CN110858697A - 用于印刷电路板的电连接器的组装方法 - Google Patents

用于印刷电路板的电连接器的组装方法 Download PDF

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CN110858697A
CN110858697A CN201910779420.7A CN201910779420A CN110858697A CN 110858697 A CN110858697 A CN 110858697A CN 201910779420 A CN201910779420 A CN 201910779420A CN 110858697 A CN110858697 A CN 110858697A
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contact
contacts
wafers
electrical connector
contact wafer
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兹拉坦·柳比扬基奇
芭芭拉·H·马滕
钟明
安迪·托费尔迈尔
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Amphenol Corp
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Abstract

本公开提供了一种组装电连接器的方法，所述电连接器构造成用于安装至印刷电路板。该方法具有以下步骤：提供具有多个触头的接触式晶片；使每个接触式晶片的尾端部弯曲；将接触式晶片交插以形成一个或更多个接触式晶片组件；将接触式晶片组件装载到电连接器的插入件中，使得一个或更多个接触式晶片组件在电连接器的配对接口处形成多个触头的配对端部的预定布置结构；并且将插入件插入到电连接器的外壳中。

Description

用于印刷电路板的电连接器的组装方法
技术领域
本发明涉及用于组装构造成印刷电路板用的类型的电连接器的方法，该电连接器比如为微型D型电连接器或D形电连接器。
背景技术
电连接器的制造和组装——比如那些构造成用于与印刷电路板一起使用的像微型D型连接器或D形连接器那样的电连接器的制造和组装——通常是耗时且繁复的。这是因为在组装标准的微型D型电连接器时，例如需要许多步骤。这些步骤可以包括从卷筒移除各个触头、压接那些触头中的每个触头、将被压接的触头中的每个触头安装到保持件中、将具有被压接的触头的保持件插入到外壳中、将薄封装层添加至外壳、布置并且管理触头端子、然后将厚封装层添加至外壳。端子被布置并且被管理成提供用于安装到印刷电路板上的正确端子位置。添加薄封装层和厚封装层来将触头固定就位并且防止在端子管理之后发生短路。特别地，添加薄封装层、添加厚封装层和管理触头端子的步骤使得制造和组装过程低效且繁琐。
因此，需要组装待安装在印刷电路板上的电连接器的方法，该方法是高效的并且消除了耗时且繁复的步骤。
发明内容
本发明可以提供组装电连接器的方法，该电连接器构造成用于安装至印刷电路板，该方法包括以下步骤：提供多个接触式晶片，每个接触式晶片包括由壳体支承的多个触头，其中，所述多个触头中的每个触头包括用于接合配对连接器的配对端部和用于电连接至印刷电路板的尾端部，该配对端部和该尾端部暴露在该壳体外部；使每个接触式晶片的尾端部弯曲；将接触式晶片交插以形成一个或更多个接触式晶片组件；将所述一个或更多个接触式晶片组件装载到电连接器的插入件中，使得所述一个或更多个接触式晶片组件在电连接器的配对接口处形成所述多个触头的配对端部的预定布置结构；以及将具有所述一个或更多个接触式晶片组件的插入件插入到电连接器的外壳中。
在一个实施方式中，该方法还包括在接触式晶片的尾端部处安装触头支承构件的步骤，并且该触头支承构件可以包括与所述多个触头中的每个触头对应的多个传导弹簧。在一些实施方式中，该方法还可以包括将插入件、外壳和触头支承件联接在一起的步骤，或在将该插入件、该壳体和该触头支承件联接在一起的步骤之后对该电连接器进行电传导性测试的步骤；该联接步骤可以包括将至少一个紧固件插入穿过该插入件、该外壳和该接触支承构件中的每一者，该紧固件构造成接合印刷电路板以用于将该电连接器安装至该印刷电路板；和/或该紧固件可以构造成接合该印刷电路板以用于将该电连接器安装至该印刷电路板，使得所述一个或更多个接触式晶片组件经由所述多个触头的尾端部电连接至印刷电路板。
