CN110854294A - OLED packaging method and OLED obtained through packaging - Google Patents

OLED packaging method and OLED obtained through packaging Download PDF

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Publication number
CN110854294A
CN110854294A CN201911140127.2A CN201911140127A CN110854294A CN 110854294 A CN110854294 A CN 110854294A CN 201911140127 A CN201911140127 A CN 201911140127A CN 110854294 A CN110854294 A CN 110854294A
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Prior art keywords
oled
layer
cover plate
metal cover
metal
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Inventor
刘康平
王倩楠
周园
徐韬
魏斌
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Beijing Transpacific Technology Development Ltd
University of Shanghai for Science and Technology
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Beijing Transpacific Technology Development Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants

Abstract

The invention provides an OLED packaging method and an OLED obtained through packaging, and relates to the field of organic light emitting diodes. The packaging method provided by the invention comprises the following steps: providing a metal cover plate and an OLED substrate to be packaged; the internal space of the metal cover plate can completely contain the OLED substrate to be packaged; and placing the OLED substrate to be packaged into the metal cover plate, completely filling a gap between the metal cover plate and the OLED substrate to be packaged with an adhesive, and curing the adhesive to realize the packaging of the OLED. The method provided by the invention adopts the metal cover plate for packaging, so that the scattering of light can be blocked, the brightness and the efficiency of light are improved, the OLED layer can be effectively sealed, water and oxygen are isolated, and the service life of an OLED device is prolonged. The embodiment result shows that the encapsulation method provided by the invention can effectively provide the brightness, the current efficiency and the service life of the OLED device.

Description

OLED packaging method and OLED obtained through packaging
Technical Field
The invention relates to the field of organic light emitting diodes, in particular to an OLED packaging method and an OLED obtained through packaging.
Background
The basic structure of an OLED (organic light emitting diode) is formed by connecting a thin and transparent Indium Tin Oxide (ITO) with semiconductor characteristics to a positive electrode of a power supply, and adding another metal cathode, wherein the basic structure layer of the OLED includes: an anode, a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Emitting Layer (EL), an Electron Transport Layer (ETL), an Electron Injection Layer (EIL), and a cathode. When the power supply voltage is proper, the positive hole and the negative charge are combined in the luminous layer to generate light, and according to the formula, the three primary colors of red, green and blue are generated to form basic colors.
After the OLED device is prepared, the OLED device is sensitive to oxygen and water, and can be quickly degraded or even cannot work after being exposed in the air for a long time, so that the OLED device needs to be packaged, the water and oxygen can be isolated from the OLED device, and the service life is prolonged. The existing packaging method is to use a glass cover plate for packaging, evenly coat ultraviolet curing glue around an OLED substrate, wrap the OLED by the glass cover plate matched with the UV curing glue, and place the glass cover plate under an ultraviolet curing lamp for curing, so as to realize the packaging of the glass cover plate. However, the OLED packaged by the method still has the problem of low brightness of the light source.
Disclosure of Invention
The invention provides an OLED packaging method and an OLED obtained through packaging, wherein a metal cover plate is adopted in the packaging method to replace a traditional glass cover plate, so that on one hand, scattering of light can be blocked, brightness and efficiency of the light are improved, on the other hand, an OLED layer can be effectively sealed, water and oxygen are isolated, and the service life of an OLED device is prolonged.
The invention provides an OLED packaging method, which comprises the following steps:
(1) providing a metal cover plate and an OLED substrate to be packaged; the internal space of the metal cover plate can completely contain the OLED substrate to be packaged;
(2) and placing the OLED substrate to be packaged into the metal cover plate, completely filling a gap between the metal cover plate and the OLED substrate to be packaged with an adhesive, and curing the adhesive to realize the packaging of the OLED.
Preferably, the material of the metal cover plate comprises aluminum, aluminum alloy, iron or iron alloy.
Preferably, the thickness of the metal cover plate is 0.5-3 μm.
Preferably, the OLED substrate to be packaged comprises a drying agent layer, a thin film packaging layer and an OLED layer which are sequentially arranged from top to bottom.
Preferably, the desiccant layer comprises a cured adhesive and a desiccant dispersed in the adhesive; the mass fraction of the drying agent in the drying agent layer is 5-10%.
