectric layer is arranged on the surface of the deep-grain pattern layer;

and the base layer is arranged on the surface of the medium layer.

Preferably, the above deep pattern layer film further comprises:

and the bonding layer is arranged between the dielectric layer and the base layer.

Preferably, the above deep pattern layer film further comprises:

and the printing enhancement layer is arranged on the second side surface of the pattern protection layer.

Preferably, in the above deep pattern layer, the thickness of the pattern protection layer is in a range of 12um to 25 um.

Preferably, the deep-line pattern layer film is provided, wherein the thickness of the dielectric layer is in a range of 200 angstroms to 500 angstroms.

Preferably, in the deep-pattern layer film, the thickness of the base layer of the dielectric layer is 75um to 250 um.

On the other hand, the utility model provides a deep line pattern rete again, wherein, include:

a pattern protection layer;

the deep pattern layer is arranged on the first side surface of the pattern protection layer and is subjected to patterning treatment to form deep pattern information;

the dielectric layer is arranged on the surface of the deep-grain pattern layer;

and the base layer is arranged on the surface of the medium layer.

Preferably, the above deep pattern layer film further comprises:

and the bonding layer is arranged between the dielectric layer and the base layer.

Preferably, the above deep pattern layer film further comprises:

and the printing enhancement layer is arranged on the second side surface of the pattern protection layer.

The utility model discloses the deep line figure rete that forms is applicable to the anti-fake field of certificate card, and its structure is the multilayer lamellar structure that top-down stacked arrangement according to fixed order. The deep-line pattern layer is printed with deep-line pattern structure information; the dielectric layer can enhance the reflectivity of the deep-grained pattern and can prevent the pattern from cracking in the laminating process; the bonding layer is firmly attached to the lower layer; and the base layer is used as a support of the whole laminated structure and is combined with the card body. The deep-pattern layer film can be firmly connected with the card body.

Drawings

FIG. 1 is a schematic structural diagram of a deep-pattern layer film according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a deep pattern layer film according to an embodiment of the present invention.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

On one hand, the utility model provides a method for manufacturing a deep pattern layer film, which comprises the following steps,

step S110, providing a pattern protection layer; the pattern protection layer is a high-light-transmittance film, and can be made of any one of materials such as PET, PVC, PETG or PC. The film is used as a bearing film layer of the deep pattern layer in the preparation process and plays a role in protecting pattern information at the later stage, and the thickness of the pattern protective layer is preferably between 12um and 25 um.

And S120, forming a deep pattern layer on the first side surface of the pattern protection layer, wherein the deep pattern layer is an optical variable device different from a holographic pattern, and the depth range of the deep pattern layer is 2 um-50 um. The deep texture structure can be tooth-shaped, rectangular and sinusoidal. The deep-line pattern can present a white light relief pattern or a Fresnel lens under visible light, the visual effect of the deep-line pattern is represented as a three-dimensional or motion state, and the deep-line pattern has a good appearance decorative effect and an anti-counterfeiting function.

The deep texture pattern layer can be directly formed on the surface of the pattern protection layer, or can be formed separately.

Step S130, forming a dielectric layer on the surface of the deep-texture pattern layer; the dielectric layer can be a film formed by metal simple substances or compound substances, the material of the dielectric layer can be simple substances such as Cr, Al, Ni, Zn and the like or oxides or sulfides thereof, and the thickness of the dielectric layer can be 200-500 angstroms. Meanwhile, the dielectric layer can effectively avoid the problem of pattern loading layer fracture in the later lamination process, and further plays a role in lamination protection.

Step S140, forming a base layer on the surface of the dielectric layer. The base layer is generally made of common materials such as PVC, PETG, PC or ABS, and the thickness is preferably 75-250 um, and the base layer and the card body can be combined by using a laminating mode.

As a further preferable aspect, the method for manufacturing a deep pattern layer film described above further includes:

step S150, a bonding layer is formed between the dielectric layer and the base layer. The bonding layer is any one of aqueous polyurethane system glue, solvent-free composite glue, epoxy resin glue, polypropylene glue, UV composite glue and hot melt glue, and the thickness of the bonding layer is 0.5-10 um.

As a further preferable aspect, the method for manufacturing a deep pattern layer film described above further includes:

and step S160, coating and forming a printing enhancement layer on the second side surface of the pattern protection layer. The printing enhancement layer is mainly used for enhancing the adhesive force of printing ink so that the surface of the printing enhancement layer can be subjected to printing or printing operation. The printing enhancement layer can be made of acrylic or polyurethane, and the thickness range of the printing enhancement layer is 0.1-1 um.

As a further preferable aspect, in the above method for manufacturing a deep pattern layer, the step S120 of forming the deep pattern layer on the first side of the pattern protection layer specifically includes:

s12011, loading UV curing resin on the first side surface of the pattern protection layer through a silk-screen printing or coating process;

s12012, carrying out hot-pressing treatment on the UV curing resin so that the UV curing resin is attached to a preset metal material to form a deep-pattern bearing layer;

s12013, hardening the deep pattern bearing layer, and demolding after the hardening is finished to form the deep pattern layer.

