CN106568411A - Different surface height difference-based tin film thickness test method - Google Patents
Different surface height difference-based tin film thickness test method Download PDFInfo
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- CN106568411A CN106568411A CN201610996570.XA CN201610996570A CN106568411A CN 106568411 A CN106568411 A CN 106568411A CN 201610996570 A CN201610996570 A CN 201610996570A CN 106568411 A CN106568411 A CN 106568411A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
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Abstract
The invention provides a different surface height difference-based tin film thickness test method and belongs to the field of metal material micro-connection. Before the tin film deposition process, a covering layer is placed on the local region of the to-be-deposited surface of a metal substrate. During the tin film deposition process, no tin is deposited on the above region. After the deposition process, the covering layer is removed, so that the exposed region of the metal substrate is formed. The edge of the above region is at a height difference relative to the surface of the exposed region of the metal substrate, wherein the height difference is equal to the thickness of a tin film. On the above basis, a probe-type contourgraph is adopted to test the contour of the surface of a sample containing the above height-difference part. When a probe slides along the height-difference part, the probe moves downwards, wherein the downward movement distance of the probe is equal to the thickness of the tin film. After that, the thicknesses of different parts of the tin film are calculated based on corresponding contour images, and then the arithmetic average value of the thicknesses, namely the thickness of the tin film obtained based on the above method of the invention, is obtained. According to the technical scheme of the invention, the high-precision measurement of the thickness of the tin film on any metal substrate is realized. Meanwhile, the process is simple, and the cost is low. The accurate measurement problem of the tin film during the current electronic manufacturing process in the prior art can be effectively solved.
Description
Technical field
The invention belongs to metal material micro-force sensing field, is related to a kind of tin film thickness based on different surfaces difference in height and tests
Method.
Background technology
Currently, in the encapsulation at different levels inside electronic product, mainly by solder connection, thermocompression bonding, ultrasonic bond etc.
Technology realizes the interconnection of different components and parts.In view of these interconnection techniques are completed under miniature scale, thus it is referred to as micro-force sensing
Technology.Wherein, due to low cost, high reliability the features such as, solder attachment technique is most widely used.Even, in very big model
In enclosing, solder connection is the method for attachment of unique feasible during Electronic products manufacturing.The typical case of solder connection in electronic product
Structure be metal substrate/solder layer/metal substrate, higher than solder layer fusing point and less than metal substrate fusing point at a temperature of, liquid
Metal substrate is soaked, fills gap and interfacial reaction formation intermetallic compound occurs with metal substrate by state solder, so as to reality
Now connect.After the completion of connection, the solder joint of formation is capable of achieving electrical connection and the mechanical connection of each inter-module.
Metallic tin due to nontoxicity, low cost, be easily obtained, wetability is good under fusing point relatively low (232 DEG C) and liquid
Good the features such as, become the preferred material of solder layer in solder connection.Correspondingly, in metal substrate Chang Weitong, silver, gold, nickel, cobalt
One or more.Under electronic manufacture micro-force sensing yardstick, the thickness of required tin solder layer is only micron order.Connect accordingly, as solder
The important step for connecing, before proceeding, often needs for tin solder layer to deposit to metal substrate surface.Clearly for what is deposited
Tin film, its thickness should be precisely controlled, this is because for the thick tin film of micron order, the difference of its thickness can cause to be formed
The performance of solder joint has very big difference, if actual deposition thickness has relatively large deviation with expected thickness, is obtained after the completion of connection
Can there is relatively large deviation with expection in the performance of solder joint, have a strong impact on Quality of electronic products.The thickness for making deposition tin film is subject to essence
Really control, need to exactly know the sedimentation rate of tin film under certain deposition parameter, and this is required for certain under this deposition parameter
The thickness of sedimentation time gained tin film carries out accurate measurement.
Currently, the measuring method for film thickness mainly has timing liquid flow method, drop thickness measuring method, weighing method, magnetic to survey
Thick method, vortex thickness measuring method, x-ray method, ellipsometry method and metallography.But, for the essence of tin film thickness in electronic manufacture
There is limitation in really measurement, said method.Wherein, timing liquid flow method, drop thickness measuring method are both needed to the film surface change that detects by an unaided eye
Change to judge Film Fractionation terminal, and then calculate film thickness, therefore often there is larger error.Weight method is sunk by measurement film
The change of sample mass determines film quality before and after product, and then calculates film thickness.The tin film thick for micron order, its quality is very
It is little, it is difficult to carry out being highly prone to external environmental interference in accurate measurement, and measurement process by weight method and cause larger error.
