CN110823158B - Electroplating hole metal layer thickness measurement system - Google Patents
Electroplating hole metal layer thickness measurement system Download PDFInfo
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- CN110823158B CN110823158B CN201910950556.XA CN201910950556A CN110823158B CN 110823158 B CN110823158 B CN 110823158B CN 201910950556 A CN201910950556 A CN 201910950556A CN 110823158 B CN110823158 B CN 110823158B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
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Abstract
The invention discloses a system for measuring the thickness of a metal layer of an electroplating hole, which comprises a weight measuring module, a weight measuring module and a weight measuring module, wherein the weight measuring module is used for measuring the weight of an IC integrated circuit carrier plate before and after the metal layer is arranged so as to generate first weight information and second weight information; the surface metal layer thickness measuring module is used for measuring the metal layer thickness on the surface of the IC integrated circuit carrier plate so as to generate surface first thickness information; and the calculation processing module is used for calculating the first weight information, the second weight information, the first thickness information, the IC integrated circuit carrier plate size information, the metal density information and the electroplating hole area information so as to obtain the metal layer thickness information of the electroplating holes. The thickness measuring system of the electroplating hole metal layer disclosed by the invention can measure the thickness of the electroplating hole metal layer of all the IC integrated circuit carrier plates in the same batch so as to reprocess the IC integrated circuit carrier plates with the thickness of the electroplating hole metal layer not conforming to the preset thickness in time.
Description
Technical Field
The invention relates to the field of measurement, in particular to a system for measuring the thickness of a metal layer of an electroplating hole.
Background
The manufacturing process of the IC integrated circuit carrier plate comprises a plurality of processing flows, such as a previous process → drilling → removing drilling dirt → copper deposition → whole plate electroplating → copper thickness measurement → a next process, and the manufacturing process of the IC integrated circuit carrier plate relates to copper deposition and whole plate electroplating, so that a copper metal layer is manufactured on the surface of the IC integrated circuit carrier plate and the surface of a through hole, the thickness of the copper metal layer directly influences the conductivity of the IC integrated circuit carrier plate, wherein an open circuit is easily caused by undersize of the thickness of a copper metal layer, and an overhigh temperature is easily caused by long-time work due to overhigh thickness of the copper metal layer, so that the detection of the copper metal layer is required to ensure that the thickness of a target copper metal layer is within a preset range.
The copper metal layer thickness measurement mainly comprises: 1. measuring the thickness of the copper metal layer on the surface by adopting a copper thickness measuring instrument in a 9-point method measuring method; 2. since the aperture of the IC carrier is too small to be measured by an instrument, the thickness of the plated hole metal layer is generally measured by a 6-point slicing method. When the thickness of the surface copper metal layer and the thickness of the electroplating hole metal layer both meet the requirements, the next procedure is executed.
In the above-mentioned manner of measuring the thickness of the copper metal layer, the manner of measuring the thickness of the plated hole metal layer is sampling detection, which cannot completely ensure whether the hole copper of the whole batch of products is qualified, and meanwhile, the manner of slicing and sampling will destroy the integrity of the IC integrated circuit carrier plate, resulting in waste of material cost. The defect rate of the thickness of the metal layer in the hole of the IC integrated circuit carrier plate is measured by slicing, sampling and detecting the finished product, and the sample which cannot be recovered and detected finally results in scrapping.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a system for measuring the thickness of a metal layer of a plated hole, which can rapidly measure the thickness of the metal layer of the plated hole without damaging the structure of an IC integrated circuit carrier plate.
According to the system for measuring the thickness of the metal layer of the plated hole in the embodiment of the first aspect of the invention, the weight measuring module is used for measuring the weight of the IC integrated circuit carrier plate before and after the IC integrated circuit carrier plate is arranged on the metal layer so as to generate first weight information and second weight information;
the surface metal layer thickness measuring module is used for measuring the metal layer thickness on the surface of the IC integrated circuit carrier plate so as to generate surface first thickness information;
and the calculation processing module is used for calculating the first weight information, the second weight information, the first thickness information, the IC integrated circuit carrier plate size information, the metal density information and the electroplating hole area information so as to obtain the metal layer thickness information of the electroplating holes.
