CN110825582A - CPU temperature sensor testing device, method and system - Google Patents
CPU temperature sensor testing device, method and system Download PDFInfo
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- CN110825582A CN110825582A CN201910996179.3A CN201910996179A CN110825582A CN 110825582 A CN110825582 A CN 110825582A CN 201910996179 A CN201910996179 A CN 201910996179A CN 110825582 A CN110825582 A CN 110825582A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
- G06F11/3024—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a central processing unit [CPU]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/30—Monitoring
- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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Abstract
The invention provides a CPU temperature sensor testing device, a testing method and a system, wherein the device comprises: the device comprises a controller, a semiconductor refrigerating sheet and a temperature sensor; the semiconductor refrigerating sheet is attached to and tightly pressed on the CPU, and the temperature sensor is installed in a manner of being tightly attached to the CPU; the semiconductor refrigerating sheet and the temperature sensor are electrically connected with the controller. The TEC refrigeration piece is attached above the CPU, the installation is simple, more space does not need to be occupied, the heating temperature of the CPU is accurately controlled, the problem that the CPU is burnt out does not exist, the test circuit can be connected to the tested board card through a connector or a cable, the CPU does not need to be disassembled and installed, the risk caused by repeated replacement and installation of the CPU is avoided, and the tested board card is protected.
Description
Technical Field
The invention relates to the technical field of server testing, in particular to a device, a method and a system for testing a CPU temperature sensor.
Background
With the development of the information technology, the density of components inside the server is higher and higher; with the rapid increase of information amount, the data that the cpu (central Processing unit) needs to process is more and more, and the power consumption thereof is also higher and more. In order to protect the device from high temperatures, a temperature sensing circuit is essential.
The CPU of the server has Integrated a temperature sensor inside, and the temperature of the CPU is transmitted to BMC (Basebard Management Controller) or PCH (platform Controller hub) through PECI (platform Environment control interface) or I2C (Inter-Integrated Circuit). And the BMC adjusts the rotating speed of the fan according to the fan regulation and control strategy and dissipates heat of the server board card.
Temperature sensor reliability is very important. If the temperature sensor is not accurate enough or cannot work, the local overheating condition is caused, and the phenomena of speed reduction, frequency reduction, high-temperature alarm, downtime and the like of the CPU are caused; even resulting in irreversible damage to the inside of the CPU chip and failure to operate. Therefore, it is necessary to detect the temperature sensor integrated in the CPU in the development stage, verify the reliability thereof, and confirm the down-frequency point. In the existing scheme, in the research and development testing stage, heating is performed in a mode of manually heating a (hot air blower) CPU. The temperature of the measured point is measured through a temperature measuring instrument or a contact thermometer and other devices, the temperature fed back by the temperature sensor is read through the BMC code, and then the data is compared to verify whether the data is accurate or not. When a plurality of CPUs need to be tested, the CPUs and the heat sinks need to be detached and replaced with the next tested CPU, and then the testing is carried out. The manual heating and temperature measuring method has the following defects: due to the fact that errors exist in manual operation, overhigh temperature and damage to devices are easily caused; the handheld tool is inconvenient to operate and occupies human resources; the CPU of different manufacturers has different ways of reading the temperature information, and the testing way has no universality; data reading can only be carried out through the circuit of the board card where the tested CPU is located, the time for replacing the CPU and installing the radiator is consumed, the risk of collision exists, and once the socket of the CPU is damaged, the whole board card can be scrapped.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention provides a device, a method and a system for testing a CPU temperature sensor, so as to solve the above-mentioned technical problems.
In a first aspect, the present invention provides a CPU temperature sensor testing apparatus, comprising: the device comprises a controller, a semiconductor refrigerating sheet and a temperature sensor; the semiconductor refrigerating sheet is attached to and tightly pressed on the CPU, and the temperature sensor is installed in a manner of being tightly attached to the CPU; the semiconductor refrigerating sheet and the temperature sensor are electrically connected with the controller.
Furthermore, the controller adopts a CPLD chip and is connected with an upper computer.
Furthermore, an H bridge is arranged between the controller and the connection link of the semiconductor refrigerating sheet.