Magnetic gaugemeter method be used for determine nonmagnetic film thickness in magnetic matrix, although tin film is nonmagnetic, but when metal substrate (as copper,
Silver) when not possessing magnetic, the method can not be measured.Eddy current test method mainly determines non-on nonmagnetic conductive metallic matrix leading
The thickness of conductive film on the thickness or non-conductive matrix of conductive film.However, tin film and metal substrate are provided with electric conductivity, therefore should
Method cannot determine the thickness of tin film in metal substrate.When X-ray ga(u)ging method determines tin film thickness, if the atomic number of metal substrate
Number is close with the atomic number (50) of tin, and (such as silver, 47), then measuring accuracy can decline to a great extent, and the equipment that the method is used is made
Valency is high, and X-ray also can produce injury to human body.During ellipsometer method test tin film thickness, the microrelief on tin film surface can be made
Collect difficult into light path, and then cause measuring accuracy to decline.Tin film thickness is tested for metallography, is needed first to sample section
Inlayed respectively, ground, polishing, and the Mohs' hardness of tin is only 1.5, and ten sub-primes are soft, in grinding and polishing process,
Tin film is highly prone to damage, and causes tin film in metallographic section to have defect, and then affects test result.Obviously, using metallography microscope
Method tests tin film thickness, not only complex procedures, and prepares that the success rate of sample is low, past to prepare qualified metallographic section
Take a significant amount of time toward needs.But, in view of metallography is more directly perceived, using the method as arbitration in the embodiment of the present invention
Method, to pass judgment on test result accuracy.
For the problems referred to above, need badly exploitation it is a kind of can in any metal substrate of high-acruracy survey tin film thickness method.This
Invention provides a kind of tin film thickness method of testing based on different surfaces difference in height, and tin film thickness in any metal substrate can be entered
Row high-acruracy survey, and technique is relatively simple, financial cost is low, human body will not be damaged.The method is opened in tin film deposition
Coating is placed in metal substrate face regional area to be deposited before beginning, causes coated region in tin film deposition process not have
Tin deposition, deposits after completing and taking away coating, and this region can expose metal substrate, and in this edges of regions tin film can be formed
Surface and the difference in height for exposing metal substrate surface, i.e. tin film thickness.After this, being covered using probe-type contourgraph measurement is had
The sample surface profiles of above-mentioned difference in height, obtain respective profile image, and according to image the difference in height is can be calculated.Should be noted
It is to expose the formation in area for metal substrate, chemical dissolution method, pressure breaking method, mask method are also the method being contemplated that.So
And, using chemical dissolution method tin can be caused to remain, and then affect measuring accuracy.During using pressure breaking method, optional equipment pressure is needed
Power apparatus, increase cost, after pressing scratches tin film, easily scratch metal substrate surface, can equally affect measuring accuracy.Separately
Outward, using the technique of mask method is sufficiently complex and high cost.Therefore, what is adopted in the present invention is advance in metal substrate face to be deposited
Place coating method formed substrate expose area have the advantages that simply, economy, work well.
The content of the invention
Present invention aim at providing a kind of tin film thickness method of testing based on different surfaces difference in height.Start in tin film
Before deposition, in metal substrate face regional area to be deposited coating, after this treatment, the region Wuxi in deposition process are placed
Film is deposited, and after the completion of deposition, coating is taken away, and the region becomes metal substrate and exposes area, can be formed in this edges of regions
Tin film surface and the difference in height for exposing metal substrate surface, i.e. tin film thickness.To ensure follow-up test precision, coating is taken away
Afterwards, the metal substrate surface for exposing should not have other materials to remain, therefore selectively the region need to be cleaned.
Localized metallic substrate exposes after area formed, and the probe of contourgraph is placed in into tin film surface, and sets sliding distance.Need
It should be noted that tin film deposition is completed in the form of tin crystal grain is stacked gradually, thus tin film surface there is also microcosmic by a small margin
It is uneven.After starting contourgraph, probe gently slides along tin film surface, and the microcosmic injustice on tin film surface can make probe same in what is slided
Shi Fasheng moves up and down accordingly, when probe slips over metal substrate exposes area edge, can be moved by a relatively large margin downwards, to
The distance of lower motion is exactly tin film surface and the difference in height for exposing metal substrate surface formation, i.e. tin film thickness.Subsequently, probe meeting
Continue to slide along metal substrate surface, until it reaches default sliding distance.Obviously, probe motion track can be reflected and slip over position
The surface profile of upper sample.The displacement transducer of contourgraph is according to probe motion situation output corresponding electric signal, electric signal Jing mono-
After series of processes, slipping over the surface profile of sample on position will show, according to contour images, by the metal substrate exposed
Surface is thought of as datum level, and calculating just can obtain slipping over the difference in height on position Zhong Ximo surfaces and the metal substrate surface for exposing,
That is tin film thickness.