The system for measuring the thickness of the plated hole metal layer provided by the embodiment of the invention at least has the following beneficial effects: the thickness of the metal layer of the electroplating hole can be rapidly measured under the condition of not damaging the structure of the IC integrated circuit carrier plate.
According to an embodiment of the present invention, the method further comprises: the identification detection module is used for scanning the identification code arranged on the surface of the IC integrated circuit carrier plate so as to generate and distinguish ID information, can distinguish the IC integrated circuit carrier plate, and loads the basic information of the IC integrated circuit carrier plate, such as the dimension information, the carrier plate model and the like of the IC integrated circuit carrier plate.
According to an embodiment of the present invention, the IC integrated circuit carrier further includes a processor, configured to receive the distinguishing ID information and the thickness information of the metal layer, to determine whether the thickness of the metal layer in the plating hole of the IC integrated circuit carrier is a preset thickness, and output a determination result, so that IC integrated circuit carriers of different models can be detected at the same time.
According to an embodiment of the invention, the surface metal layer thickness measuring module comprises any one or more of an ultrasonic thickness gauge, a magnetic thickness gauge, an eddy current thickness gauge, an isotope thickness gauge and a resistance thickness gauge, so as to meet the detection requirements of IC integrated circuit carrier plates made of different gold materials.
According to an embodiment of the invention, the calculation processing module calculates the carrier thickness, the number of the plated holes and the diameter of the plated holes of the IC integrated circuit carrier to obtain the information of the area of the plated holes.
According to an embodiment of the present invention, the calculation processing module generates weight difference information according to the first weight information and the second weight information.
According to an embodiment of the present invention, the calculation processing module calculates the metal density information, the first thickness information, and the IC carrier dimension information to generate surface metal layer weight information.
According to an embodiment of the invention, the calculation processing module performs calculation according to the surface metal layer weight information and the weight difference information to generate plated hole metal layer weight information.
According to an embodiment of the invention, the calculation processing module calculates the plated hole area information, the plated hole metal layer weight information and the metal density information to generate the plated hole thickness information.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a system for measuring a thickness of a plated hole metal layer according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative only for the purpose of illustrating the invention and are not to be construed as limiting the invention. The meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and the meaning of more than, less than, exceeding, etc. is understood as excluding the number, and the meaning of more than, less than, etc. is understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
Referring to fig. 1, fig. 1 is a schematic diagram of a system for measuring a thickness of a plated via metal layer according to an embodiment of the invention. As shown in FIG. 1, the system for measuring the thickness of the plated hole metal layer comprises a weight measuring module, a surface metal layer thickness measuring module, a calculating and processing module, an identifying and detecting module and a processor.
And the identification detection module is used for scanning the identification code arranged on the surface of the IC integrated circuit carrier plate to generate the distinguishing ID information and transmitting the distinguishing ID information to the processor. The distinguishing ID information comprises IC integrated circuit carrier plate model information and IC integrated circuit carrier plate size information, and the IC integrated circuit carrier plate size information comprises IC integrated circuit carrier plate length information, IC integrated circuit carrier plate width information and IC integrated circuit carrier plate thickness information. The weight measuring module is used for measuring the weight of the IC integrated circuit carrier plate before and after the metal layer is arranged so as to generate first weight information and second weight information; the surface metal layer thickness measuring module is used for measuring the metal layer thickness on the surface of the IC integrated circuit carrier plate so as to generate surface first thickness information; and the calculation processing module is used for calculating the first weight information, the second weight information, the first thickness information, the IC integrated circuit carrier plate size information, the metal density information and the electroplating hole area information so as to obtain the metal layer thickness information of the electroplating holes. The processor receives the ID information and the metal layer thickness information to judge whether the thickness of the metal layer in the electroplating hole of the IC integrated circuit carrier plate is a preset thickness or not and outputs a judgment result.
