CN108360055A - Monitoring device and method is electroplated - Google Patents
Monitoring device and method is electroplated Download PDFInfo
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- CN108360055A CN108360055A CN201810241611.3A CN201810241611A CN108360055A CN 108360055 A CN108360055 A CN 108360055A CN 201810241611 A CN201810241611 A CN 201810241611A CN 108360055 A CN108360055 A CN 108360055A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Abstract
The present invention relates to a kind of plating monitoring devices and method, device to include：First weight detection equipment, the second weight detection equipment, first information identification equipment, the second information identification equipment and processor；The identification information of first information identification equipment each production plate before being electroplated for identification, the first weight detection equipment are used to measure the gravimetric value of each production plate before plating；Second information identification equipment respectively produces the identification information of plate after being electroplated for identification, the second weight detection equipment is used to measure be electroplated after respectively produce the gravimetric value of plate；Processor determines the thickness of each production plated metal of plate according to the weight of each production plate before and after the identification information of each before plating and rear production plate and plating, and be compared the thickness of each production plated metal of plate with root thickness, plating monitoring is carried out to each production plate according to comparison result.It can fast and accurately judge to produce whether plate plating succeeds using above-mentioned plating monitoring device.
Description
Technical field
The present invention relates to electroplating technologies, more particularly to a kind of plating monitoring device and method.
Background technology
Plating is exactly to plate the process of the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle, is
The technique for making the surface of metal or other materials product adhere to layer of metal film using electrolysis prevents metal oxygen to play
The effects that changing (such as corrosion), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.Plating line
Refer to complete the general designation of all electroplating devices in industrial products electroplating process.Currently, coming to needs frequently with plating line
The product of plating is electroplated, and institute's metallization thickness in electroplating process needs detection electroplated product comes frequently with package substrate
Metallization thickness is detected, however is typically all using weight method under line or to use metal thickness measuring instrument when detecting
It is measured, this mensuration mode operates extremely complex inconvenience.
Invention content
Based on this, it is necessary to be directed to the problem of current plating metal thickness measuring method inconvenience complicated for operation, provide one
Kind plating monitoring device and method.
A kind of plating monitoring device, including：First weight detection equipment, the second weight detection equipment, first information identification
Equipment, the second information identification equipment and processor；
First weight detection equipment and the first information equipment are set in the upper trigger of plating line, second weight
It measures detection device and the second information identification equipment is set on the lower trigger of plating line；
The identification information of the first information identification equipment each production plate before being electroplated for identification, the first weight inspection
Measurement equipment is used to measure the gravimetric value of each production plate before plating；
The second information identification equipment respectively produces the identification information of plate, the second weight inspection after being electroplated for identification
Measurement equipment is used to measure be electroplated after respectively produce the gravimetric value of plate；
The processor according to the weight of each production plate before the identification information of each production plate, plating before plating,
The weight of each production plate determines each production plate after the identification information of each production plate and plating after plating
The thickness of the plated metal of part, and the thickness of each production plated metal of plate is compared with root thickness, according to comparing
As a result plating monitoring is carried out to each production plate.
Above-mentioned plating monitoring device, including the identification of the first weight detection equipment, the second weight detection equipment, the first information
The mark letter of production plate before the detection plating of equipment, the second information identification equipment and processor, wherein first information identification equipment
Breath, the first weight detection equipment measure plating before production plate gravimetric value, and by before plating produce plate identification information and
The gravimetric value that plate is produced after plating corresponds to storage in the processor；Production plate after the detection plating of second information identification equipment
Identification information, the second weight detection equipment measures the gravimetric value of production plate after plating, and the mark of plate will be produced after plating
Information storage corresponding with the production gravimetric value of plate after plating is in the processor；Processor only needs the mark according to production plate
The gravimetric value that information correspondence calculates the gravimetric value that preceding production plate is electroplated and produces plate after plating can obtain production plate institute
The thickness of metal is plated, then the thickness for producing the plated metal of plate is compared by processor with root thickness, is tied according to comparing
Fruit carries out plating monitoring to each production plate.Production plate can be quickly detected using above-mentioned plating monitoring device
Institute's metallization thickness, and fast and accurately judge to produce plate and be electroplated whether succeed according to institute's metallization thickness.In addition, the prison
Device is surveyed to may be implemented to monitor on-line, it is very easy to use.
