CN106900140A - One kind keeps covering the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate - Google Patents
One kind keeps covering the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate Download PDFInfo
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- CN106900140A CN106900140A CN201510970507.4A CN201510970507A CN106900140A CN 106900140 A CN106900140 A CN 106900140A CN 201510970507 A CN201510970507 A CN 201510970507A CN 106900140 A CN106900140 A CN 106900140A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
Keep covering the uniform method of copper particle spacing dimension and substrate on copper ceramic substrate the present invention relates to one kind, including：Copper Foil side etching extent is determined according to copper thickness, all copper particle appearance and sizes are integrally placed by side etching extent, spacing is a anyhow to place rear copper particle；Copper particle on the angle of edge four is designed to asymmetric quadrangle；Remaining copper particle on edge is designed to symmetric trapezium；Trapezoidal horizontal interior spacing is a, and horizontal olo is b；Trapezoidal perpendicular interior spacing is a, perpendicular olo c.B=0.30a~0.80a, c=0.40a~0.90a.The present invention is when the film drawing of copper particle shape is designed, change the conventional design method that copper particle appearance and size is integrally uniformly placed by side etching extent, the rectangle form Design that edge one is enclosed into copper particle in echelon, makes spacing be in courage jacking mouth, compensation edge flow velocity is fast, etches fast pool effect.It is in horn mouth form undesirable condition to solve edge spacing, and product edge spacing and middle ware are away from size problem of non-uniform.
Description
Technical field
It is more particularly to a kind of to keep covering on copper ceramic substrate between copper particle the invention belongs to semiconductor cooling device manufacture field
The uniform method of carpenters square cun.
Background technology
It is to use DBC (Direct Bond Copper) technologies by Copper Foil direct sintering to cover copper ceramic substrate (DBC substrates)
In a kind of basic electronic material that ceramic surface is made.Cover copper ceramic substrate have fabulous thermal cycle, dimensionally stable, just
Property good, thermal conductivity is high, reliability is high, the characteristics of covering copper face and can etch various figures, and it be it is a kind of it is pollution-free, without public affairs
Harmful green product, temperature in use is quite extensive, can be from -55 DEG C~850 DEG C, and thermal coefficient of expansion close to silicon, lead by its application
Domain is quite varied：Can be used for semiconductor cooler, electronic heater, high-power electric semiconductor module, power control circuit, work(
Rate hybrid circuit, intelligent power component, high frequency switch power, solid-state relay, automotive electronics, space flight and aviation and military electronic group
The multinomial industrial electronic fields such as part, solar cell panel assembly, telecommunication private branch exchange system, reception system, laser.
Copper ceramic substrate (DBC) product is covered for semiconductor cooling device, its surface copper particle is generally rectangular in shape
Or it is square, see Fig. 1.When the Copper Foil of product is thicker (generally 0.40mm~0.70mm), because etching period is long, after etching
Spacing non-uniform phenomenon between product copper particle occurs：Edge gap ratio middle ware is away from greatly and in horn mouth form, copper
Particle shape shape yet no longer rectangular form, product size does not meet drawing and scraps, and sees Fig. 1.Its producing cause is：In design copper particle
During the film drawing of shape, traditional design methods are the thickness according to Copper Foil, after determining Copper Foil side etching extent, then to all copper
Grain appearance and size is integrally placed by side etching extent, does not account for pool effect during etching.And in etching due to pond
Effect, etching solution is presented in product edge to be etched flow velocity gradually accelerates state, and new and old etching solution is exchanged also to be accelerated；And
Flow velocity is slow between in the product, and new and old etching solution exchanges slow, causes the copper particle etching of product edge fast (accelerating in gradient), middle
Copper particle etching is slow, and spacing is inconsistent and in horn mouth form.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided one kind keeps covering copper particle spacing on copper ceramic substrate
The method of size uniform.The method of the present invention, make product after the etching edge spacing and middle ware away from essentially identical, and
Without horn mouth form, copper particle shape is still rectangle or square, improves product yield.