In the manufacturing process of the IC integrated circuit carrier plate, a blank area is arranged on the edge of the IC integrated circuit carrier plate, and the identification code is arranged on the surface of the blank area. After the IC integrated circuit carrier board is manufactured, the IC integrated circuit carrier board is ground or cut to remove the blank area.
In other embodiments, the identification and detection module can also identify a barcode arranged on a list of the IC integrated circuit carrier board so as to quickly enter preset production parameters of the IC integrated circuit carrier board.
The surface metal layer thickness measuring module comprises any one or more of an ultrasonic thickness gauge, a magnetic thickness gauge, an eddy current thickness gauge, an isotope thickness gauge and a resistance thickness gauge so as to directly measure the thickness of the surface metal layer.
And the calculation processing module generates weight difference value information according to the first weight information and the second weight information. The weight difference information is the sum of the surface metal layer weight information and the electroplated hole metal layer weight information.
The calculation processing module is also used for calculating the metal density information, the first thickness information and the IC integrated circuit carrier plate size information to generate surface metal layer weight information, and further calculating according to the surface metal layer weight information and the weight difference information to generate electroplating hole metal layer weight information.
The calculation processing module is also used for calculating the thickness of the carrier plate of the IC integrated circuit carrier plate, the number of the electroplating holes and the aperture of the electroplating holes so as to obtain the area information of the electroplating holes, further generating the thickness information of the electroplating holes according to the weight information of the metal layer of the electroplating holes, the area information of the electroplating holes and the metal density information, and feeding back the thickness information of the electroplating holes to the processor. And the processor judges whether the thickness of the metal layer in the electroplating hole of the IC integrated circuit carrier plate is a preset thickness or not according to the thickness information of the electroplating hole and the distinguished ID information, and outputs a judgment result.
The working method of the plated hole metal layer thickness measuring system is described in detail below with reference to a specific calculation method.
The weight measurement module measures the weight of the IC integrated circuit carrier plate before the IC integrated circuit carrier plate is arranged on the metal layer and generates first weight information m1And measuring the weight of the IC integrated circuit carrier plate after the metal layer is arranged and generating second weight information m2。
The weight difference information is Δ m ═ m2-m1I.e. the sum of the weight information of the surface metal layer and the weight information of the plated hole metal layer.
The dimension information of the IC integrated circuit carrier plate comprises the thickness h, the length a and the width b of the carrier plate.
The calculation of the weight information of the surface metal layer is specifically as follows: Δ m1＝2*ρ*(t1-t)*S1，S1＝a*b-n*π*(d/2)2
Wherein Δ m1Is surface metal layer weight information, rho is metal density information, S1The surface area of the IC integrated circuit carrier plate, t is the thickness of the initial metal layer of the IC integrated circuit carrier plate, t1For the first thickness information after the provision of the metal layer, t1T is the newly added surface thickness information, d is the diameter of the electroplating holes, n is the total number of the holes, and metal layers are added on the front surface and the back surface of the IC integrated circuit carrier plate.
Therefore, the weight information of the metal layer of the plated hole is marked as Deltam2＝Δm-Δm1。
Area S of plated hole22 n pi d h, the metal layer thickness of the plated hole is
I.e. a plated hole thickness of
The processor obtains the electroplating holes according to the calculationThickness t of metal layer2And comparing the thickness with the preset thickness to judge whether the thickness is the preset thickness or not, and outputting a judgment result. In order to avoid the metal layer of the electroplated hole from being completely dissolved due to etching in the subsequent metal layer patterning process and the thickness t of the metal layer of the electroplated hole2When the thickness of the IC carrier is too small, the IC carrier is open, and the predetermined thickness value is generally set to the minimum value.