Preferably, the desiccant comprises one or more of molecular sieve, calcium chloride, calcium oxide and barium oxide.
Preferably, the thickness of the drying agent layer is 0.5-3 μm.
Preferably, the thin film encapsulation layer includes a stacked organic layer, a metal oxide layer and a metal layer; chemically, the organic layer comprises tris (8-hydroxyquinoline) aluminum, N '-diphenyl-N, N' -di (1-naphthyl) -1,1 '-biphenyl-4, 4' -diamine, or 1,3, 5-tris (1-phenyl-1H-benzimidazol-2-yl) benzene; the metal oxide layer comprises MoO2And MoO3Of WO or WO2And WO3A mixture of (a); the metal layer comprises one or more of aluminum, silver, zinc, nickel and magnesium.
The invention also provides an OLED prepared by the packaging method in the technical scheme, which comprises a substrate, a metal cover plate hermetically connected to the substrate, and an adhesive filled in a gap between the substrate and the metal cover plate.
The invention provides an OLED packaging method, which comprises the following steps: providing a metal cover plate and an OLED substrate to be packaged; the internal space of the metal cover plate can completely contain the OLED substrate to be packaged; and placing the OLED substrate to be packaged into the metal cover plate, completely filling a gap between the metal cover plate and the OLED substrate to be packaged with an adhesive, and curing the adhesive to realize the packaging of the OLED. The method provided by the invention adopts the metal cover plate for packaging, so that the scattering of light can be blocked, the brightness and the efficiency of light are improved, the OLED layer can be effectively sealed, water and oxygen are isolated, and the service life of an OLED device is prolonged. The embodiment result shows that the encapsulation method provided by the invention can effectively provide the brightness, the current efficiency and the service life of the OLED device.
Drawings
FIG. 1 is a graph of light emission from an OLED device using a glass cover plate.
FIG. 2 is a graph of current density-luminance performance for example 4 and comparative example 1;
FIG. 3 is a graph of wavelength-normalized spectral intensity for example 4 and comparative example 1;
FIG. 4 is a graph of current density versus current efficiency for example 4 and comparative example 1;
FIG. 5 is a time-voltage plot for example 4 and comparative example 1;
fig. 6 is a time-luminance graph of example 4 and comparative example 1.
Detailed Description
The invention provides an OLED packaging method, which comprises the following steps:
(1) providing a metal cover plate and an OLED substrate to be packaged; the internal space of the metal cover plate can completely contain the OLED substrate to be packaged;
(2) and placing the OLED substrate to be packaged into the metal cover plate, completely filling a gap between the metal cover plate and the OLED substrate to be packaged with an adhesive, and curing the adhesive to realize the packaging of the OLED.
The invention provides a metal cover plate and an OLED substrate to be packaged.
According to the invention, the metal cover plate is an open container with a groove, the bottom of the groove is of a smooth plane structure, the bottom of the groove is used for placing the OLED substrate, the side face of the groove can completely wrap the side face of the OLED substrate, and the phenomenon that light of an OLED device obtained after packaging is scattered from the side face to cause waste of a light source is avoided. In the present invention, the light of the OLED device is emitted from the opening of the metal cover plate after the encapsulation, that is, the light of the OLED device is emitted from the light extraction surface (front surface).
In the invention, the shape of the metal cover plate is adjusted according to the shape of the OLED substrate to be packaged, and the condition that the OLED substrate to be packaged can be completely accommodated in the inner space of the metal cover plate is taken as the standard. The invention has no special requirement on the material of the metal cover plate, and preferably comprises aluminum, aluminum alloy, iron or iron alloy; the thickness of the metal cover plate is preferably 0.5-3 μm, more preferably 1-2.5 μm, and even more preferably 1.5-2 μm; the edge height or depth of the metal cover plate is preferably 0.5-5 μm, more preferably 1-4 μm, and even more preferably 2-3 μm.