Based on above-mentioned plating monitoring device, a kind of plating monitoring method is additionally provided.
A kind of plating monitoring method using the plating monitoring device includes the following steps：
When each production plate is positioned in the upper trigger of plating line before plating, before the identification plating of first information identification equipment
The identification information of each production plate, and the identification information of each production plate before plating is sent to processor；
First weight detection equipment detects the gravimetric value of production plate before plating, and preceding each production plate will be electroplated
Gravimetric value is sent to the processor；
When respectively producing plate after plating and being positioned on the lower trigger of plating line, after the identification plating of the second information identification equipment
The identification information of each production plate, and the identification information of each production plate after plating is sent to the processor；
Produce the gravimetric value of plate after the detection plating of second weight detection equipment, and by each production plate after plating
Gravimetric value is sent to the processor；
The processor is according to each weight for producing plate before the identification information of each production plate, plating before plating
The gravimetric value of each production plate determines each life after the identification information of each production plate and plating after value, plating
The thickness of the plated metal of plate is produced, and the thickness of each production plated metal of plate is compared with root thickness, according to
Comparison result carries out plating monitoring to each production plate.
Above-mentioned plating monitoring method also has energy as a result of above-mentioned plating monitoring device, so above-mentioned method
Fast and accurately judge to produce whether plate plating succeeds, and detection process is very convenient.
Description of the drawings
Fig. 1 is the structural schematic diagram of plating line in the prior art；
Fig. 2 is the structural schematic diagram that monitoring device is electroplated in one embodiment；
Fig. 3 is the structural schematic diagram that monitoring device is electroplated in one embodiment；
Fig. 4 is the flow diagram that monitoring method is electroplated in one embodiment.
Specific implementation mode
Present disclosure is described in further detail below in conjunction with preferred embodiment and attached drawing.Obviously, hereafter institute
The embodiment of description is only used for explaining the present invention rather than limitation of the invention.Based on the embodiments of the present invention, this field is general
The every other embodiment that logical technical staff is obtained without making creative work belongs to what the present invention protected
Range.It should be noted that for ease of description, only some but not all contents related to the present invention are shown in the drawings.
Fig. 1 is the structural schematic diagram of plating line in the embodiment of the present invention, and wherein plating line upstream is provided with upper trigger, downstream
It is provided with lower trigger, upper trigger, which is mainly used for that plate will be produced to be transmitted in plating line, to be electroplated, i.e. loading；Lower plate owner wants
For after the completion of will produce plate plating, the production plate after the completion of plating being exported, that is, plays sample.In the embodiment of the present invention
Plating monitoring device is mainly used for the plating monitoring that above-mentioned plating line carries out production plate electroplating process.
Fig. 2 is the flow diagram of the plating monitoring device of the present invention in one embodiment, as shown in Fig. 2, of the invention
Plating monitoring device in embodiment, including：First weight detection equipment 10, the second weight detection equipment 20, the first information are known
Other equipment 30, the second information identification equipment 40 and processor 50；First weight detection equipment 10 and first information equipment 30 are set to
In the upper trigger of plating line, the second weight detection equipment 20 and the second information identification equipment 40 are set on the lower trigger of plating line；
The identification information of each production plate before being electroplated for identification of first information identification equipment 30, the first weight detection equipment 10 is for surveying
The gravimetric value of each production plate before fixed plating；The identification information of each production plate and each production plate before plating wherein before plating
Gravimetric value corresponds；Second information identification equipment 40 respectively produces the identification information of plate, the second weight after being electroplated for identification
Detection device 20 is used to measure be electroplated after respectively produce the gravimetric value of plate；Processor 50 is according to each mark for producing plate before plating
The identification information for respectively producing plate after the weight of plate, plating is respectively produced before information, plating and the weight of plate is respectively produced after plating
It measures to determine the thickness of each production plated metal of plate, and the thickness of each production plated metal of plate is compared with root thickness
Compared with carrying out plating monitoring to each production plate according to comparison result.