1. a kind of tin film thickness method of testing based on different surfaces difference in height, it is characterised in that comprise the following steps：
Step one：A kind of metal is provided as substrate；
Step 2：Treat depositional plane and be surface-treated as tin film depositional plane is treated in one face of selected metal substrate；
Step 3：Regional area in metal substrate face to be deposited places coating, then carries out tin film deposition；
Step 4：After tin film deposition terminates, put coating is taken away, sample surfaces metal substrate occur and expose area；
Step 5：For formed metal substrate expose area, after cleaning again be dried process or need not be cleaned,
Dried process；
Step 6；Contourgraph probe is placed in into tin film surface, sliding distance is set, start contourgraph, probe starts to slide,
When probe slips over metal substrate exposes area edge, can move downward, then continue to be slided along the metal substrate surface for exposing, directly
Terminate to sliding；
Step 7；Probe slides after terminating, and obtains the surface profile image of sample, according to image, is calculated probe cunning
Cross position Zhong Ximo surfaces and expose area's surface height difference, i.e. tin film thickness with metal substrate.
2. further, described tin film deposition, using plating, chemical plating, vapour deposition in a kind of method carry out.
3. further, if tin film is using plating, chemical plating method deposition, after placing coating, the plating solution in deposition process
Coated region cannot be penetrated into, if tin film is deposited using CVD method, coating should be able to undergo the height for being not less than 150 DEG C
Temperature.
4. further, if tin film is deposited using electro-plating method, and coating is insulating materials, then metal substrate face to be deposited
Coated region is shaped as equilateral triangle, square, circular, orthohexagonal one kind.
5. further, the tin film thickness is micron order.
6. further, described regional area area is less than the 50% of the metal substrate face gross area to be deposited.
7. further, the shape of the coating, size should be with capped metal substrate face regional areas one to be deposited
Cause.
8. further, after coating is taken away, if the metal substrate surface for exposing has glue residua, need to clean removing residual glue
Fall, then be dried process, if the metal substrate surface for exposing is without glue residua, now without the need for cleaning, dried process.
9. further, the probe slides and is carried out in diverse location；Difference is calculated respectively according to diverse location contour images
Position Xi Mo surfaces expose the difference in height on area surface, i.e. diverse location tin film thickness with metal substrate, then take arithmetic average, just
It is the tin film thickness for measuring.
10. further, the sample surface profiles image for obtaining should be the surface profile that probe slips over sample on position
Image, often completes once to slide in a position, will obtain an image.
The technical solution used in the present invention is as follows：
A kind of tin film thickness method of testing based on different surfaces difference in height, comprises the following steps：
Step one：A kind of metal is provided as substrate；The metal is preferably copper foil, silver foil piece, nickel foil piece, goldleaf
One kind in piece, cobalt paillon foil；
Step 2：For the metal substrate chosen in step one, a face is selected, be guarantee as tin film depositional plane is treated
Its flatness, cleannes, are surface-treated to the face；The surface treatment method is preferably ground successively, polishes, clearly
Wash, cold wind is dried up；
Step 3：Jing after step 2 process, first the regional area in metal substrate face to be deposited places coating, then carries out
Tin film is deposited；
For described regional area, its position are preferably the middle part in face to be deposited, it is total that its area is preferably face to be deposited
The 30% of area, it is preferably shaped to equilateral triangle, square, circular, the one kind in regular hexagon；
If in tin film deposition process, substrate face to be deposited needs to immerse in liquid, then the coating of the placement is preferably
Adhesive waterproof tape, and should closely paste with institute overlay area, if in tin film deposition process, substrate face to be deposited need not immerse liquid,
Then the coating of the placement is preferably the one kind in sheet glass, silicon chip；
For the coating, its size should be consistent with face coated region to be deposited, and the purpose for placing coating is
Prevent substrate coated region from having tin deposition in tin film deposition process；
For the tin film, its thickness is micron order, its deposition process be preferably plating, chemical plating, sputtering, evaporation, from
One kind in son plating；Step 4：After the completion of tin film deposition, put coating is taken away, sample surfaces metal substrate occur and expose
Area, the edges of regions defines the difference in height for exposing metal substrate surface and tin film surface, i.e. tin film thickness；
It is described to avoid when coating is taken away that periphery tin film is caused to damage, take method away and be preferably and gently pressed from both sides with tweezers
Firmly coating, slowly removes；