In a second aspect, the present invention provides a CPU temperature sensor testing method, including:
setting a CPU target temperature;
acquiring the actual temperature of the CPU through a temperature sensor signal;
calculating a temperature control duty ratio according to the target temperature and the actual temperature, and ensuring that the actual temperature of the CPU is consistent with the target temperature by adjusting the temperature control duty ratio output to the semiconductor refrigerating sheet;
reading the temperature fed back by a temperature sensor integrated in the CPU;
and comparing the CPU feedback temperature with the target temperature, and judging that the test is passed if the CPU feedback temperature is consistent with the target temperature.
Further, the calculating the temperature control duty cycle according to the target temperature and the actual temperature and the adjusting the temperature control duty cycle output to the semiconductor chilling plate to ensure that the actual temperature of the CPU is consistent with the target temperature includes:
dividing the difference value between the target temperature and the time temperature by the target temperature, multiplying the quotient by the temperature control speed parameter of the semiconductor refrigerating sheet, and taking the finally obtained product as the temperature control duty ratio;
if the temperature control duty ratio is not more than 1, updating the duty ratio of the original electric signal output to the semiconductor refrigerating sheet by the controller into the temperature control duty ratio;
and if the temperature control duty ratio exceeds 1, updating the duty ratio of the original electric signal output to the semiconductor chilling plate by the controller to 1.
Further, after the ensuring ensures that the actual temperature of the CPU is consistent with the target temperature, the method further includes:
monitoring the PROCHOT signal and THERMALTRIP signal of the CPU;
monitoring the CPU frequency reduction condition through a PROCHOT signal;
the CPU temperature alarm condition is monitored via the THERMALTRIP signal.
In a third aspect, the present invention provides a CPU temperature sensor testing system, including:
a target setting unit configured to set a CPU target temperature;
the temperature acquisition unit is configured for acquiring the actual temperature of the CPU through a temperature sensor signal;
the temperature regulation and control unit is configured for calculating a temperature control duty ratio according to the target temperature and the actual temperature and ensuring that the actual temperature of the CPU is kept consistent with the target temperature by regulating the temperature control duty ratio output to the semiconductor refrigerating sheet;
the temperature feedback unit is configured for reading the temperature fed back by the temperature sensor integrated in the CPU;
and the temperature comparison unit is configured for comparing the CPU feedback temperature with the target temperature, and judging that the test is passed if the CPU feedback temperature is consistent with the target temperature.
Further, the temperature regulation unit includes:
the temperature control calculation module is configured to divide the difference value between the target temperature and the time temperature by the target temperature, multiply the quotient by a temperature control speed parameter of the semiconductor refrigerating sheet, and take the finally obtained product as a temperature control duty ratio;
the parameter updating module is configured to update the duty ratio of the original electric signal output to the semiconductor refrigeration piece by the controller to the temperature control duty ratio if the temperature control duty ratio does not exceed 1;
and the full-quantity adjusting module is configured to update the duty ratio of the original electric signal output to the semiconductor chilling plate by the controller to 1 if the temperature control duty ratio exceeds 1.
Further, the system further comprises:
the signal monitoring module is used for monitoring a PROCHOT signal and an THERMALTRIP signal of the CPU;
the frequency reduction monitoring module is configured for monitoring the frequency reduction condition of the CPU through a PROCHOT signal;
and the alarm monitoring module is configured for monitoring the temperature alarm condition of the CPU through THERMALTRIP signals.
The beneficial effect of the invention is that,
according to the CPU temperature sensor testing method, the system, the terminal and the storage medium, the temperature of the CPU is adjusted by controlling the heating or refrigerating of the TEC (thermoelectric cooler); detecting the temperature of the heated (or refrigerated) CPU by an NTC (negative temperature coefficient) temperature sensor or a thermal diode to form negative feedback regulation; and after the temperature of the CPU is stable, reading data fed back by the CPU through circuits such as I2C or PECI and the like, and finally comparing the temperature data measured by the detection circuit with the data fed back by the CPU to obtain a reliability test result of the CPU temperature sensor. The TEC refrigeration piece is attached above the CPU, the installation is simple, more space does not need to be occupied, the heating temperature of the CPU is accurately controlled, the problem that the CPU is burnt out does not exist, the test circuit can be connected to the tested board card through a connector or a cable, the CPU does not need to be disassembled and installed, the risk caused by repeated replacement and installation of the CPU is avoided, and the tested board card is protected.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic flow diagram of a method of one embodiment of the invention.