The light emission pattern of an OLED device when a glass cover plate is used is shown in fig. 1 in the art. As can be seen from fig. 1, light generated by the OLED device is not only emitted from the light extraction surface, i.e., the front surface, but also scattered from the side surface of the OLED device, but the light scattered from the side surface of the OLED device cannot be utilized, which causes waste of the light source and reduces the utilization rate of the light source. The invention replaces the glass cover plate in the traditional method with the metal cover plate, thereby effectively solving the problem of light scattering when the glass cover plate is adopted. The metal cover plate can well prevent the light of the OLED device from being scattered out from the side surface, so that the light source generated by the OLED device is emitted out from the front surface, the light enhancement effect is achieved, and the utilization rate of the light source is favorably improved. In addition, the metal cover plate is adopted, so that the sealing effect on the OLED device is good, oxygen and water molecules are isolated, and the service life of the OLED device is prolonged.
In the invention, the OLED substrate to be packaged preferably comprises a drying agent layer, a thin film packaging layer and an OLED layer which are sequentially arranged from top to bottom.
In the present invention, the desiccant layer preferably includes a cured adhesive and a desiccant dispersed in the adhesive; the mass fraction of the drying agent in the drying agent layer is preferably 5-10%. In the present invention, the desiccant preferably comprises one or more of molecular sieve, calcium chloride, calcium oxide and barium oxide. In the invention, the adhesive preferably comprises ultraviolet curing adhesive or AB adhesive, and the invention preferably adopts ultraviolet curing adhesive; the UV curable glue preferably comprises Permabond UV681 or Permabond UV 630. In the present invention, the method for preparing the desiccant layer preferably includes: and mixing the adhesive and the drying agent, coating the mixture on the surface of the thin film packaging layer, and curing the mixture under ultraviolet light to obtain the drying agent layer. The present invention does not require any particular method for coating and curing, and methods known to those skilled in the art can be used. In the present invention, the thickness of the desiccant layer is preferably 0.5 to 3 μm, and more preferably 1 to 2.5 μm. In the invention, the drying agent layer plays a role in absorbing water vapor and other gases such as air, hydrogen, oxygen, nitrogen and argon, so that the OLED layer is favorable for isolating the water vapor, and the effect of prolonging the service life of an OLED device is achieved.
In the present invention, the thin film encapsulation layer preferably includes an organic layer, a metal oxide layer, and a metal layer stacked; chemically, the organic layer comprises tris (8-hydroxyquinoline) aluminum, N '-diphenyl-N, N' -di (1-naphthyl) -1,1 '-biphenyl-4, 4' -diamine, or 1,3, 5-tris (1-phenyl-1H-benzimidazol-2-yl) benzene; the metal oxide layer comprises MoO2And MoO3Of WO or WO2And WO3A mixture of (a); the metal layer comprises one or more of aluminum, silver, zinc, nickel and magnesium.
In the present invention, the organic layer preferably includes tris (8-hydroxyquinoline) aluminum (Alq3), N '-diphenyl-N, N' -di (1-naphthyl) -1,1 '-biphenyl-4, 4' -diamine (NPB) or 1,3, 5-tris (1-phenyl-1H-benzimidazol-2-yl) benzene (TPBi). In the present invention, the thickness of the organic material layer is preferably 50 to 100nm, and more preferably 50 to 70 nm. The source of the organic layer is not particularly limited in the present invention, and commercially available products known to those skilled in the art may be used. In the present invention, the organic layer can function as an organic buffer layer.
In the present invention, the metal oxide layer preferably includes MoO2And MoO3Of WO or WO2And WO3A mixture of (a). In the present invention, the thickness of the metal oxide layer is preferably 50 to 100nm, and more preferably 50 to 70 nm.
In the present invention, the metal OXIDE preferably includes both divalent and trivalent metal OXIDEs, the source of which is preferably purchased from SIGMA, wherein the molybdenum OXIDE is preferably MOLYBDENUM (VI) OXIDE. In the invention, the metal oxide is a low-temperature easily-deposited metal compound and is a mixture of divalent and trivalent metal oxides, wherein the divalent metal oxide can absorb oxygen to react to form the trivalent metal oxide, so that the effect of absorbing the oxygen permeated into the device is achieved; the trivalent metal oxide slowly reacts with water to generate corresponding metal acid, so that the effect of absorbing water permeating into the device is achieved, water and oxygen permeating into the OLED device are absorbed, the protection effect is achieved, and the service life of the OLED device is greatly prolonged.