在某些实施方式中，该方法还包括将所述多个触头的尾端部焊接至印刷电路板的步骤；并且未将封装材料或封装层添加至电连接器；将所述一个或更多个接触式晶片组件装载到插入件中的步骤和将插入件插入到外壳中的步骤都不包括管理多个端子的步骤；该方法还包括将至少两个接触式晶片组件组合以形成所述多个触头的配对端部的预定布置结构的步骤；两个接触式晶片组件中的一个接触式晶片组件的接触式晶片彼此可以具有不同或相同数量的多个触头；两个接触式晶片组件中的另一接触式晶片组件的接触式晶片彼此可以具有不同或相同数量的多个触头。
在其他实施方式中，该方法还可以包括从多个接触式晶片中选择至少两个接触式晶片的步骤，所述至少两个接触式晶片彼此可以具有不同或相同数量的多个触头以形成接触式晶片组件中的至少一个接触式晶片组件；接触式晶片中的每个接触式晶片具有与其他接触式晶片不同数量的触头；和/或该方法还可以包括将接触式晶片组件中的至少两个接触式晶片组件组合以形成所述多个触头的配对端部的预定布置结构的步骤。
本发明还可以提供组装电连接器的方法，该电连接器构造成用于安装至印刷电路板，该方法包括以下步骤：提供多个接触式晶片，每个接触式晶片包括由壳体支承的多个触头，其中，所述多个触头中的每个触头包括用于接合配对连接器的配对端部和用于电连接至印刷电路板的尾端部，该配对端部和该尾端部暴露在该壳体外部，并且其中，至少一个接触式晶片形成有四个触头，至少一个接触式晶片形成有五个触头，并且至少一个接触式晶片形成有六个触头；将接触式晶片交插以形成一个或更多个接触式晶片组件；将所述一个或更多个接触式晶片组件装载到电连接器的插入件中，使得所述一个或更多个接触式晶片组件在电连接器的配对接口处形成所述多个触头的配对端部的预定布置结构；以及将具有所述一个或更多个接触式晶片组件的插入件插入到电连接器的外壳中。
在一些实施方式中，交插步骤包括将具有四个触头、五个触头或六个触头的接触式晶片中的一个接触式晶片与具有四个触头、五个触头或六个触头的接触式晶片中的另一接触式晶片交插，以至少形成接触式晶片组件中的第一接触式晶片组件；交插步骤包括将具有四个触头、五个触头或六个触头的接触式晶片中的一个接触式晶片与具有四个触头、五个触头或六个触头的接触式晶片中的另一接触式晶片交插，以至少形成接触式晶片组件中的第二接触式晶片组件；该方法还可以包括将第一接触式晶片组件与第二接触式晶片组件组合以形成所述多个触头的配对端部的预定布置结构的步骤；将触头组件装载到插入件中的步骤包括装载所组合的第一接触式晶片组件和第二接触式晶片组件；具有四个触头、五个触头和六个触头的接触式晶片中的每个接触式晶片包括位于触头之间的至少一个弱化区域；该方法还可以包括在所述至少一个弱化区域处将具有四个触头、五个触头和六个触头的接触式晶片中的至少一个接触式晶片拆分，从而由该至少一个接触式晶片形成多个接触式晶片的步骤；和/或该方法还可以包括在将接触式晶片交插的步骤之前，使每个接触式晶片的尾端部弯曲的步骤。在一个实施方式中，所述多个触头的配对端部的在电连接器的配对接口处的预定布置结构为9位触头、15位触头、21位触头、25位触头、31位触头、37位触头、41位触头、51位触头、69位触头或100位触头或根据需要的任何其他不同数量的触头中的一者。
附图说明
通过参照结合附图考虑时的以下详细描述，将容易获得并更好理解本发明以及本发明的许多附带优点的全面理解，其中：
图1是根据本发明示例性实施方式的组装电连接器的方法中的电连接器的分解立体图；
图2A至图2C是在电连接器被组装的情况下图1所示的电连接器的各横截面视图；
图3是图1所示的电连接器的接触式晶片的立体图；
图4A和图4B是图1所示的电连接器的示例性接触式晶片组件的立体图；
图5是图1所示的电连接器的所组合的接触式晶片组件的立体图；
图6是根据本发明的示例性实施方式的示例性接触式晶片的端视图；以及
图7至图9分别是图6所示的根据本发明的示例性实施方式的接触式晶片的示例性组合、例如9位、25位和51位的端视图。
具体实施方式
参照附图，本发明总体上涉及组装电连接器100比如微型D型连接器或D形连接器的方法，电连接器100构造成用于安装在印刷电路板10上。本发明的方法消除了耗时且繁复的组装步骤以使连接器的组装过程更高效并且更快捷。
电连接器100总体上包括由插入件106支承的一个或更多个接触式晶片组件102和104，插入件106被接纳在连接器的外壳108中。支承构件110可以用于将接触式晶片102和104保持在插入件106和外壳108中。支承构件110、插入件106和外壳108可以联接在一起、比如通过一个或更多个如在图2A至图2C中观察到的紧固件112联接在一起。本发明的方法包括将电连接器100的这些部件组装的步骤。