Step 5：For the metal substrate for being formed exposes area surface, it is dried process after cleaning again or need not carries out
Cleaning, dried process；
It is described needs or need not be cleaned, dried process, its reason be coating is taken away after, the metal liner exposed
Basal surface has glue residua sometimes, to avoid affecting testing precision, need to wash removing residual glue, then is dried process, and
Sometimes glue residua is not had, now without the need for cleaning, dried process；
The cleaning method is preferably and is cleaned successively in acetone, ethanol analysis are pure；The drying means is preferably
Cold wind is dried up；
Step 6：Contourgraph probe is placed in into tin film surface, sliding distance is set, probe is first along tin film after contourgraph starts
Surface is slided, and when metal substrate exposed area edge is slipped over, probe can be moved downward, and is then continued along the metal substrate exposed
Slide on surface, until it reaches default sliding distance, probe stops sliding；
The contourgraph probe should be vertically disposed at tin film surface, it is preferable that probe is placed in metal substrate and exposes area edge
Neighbouring tin film surface；
The probe slides and should carry out in sample surfaces diverse location, and these positions should be able to represent different parts tin thickness
Degree, its quantity is preferably 3～4；
The sliding distance of the setting, it should be ensured that probe can slip over metal substrate and expose area edge；
The probe is moved downward, and moves downward the difference in height that distance is tin film surface and the metal substrate surface for exposing,
That is tin film thickness；
Step 7：After step 6 terminates, diverse location sample surface profiles show in a coordinate system, according to respective wheel
Wide image, by the metal substrate surface for exposing datum level is thought of as, and be can be calculated each position tin film surface and is exposed with metal substrate
The difference in height on area surface, i.e. tin film thickness, then for the diverse location tin film thickness for obtaining, calculate its arithmetic average, should
Mean value tin film thickness just to measure；
For tin film thickness method of testing proposed by the present invention, need to be before tin film deposition in metal substrate face local to be deposited
Coating is placed in region, and after the completion of tin film deposition, the region becomes metal substrate and exposes area, and the edges of regions forms tin film surface
With the difference in height for exposing metal substrate surface, i.e. tin film thickness, this process have it is simple, economical, the features such as work well.Gold
Category substrate exposes after area formed, using probe-type contourgraph to surveying comprising the sample surface profiles for having formed difference in height
Amount, and then obtain tin film thickness.The present invention is capable of achieving the high-acruracy survey of tin film thickness in any metal substrate, and technique is more
Simply, low cost, it is harmless.Obviously, the present invention can effectively solving Current electronic manufacture in tin film thickness accurate measurement institute
The problem of presence.
Description of the drawings
Fig. 1 a～1e：Coating schematic diagram is placed in metal substrate Middle face region to be deposited in the embodiment of the present invention；
Fig. 2：There is metal substrate and expose the sectional schematic diagram behind area in sample surfaces in the embodiment of the present invention；
Fig. 3：Contourgraph probe is placed in metal substrate and exposes area edge tin film schematic surface nearby in the embodiment of the present invention；
Fig. 4 a～4e：Embodiment of the present invention middle probe sliding position schematic diagram；
Fig. 5 a～5c：Sample diverse location surface profile in the embodiment of the present invention 1；
Fig. 6：The metallographic section of tin film in the embodiment of the present invention 1；
Fig. 7 a～7d：Sample diverse location surface profile in the embodiment of the present invention 2；
Fig. 8：The metallographic section of tin film in the embodiment of the present invention 2；
Fig. 9 a～9d：Sample diverse location surface profile in the embodiment of the present invention 3；
Figure 10：The metallographic section of tin film in the embodiment of the present invention 3；
Figure 11 a～11d：Sample diverse location surface profile in inventive embodiments 4；
Figure 12：The metallographic section of tin film in the embodiment of the present invention 4；
Figure 13 a～13c：Sample diverse location surface profile in the embodiment of the present invention 5；
Figure 14：The metallographic section of tin film in the embodiment of the present invention 5；
Description of reference numerals：
1-copper foil；2-adhesive waterproof tape；3-nickel foil piece；4-silver foil piece；5-silicon chip；
6-gold foil；7-sheet glass；8-cobalt paillon foil；9-metal substrate；10-tin film；
11-metal substrate exposes area；12-tin film surface with expose metal substrate surface difference in height；
13-contourgraph probe；14-copper substrate exposes area；15-nickel substrate exposes area；
16-silver-colored substrate exposes area；17-golden substrate exposes area：18-cobalt substrate exposes area
Specific embodiment
With reference to concrete drawings and Examples, the invention will be further described.