The purpose of the present invention is achieved through the following technical solutions：
Keep covering the uniform method of copper particle spacing dimension on copper ceramic substrate it is an object of the invention to provide one kind, it is special
Levy and be, including：
The first step：Etching extent δ in Copper Foil side is determined according to copper thickness；
Second step：Copper particle square is integrally placed by side etching extent to copper particle appearance and size：
Copper particle matrix includes mutually perpendicular X-direction and Y-direction, and the copper particle of copper particle matrix is divided into arrangement according to arrangement position
Middle part copper particle in the middle of copper particle matrix, the edge copper particle for being arranged in the side of middle part copper particle outer rim four and it is arranged in copper particle matrix corner
Corner copper particle；
Middle part copper particle is rectangle, and the side long of middle part copper particle is parallel with X-direction, and broadside is parallel with Y-direction, middle part after placing
X between copper particle is a to spacing and Y-direction spacing, if a is the base at interval；
Described edge copper particle is isosceles trapezoid, during edge copper particle includes that upper bottom edge and bottom, the upper bottom edge are neighbouring
Portion's copper particle；It is side copper particle long along the edge copper particle that Y-direction is distributed, the upper bottom edge spacing of adjacent side copper particle long is a, adjacent side long
The bottom spacing of copper particle is b, b=0.30a~0.80a；Along X to distribution edge copper particle be broadside copper particle, adjacent broadside
The upper bottom edge spacing of copper particle is a, and the bottom spacing of adjacent broadside copper particle is c, c=0.40a~0.90a；
Described corner copper particle is that, with the quadrangle at right angle, right angle joint is right angle electrical, relative with right angle
Acute angle joint is interior angle point；In copper particle upper bottom edge in side long to adjacent corner copper particle between angle point at intervals of a, side copper particle long
Bottom to the interval between adjacent corner copper particle right angle electrical is also b, b=0.30a~0.80a；Broadside copper particle upper bottom edge is extremely
In adjacent corner copper particle between angle point at intervals of a；Interval between the copper particle right angle electrical of broadside copper particle bottom to corner
It is c, c=0.40a~0.90a.
Preferably, the X between described side copper particle long and middle part copper particle is a to spacing, and the upper bottom edge of side copper particle long is with
The length of portion's copper particle is identical, and the height of side copper particle long is identical with the width of middle part copper particle；Y between described broadside copper particle and middle part copper particle
It is a to spacing, the upper bottom edge of broadside copper particle is identical with the width of middle part copper particle, the height of broadside copper particle is identical with the length of middle part copper particle.
Preferably, described a value determination modes are that the pitch requirements between pre-set product copper particle are Da, a=D-2 δ.
One kind keeps covering the uniform method of copper particle spacing dimension on copper ceramic substrate, including：
The first step：Etching extent δ in Copper Foil side is determined according to copper thickness；
Second step：Copper particle matrix is integrally placed by side etching extent to copper particle appearance and size, copper particle matrix includes orthogonal
X-direction and Y-direction, the copper particle unit of copper particle matrix is divided into the middle part copper being arranged in the middle of copper particle matrix according to arrangement position
Grain, the edge copper particle for being arranged in the side of middle part copper particle outer rim four and the corner copper particle for being arranged in copper particle matrix corner；
Middle part copper particle is square, and the X after placing between the copper particle of middle part is a to spacing and Y-direction spacing, if a is interval
Base；
Described edge copper particle is isosceles trapezoid, during edge copper particle includes that upper bottom edge and bottom, the upper bottom edge are neighbouring
Portion's copper particle；The upper bottom edge spacing of adjacent edge copper particle is a, and the bottom spacing of adjacent edge copper particle is b, b=0.30a~
0.90a；
Described corner copper particle is that, with the quadrangle at right angle, right angle joint is right angle electrical, relative with right angle
Acute angle joint is interior angle point；In edge copper particle upper bottom edge to adjacent corner copper particle between angle point at intervals of a；Edge copper particle
Bottom to the interval between adjacent corner copper particle right angle electrical also be b, b=0.30a~0.90a.
Preferably, the spacing between described edge copper particle and middle part copper particle is a, upper bottom edge and the middle part copper of edge copper particle
The length of grain is identical.