FIG. 3 is a schematic block diagram of a system of one embodiment of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following explains key terms appearing in the present invention.
Semiconductor refrigeration chip (TEC 1): the thermoelectric refrigerating assembly made up by using Peltier effect is light in weight, small in volume, and possesses relatively high refrigerating capacity, so that it is specially applicable to refrigeration of limited space. In addition, when the working current polarity of the component is changed, the component can also heat, and the cooling power can be adjusted by changing the current intensity.
Referring to fig. 1, the present embodiment provides a testing apparatus for a CPU temperature sensor, including: a controller, a semiconductor refrigerating chip and a temperature sensor (a thermistor is adopted in the embodiment); attaching and pressing the heating surface of the TEC refrigerating sheet with the CPU, smearing heat-conducting silicone grease in the middle and installing an NTC thermistor; the semiconductor refrigerating sheet and the thermistor are electrically connected with the controller. The controller adopts a CPLD chip LCMXXO 2-4000HC-4FTG256I which is provided with 4000 multi-lookup tables and 206 IO ports and can simultaneously support data reading of a plurality of tested points, including PROCHOT and THERMALTRIP signal monitoring. The reaction speed reaches ns level, I2C is supported, and CPLD codes are flexible and can be modified according to different configurations. The response speed is fast, and the control accuracy is high. The CPLD chip is also in communication connection with an upper computer. In addition, an H bridge is arranged in the middle of a connecting link of the controller and the semiconductor refrigerating piece, the H bridge controls the size and the direction of current flowing through the TEC, when the TEC flows through current in a fixed direction, the refrigerating surface of the TEC starts to refrigerate, the heating surface of the TEC starts to heat, and the refrigerating capacity of the TEC is in direct proportion to the size of the current.
The internal thermistor of the CPU can be connected with the CPLD chip through I2C, and can also be directly connected with an upper computer through I2C. The present embodiment selects to connect the internal thermistor of the CPU to the CPLD chip through I2C. The CPLD reads CPU information in two ways, namely, aiming at the INTEL CPU, a PECI management chip firstly acquires temperature, and then the CPLD reads data in the PECI chip through I2C; aiming at CPUs of other manufacturers, the CPLD can directly acquire the temperature of the CPUs through I2C and other modes; meanwhile, rich IO resources of the CPLD can monitor signals such as PROCHOT and THERMALTRIP of the CPU and determine whether the functions of CPU frequency reduction and temperature alarm are triggered. In the embodiment, the PECI management chip selects a hardware monitoring chip NCT7802Y from NUVOTON corporation, and an ADC with a precision of 10 bits is integrated therein and supports up to 5 thermal diodes.
FIG. 2 is a schematic flow diagram of a method of one embodiment of the invention. The execution body in fig. 2 may be a CPU temperature sensor testing system.
As shown in fig. 2, the method 200 includes:
and step 250, comparing the CPU feedback temperature with the target temperature, and judging that the test is passed if the CPU feedback temperature is consistent with the target temperature.
Optionally, as an embodiment of the present invention, the calculating a temperature control duty cycle according to the target temperature and the actual temperature and ensuring that the actual temperature of the CPU is kept consistent with the target temperature by adjusting the temperature control duty cycle output to the semiconductor chilling plate includes:
dividing the difference value between the target temperature and the time temperature by the target temperature, multiplying the quotient by the temperature control speed parameter of the semiconductor refrigerating sheet, and taking the finally obtained product as the temperature control duty ratio;
if the temperature control duty ratio is not more than 1, updating the duty ratio of the original electric signal output to the semiconductor refrigerating sheet by the controller into the temperature control duty ratio;
and if the temperature control duty ratio exceeds 1, updating the duty ratio of the original electric signal output to the semiconductor chilling plate by the controller to 1.