Embodiment 1：
A kind of tin film thickness method of testing based on different surfaces difference in height of the present invention can be realized by following steps：
(1) provide copper foil as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm、1mm；
(2) select a length and width and be respectively the surface of 10mm, 10mm as tin film depositional plane is treated, copper foil is carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream its face to be deposited is ground and
Mechanical polishing is processed, and grinding and polishing will inlay to be fallen with resin immersion after terminating using acetone, take out copper foil, and deionized water is cleaned,
Subsequently cold wind is dried up, and obtains the copper foil that face to be deposited is smooth, clean；
(3) tin film starts before deposition, is 30mm prior to the area of Middle face to be deposited2Equilateral triangle region paste anti-
Glue band as shown in Figure 1a, then carries out tin film deposition as coating using electric plating method；It should be noted that should be by
Adhesive waterproof tape is cut out to consistent with equilateral triangle area size, and adhesive waterproof tape should closely be pasted with face to be deposited, its purpose
It is to prevent from plating solution in electroplating process from penetrating into the region to make the region local have tin deposition, and then avoids test result from being subject to shadow
Ring；
(4) after the completion of electroplating, adhesive waterproof tape is gently clamped with tweezers, is slowly removed it, copper substrate occur in sample surfaces
Expose area, the edges of regions defines tin film surface and exposes the difference in height on area surface with copper substrate, now sample section such as Fig. 2 institutes
Show；
(5) be that copper substrate is exposed in area into remaining glue to clean out, successively with acetone, ethanol analysis are pure that the region is entered
Row cleaning, then carries out cold wind and dries up to the region；
(6) contourgraph probe is vertically disposed at into copper substrate and exposes tin film surface near area edge, see Fig. 3, setting is slided
Dynamic distance is 450 μm, and probe slides and carried out respectively according to the position shown in Fig. 4 a；
(7) after the completion of probe slides, position surface profile 1., 2., 3. is obtained, respectively as shown in Fig. 5 a, 5b, 5c, according to
According to contour images, the brass basal surface for exposing is thought of as into datum level, 1., 2., 3. place's tin film thickness is respectively to calculate out position
2.05 μm, 2.01 μm, 2.01 μm, for the diverse location tin film thickness for obtaining, its arithmetic average is calculated, obtain tin film thickness
For 2.02 μm；
It is more directly perceived in view of metallography, sample tin film thickness is tested using metallography, by metallographic
The result that microscopy is measured as standard, to pass judgment on the tin film thickness accuracy that the present embodiment is measured.The metallographic section of tin film, such as
Shown in Fig. 6, section diverse location tin film thickness is measured, obtain average thickness for 2.04 μm.It follows that the present embodiment
The tin film thickness for measuring, compared with the tin film thickness that metallography is obtained, deviation ratio is only 0.98%.