Preferably, described a value determination modes are that the pitch requirements between pre-set product copper particle are Da, a=D-2 δ.
One kind is kept covering substrate obtained in the uniform method of copper particle spacing dimension on copper ceramic substrate, and copper particle is set on substrate
Matrix, including mutually perpendicular X-direction and Y-direction, copper particle unit are same shape, and X is identical with Y-direction spacing to spacing.
One kind keeps covering the uniform method of copper particle spacing dimension on copper ceramic substrate, determines that Copper Foil side is rotten according to copper thickness
Erosion amount；Copper particle matrix integrally placed by side etching extent to copper particle appearance and size, copper particle matrix have X to and Y-direction, X is to mutual with Y-direction
Vertically, the middle part of copper particle matrix is middle part copper particle, and the peripheral four edges of middle part copper particle are edge copper particle, four angles of copper particle matrix
It is corner copper particle.The coordinate of homography, i.e. copper particle (X1,Y1), copper particle (Xn, Y1), copper particle (X1, Yn) and copper particle (Xn,Yn) it is angle
Portion's copper particle, the shape of corner copper particle is identical, is with the quadrangle at right angle, the right angle of right angle counterpart substrate in arrangement
Place.Copper particle (X2, Y1), copper particle (X3, Y1) ... copper particle (Xn-1, Y1) it is edge copper particle, copper particle (X2,Yn), copper particle (X3, Yn)……
Copper particle (Xn-1,Yn) it is edge copper particle, copper particle (X1, Y2), copper particle (X1, Y3) ... copper particle (X1, Yn-1) it is edge copper particle, copper particle
(Xn, Y2), copper particle (Xn, Y3) ... copper particle (Xn, Yn-1) it is edge copper particle.Remaining copper particle is middle part copper particle, and middle part copper particle is length
Square, the broadside of middle part copper particle and X are to parallel, and side long is parallel with Y-direction.Edge copper particle is isosceles trapezoid, the upper bottom of edge copper particle
While close on middle part copper particle, but edge copper particle shape differs, and to the edge copper particle of distribution is broadside copper particle along X, broadside copper particle
High identical with the length of middle part copper particle, the upper bottom edge of broadside copper particle is identical with the width of middle part copper particle.Along Y-direction be distributed edge copper particle be
Side copper particle long, the height of side copper particle long is identical with the width of middle part copper particle, and the upper bottom edge of side copper particle long is identical with the length of middle part copper particle 1.
All copper particles are rectangle or close to rectangle, and four angles of copper particle are A, B, C, D, are said by taking one jiao of substrate as an example
The arrangement relation of bright copper particle matrix.The X of middle part copper particle is identical with Y-direction spacing to spacing, is a, and a is interval base.Angle
Portion copper particle (X1,Y1) 4 points be：,AB(X1,Y1)And CD(X1,Y1)While be right-angle side, with corner copper
Grain (X1,Y1) adjacent broadside copper particle (X2,Y1) 4 points beAB(X2,Y1)With middle part copper particle 1
Width is identical, B(X1,Y1)With A(X2,Y1)Between spacing be a, D(X1,Y1)With C(X2,Y1)Between spacing be c.Middle part copper particle (X2,
Y2) 4 points beA(X2,Y1)With C(X2,Y2)Between spacing be a.Edge copper particle (X3, Y1) four
Put and beB(X2,Y1)With A(X3,Y1)Between spacing be a, D(X2,Y1)With C(X3,Y1)Between spacing be
c.Copper particle (X in side long1,Y2) 4 points beWith corner copper particle (X1,Y1) adjacent.B(X1,Y1)With
D(X1,Y2)Between spacing be a, A(X1,Y1)With C(X1,Y2)Between spacing be b.With middle part copper particle (X2,Y2) between A(X2,Y1)With
B(X1,Y2)Between spacing be a.Edge copper particle (X1, Y3) 4 points beB(X1,Y2)With D(X1,Y3)It
Between spacing be a, A(X1,Y2)With C(X1,Y3)Between spacing be b.B=0.5a, c=0.6a.Positioned at XnSide copper particle long be located at
X1Side copper particle long be arranged symmetrically, positioned at YnBroadside copper particle and Y1Broadside copper particle be arranged symmetrically.Corner copper particle (X1,Y1) and angle
Portion copper particle (Xn, Y1) Y-axis is arranged symmetrically, corner copper particle (X1,Y1) with corner copper particle (X1,Yn) X-axis is arranged symmetrically.Corner copper particle
(X1,Y1) with corner copper particle (Xn,Yn) be centrosymmetrically arranged.