Specifically, the identification information for producing plate is a kind of information that can uniquely determine production plate, is mainly used for life
Production plate is identified and determines that, wherein the identification information of production plate can be a kind of number information, wherein number information can
With using digital number, alpha code and number with monogram number etc. any one, in addition, number information existing way
Various, such as can be that the forms such as Quick Response Code, one-dimension code exist, first information identification equipment and the second information identification equipment can be with
Identification generates the number information on plate.
In addition, plating is the mistake for plating the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle
Journey is the technique for making the surface of metal or other materials product adhere to layer of metal film using electrolysis prevents gold to play
The effects that belonging to oxidation (such as corrosion), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.Institute
Plating metal can be the arbitrary metal, including copper, gold, silver etc. for needing to plate.
A detailed embodiment is provided for the ease of understanding.There are multiple production plates to need to be electroplated, to each production
Plate is numbered, and number information is followed successively by 1,2,3 ... ..N, and the production plate after number is positioned over the upper of plating line
On trigger, first identifier information identification equipment 30 reads 1,2,3 ... the ..N of label information of each production plate before plating,
First weight detection equipment 10 corresponds to the gravimetric value of each production plate before detection plating according to the number information of production plate,
It is M to be denoted as production 1 gravimetric value of plate respectively1, the gravimetric value of production plate 2 is M2... ... the gravimetric value that produces plate N is MN,
First identifier information equipment equipment 30 by each production plate number information and the first weight detection equipment 10 by each
The gravimetric value of production plate is all sent to processor 50, and processor 50 is corresponding with gravimetric value by each production plate number information
Storage；Then each production plate is electroplated in plating line, after the completion of plating, when each production plate reaches plating
When under line on trigger, second identifier information identification equipment 40 read plating after each production plate label information 1,2,
3 ... ..N, each produces plate after the second weight detection equipment 20 corresponds to detection plating according to the number information of production plate
Gravimetric value, be denoted as respectively production 1 gravimetric value of plate be M11, the gravimetric value of production plate 2 is M22... ... produces plate N's
Gravimetric value is MNN, each is produced plate number information to second identifier information equipment equipment 40 and the second weight detecting is set
The gravimetric value of each production plate is sent to processor 50 by standby 20, each is produced plate number information by processor 50
Storage corresponding with gravimetric value；Number information and number information corresponding plating of the processor 50 according to each production plate
Gravimetric value after preceding gravimetric value and plating calculates the thickness of the plated metal of each production plate, such as 1 institute of number information
The thickness for plating metal is H1=M11-M1, the thickness of 2 plated metal of number information is H2=M22-M2... ... .. and so on, number
The thickness of the plated metals of information N is HN=MNN-MN；Each is produced the thickness H of plate by processor1、H2、………HNRespectively
Compared with root thickness H, the difference of the thickness and root thickness of each production plate is calculated, that is, calculates H1- H, H2- H ... ...
HN-H；It then will be respectively by H1- H, H2- H ... ... HN- H is compared with preset difference value β, if H1- H, H2- H ... ... HNIn-H
When any one value is more than β, that the production plate plating failure of difference more than β, and so on, it can be determined that go out all productions
Whether plate is electroplated success.
Above-mentioned plating monitoring device, including the first weight detection equipment 10, the second weight detection equipment 20, the first information
Production before the detection plating of identification equipment 30, the second information identification equipment 40 and processor 50, wherein first information identification equipment 30
The identification information of plate, the first weight detection equipment 10 measures the gravimetric value of production plate before plating, and will produce plate before plating
The gravimetric value that plate is produced after the identification information of part and plating corresponds to storage in the processor；Second information identification equipment 40 detects
The identification information of plate is produced after plating, the second weight detection equipment 20 measures the gravimetric value of production plate after plating, and will be electric
After plating the gravimetric value correspondence storage of plate is produced after the identification information of production plate and plating in the processor 50；Processor 50
The weight of plate is produced after needing the identification information pair according to production plate that should calculate the preceding gravimetric value for producing plate of plating and plating
Magnitude can obtain the thickness of production the plated metal of plate, and then processor is thick by the thickness and benchmark that produce the plated metal of plate
Degree is compared, and plating monitoring is carried out to each production plate according to comparison result, can using above-mentioned plating monitoring device
Quickly to detect production plate institute metallization thickness, and production plate is fast and accurately judged according to institute's metallization thickness
Whether plating succeeds.In addition, the monitoring device may be implemented to monitor on-line, it is very easy to use.