Embodiment 2：
A kind of tin film thickness method of testing based on different surfaces difference in height of the present invention can be realized by following steps：
(1) provide nickel foil piece as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm、1mm；
(2) select a length and width and be respectively the surface of 10mm, 10mm as tin film depositional plane is treated, nickel foil piece is carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream its face to be deposited is ground and
Mechanical polishing is processed, and grinding and polishing will inlay to be fallen with resin immersion after terminating using acetone, take out nickel foil piece, and deionized water is cleaned,
Subsequently cold wind is dried up, and obtains the nickel foil piece that face to be deposited is smooth, clean；
(3) tin film starts before deposition, is 30mm prior to the area of Middle face to be deposited2Square area paste marine glue
Band as shown in Figure 1 b, then carries out tin film deposition as coating using the method for chemical plating；It should be noted that should prevent
Water adhesive tape cutting its object is to prevent to should closely paste with face to be deposited with square area consistent size, and adhesive waterproof tape
Only plating solution penetrates into the region and makes region local have tin deposition in plating process, and then test result can be avoided to be affected；
(4) after the completion of chemical plating, adhesive waterproof tape is gently clamped with tweezers, is slowly removed it, nickel lining occur in sample surfaces
Area is exposed at bottom, and the edges of regions defines tin film surface and exposes the difference in height on area surface with nickel substrate, now sample section such as Fig. 2
It is shown；
(5) be that nickel substrate is exposed in area into remaining glue to clean out, successively with acetone, ethanol analysis are pure that the region is entered
Row cleaning, then carries out cold wind and dries up to the region；
(6) contourgraph probe is vertically disposed at into nickel substrate and exposes tin film surface near area edge, see Fig. 3, setting is slided
Dynamic distance is 550 μm, and probe slides and carried out respectively according to the position shown in Fig. 4 b；
(7) after the completion of probe slides, position surface profile 1., 2., 3., 4. is obtained, respectively such as Fig. 7 a, 7b, 7c, 7d institute
Show, according to contour images, the nickel substrate surface for exposing is thought of as into datum level, calculate out position and 1., 2., 3., 4. locate tin thickness
Degree is respectively 4.02 μm, 4.02 μm, 3.98 μm, 4.00 μm, for the diverse location tin film thickness for obtaining, calculates its arithmetic mean
Value, obtains tin film thickness for 4.01 μm；
It is more directly perceived in view of metallography, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to pass judgment on the tin film thickness accuracy that the present embodiment is measured.The metallographic section of tin film, such as schemes
Shown in 8, section diverse location tin film thickness is measured, obtain average thickness for 4.05 μm.It follows that the present embodiment is surveyed
The tin film thickness for obtaining, compared with the tin film thickness that metallography is obtained, deviation ratio is only 0.99%.
Embodiment 3：
A kind of tin film thickness method of testing based on different surfaces difference in height of the present invention can be realized by following steps：
(1) provide silver foil piece as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm、1mm；
(2) select a length and width and be respectively the surface of 10mm, 10mm as tin film depositional plane is treated, silver foil piece is carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream its face to be deposited is ground and
Mechanical polishing is processed, and grinding and polishing will inlay to be fallen with resin immersion after terminating using acetone, take out silver foil piece, and deionized water is cleaned,
Subsequently cold wind is dried up, and obtains the silver foil piece that face to be deposited is smooth, clean；
(3) tin film starts before deposition, is 30mm prior to the area of Middle face to be deposited2Border circular areas place a silicon chip make
For coating, as illustrated in figure 1 c, then tin film deposition is carried out using the method for sputtering；It should be noted that silicon chip should be cut out
It is extremely consistent with circular region size；
(4) after the completion of sputtering, silicon chip is gently clamped with tweezers, is slowly removed it, sample surfaces silver-colored substrate occur and expose
Area, the edges of regions defines tin film surface and exposes the difference in height on area surface with silver-colored substrate, and now sample section is as shown in Figure 2；
(5) contourgraph probe is vertically disposed at into silver-colored substrate and exposes tin film surface near area edge, see Fig. 3, setting is slided
Dynamic distance is 600 μm, and probe slides and carried out respectively according to the position shown in Fig. 4 c；
(6) after the completion of probe slides, position surface profile 1., 2., 3., 4. is obtained, respectively such as Fig. 9 a, 9b, 9c, 9d institute
Show, according to contour images, the silver-colored substrate surface for exposing is thought of as into datum level, calculate out position and 1., 2., 3., 4. locate tin thickness
Degree is 6.00 μm, and then obtains tin film thickness for 6.00 μm；
It is more directly perceived in view of metallography, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to pass judgment on the tin film thickness accuracy that the present embodiment is measured.The metallographic section of tin film, such as schemes
Shown in 10, section diverse location tin film thickness is measured, obtain average thickness for 6.04 μm.It follows that the present embodiment
The tin film thickness for measuring, compared with the tin film thickness that metallography is obtained, deviation ratio is only 0.66%.