Compared with prior art, the positive effect of the present invention is as follows：
The present invention is being designed by changing the conventional design method that copper particle appearance and size is integrally uniformly placed by side etching extent
During the film drawing of copper particle shape, the rectangle form Design that edge one is enclosed into copper particle in echelon, makes spacing in courage jacking mouth,
Compensation edge flow velocity is fast, etches fast pool effect, so as to solve edge spacing in horn mouth form
Undesirable condition, and product edge spacing and middle ware improve product yield away from size problem of non-uniform.
Brief description of the drawings
Fig. 1 is arranged for the substrate copper particle of prior art.
Fig. 2 is the schematic diagram of copper particle matrix arrangements of the present invention；
Fig. 3 is the schematic diagram of finished product of the present invention；
Wherein, 1- middle parts copper particle；2- edge copper particles；21- side copper particles long；
22- broadside copper particles；3- corners copper particle；
Specific embodiment：
With reference to specific embodiment, the present invention is expanded on further.It should be understood that these embodiments are merely to illustrate the present invention
Rather than limitation the scope of the present invention.In addition, it is to be understood that after the content for having read instruction of the present invention, people in the art
Member can make various changes or modifications to the present invention, and these equivalent form of values equally fall within the application appended claims and limited
Scope.
Embodiment 1
The uniform method of copper particle spacing dimension on copper ceramic substrate, the first step, according to copper are covered in a kind of holding as shown in Figure 2
Paper tinsel thickness and etching machine performance determine Copper Foil side etching extent δ；Second, the pitch requirements between product copper particle are D, are corroded by side
Amount δ carries out entirety and places, spacing a, the a=D-2 δ after placing；By this size design copper particle film drawing and make film bottom
Piece；By pattern transfer operation by pattern transfer to product surface, required copper particle profile is obtained after overetch.
Copper particle matrix have X to and Y-direction, X is mutually perpendicular to Y-direction, and the middle part of copper particle matrix is middle part copper particle 1, middle part copper
The peripheral four edges of grain 1 are edge copper particle 2, and four angles of copper particle matrix are corner copper particle 3.The coordinate of homography, i.e. copper particle
(X1,Y1), copper particle (Xn, Y1), copper particle (X1, Yn) and copper particle (Xn,Yn) it is corner copper particle 3, the shape of corner copper particle 3 is identical, is
With the quadrangle at right angle, the right angle of right angle counterpart substrate in arrangement.Copper particle (X2, Y1), copper particle (X3, Y1)……
Copper particle (Xn-1, Y1) it is edge copper particle 2, copper particle (X2,Yn), copper particle (X3, Yn) ... copper particle (Xn-1,Yn) it is edge copper particle 2, copper particle
(X1, Y2), copper particle (X1, Y3) ... copper particle (X1, Yn-1) it is edge copper particle 2, copper particle (Xn, Y2), copper particle (Xn, Y3) ... copper particle
(Xn, Yn-1) it is edge copper particle 2.Remaining copper particle be middle part copper particle 1, middle part copper particle 1 be rectangle, the broadside of middle part copper particle 1 with
X is to parallel, and side long is parallel with Y-direction.Edge copper particle 2 is isosceles trapezoid, and middle part copper particle 1, but side are closed in the upper bottom edge of edge copper particle 2
The shape of portion's copper particle 2 is differed, and to the edge copper particle of distribution is broadside copper particle 22 along X, the high and middle part copper particle 1 of broadside copper particle 22
Length is identical, and the upper bottom edge of broadside copper particle 22 is identical with the width of middle part copper particle 1.It is side copper particle 21 long along the edge copper particle that Y-direction is distributed,
The height of side copper particle 21 long is identical with the width of middle part copper particle 1, and the upper bottom edge of side copper particle 21 long is identical with the length of middle part copper particle 1.