In the present invention, the metal layer preferably includes one or more of aluminum, silver, zinc, nickel and magnesium; the form of the aluminum is preferably simple substance aluminum or aluminum alloy, the form of the silver is preferably simple substance silver or silver alloy, the form of the zinc is preferably simple substance zinc or zinc alloy, the form of the nickel is preferably simple substance nickel or nickel alloy, and the form of the magnesium is preferably simple substance magnesium or magnesium alloy. The invention has no special requirements on the specific compositions of the silver alloy, the zinc alloy, the nickel alloy and the magnesium alloy, and the corresponding metal alloy which is well known by the technical personnel in the field can be adopted. In the present invention, the thickness of the metal layer is preferably 50 to 100nm, and more preferably 70 to 100 nm. The source of the metal layer is not particularly limited in the present invention, and may be a commercially available product known to those skilled in the art or may be prepared by a conventional technique. In the invention, the metal layer can react with the generated metal acid to generate stable metal acid salt, thereby promoting the stability of the system and prolonging the service life of the OLED device.
In the invention, the organic material layer, the metal oxide layer and the metal layer in the thin film encapsulation layer are preferably arranged periodically, and the number of the periodically arranged periods is preferably 1-8, and more preferably 2-3. Specifically, when the periodicity is 2, the arrangement is in the form of an organic layer-a metal oxide layer-a metal layer-an organic layer-a metal oxide layer-a metal layer, and so on when the periodicity is other. In the invention, the organic layer, the metal oxide layer and the metal layer are periodically superposed, and the periodic increase is more favorable for absorbing external water and oxygen, thereby improving the packaging effect and prolonging the service life of the OLED device.
In the invention, a calcium layer is preferably further included between the organic layer and the metal oxide layer, and the thickness of the calcium layer is preferably 50-200 nm. In the present invention, the calcium layer preferably includes elemental calcium. The source of the calcium layer is not particularly limited in the present invention, and a conventional product well known to those skilled in the art may be used. In the invention, the calcium layer can absorb water and oxygen permeating into the OLED device, thereby prolonging the service life of the OLED device. In the invention, when a calcium layer is included between the organic layer and the metal oxide layer, the organic layer, the calcium layer, the metal oxide layer and the metal layer in the thin film encapsulation layer are preferably arranged periodically, and the number of periods of the periodic arrangement is preferably 1-8, and more preferably 2-3. Specifically, when the periodicity is 2, the arrangement is in the form of an organic layer-a calcium layer-a metal oxide layer-a metal layer-an organic layer-a calcium layer-a metal oxide layer-a metal layer, and so on when the periodicity is other.
In the present invention, the method for preparing the thin film encapsulation layer preferably comprises the following steps: and sequentially evaporating an organic layer, a metal oxide layer and a metal layer on the OLED layer to obtain the thin film packaging layer.
In the present invention, when depositing an organic material layer, the current for deposition is selected to be different depending on the organic material, specifically, the current for deposition is 40A for Alq3 layer, and the evaporation rate of the deposition is preferably 40A
Figure BDA0002280683110000061
When the metal oxide layer is evaporated, the current of evaporation is preferably 80-100A, and the evaporation rate of evaporation is preferably 80-100A
Figure BDA0002280683110000062
When the metal layer is evaporated, different evaporation currents are selected according to different metals, specifically, the evaporation current of aluminum is 30A, the evaporation current of silver is 110-120A, the evaporation current of zinc is 70-90A, and the evaporation rate of evaporation is preferably selected
Figure BDA0002280683110000063
When a calcium layer is included, the calcium layer is preferably evaporated between the organic layer and the metal oxide layer.
In the present invention, when the calcium layer is evaporated, the current for the evaporation is preferably 70A, and the rate of evaporation is preferably 70A
Figure BDA0002280683110000064
When the organic substance layer, the metal oxide layer and the metal layer or the organic substance layer, the calcium layer, the metal oxide layer and the metal layer are arranged periodically, the cyclic vapor deposition is carried out in sequence according to the vapor deposition conditions of different substance layers according to the technical scheme.
In the invention, the thin film packaging layer is beneficial to isolating the OLED layer from water vapor and oxygen, thereby prolonging the service life of the OLED device.