每个接触式晶片组件102和104优选地通过交插至少两个接触式晶片120来形成。每个接触式晶片120支承壳体130中的多个触头122，其中，如在图3中最佳地观察到的，每个触头122具有暴露于壳体130的外部并且在壳体130的外部延伸的配对端部124和相反的尾端部126。壳体130可以例如以类似于在共同拥有的美国专利No.9,362,638中公开的方式包覆成型在触头122上，该专利的主题通过参引并入本文。壳体130在其至少一侧134上可以具有一个或更多个凹入表面132，其中，如图4A和图4B所示，在将接触式晶片120交插以形成接触式晶片组件102和104时，每个凹入表面132设计成接纳另一壳体的对应部分。一旦接触式晶片120互锁，接触式晶片120的触头122交替并且大致轴向对准。也就是说，两个晶片120的触头122的配对端部124可以是对准的，并且同样地，两个晶片的触头的尾端部126也可以是对准的。
如在图1和图2A至图2C中最佳地观察到的，插入件106可以具有触头接纳部分140和凸缘部分142，触头接纳部分140设计成接纳接触式晶片组件102和104，凸缘部分142设计成与支承构件110联接。替代性地，可以消除支承构件110，使得插入件106的凸缘部分142直接安装至印刷电路板10。触头接纳部分140可以包括容纳接触式晶片组件102和104的壳体130的壳体部段144和容纳触头122的触头部段146。在优选实施方式中，触头部段146包括接纳各个触头122的多个端部敞开的通道148。凸缘部分142可以包括一个或更多个孔149以接纳一个或更多个紧固件112。
外壳108具有插入件接纳部分150和凸缘部分152。插入件接纳部分150定尺寸成接纳插入件106的触头接纳部分140。插入件接纳部分150的敞开端部156使触头122的配对端部126暴露并且限定用于连接至配对连接器(未示出)的配对接口。凸缘部分152可以抵接插入件106的凸缘部分142，并且还具有一个或更多个孔158，所述一个或更多个孔158与插入件106的一个或更多个孔149对准以用于接纳紧固件112。支承构件110还可以包括分别与插入件106的孔149和外壳108的孔158对准的一个或更多个孔160以接纳紧固件112，并且紧固件112可以接合印刷电路板10，从而将连接器100安装至板10。在一个实施方式中，支承构件110可以包括诸如c形夹的传导弹簧162，传导弹簧162与触头122中的每个触头相对应并且与触头的尾端部124接合，以便在触头122与印刷电路板10之间建立电连接。替代性地，可以消除支承构件110，并且触头122的尾端部124可以比如通过焊接直接接合印刷电路板10，以便在触头122与印刷电路板10之间建立电连接。
本发明的方法优选地包括使每个接触式晶片120的每个触头122的尾端部124弯曲的步骤。例如，如在图3、图4A和图4B中观察到的，尾端部124可以弯曲大约90度，以便有助于与支承构件110的传导弹簧162接合或与印刷电路板直接接合。优选地，在将接触式晶片120交插以形成接触式晶片组件102和104之前，使尾端部124弯曲。
接触式晶片120中的至少两个接触式晶片可以被交插以形成接触式晶片组件、比如接触式晶片组件102(图4A)或接触式晶片组件104(图4B)。一旦形成接触式晶片组件102和104，接触式晶片组件102和104就可以被容易地装载到插入件106的触头接纳部分140中，使得触头122的配对端部126被接纳在各个通道148中。在将接触式晶片组件102和104装载时，如在图5中示出的，可以对接触式晶片组件102和104进行组合以用于装载到插入件106中，使得接触式晶片组件102和104形成多个触头122的配对端部126的预定布置结构。如此，在连接器100的组装期间不需要接触或接线管理。
然后可以将在其中装载有接触式晶片组件102和104的插入件106插入到外壳108的插入件接纳部分150中，使得触头配对端部126在电连接器的配对接口处、即在外壳108的敞开端部156处处于预定布置结构。因为触头122被插入件106以触头122的预定布置结构完全支承，所以在组装期间不需要将封装或环氧树脂材料或层添加至连接器100。触头122的配对端部126的预定布置结构可以基于所需的连接器类型——例如，9位触头、15位触头、21位触头、25位触头、31位触头、37位触头、41位触头、51位触头、69位触头、或100位触头、或根据需要的任何其他不同数量的触头——来选择。例如，图7示出了触头122的9位布置结构，其中，一个接触式晶片组件102包括五个触头，另一接触式晶片组件104包括四个触头。一旦将装载的插入件106、外壳108和支承构件11联接在一起，连接器100就可以在运送给客户之前进行电传导性测试。