All copper particles are rectangle or close to rectangle, and four angles of copper particle are A, B, C, D, are said by taking one jiao of substrate as an example
The arrangement relation of bright copper particle matrix.The X of middle part copper particle 1 is identical with Y-direction spacing to spacing, is a.Corner copper particle (X1,Y1) four
Put and be：,AB(X1,Y1)And CD(X1,Y1)While be right-angle side, with corner copper particle (X1,Y1) adjacent width
Side copper particle (X2,Y1) 4 points beAB(X2,Y1)Width with middle part copper particle 1 is identical, B(X1,Y1)With
A(X2,Y1)Between spacing be a, D(X1,Y1)With C(X2,Y1)Between spacing be c.Middle part copper particle (X2,Y2) 4 points beA(X2,Y1)With C(X2,Y2)Between spacing be a.Edge copper particle (X3, Y1) 4 points beB(X2,Y1)With A(X3,Y1)Between spacing be a, D(X2,Y1)With C(X3,Y1)Between spacing be c.It is long
Side copper particle (X1,Y2) 4 points beWith corner copper particle (X1,Y1) adjacent.B(X1,Y1)With D(X1,Y2)It
Between spacing be a, A(X1,Y1)With C(X1,Y2)Between spacing be b.With middle part copper particle (X2,Y2) between A(X2,Y1)With B(X1,Y2)Between
Spacing be a.Edge copper particle (X1, Y3) 4 points beB(X1,Y2)With D(X1,Y3)Between spacing be
A, A(X1,Y2)With C(X1,Y3)Between spacing be b.B=0.5a, c=0.6a.Positioned at XnSide copper particle long be located at X1Side copper long
Grain is arranged symmetrically, positioned at YnBroadside copper particle and Y1Broadside copper particle be arranged symmetrically.Corner copper particle (X1,Y1) with corner copper particle (Xn,
Y1) Y-axis is arranged symmetrically, corner copper particle (X1,Y1) with corner copper particle (X1,Yn) X-axis is arranged symmetrically.Corner copper particle (X1,Y1) and angle
Portion copper particle (Xn,Yn) be centrosymmetrically arranged.Copper thickness is 0.40mm, determines side etching extent δ=0.20mm；Space D is 0.65mm
When, calculate a=D-2 × δ=0.25mm, b=0.18mm, c=0.21mm.
Embodiment 2
One kind keeps covering the uniform method of copper particle spacing dimension on copper ceramic substrate, the first step, according to copper thickness and corruption
Erosion machine performance determines Copper Foil side etching extent δ；Second, the pitch requirements between product copper particle are D, are carried out by side etching extent δ whole
Body is placed, spacing a, the a=D-2 δ after placing；By this size design copper particle film drawing and make film egative film；By figure
Pattern transfer to product surface is obtained required copper particle profile by shape transfering process after overetch.
Copper particle matrix have X to and Y-direction, X is mutually perpendicular to Y-direction, and the middle part of copper particle matrix is middle part copper particle 1, middle part copper
The peripheral four edges of grain 1 are edge copper particle 2, and four angles of copper particle matrix are corner copper particle 3.The coordinate of homography, i.e. copper particle
(X1,Y1), copper particle (Xn, Y1), copper particle (X1, Yn) and copper particle (Xn,Yn) it is corner copper particle 3, the shape of corner copper particle 3 is identical, is
With the quadrangle at right angle, the right angle of right angle counterpart substrate in arrangement.Copper particle (X2, Y1), copper particle (X3, Y1)……
Copper particle (Xn-1, Y1) it is edge copper particle 2, copper particle (X2,Yn), copper particle (X3, Yn) ... copper particle (Xn-1,Yn) it is edge copper particle 2, copper particle
(X1, Y2), copper particle (X1, Y3) ... copper particle (X1, Yn-1) it is edge copper particle 2, copper particle (Xn, Y2), copper particle (Xn, Y3) ... copper particle
(Xn, Yn-1) it is edge copper particle 2.Remaining copper particle be middle part copper particle 1, middle part copper particle 1 for square, one side of middle part copper particle 1 with
X is to parallel, and another side is parallel with Y-direction.Edge copper particle 2 is isosceles trapezoid, and middle part copper particle 1, side are closed in the upper bottom edge of edge copper particle 2
The shape of portion's copper particle 2 is identical.