Processor 50 is in the thickness and benchmark for detecting any one production plated metal of plate in one of the embodiments,
When the difference of thickness is more than preset difference value, judgement difference is more than the production plate plating failure of preset difference value.
Specifically, the preset difference value can be any number, be in practical electroplating process according to the gold to be electroplated
Belonging to type and produces the property determination of plate, different metals and the plated thickness of different types of production plate are different,
And thickness is different from the difference of root thickness after plating.
Processor 50 carries out plating monitoring according to comparison result to each production plate, is detecting any one production plate institute
When the difference of the thickness and root thickness that plate metal is more than preset difference value, the production plate that judgement difference is more than preset difference value is electroplated
Failure.Above-mentioned plating monitoring device can quickly judge plating failure scenarios, and when failure is electroplated, it may be determined that electricity
Plate wire breaks down, to remind staff's on-call maintenance that line apparatus is electroplated.
The first weight detection equipment 10 and the second weight detection equipment 30 are weight induction in one of the embodiments,
Device.
Weight sensor is actually a kind of device that quality signal is changed into measurable electric signal output, user
Just, measurement result is accurate.Use weight sensor that the gravimetric value of front and back each production plate can be electroplated with Accurate Determining, so that it is guaranteed that
The result for measuring each obtained production plate is more accurate.
One embodiment wherein, as shown in Fig. 2, warning device 60；Processor 50 is detecting any one production plate
When the thickness of plated metal and the difference of root thickness are more than preset difference value, warning device alert is controlled.
Specifically, processor 50 by calculate each production the plated number of packages of plate thickness and root thickness difference,
To come monitor plating line to each production plate plating stability, any one production the plated metal of plate thickness and
When root thickness difference is larger, warning device alert is triggered, convenient for notifying that it is abnormal that relevant staff is handled in time
Production plate, and investigate the exception of related plating line in time.
First information identification equipment 30 and the second information equipment 40 are known for contactless information in one of the embodiments,
Other equipment.
In the present embodiment, can label, before plating, first be set to the production plate that each is electroplated
Information identification equipment 30 reads the label being electroplated on preceding each production plate, to obtain the mark letter of the preceding respectively production plate of plating
Breath.After the completion of plating, the label on plate is respectively produced after the reading plating of the second information identification equipment 40, after obtaining plating
The identification information of each production plate.The identification information of each production plate can rapidly be read.Wherein the first information identifies
Equipment 30 and the second information equipment 40 are contactless information identification equipment, before and after can quickly identifying plating in a non contact fashion
The label of each production plate, it is easy to use to obtain the identification information of the front and back each production plate of plating.
Label is two-dimension code label in one of the embodiments,.
In the present embodiment, label uses the form of Quick Response Code.General data label uses one-dimensional bar code, but this
The data information that one-dimensional bar code can include is less, and the information for including in Quick Response Code is much larger than one-dimensional bar code, accuracy higher.
Therefore, the accuracy of identification information on production plate can be improved using Quick Response Code mode.
First information identification equipment 30 is code reader in one of the embodiments,.
The second information identification equipment 40 is code reader in one of the embodiments,.
Specifically, code reader is that one kind is used to that one-dimension code/Quick Response Code character to be identified, to obtain relevant information
A kind of equipment, wherein one-dimension code/Quick Response Code are arranged according to certain coding rule, to express the pattern identification of a group information
Symbol.The identification information on each production plate can be rapidly read using code reader, and identification information is accurate, discrimination is high.
Warning device 60 is indicator light alarm device in one of the embodiments,；Processor 50 is detecting any one
When the difference of the thickness and root thickness that produce the plated metal of plate is more than preset difference value, control indicator light alarm device sends out light
Alarm.
In the present embodiment, processor 50 is in the thickness and root thickness for detecting any one production plated metal of plate
When difference is more than preset difference value, illustrate have production plate plating unqualified, indicator light alarm device sends out luminous alarm, with prompt
Staff finds out corresponding gold-plated underproof production plate, and detects whether plating line breaks down.