在优选实施方式中，接触式晶片120彼此可以具有不同数量的触头122。例如，每个接触式晶片120可以是三种类型、即如在图6中观察到的4触头型晶片120a、5触头型晶片120b和6触头型晶片102c中的一种类型。4触头型晶片120a、5触头型晶片120b和6触头型晶片120c中的每一者分别具有被支承在壳体130中的4个触头122、5个触头122和6个触头122。4触头型晶片120a、5触头型晶片120b和6触头型晶片120c的各个壳体130可以具有允许将晶片拆分成多于一个晶片的一个或更多个弱化区域170。使用可拆分的4触头型晶片120a、5触头型晶片120b和6触头型晶片120c，可以布置任何位置数量连接器(connector positions)(例如9位、15位、21位、25位、31位、37位、41位、51位、69位或100位)。例如，图7所示的9位的触头布置结构是通过将具有五个触头的接触式晶片组件102与具有四个触头的接触式晶片组件104组合来形成的。接触式晶片组件102可以例如通过交插接触式晶片120中的下述两个接触式晶片来产生：所述两个接触式晶片是通过将5触头型晶片120b经由弱化区域170拆分成两个晶片而形成的，其中，一个晶片具有两个触头而另一晶片具有其余的三个触头。类似地，另一接触式晶片104可以例如通过交插接触式晶片中的下述两个接触式晶片来产生：所述两个接触式晶片是通过将4位型的晶片120a拆分成各自具有两个触头的两个晶片而形成的。当这些接触式晶片组件102和104被组合并且被装载到插入件106和外壳108中时，其结果是9位的触头布置结构准备好在敞开端部156处连接至对应的配对连接器。
类似地，图8所示的25位的触头布置结构可以通过交插用于接触式晶片组件102的两个4触头型晶片120a加一个被拆分成交插的两个触头和三个触头的5触头型晶片120b、并且交插用于另一接触式晶片组件104的两个6触头型晶片120c来形成。另一示例是图9所示的51位的触头布置结构，该布置结构以类似的方式形成。即，接触式晶片组件102通过交插两个6触头型晶片120c加一个被拆分成两半且交插的6触头型晶片120c来形成。另一接触式晶片组件104可以通过交插四个4触头型晶片120a来形成。另一接触式晶片组件105设置在接触式晶片组件102与104之间以完成51位的触头布置结构。中间的接触式晶片组件105可以通过将一个4触头型晶片120a与一个5触头型晶片120b加两个彼此交插的4触头型晶片120a交插来形成。
虽然已经选择特定实施方式来说明本发明，但是本领域技术人员将理解，在不脱离所附权利要求限定的本发明的范围的情况下，可以在其中进行各种改变和修改。

Claims (25)

1.一种组装电连接器的方法，所述电连接器构造成用于安装至印刷电路板，所述方法包括以下步骤：
提供多个接触式晶片，每个接触式晶片包括由壳体支承的多个触头，其中，所述多个触头中的每个触头包括用于接合配对连接器的配对端部和用于电连接至所述印刷电路板的尾端部，所述配对端部和所述尾端部暴露在所述壳体外部；
使每个接触式晶片的所述尾端部弯曲；
将所述接触式晶片交插以形成一个或更多个接触式晶片组件；
将所述一个或更多个接触式晶片组件装载到所述电连接器的插入件中，使得所述一个或更多个接触式晶片组件在所述电连接器的配对接口处形成所述多个触头的所述配对端部的预定布置结构；以及
将具有所述一个或更多个接触式晶片组件的所述插入件插入到所述电连接器的外壳中。
2.根据权利要求1所述的方法，还包括在所述接触式晶片的所述尾端部处安装触头支承构件的步骤。
3.根据权利要求2所述的方法，其中，所述触头支承构件包括与所述多个触头中的每个触头对应的多个传导弹簧。
4.根据权利要求1所述的方法，还包括将所述插入件、所述外壳和所述触头支承件联接在一起的步骤。
5.根据权利要求4所述的方法，还包括在将所述插入件、所述壳体和所述触头支承件联接在一起的步骤之后，对所述电连接器进行电传导性测试的步骤。
6.根据权利要求4所述的方法，其中，所述联接的步骤包括将至少一个紧固件插入穿过所述插入件、所述外壳和所述触头支承构件中的每一者，所述紧固件构造成接合所述印刷电路板以用于将所述电连接器安装至所述印刷电路板。