All copper particles are square or close to square, and four angles of copper particle are A, B, C, D, are said by taking one jiao of substrate as an example
The arrangement relation of bright copper particle matrix.The X of middle part copper particle 1 is identical with Y-direction spacing to spacing, is a.Corner copper particle (X1,Y1) four
Put and beAB(X1,Y1)And CD(X1,Y1)While be right-angle side, with corner copper particle (X1,Y1) adjacent edge
Copper particle (X2,Y1) 4 points beB(X1,Y1)With A(X2,Y1)Between spacing be a, D(X1,Y1)With
C(X2,Y1)Between spacing be c.Middle part copper particle (X2,Y2) 4 points beA(X2,Y1)With C(X2,Y2)
Between spacing be a.Edge copper particle (X3, Y1) 4 points beB(X2,Y1)With A(X3,Y1)Between
Spacing is a, D(X2,Y1)With C(X3,Y1)Between spacing be c.Edge copper particle (X1,Y2) 4 points be
With corner copper particle (X1,Y1) adjacent.B(X1,Y1)With D(X1,Y2)Between spacing be a, A(X1,Y1)With C(X1,Y2)Between spacing be b.
With middle part copper particle (X2,Y2) between A(X2,Y1)With B(X1,Y2)Between spacing be a.Edge copper particle (X1, Y3) 4 points beB(X1,Y2)With D(X1,Y3)Between spacing be a, A(X1,Y2)With C(X1,Y3)Between spacing be b.B=
C=0.7a.Positioned at XnEdge copper particle be located at X1Edge copper particle be arranged symmetrically, positioned at YnEdge copper particle and Y1Edge
Copper particle is arranged symmetrically.Corner copper particle (X1,Y1) with corner copper particle (Xn, Y1) Y-axis is arranged symmetrically, corner copper particle (X1,Y1) and corner
Copper particle (X1,Yn) X-axis is arranged symmetrically.Corner copper particle (X1,Y1) with corner copper particle (Xn,Yn) be centrosymmetrically arranged.
General principle of the invention, principal character and advantages of the present invention has been shown and described above.The technology of the industry
Personnel it should be appreciated that the present invention is not limited to the above embodiments, simply explanation described in above-described embodiment and specification this
The principle of invention, various changes and modifications of the present invention are possible without departing from the spirit and scope of the present invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appending claims and its
Equivalent is defined.
Claims (7)
1. it is a kind of to keep covering the uniform method of copper particle spacing dimension on copper ceramic substrate, it is characterised in that including：
The first step：Etching extent δ in Copper Foil side is determined according to copper thickness；
Second step：Copper particle square is integrally placed by side etching extent to copper particle appearance and size：
Copper particle matrix includes mutually perpendicular X-direction and Y-direction, and the copper particle of copper particle matrix is divided into according to arrangement position and is arranged in copper
Middle part copper particle in the middle of grain matrix, it is arranged in the edge copper particle on the side of middle part copper particle outer rim four and is arranged in the angle of copper particle matrix corner
Portion's copper particle；
Middle part copper particle is rectangle, and the side long of middle part copper particle is parallel with X-direction, and broadside is parallel with Y-direction, middle part copper particle after placing
Between X be a to spacing and Y-direction spacing, if a is the base at interval；
Described edge copper particle is isosceles trapezoid, and edge copper particle includes upper bottom edge and bottom, and the upper bottom edge is adjacent to middle part copper
Grain；It is side copper particle long along the edge copper particle that Y-direction is distributed, the upper bottom edge spacing of adjacent side copper particle long is a, adjacent side copper particle long
Bottom spacing be b, b=0.30a~0.80a；Along X to distribution edge copper particle be broadside copper particle, adjacent broadside copper particle
Upper bottom edge spacing be a, the bottom spacing of adjacent broadside copper particle is c, c=0.40a~0.90a；
Described corner copper particle is that, with the quadrangle at right angle, right angle joint is right angle electrical, the acute angle relative with right angle
Joint is interior angle point；In copper particle upper bottom edge in side long to adjacent corner copper particle between angle point at intervals of a, side copper particle long bottom
While being also b, b=0.30a~0.80a to the interval between adjacent corner copper particle right angle electrical；Broadside copper particle upper bottom edge is to adjacent
Corner copper particle between angle point at intervals of a；Interval between the copper particle right angle electrical of broadside copper particle bottom to corner is also c, c
=0.40a~0.90a.
2. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in holding according to claim 1, it is characterised in that
X between described side copper particle long and middle part copper particle is a to spacing, and the upper bottom edge of side copper particle long is identical with the length of middle part copper particle,
The height of side copper particle long is identical with the width of middle part copper particle；Y-direction spacing between described broadside copper particle and middle part copper particle is a, broadside
The upper bottom edge of copper particle is identical with the width of middle part copper particle, and the height of broadside copper particle is identical with the length of middle part copper particle.
3. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in holding according to claim 1 and 2, and its feature exists
In,
Described a value determination modes are that the pitch requirements between pre-set product copper particle are Da, a=D-2 δ.
4. it is a kind of to keep covering the uniform method of copper particle spacing dimension on copper ceramic substrate, it is characterised in that including：
The first step：Etching extent δ in Copper Foil side is determined according to copper thickness；
Second step：Copper particle matrix is integrally placed by side etching extent to copper particle appearance and size, copper particle matrix includes mutually perpendicular X side
To and Y-direction, the copper particle unit of copper particle matrix be divided into according to arrangement position be arranged in the middle of copper particle matrix middle part copper particle, arrangement
In the side of middle part copper particle outer rim four edge copper particle and be arranged in the corner copper particle of copper particle matrix corner；
Middle part copper particle is square, and the X after placing between the copper particle of middle part is a to spacing and Y-direction spacing, if a is the base at interval
Quasi- unit；
Described edge copper particle is isosceles trapezoid, and edge copper particle includes upper bottom edge and bottom, and the upper bottom edge is adjacent to middle part copper
Grain；The upper bottom edge spacing of adjacent edge copper particle is a, and the bottom spacing of adjacent edge copper particle is b, b=0.30a~
0.90a；
Described corner copper particle is that, with the quadrangle at right angle, right angle joint is right angle electrical, the acute angle relative with right angle
Joint is interior angle point；In edge copper particle upper bottom edge to adjacent corner copper particle between angle point at intervals of a；Under edge copper particle
Base to the interval between adjacent corner copper particle right angle electrical is also b, b=0.30a~0.90a.
5. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in holding according to claim 4, it is characterised in that
Spacing between described edge copper particle and middle part copper particle is a, and the upper bottom edge of edge copper particle is identical with the length of middle part copper particle.
6. the uniform method of copper particle spacing dimension on copper ceramic substrate is covered in the holding according to claim 4 or 5, and its feature exists
In,
Described a value determination modes are that the pitch requirements between pre-set product copper particle are Da, a=D-2 δ.
7. the uniform method system of copper particle spacing dimension on copper ceramic substrate is covered in a kind of any described holding of claim 1 to 6
The substrate for obtaining, it is characterised in that copper particle matrix, including mutually perpendicular X-direction and Y-direction are set on substrate, copper particle unit is equal
It is same shape, and X is identical with Y-direction spacing to spacing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN108601111A (en) * | 2018-05-23 | 2018-09-28 | 深圳市新宜康科技股份有限公司 | The production method of the accurate controllable type fever tablet of size |
| CN110868807A (en) * | 2019-11-04 | 2020-03-06 | 上海申和热磁电子有限公司 | Method for keeping right angle of copper foil on DBC substrate |
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| CN106900140B (en) | 2019-03-05 |
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