Embodiment 4：
A kind of tin film thickness method of testing based on different surfaces difference in height of the present invention can be realized by following steps：
(1) provide gold foil as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm、1mm；
(2) select a length and width and be respectively the plane of 10mm, 10mm as tin film depositional plane is treated, gold foil is carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream its face to be deposited is ground and
Mechanical polishing is processed, and grinding and polishing will inlay to be fallen with resin immersion after terminating using acetone, take out gold foil, and deionized water is cleaned,
Subsequently cold wind is dried up, and obtains the gold foil that face to be deposited is smooth, clean；
(3) tin film starts before deposition, is 30mm prior to the area of Middle face to be deposited2Positive six border area domain place a glass
Piece as shown in Figure 1 d, then carries out tin film deposition as coating using the method for evaporation；It should be noted that should be by glass
Piece is cut out to consistent with regular hexagon area size；
(4) after the completion of being deposited with, sheet glass is gently clamped with tweezers, is slowly removed it, sample surfaces go out cash substrate dew
Go out area, the edges of regions defines tin film surface and exposes the difference in height on area surface with golden substrate, now sample section such as Fig. 2 institutes
Show；
(5) contourgraph probe is vertically disposed at into golden substrate and exposes tin film surface near area edge, see Fig. 3, setting is slided
Dynamic distance is 450 μm, and probe slides and carried out respectively according to the position shown in Fig. 4 d；
(6) probe slide after the completion of, obtain position surface profile 1., 2., 3., 4., respectively as Figure 11 a, 11b, 11c,
Shown in 11d, according to contour images, the golden substrate surface for exposing is thought of as into datum level, calculates out position and 1., 2., 3., 4. locate tin
Film thickness is respectively 8.00 μm, 8.00 μm, 8.05 μm, 7.98 μm, for the diverse location tin film thickness for obtaining, calculates it and counts
Mean value, obtains tin film thickness for 8.01 μm；
It is more directly perceived in view of metallography, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to pass judgment on the tin film thickness accuracy that the present embodiment is measured.The metallographic section of tin film, such as schemes
Shown in 12, section diverse location tin film thickness is measured, obtain average thickness for 8.07 μm.It follows that the present embodiment
The tin film thickness for measuring, compared with the tin film thickness that metallography is obtained, deviation ratio is only 0.74%.
Embodiment 5：
A kind of tin film thickness method of testing based on different surfaces difference in height of the present invention can be realized by following steps：
(1) provide cobalt paillon foil as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm、1mm；
(2) select a length and width and be respectively the plane of 10mm, 10mm as tin film depositional plane is treated, cobalt paillon foil is carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream its face to be deposited is ground and
Mechanical polishing is processed, and grinding and polishing will inlay to be fallen with resin immersion after terminating using acetone, take out cobalt paillon foil, and deionized water is cleaned,
Subsequently cold wind is dried up, and obtains the cobalt paillon foil that face to be deposited is smooth, clean；
(3) tin film starts before deposition, is 30mm prior to the area of Middle face to be deposited2Equilateral triangle region place one
Silicon chip as shown in fig. le, then carries out tin film deposition as coating using the method for ion plating；It should be noted that should be by
Silicon chip is cut out to consistent with equilateral triangle area size；
(4) after the completion of ion plating, silicon chip is gently clamped with tweezers, is slowly removed it, cobalt substrate dew occur in sample surfaces
Go out area, the edges of regions defines tin film surface and exposes the difference in height on area surface with cobalt substrate, now sample section such as Fig. 2 institutes
Show；
(5) contourgraph probe is vertically disposed at into cobalt substrate and exposes tin film surface near area edge, see Fig. 3, setting is slided
Dynamic distance is 450 μm, and probe slides and carried out respectively according to the position shown in Fig. 4 e；
(6) after the completion of probe slides, position surface profile 1., 2., 3. is obtained, respectively as shown in Figure 13 a, 13b, 13c,
According to contour images, the cobalt substrate surface for exposing is thought of as into datum level, calculates out position and 1., 2., 3. locate tin film thickness difference
For 10.01 μm, 10.00 μm, 10.00 μm, for the diverse location tin film thickness for obtaining, its arithmetic average is calculated, obtain tin
Film thickness is 10.00 μm；
It is more directly perceived in view of metallography, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to pass judgment on the tin film thickness accuracy that the present embodiment is measured.The metallographic section of tin film, such as schemes
Shown in 14, section diverse location tin film thickness is measured, obtain average thickness for 9.94 μm.It follows that the present embodiment
The tin film thickness for measuring, compared with the tin film thickness that metallography is obtained, deviation ratio is only 0.6%.
Embodiments above is further description made for the present invention, it is impossible to assert being embodied as the present invention
It is confined to these explanations.For general technical staff of the technical field of the invention, without departing from present inventive concept
On the premise of principle, some deduction or replace can also be made, should all be considered as belonging to protection scope of the present invention.