The thickness measuring system for the metal layer of the electroplating hole can not damage the IC integrated circuit carrier plates in the measuring process, so that all the IC integrated circuit carrier plates in the same batch are measured, and the problem of high missing rate in the traditional sampling detection is solved. Because the traditional detection mode is sampling detection, the reject ratio of finished products can be judged only by samples, and therefore, the missing rate is high. The measuring system provided by the invention can measure the thickness of the metal layer of the electroplating hole of all the IC integrated circuit carrier plates without damaging the IC integrated circuit carrier plates, so the omission ratio is 0 percent, and the IC integrated circuit carrier plates with the thickness of the metal layer of the electroplating hole not conforming to the preset thickness are reprocessed in time, thereby reducing the possibility that the thickness of the metal layer of the electroplating hole of the finished product is lower than the preset thickness. Meanwhile, the IC integrated circuit carrier plate with the thickness of the plated hole metal layer which does not accord with the preset thickness is reprocessed in time in the production process, so that the condition that the IC integrated circuit carrier plate is scrapped because the thickness of the plated hole metal layer of the finished IC integrated circuit carrier plate can not be reprocessed can be avoided.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (9)
1. A system for measuring a thickness of a plated via metal layer, comprising:
the weight measuring module is used for respectively measuring the weight of the IC integrated circuit carrier plate before and after the metal layer is arranged so as to generate first weight information and second weight information;
the surface metal layer thickness measuring module is used for measuring the metal layer thickness on the surface of the IC integrated circuit carrier plate so as to generate surface first thickness information;
the calculation processing module is used for calculating the first weight information, the second weight information, the first thickness information, the IC integrated circuit carrier plate size information, the metal density information and the electroplating hole area information to obtain metal layer thickness information of the electroplating holes, wherein the metal layer thickness information comprises the thickness of the electroplating holes;
wherein the thickness of the plated hole is
m1M is the first weight information2For the second weight information, ρ is metal density information, S1The surface area of the IC integrated circuit carrier plate, t is the thickness of the initial metal layer of the IC integrated circuit carrier plate, t1For the first thickness information after the provision of the metal layer, t1T is the new surface thickness information, d is the diameter of the plated holes, n is the total number of holes, h is the thickness of the support plate, a is the length, and b is the width.
2. The plated hole metal layer thickness measurement system of claim 1, further comprising: and the identification detection module is used for scanning the identification code arranged on the surface of the IC integrated circuit carrier plate so as to generate the distinguishing ID information.
3. The system of claim 2, further comprising a processor configured to receive the distinguishing ID information and the thickness information of the metal layer, determine whether the thickness of the metal layer in the plated hole of the IC carrier is a predetermined thickness, and output the determination result.
4. The electroplated hole metal layer thickness measurement system of any one of claims 1 to 3, wherein the surface metal layer thickness measurement module comprises any one or more of an ultrasonic thickness gauge, a magnetic thickness gauge, an eddy current thickness gauge, an isotope thickness gauge, and a resistance thickness gauge.
5. The system as claimed in claim 1, wherein the calculation module calculates a carrier thickness, a number of plated holes and a hole diameter of the IC carrier to obtain the information of the area of the plated holes.
6. The system of claim 5, wherein the calculation processing module generates weight difference information based on the first weight information and the second weight information.
7. The system of claim 6, wherein the calculation module calculates the metal density information, the first thickness information, and the IC carrier dimension information to generate surface metal layer weight information.
8. The plated hole metal layer thickness measurement system of claim 7, wherein the calculation processing module performs a calculation based on the surface metal layer weight information and the weight difference information to generate plated hole metal layer weight information.
9. The plated hole metal layer thickness measurement system of claim 7, wherein the calculation processing module calculates the plated hole area information, the plated hole metal layer weight information, the metal density information to generate the plated hole thickness information.
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| CN112325825B (en) * | 2020-09-27 | 2022-11-11 | 中国空间技术研究院 | Method for obtaining thickness of surface plated thin layer |
| CN112921368A (en) * | 2021-02-01 | 2021-06-08 | 林元霞 | Plate making method of gravure plate roller |
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