In the present invention, the OLED layer preferably includes an anode glass substrate, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and a cathode. The invention has no special requirements on the source of the OLED layer; either by OLED layers or by self-fabrication, as is well known to those skilled in the art. When self-prepared, the process for preparing the OLED layer preferably comprises the steps of:
plating an ITO film on a glass substrate by magnetron sputtering, and then etching to obtain an ITO film glass substrate;
cleaning the ITO film glass substrate, and then drying and irradiating by ultraviolet to obtain a clean ITO film glass substrate;
and putting the material to be evaporated on each boat source or crucible source of the evaporation chamber, and putting the clean ITO substrate into the evaporation chamber for evaporation to obtain the OLED layer.
According to the invention, an ITO film is plated on a glass substrate through magnetron sputtering, and then the ITO film glass substrate is obtained through etching.
In the present invention, the pressure of the magnetron sputtering is preferably less than 2.0X 10-5mbar, the thickness of the ITO film is preferably 150 nm.
In the present invention, the etching is preferably performed by using a photolithography machine. The method preferably comprises the steps of rinsing the etched glass substrate in a developing solution for 2-3 times, soaking the glass substrate in aqua regia for 5-10 minutes, and then putting the glass substrate in an acetone solution for cleaning.
The invention has no special requirements on the structure of the etched glass substrate, and the etching is carried out according to the pre-designed structure.
After the ITO film glass substrate is obtained, the ITO film glass substrate is cleaned, and then the clean ITO film glass substrate is obtained through drying and ultraviolet irradiation.
In the invention, the cleaning agent for cleaning is preferably detergent and/or cleaning powder. The source of the cleaning agent is not particularly limited in the present invention, and products well known to those skilled in the art can be used. The dosage proportion of the cleaning agent is not specially limited, and the ITO film glass substrate can be cleaned.
In the present invention, the washing is preferably carried out under ultrasonic conditions, each time with a new detergent; the power of the ultrasonic wave is preferably 800-1000W, the time of the ultrasonic wave is preferably 60-120 min, and the frequency of the ultrasonic wave is preferably 3-4.
The drying temperature and time are not specially limited, and the ITO film glass substrate can be dried by adopting the conventional technical means in the field.
In the invention, the wavelength of the ultraviolet radiation is preferably 185-254 nm, and the time of the ultraviolet radiation is preferably 15-20 min.
After the clean ITO film glass substrate is obtained, the material to be evaporated is placed on each boat source or crucible source of the evaporation chamber, and the clean ITO substrate is placed in the evaporation chamber for evaporation, so that the OLED layer is obtained.
In the present invention, the boat source or the crucible source is preferably preheated before the evaporation. In the invention, the preheating temperature is preferably 100 ℃, and the preheating time is preferably 1-3 min.
In the present invention, the pressure of the evaporation is preferably less than 10-5mbar。
In the invention, the evaporated material preferably comprises materials corresponding to the components of the anode glass substrate, the hole injection layer, the hole transport layer, the luminescent layer, the electron transport layer, the electron injection layer and the cathode, wherein the hole injection layer, the hole transport layer, the luminescent layer, the electron transport layer and the electron injection layer are organic matters, and the cathode is a metal layer.
In the present invention, when the material to be deposited is an organic layer, the current for deposition is preferably 20A, and the evaporation rate for deposition is preferably 20A
Figure BDA0002280683110000081
When the evaporated material is a metal layer, the evaporation rate of the evaporation is preferably set to be higher than that of the metal layer
Figure BDA0002280683110000082
After the OLED substrate to be packaged and the metal cover plate are obtained, the OLED substrate to be packaged is placed in the metal cover plate, then the adhesive is used for completely filling a gap between the metal cover plate and the OLED substrate to be packaged, and the adhesive is cured, so that the packaging of the OLED is realized.
In the invention, the adhesive preferably comprises an ultraviolet curing adhesive or an AB adhesive; the uv curable glue preferably comprises permabond uv681 or permabond uv 630. According to the invention, the adhesive is filled in the gap between the metal cover plate and the OLED substrate to be packaged, so that the effect of isolating water and oxygen is favorably achieved, and the service life of the OLED is favorably prolonged. The present invention does not require any particular embodiment of curing, and curing means well known to those skilled in the art may be used.
