CN110828647A - 一种柔性led灯串的制造方法 - Google Patents
一种柔性led灯串的制造方法 Download PDFInfo
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- CN110828647A CN110828647A CN201911140239.8A CN201911140239A CN110828647A CN 110828647 A CN110828647 A CN 110828647A CN 201911140239 A CN201911140239 A CN 201911140239A CN 110828647 A CN110828647 A CN 110828647A
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- 239000011347 resin Substances 0.000 claims description 38
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 229910000679 solder Inorganic materials 0.000 description 1
- 239000011573 trace mineral Substances 0.000 description 1
- 235000013619 trace mineral Nutrition 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911140239.8A CN110828647B (zh) | 2019-11-20 | 2019-11-20 | 一种柔性led灯串的制造方法 |
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CN201911140239.8A CN110828647B (zh) | 2019-11-20 | 2019-11-20 | 一种柔性led灯串的制造方法 |
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CN110828647A true CN110828647A (zh) | 2020-02-21 |
CN110828647B CN110828647B (zh) | 2020-12-18 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111509109A (zh) * | 2020-04-27 | 2020-08-07 | 山东傲天环保科技有限公司 | 一种led封装设备及其使用方法 |
CN111667764A (zh) * | 2020-06-28 | 2020-09-15 | 昆山国显光电有限公司 | 一种柔性显示面板及显示装置 |
CN111968964A (zh) * | 2020-04-27 | 2020-11-20 | 山东傲天环保科技有限公司 | 一种led照明灯及其制造方法 |
CN112038332A (zh) * | 2020-04-27 | 2020-12-04 | 山东傲天环保科技有限公司 | 一种led灯带及其制造方法 |
CN117133853A (zh) * | 2023-10-27 | 2023-11-28 | 深圳市欣上科技有限公司 | 一种360度发光的柔性正装led灯丝 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022215A (zh) * | 2013-03-01 | 2014-09-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
WO2015191273A1 (en) * | 2014-06-10 | 2015-12-17 | 3M Innovative Properties Company | Flexible led assembly with uv protection |
US20160305642A1 (en) * | 2015-04-15 | 2016-10-20 | True Star, Inc. | Flexible led module |
CN106104820A (zh) * | 2014-03-25 | 2016-11-09 | 3M创新有限公司 | 具有共面导电零件的柔性电路及其制造方法 |
CN106287341A (zh) * | 2016-08-18 | 2017-01-04 | 四川蓝景光电技术有限责任公司 | 一种硅胶挤塑软灯条的加工工艺 |
CN109638008A (zh) * | 2018-12-28 | 2019-04-16 | 苏州工业园区客临和鑫电器有限公司 | 一种双色温的柔性灯丝及其封装方法 |
CN110265524A (zh) * | 2019-05-06 | 2019-09-20 | 江苏稳润光电科技有限公司 | 一种高光效柔性led灯丝及其封装方法 |
-
2019
- 2019-11-20 CN CN201911140239.8A patent/CN110828647B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104022215A (zh) * | 2013-03-01 | 2014-09-03 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及其制造方法 |
CN106104820A (zh) * | 2014-03-25 | 2016-11-09 | 3M创新有限公司 | 具有共面导电零件的柔性电路及其制造方法 |
WO2015191273A1 (en) * | 2014-06-10 | 2015-12-17 | 3M Innovative Properties Company | Flexible led assembly with uv protection |
US20160305642A1 (en) * | 2015-04-15 | 2016-10-20 | True Star, Inc. | Flexible led module |
CN106287341A (zh) * | 2016-08-18 | 2017-01-04 | 四川蓝景光电技术有限责任公司 | 一种硅胶挤塑软灯条的加工工艺 |
CN109638008A (zh) * | 2018-12-28 | 2019-04-16 | 苏州工业园区客临和鑫电器有限公司 | 一种双色温的柔性灯丝及其封装方法 |
CN110265524A (zh) * | 2019-05-06 | 2019-09-20 | 江苏稳润光电科技有限公司 | 一种高光效柔性led灯丝及其封装方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111509109A (zh) * | 2020-04-27 | 2020-08-07 | 山东傲天环保科技有限公司 | 一种led封装设备及其使用方法 |
CN111968964A (zh) * | 2020-04-27 | 2020-11-20 | 山东傲天环保科技有限公司 | 一种led照明灯及其制造方法 |
CN112038332A (zh) * | 2020-04-27 | 2020-12-04 | 山东傲天环保科技有限公司 | 一种led灯带及其制造方法 |
CN111509109B (zh) * | 2020-04-27 | 2021-03-12 | 江西省兆驰光电有限公司 | 一种led封装设备及其使用方法 |
CN112038332B (zh) * | 2020-04-27 | 2022-04-12 | 江门市品而亮照明有限公司 | 一种led灯带及其制造方法 |
CN111667764A (zh) * | 2020-06-28 | 2020-09-15 | 昆山国显光电有限公司 | 一种柔性显示面板及显示装置 |
CN117133853A (zh) * | 2023-10-27 | 2023-11-28 | 深圳市欣上科技有限公司 | 一种360度发光的柔性正装led灯丝 |
CN117133853B (zh) * | 2023-10-27 | 2024-05-10 | 深圳市欣上科技有限公司 | 一种360度发光的柔性正装led灯丝 |
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CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Yuan Ruping Inventor after: Hou Lidong Inventor before: Hou Lidong |
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Effective date of registration: 20201125 Address after: The remarkable plum forests central plaza 1 phase No. 2 building 15 floor 03-05 in plum forests Zhong Kang road on 518000 Futian District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN LEDMY Co.,Ltd. Address before: No. 21-1-901, yuxinyuan community, Licheng District, Jinan City, Shandong Province Applicant before: Hou Lidong |
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