As a further preferred embodiment, the above method for manufacturing a deep-texture patterned layer film, wherein the forming of a dielectric layer on the surface of the deep-texture patterned layer specifically includes:

and carrying out chemical or electromagnetic coating on the surface of the deep-grain pattern layer to form the dielectric layer.

As a further preferred embodiment, in the above method for manufacturing a deep pattern layer film, when PVC, PE, PC, PETG, ABS, OPP, and the like are used as the pattern protecting layer material, the step of forming the deep pattern layer on the first side of the pattern protecting layer specifically includes:

and patterning the first side surface of the pattern protection layer to form the deep pattern layer, wherein the patterning at least comprises injection molding and heating and pressurizing modes. Because the pattern protective layer material has good thermoplastic performance, the deep pattern can be directly transferred onto the pattern protective layer in a heating and pressurizing mode by using an injection molding mode, and thus, the pattern transfer is completed. The injection molding process does not need to coat or screen print the pattern protection layer), the number of structural layers is reduced, and the material cost is reduced.

The utility model discloses the deep line figure rete that forms is applicable to the anti-fake field of certificate card, and its structure is the multilayer lamellar structure that top-down stacked arrangement according to fixed order. The deep-line pattern layer is printed with deep-line pattern structure information; the dielectric layer can enhance the reflectivity of the deep-grained pattern and can prevent the pattern from cracking in the laminating process; the bonding layer is firmly attached to the lower layer; and the base layer is used as a support of the whole laminated structure and is combined with the card body. The deep-pattern layer film can be firmly connected with the card body.

Example two

As shown in fig. 1, on the other hand, the present invention further provides a deep pattern layer film, which comprises:

the pattern protection layer 1 is subjected to patterning treatment to form a deep-texture pattern layer; wherein, the shape of the deep pattern layer 2 is tooth-shaped, and/or rectangular, and/or sinusoidal, and/or polygonal.

The dielectric layer 3 is arranged on the surface of the deep-grain pattern layer;

and the base layer 6 is arranged on the surface of the dielectric layer 3.

As a further preferred embodiment, the above deep pattern layer film further comprises:

and the bonding layer 5 is arranged between the dielectric layer 3 and the base layer 6.

As a further preferred embodiment, the above deep pattern layer film further comprises:

and the printing enhancement layer 4 is arranged on the second side surface of the pattern protection layer 1.

The deep pattern layer film is formed by the deep pattern layer film manufacturing method, and the technical effects of the deep pattern layer film are not described herein.

EXAMPLE III

As shown in FIG. 2, in another aspect, the present invention further provides a deep pattern layer film, which comprises

A deep-line graphic layer film, comprising:

a pattern protection layer 1;

the deep pattern layer 2 is arranged on the first side surface of the pattern protection layer and is subjected to patterning treatment to form deep pattern information, wherein the shape of the deep pattern layer 2 is tooth shape, and/or rectangular shape, and/or sinusoidal shape, and/or broken line shape;

the dielectric layer 3 is arranged on the surface of the deep pattern layer 2;

and the base layer 6 is arranged on the surface of the dielectric layer 3.

The deep pattern layer film is formed by the deep pattern layer film manufacturing method, and the technical effects of the deep pattern layer film are not described herein.

The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications, additions and substitutions for the specific embodiments described herein may be made by those skilled in the art without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.

Claims (9)

1. A deep-line graphic layer comprising:

a pattern protection layer; patterning the first side surface of the pattern protection layer to form a deep pattern layer;

the dielectric layer is arranged on the surface of the deep-grain pattern layer;

and the base layer is arranged on the surface of the medium layer.

2. The deep texture pattern layer film as set forth in claim 1, further comprising:

and the bonding layer is arranged between the dielectric layer and the base layer.

3. The deep texture pattern layer film as set forth in claim 1, further comprising:

and the printing enhancement layer is arranged on the second side surface of the pattern protection layer.

4. The deep groove pattern layer film according to claim 1, wherein the thickness of the pattern protective layer is in the range of 12um to 25 um.

5. The deep-line pattern layer film according to claim 1, wherein the dielectric layer has a thickness in the range of 200 angstroms to 500 angstroms.

6. The deep groove pattern layer film as defined in claim 1, wherein the thickness of the base layer of the dielectric layer is 75um to 250 um.

7. A deep-line graphic layer comprising:

a pattern protection layer;

the deep pattern layer is arranged on the first side surface of the pattern protection layer and is subjected to patterning treatment to form deep pattern information;

the dielectric layer is arranged on the surface of the deep-grain pattern layer;

and the base layer is arranged on the surface of the medium layer.

8. The deep texture pattern layer film as set forth in claim 7, further comprising:

and the bonding layer is arranged between the dielectric layer and the base layer.

9. The deep texture pattern layer film as set forth in claim 7, further comprising:

and the printing enhancement layer is arranged on the second side surface of the pattern protection layer.

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