The invention also provides an OLED prepared by the packaging method in the technical scheme, which comprises a substrate, a metal cover plate hermetically connected to the substrate, and an adhesive filled in a gap between the substrate and the metal cover plate.
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention.
Example 1
(1) Preparation of the OLED layer
Obtaining an ITO film glass substrate through magnetron sputtering, then placing materials to be evaporated on each boat source or crucible source of an evaporation chamber, and placing the clean ITO substrate in the evaporation chamber for evaporation to obtain the OLED layer;
(2) preparation of thin film encapsulation layer
After the OLED layer was deposited, an Alq3 layer (50nm) was deposited on the cathode surface of the OLED layer at a current of 40A, and a Ca layer (50nm) was deposited at a current of 70A and MoO was deposited at a current of 90A2And MoO3The mixture layer (50nm) of (2) is formed so that the evaporation rate of the vapor deposition is set to beAn Al layer (50nm) was deposited at a current of 30A to obtain Alq3/Ca/MoOxa/Al encapsulation film of which MoOxRepresents MoO2And MoO3The mixture layer of (2).
(3) Preparation of desiccant layer
Uniformly mixing the molecular sieve and the Permabond UV630, coating the mixture on the surface of a metal Al layer of a thin film packaging layer, and curing the Permabond UV630 through ultraviolet light to obtain an OLED substrate to be packaged, wherein the OLED substrate comprises a drying agent layer, the thin film packaging layer and an OLED layer; wherein the mass fraction of the molecular sieve in the desiccant layer is 5%, and the thickness of the desiccant layer is 1.5 μm.
(4) Preparation of Metal sheets
And preparing a metal plate according to the shape of the OLED layer, wherein the metal plate is an aluminum cover plate, the thickness of the metal plate is 1 micrometer, and the edge height of the metal cover plate is 2 micrometers.
(5) Package with a metal layer
And (3) placing the OLED substrate to be packaged into the metal plate, completely filling a gap between the metal plate and the OLED substrate to be packaged by Permabond UV681 ultraviolet curing glue, and then performing ultraviolet curing to achieve the effect of isolating water and oxygen and realize the packaging of the OLED.
Example 2
The preparation method of the OLED device is the same as that of the OLED device in the embodiment 1, and the evaporated OLED thin film packaging layer material is different. In this example, Alq3 and MoO were sequentially deposited by evaporationxAnd Al to give Alq3/MoOxa/Al encapsulation film of which MoOxRepresents MoO2And MoO3The mixture layer of (2).
Example 3
The preparation method of the OLED device is the same as that of the OLED device in the embodiment 1, and the evaporated OLED thin film packaging layer material is different. In this example, Alq3 and MoO were sequentially deposited by cyclic vapor depositionxAnd aluminum, and vapor deposition was carried out continuously for 3 cycles to obtain Alq3/MoOxPeriodic encapsulation films of/Al, in which MoOxRepresents MoO2And MoO3The mixture layer of (2).
Example 4
The preparation method of the OLED device is the same as that of the OLED device in the embodiment 1, and the evaporated OLED thin film packaging layer material is different. In this example, Alq3 and WO were sequentially deposited by evaporationxAnd Al, the thickness of the Alq3 layer being 50nm, WOxThe thickness of the layer was 50nm and that of the Al layer was 50nm, giving Alq3/WOxA film for encapsulation of Al, in which WOxRepresents WO2And WO3The mixture layer of (2).
Through the detection of brightness and voltage, the brightness of the OLED prepared in the embodiment is 2201cd/m within 0-300 h2Becomes 1806cd/m2The voltage changed from 5.74V to 8.65V.
Comparative example 1
Performing tests according to the methods of the steps (1), (2) and (3) in the embodiment 1 to obtain an OLED substrate to be packaged;
then, the OLED substrate is packaged by adopting a traditional glass cover plate, and the specific method comprises the following steps: and (3) attaching a drying sheet in the glass cover plate, coating ultraviolet curing glue on the periphery of the glass cover plate, putting the glass cover plate on the OLED substrate, and performing ultraviolet curing.
The current density-luminance performance of example 4 and comparative example 1 was tested using a PR650 spectrometer. The test results are shown in fig. 2, and it can be seen from fig. 2 that the OLED of the present invention encapsulated by the metal cover plate has higher luminance than the OLED encapsulated by the glass cover plate under the same current density.
