CN110868807A - Method for keeping right angle of copper foil on DBC substrate - Google Patents
Method for keeping right angle of copper foil on DBC substrate Download PDFInfo
- Publication number
- CN110868807A CN110868807A CN201911065411.8A CN201911065411A CN110868807A CN 110868807 A CN110868807 A CN 110868807A CN 201911065411 A CN201911065411 A CN 201911065411A CN 110868807 A CN110868807 A CN 110868807A
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- China
- Prior art keywords
- copper foil
- edge
- arc
- thickness
- right angle
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
Abstract
The invention designs a method for keeping a copper foil right angle on a DBC substrate, which is characterized in that the copper foil right angle is designed into a sharp angle with two arc-shaped sides when a film graph is designed, and the distances from the crossing sharp angle point of the two arcs to two sides A and B are both a; the distance from the tangent point of the arc to the edge A to the edge B and the distance from the tangent point of the arc to the edge B to the edge A are both B; the radius of the arc is r; the relationship between the thickness t of the copper foil and the sizes a, b and r of the sharp corners is in mm; a is (0.4-0.6) t; b is (0.55-0.75) t; r ═ 1.35 to 1.55) t; the copper foil corner can still keep a right angle after being etched, thereby meeting the subsequent requirements of products.
Description
Technical Field
The invention belongs to the field of semiconductor manufacturing, LED and optical communication, and is particularly suitable for manufacturing DBC substrates of semiconductor refrigerators, LEDs, power semiconductors and the like.
Background
The copper clad ceramic substrate (DBC substrate) obtains a required copper foil design pattern after the film pasting, exposing, developing and etching processes are completed, in the etching process, the etching solution continuously etches the copper foil in all directions, and the edge right angle (figure 1 left figure) of the originally developed copper foil becomes a fillet after being etched (figure 1 right figure).
Because the DBC substrate is sometimes welded along the edge of the copper foil when being packaged in the back channel, the fillet at the edge of the copper foil can cause the suspension of the chip edge and the failure of welding. In order to make the chip and the copper foil completely fit at the edge for welding, the corner of the etched copper foil is still in a right angle, so the original pattern design method cannot meet the requirement.
The film graph refers to that a needed product design graph is designed through CAD software and is added on the film to form a film graph, and the film graph is changed into an actual design graph of the product through film pasting, exposure, development and etching processes.
Disclosure of Invention
Aiming at the problems in the prior art, the invention designs a method for keeping the right angle of the copper foil on the DBC substrate, and the right angle of the copper foil can be still kept after the corner of the copper foil is etched by designing the right angle of the copper foil into a sharp angle with two arc-shaped sides during the design of a film pattern, so that the subsequent requirement of a product is met.
The technical scheme of the invention is as follows: a method for keeping a copper foil right angle on a DBC substrate comprises the following specific steps:
firstly, performing side corrosion addition and release on a film graph according to the thickness of a copper foil;
step two, designing a sharp corner:
(1) designing the corners of the copper foil into symmetrical sharp corners with two arcs;
(2) setting the distances from the intersection sharp corner points of the two arcs to the two sides A and B as a; the distance from the tangent point of the arc to the edge A to the edge B and the distance from the tangent point of the arc to the edge B to the edge A are both B; the radius of the arc is r;
(3) the relationship between the thickness t of the copper foil and the sizes a, b and r of the sharp corners is in mm;
a＝(0.4～0.6)t；
b＝(0.55～0.75)t；
r＝(1.35～1.55)t；
and step three, pasting, exposing, developing and etching processes, wherein the corners of the copper foil are right-angled after being etched.
Further, when the copper foil thickness is 0.20: a is 0.1; b is 0.14; r is 0.29.
Further, when the thickness of the copper foil is 0.40: a is 0.2; b is 0.25; r is 0.6.
Further, when the copper foil thickness is 0.60: a is 0.3; b is 0.4; r is 0.87.
Further, when the thickness of the copper foil is 0.80: a is 0.4; b is 0.52; r is 1.16.
The invention has the beneficial effects that: when the film pattern is designed, the right angle of the copper foil is designed to be a sharp angle with two arc-shaped sides instead of a right angle, so that the copper foil still keeps a right angle after etching, and the subsequent requirements of products are met.
Drawings
Fig. 1 shows that the right angle of the edge of the copper foil (left view in fig. 1) developed from the original copper foil in the prior art becomes rounded after etching (right view in fig. 1).
FIG. 2 is a schematic view of a corner of a copper foil designed as a symmetrical tip with two arcs;
FIG. 3 shows that the distances from the intersection cusp point of the two arcs to both sides A and B are a; the distance from the tangent point of the arc to the edge A to the edge B and the distance from the tangent point of the arc to the edge B to the edge A are both B; the radius of the arc is r;
FIG. 4 shows a design in which the two sides are rounded so that the corners of the substrate are sharp (left side of FIG. 4), so that the copper foil remains at right angles after right angle etching (right side of FIG. 4).
Detailed Description
The invention is further described below with reference to the accompanying drawings.
The invention aims to solve the problem that the corners of the copper foil can become round corners after being etched, and the subsequent requirements of products cannot be met.