Optionally, as an embodiment of the present invention, after the ensuring ensures that the actual temperature of the CPU keeps consistent with the target temperature, the method further includes:
monitoring the PROCHOT signal and THERMALTRIP signal of the CPU;
monitoring the CPU frequency reduction condition through a PROCHOT signal;
the CPU temperature alarm condition is monitored via the THERMALTRIP signal.
In order to facilitate understanding of the present invention, the CPU temperature sensor testing method provided by the present invention is further described below with reference to the principle of the CPU temperature sensor testing method of the present invention and the process of testing the reliability and accuracy of the CPU temperature sensor in the embodiment.
Specifically, the CPU temperature sensor testing method includes:
and S1, setting the CPU target temperature.
The temperature value T1 set in the CPLD is controlled by the upper computer through an I2C bus, and can be any temperature within a PROCHOT down-conversion temperature point, a THERMALTRIP shutdown temperature point and a safety range allowed by the CPU.
And S2, acquiring the actual temperature of the CPU through the temperature sensor signal.
The CPLD chip sends an electric signal to the temperature sensor, and the electric signal is converted into a temperature signal by monitoring the voltage value change at two ends of the temperature sensor under the condition of inconvenient input of the electric signal and current (the resistance value of the temperature sensor changes along with the temperature change, and the change rule is determined by the specification of the temperature sensor). Thereby acquiring the actual temperature of the CPU through the voltage value of the temperature sensor.
And S3, calculating a temperature control duty ratio according to the target temperature and the actual temperature, and ensuring that the actual temperature of the CPU is consistent with the target temperature by adjusting the temperature control duty ratio output to the semiconductor refrigerating sheet.
The CPLD outputs an electric signal to the semiconductor refrigerating chip, and the heating efficiency of the semiconductor refrigerating chip is adjusted by adjusting the duty ratio of the electric signal. The CPLD adjusts the duty ratio in real time according to the actual temperature of the CPU obtained in step S2, and the adjustment process is as follows:
calculating the temperature control duty ratio according to the target temperature and the actual temperature
The target temperature set by the upper computer is T1, the actual temperature of the CPU detected by the CPLD through a temperature sensor or a thermal diode is T2, the PWM Duty ratio Duty1 is (T1-T2)/T1C, and C is 30%. C is a parameter for controlling the temperature control speed of the TEC, and can be adjusted according to actual conditions, wherein the larger C is, the faster the heating speed is. If the set target temperature is 60 ℃, and the CPLD detects that the actual temperature of the CPU is 20 ℃, the Duty1 is 60%.
When the calculated Duty1 is less than 1, the CPLD outputs a PWM Duty ratio Duty equal to Duty 1; when the calculated Duty1 is equal to or greater than 1, the CPLD sets the Duty of the actual output to 1. In this embodiment, a CPU is heated as an example, that is, the semiconductor cooling plate only heats the CPU. In other embodiments, if the temperature of the CPU is too high, the direction of the electric signal current input to the semiconductor cooling plate may be switched by the H-bridge to achieve the cooling purpose. Namely, the default test condition is T1> T2, and if the set temperature T1 is smaller than the actual temperature of the CPU, the refrigerating surface and the heating surface of the TEC refrigerating sheet are exchanged.
Based on the temperature regulation and control method, the actual temperature measured by the temperature sensor is ensured to be consistent with the set target temperature.
And S4, reading the temperature fed back by the temperature sensor integrated in the CPU.
The CPLD reads CPU information in two ways, namely, aiming at the INTEL CPU, a PECI management chip firstly acquires temperature, and then the CPLD reads data in the PECI chip through I2C; for the CPUs of other manufacturers, the CPLD can directly acquire the temperature thereof by means of I2C and the like. Meanwhile, rich IO resources of the CPLD can monitor signals such as PROCHOT and THERMALTRIP of the CPU and determine whether the CPU frequency reduction function and the temperature alarm function are triggered or not, so that the stability of the CPU frequency reduction function and the temperature alarm function is verified (the target temperature required to be set meets the frequency reduction and temperature alarm conditions).