The wavelength-normalized spectral intensities of example 4 and comparative example 1 were tested. The test result is shown in fig. 3, and it can be seen from fig. 3 that the light emitting color of the device is not affected by the metal cover plate package adopted in the present invention.
The current density-current efficiency of example 4 and comparative example 1 were tested. The test results are shown in fig. 4, and it can be seen from fig. 4 that the OLED of the present invention encapsulated by the metal cap plate has higher current efficiency than the OLED encapsulated by the glass cap plate under the same current density.
The voltage-time curves of example 4 and comparative example 1 were tested, and the results are shown in fig. 5, and it can be seen from fig. 5 that the voltage of the OLED device encapsulated by the metal cover plate according to the present invention increases slowly with the increase of the service time, while the voltage of the OLED device encapsulated by the glass cover plate according to comparative example 1 increases rapidly with the increase of the service time. Since the voltage rise of the OLED device in the using process means that the performance of the OLED device is reduced, the practical application is not facilitated. Therefore, the OLED device packaged by the metal cover plate has longer service life.
The luminance change curves of the devices of example 4 and comparative example 1 with time were tested, and the results are shown in fig. 6, and it can be seen from fig. 6 that the OLED device using the metal cover plate for encapsulation according to the present invention has a slower luminance decrease with the use time, while the OLED device using the glass cover plate for encapsulation according to comparative example 1 has a rapid luminance decrease with the use time. The reduction of brightness in the use process of the OLED device means the performance reduction of the OLED device, which is not beneficial to practical application. Therefore, the OLED device packaged by the metal cover plate has longer service life.
According to the invention, the metal cover plate is adopted to package the OLED, so that on one hand, the scattering of light can be blocked, the brightness and the efficiency of light are improved, on the other hand, the OLED layer can be effectively sealed, water and oxygen are isolated, and the service life of an OLED device is prolonged. The experimental results show that the OLED obtained by the packaging method has higher brightness and light efficiency, and the service life of the OLED is longer.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (9)

1. An OLED packaging method is characterized by comprising the following steps:
(1) providing a metal cover plate and an OLED substrate to be packaged; the internal space of the metal cover plate can completely contain the OLED substrate to be packaged;
(2) and placing the OLED substrate to be packaged into the metal cover plate, completely filling a gap between the metal cover plate and the OLED substrate to be packaged with an adhesive, and curing the adhesive to realize the packaging of the OLED.
2. The method of claim 1, wherein the metal cover plate comprises aluminum, aluminum alloy, iron or iron alloy.
3. The packaging method according to claim 1 or 2, wherein the thickness of the metal cover plate is 0.5-3 μm.
4. The packaging method according to claim 1, wherein the OLED substrate to be packaged comprises a desiccant layer, a thin film packaging layer and an OLED layer which are sequentially arranged from top to bottom.
5. The packaging method according to claim 4, wherein the desiccant layer comprises a cured adhesive and a desiccant dispersed in the adhesive; the mass fraction of the drying agent in the drying agent layer is 5-10%.
6. The method of claim 5, wherein the desiccant comprises one or more of molecular sieves, calcium chloride, calcium oxide, and barium oxide.
7. The packaging method according to any one of claims 4 to 6, wherein the thickness of the desiccant layer is 0.5 to 3 μm.
8. The method of claim 4, wherein the step of encapsulating the semiconductor device comprisesCharacterized in that the thin film encapsulation layer comprises a stacked organic layer, a metal oxide layer and a metal layer; chemically, the organic layer comprises tris (8-hydroxyquinoline) aluminum, N '-diphenyl-N, N' -di (1-naphthyl) -1,1 '-biphenyl-4, 4' -diamine, or 1,3, 5-tris (1-phenyl-1H-benzimidazol-2-yl) benzene; the metal oxide layer comprises MoO2And MoO3Of WO or WO2And WO3A mixture of (a); the metal layer comprises one or more of aluminum, silver, zinc, nickel and magnesium.
9. The OLED obtained by the encapsulating method of any one of claims 1-8, comprising a substrate, a metal cover plate hermetically connected to the substrate, and an adhesive filled in the gap between the substrate and the metal cover plate.
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