The design steps of the design are as follows:
1. adding and releasing the lateral corrosion amount of the film pattern according to the thickness of the copper foil
2. And designing a sharp corner.
1) Designing the corners of the copper foil as symmetrical sharp angles with two arcs
See FIG. 2
2) The distances from the intersection sharp corner points of the two arcs to the two sides A and B are both a;
the distance from the tangent point of the arc to the edge A to the edge B and the distance from the tangent point of the arc to the edge B to the edge A are both B;
the radius of the arc is r;
see FIG. 3
2) Copper foil thickness and closed angle size relation (mm)
When the thickness of the copper foil is 0.20:
a＝0.1；b＝0.14；r＝0.29。
when the thickness of the copper foil is 0.40:
a＝0.2；b＝0.25；r＝0.6。
when the thickness of the copper foil is 0.60:
a＝0.3；b＝0.4；r＝0.87。
when the thickness of the copper foil is 0.80:
a＝0.4；b＝0.52；r＝1.16。
through the design that the two sides are in the shape of circular arcs, the corners of the substrate are in sharp angles, so that the right angle of the copper foil can be maintained after right-angle etching, and the subsequent requirements of products are met. See fig. 4.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (5)
1. A method for keeping the right angle of a copper foil on a DBC substrate is characterized in that: the method comprises the following specific steps:
firstly, performing side corrosion addition and release on a film graph according to the thickness of a copper foil;
step two, designing a sharp corner:
(1) designing the corners of the copper foil into symmetrical sharp corners with two arcs;
(2) setting the distances from the intersection sharp corner points of the two arcs to the two sides A and B as a; the distance from the tangent point of the arc to the edge A to the edge B and the distance from the tangent point of the arc to the edge B to the edge A are both B; the radius of the arc is r;
(3) the relationship between the thickness t of the copper foil and the sizes a, b and r of the sharp corners is in mm;
a＝(0.4～0.6)t；
b＝(0.55～0.75)t；
r＝(1.35～1.55)t；
and step three, pasting, exposing, developing and etching processes, wherein the corners of the copper foil are right-angled after being etched.
2. The method of claim 1, wherein the method comprises the steps of: when the thickness of the copper foil is 0.20: a is 0.1; b is 0.14; r is 0.29.
3. The method of claim 1, wherein the method comprises the steps of: when the thickness of the copper foil is 0.40: a is 0.2; b is 0.25; r is 0.6.
4. The method of claim 1, wherein the method comprises the steps of: when the thickness of the copper foil is 0.60: a is 0.3; b is 0.4; r is 0.87.
5. The method of claim 1, wherein the method comprises the steps of: when the thickness of the copper foil is 0.80: a is 0.4; b is 0.52; r is 1.16.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911065411.8A CN110868807A (en) | 2019-11-04 | 2019-11-04 | Method for keeping right angle of copper foil on DBC substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911065411.8A CN110868807A (en) | 2019-11-04 | 2019-11-04 | Method for keeping right angle of copper foil on DBC substrate |
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| CN110868807A true CN110868807A (en) | 2020-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911065411.8A Pending CN110868807A (en) | 2019-11-04 | 2019-11-04 | Method for keeping right angle of copper foil on DBC substrate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040660A (en) * | 2020-08-17 | 2020-12-04 | 鹤山市中富兴业电路有限公司 | Circuit board for pattern transfer and pattern transfer process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106455325A (en) * | 2016-09-27 | 2017-02-22 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 77Ghz high-precision radio radar printed circuit board |
| CN106900140A (en) * | 2015-12-21 | 2017-06-27 | 上海申和热磁电子有限公司 | One kind keeps covering the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate |
| CN106973514A (en) * | 2017-03-10 | 2017-07-21 | 江门崇达电路技术有限公司 | PAD preparation method in a kind of PCB |
| CN108012432A (en) * | 2017-11-27 | 2018-05-08 | 深南电路股份有限公司 | A kind of production method of millimetre-wave radar PCB |
-
2019
- 2019-11-04 CN CN201911065411.8A patent/CN110868807A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900140A (en) * | 2015-12-21 | 2017-06-27 | 上海申和热磁电子有限公司 | One kind keeps covering the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate |
| CN106455325A (en) * | 2016-09-27 | 2017-02-22 | 惠州市金百泽电路科技有限公司 | Manufacturing method of 77Ghz high-precision radio radar printed circuit board |
| CN106973514A (en) * | 2017-03-10 | 2017-07-21 | 江门崇达电路技术有限公司 | PAD preparation method in a kind of PCB |
| CN108012432A (en) * | 2017-11-27 | 2018-05-08 | 深南电路股份有限公司 | A kind of production method of millimetre-wave radar PCB |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040660A (en) * | 2020-08-17 | 2020-12-04 | 鹤山市中富兴业电路有限公司 | Circuit board for pattern transfer and pattern transfer process |
| CN112040660B (en) * | 2020-08-17 | 2021-11-02 | 鹤山市中富兴业电路有限公司 | Circuit board for pattern transfer and pattern transfer process |
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Effective date of registration: 20201112 Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Applicant after: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. Address before: 200444 Baoshan District, Baoshan City Industrial Park Road, No., Hill Road, No. 181 Applicant before: SHANGHAI SHENHE THERMO-MAGNETICS ELECTRONICS Co.,Ltd. |
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