And S5, comparing the CPU feedback temperature with the target temperature, and judging that the test is passed if the CPU feedback temperature and the target temperature are consistent.
And comparing whether the CPU temperature fed back by the CPU internal temperature sensor read in the step S4 is consistent with the target temperature set in the step S1, if so, indicating that the working state of the CPU temperature sensor is normal, and if not, indicating that the CPU temperature sensor does not pass the test.
As shown in fig. 3, the system 300 includes:
a target setting unit 310 configured to set a CPU target temperature;
a temperature acquisition unit 320 configured to acquire the CPU actual temperature from the temperature sensor signal;
the temperature regulation and control unit 330 is configured to calculate a temperature control duty ratio according to the target temperature and the actual temperature, and ensure that the actual temperature of the CPU is kept consistent with the target temperature by adjusting the temperature control duty ratio output to the semiconductor chilling plate;
a temperature feedback unit 340 configured to read a temperature fed back by a temperature sensor integrated in the CPU;
and a temperature comparison unit 350 configured to compare the CPU feedback temperature with the target temperature, and determine that the test is passed if the two temperatures are the same.
Optionally, as an embodiment of the present invention, the temperature regulation unit includes:
the temperature control calculation module is configured to divide the difference value between the target temperature and the time temperature by the target temperature, multiply the quotient by a temperature control speed parameter of the semiconductor refrigerating sheet, and take the finally obtained product as a temperature control duty ratio;
the parameter updating module is configured to update the duty ratio of the original electric signal output to the semiconductor refrigeration piece by the controller to the temperature control duty ratio if the temperature control duty ratio does not exceed 1;
and the full-quantity adjusting module is configured to update the duty ratio of the original electric signal output to the semiconductor chilling plate by the controller to 1 if the temperature control duty ratio exceeds 1.
Optionally, as an embodiment of the present invention, the system further includes:
the signal monitoring module is used for monitoring a PROCHOT signal and an THERMALTRIP signal of the CPU;
the frequency reduction monitoring module is configured for monitoring the frequency reduction condition of the CPU through a PROCHOT signal;
and the alarm monitoring module is configured for monitoring the temperature alarm condition of the CPU through THERMALTRIP signals.
In the embodiments provided in the present invention, it should be understood that the disclosed system and method can be implemented in other ways. For example, the above-described system embodiments are merely illustrative, and for example, the division of the units is only one logical functional division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, systems or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present invention may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A CPU temperature sensor testing device is characterized by comprising: the device comprises a controller, a semiconductor refrigerating sheet and a temperature sensor; the semiconductor refrigerating sheet is attached to and tightly pressed on the CPU, and the temperature sensor is installed in a manner of being tightly attached to the CPU; the semiconductor refrigerating sheet and the temperature sensor are electrically connected with the controller.
2. The device of claim 1, wherein the controller is a CPLD chip and is connected to an upper computer.
3. The device of claim 1, wherein an H-bridge is arranged between the connection links of the controller and the semiconductor refrigeration chip.
4. A CPU temperature sensor testing method is characterized by comprising the following steps:
setting a CPU target temperature;
acquiring the actual temperature of the CPU through a temperature sensor signal;
calculating a temperature control duty ratio according to the target temperature and the actual temperature, and ensuring that the actual temperature of the CPU is consistent with the target temperature by adjusting the temperature control duty ratio output to the semiconductor refrigerating sheet;
reading the temperature fed back by a temperature sensor integrated in the CPU;
and comparing the CPU feedback temperature with the target temperature, and judging that the test is passed if the CPU feedback temperature is consistent with the target temperature.
5. The method of claim 4, wherein calculating the temperature-controlled duty cycle according to the target temperature and the actual temperature and ensuring that the actual temperature of the CPU is consistent with the target temperature by adjusting the temperature-controlled duty cycle output to the semiconductor chilling plate comprises:
dividing the difference value between the target temperature and the time temperature by the target temperature, multiplying the quotient by the temperature control speed parameter of the semiconductor refrigerating sheet, and taking the finally obtained product as the temperature control duty ratio;
if the temperature control duty ratio is not more than 1, updating the duty ratio of the original electric signal output to the semiconductor refrigerating sheet by the controller into the temperature control duty ratio;
and if the temperature control duty ratio exceeds 1, updating the duty ratio of the original electric signal output to the semiconductor chilling plate by the controller to 1.