Warning device 60 is audible alarm unit in one of the embodiments,；Processor 5 is detecting any one production
When the thickness of the plated metal of plate and the difference of root thickness are more than preset difference value, control audible alarm unit makes a sound report
It is alert.
In the present embodiment, processor 50 is in the thickness and root thickness for detecting any one production plated metal of plate
When difference is more than preset difference value, illustrate have production plate plating unqualified, audible alarm unit makes a sound alarm, to prompt work
Corresponding gold-plated underproof production plate is found out as personnel, and detects whether plating line breaks down.
According to the plating monitoring device of aforementioned present invention, the present invention also provides a kind of electricity using the plating monitoring device
Monitoring method is plated, below in conjunction with the accompanying drawings and the plating monitoring method of the present invention is described in detail in preferred embodiment.
As shown in figure 4, in the present embodiment, a kind of plating monitoring method, including：
Step S110, when each production plate is positioned in the upper trigger of plating line before plating, first information identification equipment
The identification information of each production plate before identification plating, and the identification information of each production plate before plating is sent to processor；
Step S120 produces the gravimetric value of plate, and is produced each before plating before the detection plating of the first weight detection equipment
The gravimetric value of plate is sent to processor；
Step S130, when after plating respectively producing plate and being positioned on the lower trigger of plating line, the second information identification equipment
The identification information of plate is respectively produced after identification plating, and the identification information for respectively producing plate after plating is sent to processor；
Step S140 produces the gravimetric value of plate after the detection plating of the second weight detection equipment, and will respectively be produced after plating
The gravimetric value of plate is sent to processor；
Step S150, processor is according to the weight for respectively producing plate before the identification information of each production plate, plating before plating
Respectively produced after value, plating plate identification information and plating after respectively produce the gravimetric value of plate determine each production plate it is gold-plated
The thickness of category, and the thickness of each production plated metal of plate is compared with root thickness, according to comparison result to each described
Production plate carries out plating monitoring.
Specifically, the identification information for producing plate is a kind of information that can uniquely determine production plate, is mainly used for life
Production plate is identified and determines that, wherein the identification information of production plate can be a kind of number information, wherein number information can
With using digital number, alpha code and number with monogram number etc. any one, in addition, number information existing way
Various, such as can be that the forms such as Quick Response Code, one-dimension code exist, first information identification equipment and the second information identification equipment can be with
Identification generates the number information on plate.
In addition, plating is the mistake for plating the other metal or alloy of a thin layer on certain metal surfaces using electrolysis principle
Journey is the technique for making the surface of metal or other materials product adhere to layer of metal film using electrolysis prevents gold to play
The effects that belonging to oxidation (such as corrosion), improving wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and having improved aesthetic appearance.Institute
Plating metal can be the arbitrary metal, including copper, gold, silver etc. for needing to plate.
Above-mentioned plating monitoring method also has energy as a result of above-mentioned plating monitoring device, so above-mentioned method
Fast and accurately judge to produce whether plate plating succeeds, and detection process is very convenient.
Each technical characteristic of above example can be combined arbitrarily, to keep description succinct, not to above-described embodiment
In each technical characteristic it is all possible combination be all described, as long as however, the combination of these technical characteristics be not present lance
Shield is all considered to be the range of this specification record.
Only several embodiments of the present invention are expressed for above example, the description thereof is more specific and detailed, but can not
Therefore it is construed as limiting the scope of the patent.It should be pointed out that for those of ordinary skill in the art,
Under the premise of not departing from present inventive concept, various modifications and improvements can be made, these are all within the scope of protection of the present invention.
Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of plating monitoring device, which is characterized in that including：First weight detection equipment, the second weight detection equipment, first
Information identification equipment, the second information identification equipment and processor；
First weight detection equipment and the first information equipment are set in the upper trigger of plating line, the second weight inspection
Measurement equipment and the second information identification equipment are set on the lower trigger of plating line；
The identification information of the first information identification equipment each production plate before being electroplated for identification, first weight detecting are set
It is ready for use on the gravimetric value of each production plate before measuring plating；
The second information identification equipment respectively produces the identification information of plate after being electroplated for identification, second weight detecting is set
It is ready for use on the gravimetric value that plate is respectively produced after measuring plating；The processor according to the identification information of each production plate before plating,
Each production plate after the identification information of each production plate and plating after each production weight of plate, plating before plating
The weight of part come determine it is each it is described production the plated metal of plate thickness, and by it is each it is described production the plated metal of plate thickness and
Root thickness is compared, and plating monitoring is carried out to each production plate according to comparison result.