Claims (10)
1. a kind of tin film thickness method of testing based on different surfaces difference in height, it is characterised in that comprise the following steps：
Step one：A kind of metal is provided as substrate；
Step 2：Treat depositional plane and be surface-treated as tin film depositional plane is treated in one face of selected metal substrate；
Step 3：Regional area in metal substrate face to be deposited places coating, then carries out tin film deposition；
Step 4：After tin film deposition terminates, put coating is taken away, sample surfaces metal substrate occur and expose area；
Step 5：For the metal substrate for being formed exposes area, it is dried process after cleaning again or need not be cleaned, be dried
Process；
Step 6；Contourgraph probe is placed in into tin film surface, sliding distance is set, start contourgraph, probe starts to slide, and works as spy
When pin slips over metal substrate and exposes area edge, can move downward, then continue to be slided along the metal substrate surface for exposing, until sliding
It is dynamic to terminate；
Step 7；Probe slides after terminating, and obtains the surface profile image of sample, according to image, is calculated probe and slips over portion
Area's surface height difference, i.e. tin film thickness are exposed in tin film surface with metal substrate in position.
2. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 1, it is characterised in that：
Described tin film deposition, using plating, chemical plating, vapour deposition in a kind of method carry out.
3. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 2, it is characterised in that：
If using plating, chemical plating method deposition, after placing coating, plating solution cannot penetrate into coating cover region to tin film in deposition process
Domain, if tin film is deposited using CVD method, coating should be able to undergo the high temperature for being not less than 150 DEG C.
4. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 2, it is characterised in that：
If tin film is deposited using electro-plating method, and coating is insulating materials, then metal substrate face coated region to be deposited is shaped as
Equilateral triangle, square is circular, orthohexagonal one kind.
5. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 1, it is characterised in that：
The tin film thickness is micron order.
6. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 1, it is characterised in that：
Described regional area area is less than the 50% of the metal substrate face gross area to be deposited.
7. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 1, it is characterised in that：
The shape of the coating, size should be consistent with capped metal substrate face regional area to be deposited.
8. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 1, it is characterised in that：
After coating is taken away, if the metal substrate surface for exposing has glue residua, need to wash removing residual glue, then be dried place
Reason, if the metal substrate surface for exposing is without glue residua, now without the need for cleaning, dried process.
9. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 1, it is characterised in that：
The probe slides and is carried out in diverse location；Diverse location tin film surface and metal are calculated respectively according to diverse location contour images
Substrate exposes the difference in height on area surface, i.e. diverse location tin film thickness, then takes arithmetic average, the tin film thickness for exactly measuring.
10. a kind of tin film thickness method of testing based on different surfaces difference in height according to claim 1, its feature exists
In：The sample surface profiles image for obtaining, should be the surface profile image that probe slips over sample on position, often in a position
Put and complete once to slide, an image will be obtained.
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| CN107339951A (en) * | 2017-06-26 | 2017-11-10 | 华中科技大学 | The precision measurement method of Micropicture profile information on a kind of three-dimension curved surface |
| CN107655415A (en) * | 2017-09-19 | 2018-02-02 | 合肥国轩高科动力能源有限公司 | A kind of device and method based on Raman spectrum system measure film thickness |
| CN107869978A (en) * | 2017-10-13 | 2018-04-03 | 清华大学 | A kind of method for measuring thickness of electrochemical deposition nano thin-film |
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| CN107339951A (en) * | 2017-06-26 | 2017-11-10 | 华中科技大学 | The precision measurement method of Micropicture profile information on a kind of three-dimension curved surface |
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| CN108091821A (en) * | 2018-01-19 | 2018-05-29 | 中航锂电技术研究院有限公司 | Affluxion body in lithium ion batteries foil calendaring molding balance device |
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| CN110823158A (en) * | 2019-10-08 | 2020-02-21 | 广州兴森快捷电路科技有限公司 | Electroplating hole metal layer thickness measurement system |
| CN110823158B (en) * | 2019-10-08 | 2021-07-27 | 广州兴森快捷电路科技有限公司 | Electroplating hole metal layer thickness measurement system |
| CN110865594A (en) * | 2019-11-18 | 2020-03-06 | 浙江长兴昊隆电子科技有限公司 | Production monitoring method and device for high-performance metallized film |
| CN113405514A (en) * | 2021-07-09 | 2021-09-17 | 洛阳Lyc轴承有限公司 | Method for measuring thickness of steel oxide film |
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