6. The method of claim 1, wherein after said ensuring ensures that the actual CPU temperature remains consistent with the target temperature, the method further comprises:
monitoring the PROCHOT signal and THERMALTRIP signal of the CPU;
monitoring the CPU frequency reduction condition through a PROCHOT signal;
the CPU temperature alarm condition is monitored via the THERMALTRIP signal.
7. A CPU temperature sensor testing system, comprising:
a target setting unit configured to set a CPU target temperature;
the temperature acquisition unit is configured for acquiring the actual temperature of the CPU through a temperature sensor signal;
the temperature regulation and control unit is configured for calculating a temperature control duty ratio according to the target temperature and the actual temperature and ensuring that the actual temperature of the CPU is kept consistent with the target temperature by regulating the temperature control duty ratio output to the semiconductor refrigerating sheet;
the temperature feedback unit is configured for reading the temperature fed back by the temperature sensor integrated in the CPU;
and the temperature comparison unit is configured for comparing the CPU feedback temperature with the target temperature, and judging that the test is passed if the CPU feedback temperature is consistent with the target temperature.
8. The system of claim 7, wherein the temperature regulation unit comprises:
the temperature control calculation module is configured to divide the difference value between the target temperature and the time temperature by the target temperature, multiply the quotient by a temperature control speed parameter of the semiconductor refrigerating sheet, and take the finally obtained product as a temperature control duty ratio;
the parameter updating module is configured to update the duty ratio of the original electric signal output to the semiconductor refrigeration piece by the controller to the temperature control duty ratio if the temperature control duty ratio does not exceed 1;
and the full-quantity adjusting module is configured to update the duty ratio of the original electric signal output to the semiconductor chilling plate by the controller to 1 if the temperature control duty ratio exceeds 1.
9. The system of claim 7, further comprising:
the signal monitoring module is used for monitoring a PROCHOT signal and an THERMALTRIP signal of the CPU;
the frequency reduction monitoring module is configured for monitoring the frequency reduction condition of the CPU through a PROCHOT signal;
and the alarm monitoring module is configured for monitoring the temperature alarm condition of the CPU through THERMALTRIP signals.
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| CN201910996179.3A CN110825582A (en) | 2019-10-18 | 2019-10-18 | CPU temperature sensor testing device, method and system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111966187A (en) * | 2020-09-06 | 2020-11-20 | 苏州浪潮智能科技有限公司 | External plug-in card heat dissipation management device and method applied to high-density server |
| CN112904913A (en) * | 2021-01-18 | 2021-06-04 | 北京理工大学重庆创新中心 | Liquid crystal device temperature control system and temperature control method |
| CN114003450A (en) * | 2021-10-25 | 2022-02-01 | 苏州浪潮智能科技有限公司 | Test fixture and test method for automatically switching PCIE (peripheral component interface express) link and computer equipment |
-
2019
- 2019-10-18 CN CN201910996179.3A patent/CN110825582A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111966187A (en) * | 2020-09-06 | 2020-11-20 | 苏州浪潮智能科技有限公司 | External plug-in card heat dissipation management device and method applied to high-density server |
| CN112904913A (en) * | 2021-01-18 | 2021-06-04 | 北京理工大学重庆创新中心 | Liquid crystal device temperature control system and temperature control method |
| CN114003450A (en) * | 2021-10-25 | 2022-02-01 | 苏州浪潮智能科技有限公司 | Test fixture and test method for automatically switching PCIE (peripheral component interface express) link and computer equipment |
| CN114003450B (en) * | 2021-10-25 | 2024-01-12 | 苏州浪潮智能科技有限公司 | Test fixture, test method and computer equipment for automatically switching PCIE links |
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Application publication date: 20200221 |