2. plating monitoring device according to claim 1, which is characterized in that the processor is detecting described in any one
When the difference of the thickness and the root thickness that produce the plated metal of plate is more than preset difference value, it is described to judge that the difference is more than
The production plate plating failure of preset difference value.
3. plating monitoring device according to claim 1, which is characterized in that first weight detection equipment and described
Two weight detection equipments are weight induction device.
4. plating monitoring device according to claim 2 or 3, which is characterized in that further include：Warning device；
The processor is detecting that the difference of the thickness and the root thickness of any one production plated metal of plate is big
When the preset difference value, the warning device alert is controlled.
5. plating monitoring device according to claim 1, which is characterized in that the first information identification equipment and described
Two information equipments are contactless information identification equipment.
6. plating monitoring device according to claim 1, which is characterized in that the first information identification equipment and described
Two information identification equipments are code reader.
7. plating monitoring device according to claim 1, which is characterized in that the second information identification equipment is reading code
Device.
8. plating monitoring device according to claim 4, which is characterized in that the warning device fills for indicator light alarm
It sets；
The processor is detecting that the difference of the thickness and the root thickness of any one production plated metal of plate is big
When the preset difference value, controls the indicator light alarm device and send out light alarm.
9. plating monitoring device according to claim 4, which is characterized in that the warning device is audible alarm unit；
The processor is detecting that the difference of the thickness and the root thickness of any one production plated metal of plate is big
When the preset difference value, controls the audible alarm unit and make a sound alarm.
10. a kind of plating monitoring method using any one of the claim 1-9 plating monitoring devices, which is characterized in that packet
Include following steps：
When each production plate is positioned in the upper trigger of plating line before plating, each life before the identification plating of first information identification equipment
The identification information of plate is produced, and the identification information of each production plate before plating is sent to processor；
First weight detection equipment detects the gravimetric value of production plate before plating, and the weight of preceding each production plate will be electroplated
Value is sent to the processor；
When respectively producing plate after plating and being positioned on the lower trigger of plating line, each life after the identification plating of the second information identification equipment
The identification information of plate is produced, and the identification information of each production plate after plating is sent to the processor；
Second weight detection equipment detection plating after produce plate gravimetric value, and by after plating it is each it is described production plate weight
Value is sent to the processor；
The processor is according to each gravimetric value, electricity for producing plate before the identification information of each production plate, plating before plating
The gravimetric value of each production plate determines each production plate after the identification information of each production plate and plating after plating
The thickness of the plated metal of part, and the thickness of each production plated metal of plate is compared with root thickness, according to comparing
As a result plating monitoring is carried out to each production plate.
Priority Applications (1)
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|---|---|---|---|
| CN201810241611.3A CN108360055A (en) | 2018-03-22 | 2018-03-22 | Monitoring device and method is electroplated |
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|---|---|---|---|
| CN201810241611.3A CN108360055A (en) | 2018-03-22 | 2018-03-22 | Monitoring device and method is electroplated |
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| CN109183091A (en) * | 2018-10-26 | 2019-01-11 | 成都科力夫科技有限公司 | A kind of Vehicular engine accessory manufacturing method |
| CN110158120A (en) * | 2019-05-28 | 2019-08-23 | 合肥铜冠国轩铜材有限公司 | Foil machine on-line monitoring system and its monitoring method |
| CN110387573A (en) * | 2019-07-04 | 2019-10-29 | 广州兴森快捷电路科技有限公司 | More segregation of waste devices and electroplating producing system |
| CN114182305A (en) * | 2021-12-31 | 2022-03-15 | 理纯(上海)洁净技术有限公司 | Metal recovery system of semiconductor etching liquid |
| CN114277410A (en) * | 2022-01-19 | 2022-04-05 | 宁波市信泰科技有限公司 | Electroplating process of neodymium iron boron magnet |
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| CN110387573A (en) * | 2019-07-04 | 2019-10-29 | 广州兴森快捷电路科技有限公司 | More segregation of waste devices and electroplating producing system |
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