7.根据权利要求6所述的方法，其中，所述紧固件构造成接合所述印刷电路板以用于将所述电连接器安装至所述印刷电路板，使得所述一个或更多个接触式晶片组件经由所述多个触头的所述尾端部电连接至所述印刷电路板。
8.根据权利要求1所述的方法，还包括将所述多个触头的所述尾端部焊接至所述印刷电路板的步骤。
9.根据权利要求1所述的方法，其中，未将封装材料添加至所述电连接器。
10.根据权利要求1所述的方法，其中，将所述一个或更多个接触式晶片组件装载在所述插入件中的步骤和将所述插入件插入到所述外壳中的步骤都不包括管理所述多个触头的端子的步骤。
11.根据权利要求1所述的方法，还包括将至少两个接触式晶片组件组合以形成所述多个触头的所述配对端部的所述预定布置结构的步骤。
12.根据权利要求11所述的方法，其中，所述两个接触式晶片组件中的一个接触式晶片组件的所述接触式晶片彼此具有不同数量的多个触头。
13.根据权利要求12所述的方法，其中，所述两个接触式晶片组件中的另一接触式晶片组件的所述接触式晶片彼此具有不同数量的多个触头。
14.根据权利要求1所述的方法，还包括从所述多个接触式晶片中选择至少两个接触式晶片以形成所述接触式晶片组件中的至少一个接触式晶片组件的步骤，所述至少两个接触式晶片彼此具有不同数量的所述多个触头。
15.根据权利要求1所述的方法，其中，所述接触式晶片中的每个接触式晶片具有与其他接触式晶片不同数量的触头。
16.根据权利要求15所述的方法，还包括将所述接触式晶片组件中的至少两个接触式晶片组件组合以形成所述多个触头的所述配对端部的所述预定布置结构的步骤。
17.一种组装电连接器的方法，所述电连接器构造成用于安装至印刷电路板，所述方法包括以下步骤：
提供多个接触式晶片，每个接触式晶片包括由壳体支承的多个触头，其中，所述多个触头中的每个触头包括用于接合配对连接器的配对端部和用于电连接至所述印刷电路板的尾端部，所述配对端部和所述尾端部暴露在所述壳体外部，并且其中，至少一个接触式晶片形成有四个触头，至少一个接触式晶片形成有五个触头，并且至少一个接触式晶片形成有六个触头；
将所述接触式晶片交插以形成一个或更多个接触式晶片组件；
将所述一个或更多个接触式晶片组件装载到所述电连接器的插入件中，使得所述一个或更多个接触式晶片组件在所述电连接器的配对接口处形成所述多个触头的所述配对端部的预定布置结构；以及
将具有所述一个或更多个接触式晶片组件的所述插入件插入到所述电连接器的外壳中。
18.根据权利要求17所述的方法，其中，所述交插的步骤包括将具有四个触头、五个触头或六个触头的所述接触式晶片中的一个接触式晶片与具有四个触头、五个触头或六个触头的所述接触式晶片中的另一接触式晶片交插，以至少形成所述接触式晶片组件中的第一接触式晶片组件。
19.根据权利要求18所述的方法，其中，所述交插的步骤包括将具有四个触头、五个触头或六个触头的所述接触式晶片中的一个接触式晶片与具有四个触头、五个触头或六个触头的所述接触式晶片中的另一接触式晶片交插，以至少形成所述接触式晶片组件中的第二接触式晶片组件。
20.根据权利要求19所述的方法，还包括将所述第一接触式晶片组件与所述第二接触式晶片组件组合以形成所述多个触头的所述配对端部的所述预定布置结构的步骤。
21.根据权利要求20所述的方法，其中，将所述触头组件装载到所述插入件中的步骤包括装载所组合的第一接触式晶片组件和第二接触式晶片组件。
22.根据权利要求17所述的方法，其中，具有四个触头、五个触头和六个触头的所述接触式晶片中的每个接触式晶片包括位于所述触头之间的至少一个弱化区域。
23.根据权利要求22所述的方法，还包括在所述至少一个弱化区域处将具有四个触头、五个触头和六个触头的所述接触式晶片中的至少一个接触式晶片拆分，从而由该至少一个接触式晶片形成多个接触式晶片的步骤。
24.根据权利要求17所述的方法，还包括在将所述接触式晶片交插的步骤之前，使每个接触式晶片的所述尾端部弯曲的步骤。
25.根据权利要求17所述的方法，其中，所述多个触头的所述配对端部的在所述电连接器的配对接口处的所述预定布置结构是9位、15位、21位、25位、31位、37位、41位、51位、69位或100位中的一者。
CN201910779420.7A 2018-08-22 2019-08-22 用于印刷电路板的电连接器的组装方法 Pending CN110858697A (zh)

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