CN110822964A

CN110822964A - Heat conduction device

Info

Publication number: CN110822964A
Application number: CN201911268883.3A
Authority: CN
Inventors: 孙伟; 刘建美; 胡蓉; 徐雪玲; 薛文娟
Original assignee: Shenzhen Yisheng Technology Development Co Ltd
Current assignee: Shenzhen Yisheng Technology Development Co Ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-02-21

Abstract

The invention relates to the technical field of heat conduction, and particularly provides a heat conduction device, aiming at solving the problem that the heat dissipation efficiency of the existing heat dissipation device cannot meet the heat dissipation requirements of electronic components with large heat productivity and high heating speed. To this end, the heat conducting device of the present invention comprises: the first heat exchange component is internally provided with a first cavity; the second heat exchange component is internally provided with a second cavity and a third cavity which are communicated through a connecting channel; the connecting pipe comprises a first connecting pipe, and the second cavity and the first cavity are communicated through the first connecting pipe; the first cavity, the second cavity, the third cavity, the connecting channel and the connecting pipe form a closed space, and gas-liquid phase change materials are filled in the closed space. Through such setting, liquid phase-change material can fully vaporize in the second heat transfer part, has greatly improved the heat transfer capacity of second heat transfer part to heat conduction device's heat transfer capacity has been promoted.

Description

Heat conduction device

Technical Field

The invention relates to the technical field of heat conduction, and particularly provides a heat conduction device.

Background

Heating of electronic components inside electrical appliances is a common problem. Generally, in a conventional heat dissipation mode, a fan blows air to an electronic component, so that the electronic component is quickly dissipated, and the electronic component is prevented from being damaged due to overhigh temperature. However, for the electric appliances with higher integration degree, the heat dissipation by blowing the fan cannot achieve the purpose of good heat dissipation.

In view of this, new heat abstractor has appeared in the market, and heat abstractor includes evaporation portion and condensing part, and the inside of evaporation portion has the evaporation chamber, and the inside of condensing part has the condensation chamber, and evaporation chamber and condensation chamber pass through the connecting pipe intercommunication, and the evaporation intracavity stores has liquid phase change working medium. The heating source is in direct contact with the evaporation cavity, the liquid phase-change working medium in the evaporation cavity absorbs heat to become a gaseous phase-change working medium, the gaseous phase-change working medium enters the condensation cavity through the connecting pipe, the gaseous phase-change working medium is radiated in the condensation cavity to become the liquid phase-change working medium, and the gaseous phase-change working medium flows back to the evaporation cavity through the connecting pipe under the action of gravity. However, for electronic components with large heat generation and fast heat generation, the heat dissipation efficiency of the heat dissipation device cannot meet the heat dissipation requirement.

Accordingly, there is a need in the art for a solution to the above-mentioned problems.

Disclosure of Invention

In order to solve the above-mentioned problems in the prior art, that is, to solve the problem that the heat dissipation efficiency of the conventional heat dissipation device cannot meet the heat dissipation requirements of electronic components with large heat productivity and high heat dissipation speed, the present invention provides a heat conduction device, which includes: the first heat exchange component is internally provided with a first cavity; the second heat exchange component is internally provided with a second cavity and a third cavity which are communicated through a connecting channel; the connecting pipe comprises a first connecting pipe, and the second cavity and the first cavity are communicated through the first connecting pipe; the first cavity, the second cavity, the third cavity, the connecting channel and the connecting pipe form a closed space, and a gas-liquid phase change material is filled in the closed space.

In a preferred embodiment of the above heat conducting device, the second heat exchanging component includes a housing and a core disposed in the housing, the core divides an inner space of the housing into the first cavity and the second cavity, and the connecting channel is formed on the core.

In a preferred embodiment of the above heat conducting device, the connecting channel includes a plurality of vertical sub-channels, a first end of each sub-channel is communicated with the second cavity, and a second end of each sub-channel is communicated with the third cavity.

In a preferred embodiment of the above heat conducting device, the cross-sectional area of each of the sub-channels is constant in a direction from the second end to the first end.

In a preferred embodiment of the above heat conducting device, the cross-sectional area of each of the sub-channels increases in a direction from the second end to the first end.

In a preferred embodiment of the above heat conducting device, each of the sub-channels includes a plurality of cylindrical sections with increasing cross-sectional areas, which are sequentially distributed along a direction from the second end to the first end.

In a preferred technical solution of the above heat conducting device, a plurality of first heat conducting members are disposed in the third cavity, one end of each first heat conducting member is connected to the core, and the other end of each first heat conducting member is connected to the inner wall of the housing.

In a preferred technical solution of the above heat conducting device, a plurality of second heat conducting members are disposed in the second cavity, one end of each second heat conducting member is connected to the core, and the other end of each second heat conducting member is connected to the inner wall of the housing.

In a preferred embodiment of the above heat conduction device, the connection pipe includes a second connection pipe, and the third cavity and the first cavity are communicated with each other through the second connection pipe.

In a preferred embodiment of the above heat conduction device, the core, the first heat conduction member, the second heat conduction member, and the housing are integrally formed.

As can be understood by those skilled in the art, in the technical solution of the present invention, the heat conducting device includes a first heat exchanging component, a second heat exchanging component, and a connecting pipe, a first cavity is formed in the first heat exchanging component, a second cavity and a third cavity are formed in the second heat exchanging component, and the second cavity and the third cavity are communicated through the connecting channel. The connecting pipe comprises a first connecting pipe, and the second cavity is communicated with the first cavity through the first connecting pipe. The first cavity, the second cavity, the third cavity, the connecting channel and the connecting pipe form a closed space, and gas-liquid phase change materials are filled in the closed space.

In use, the second heat exchange component is in contact with the heat generating source, and the first heat exchange component is at a higher position than the second heat exchange component. The liquid phase-change material in the third cavity absorbs heat and is vaporized, and the gaseous phase-change material flows to the second cavity through the connecting channel. In the process, the gaseous phase-change material carrying part of the liquid phase-change material flows into the second cavity through the connecting channel, due to the fact that in the moment from the connecting channel to the second cavity, the space where the gaseous phase-change material is located is suddenly increased, the pressure is suddenly reduced, the boiling point of the phase-change material is reduced, part of the liquid phase-change material carried by the gaseous phase-change material is changed into overheated liquid and is boiled violently, vaporized and absorbed heat, the gaseous phase-change material flows to the first cavity through the first connecting pipe, the gaseous phase-change material is changed into the liquid phase-change material through heat dissipation in the first cavity and flows back into the third cavity. Through the arrangement of the structure, the liquid phase-change material can be fully vaporized in the second heat exchange part, so that the heat exchange capacity of the second heat exchange part is greatly improved, the heat transfer capacity of the heat conduction device is improved, and the high-efficiency heat dissipation requirements of electronic components with large heat productivity and high heating speed are met.

In another aspect, the heat transfer device of the present invention may also be used to "conduct cold". Particularly, the second heat exchange component is in contact with the cold source, and the first heat exchange component is in a position lower than the second heat exchange component. Gaseous phase change material in the third cavity carries out the heat exchange with outside cold source, and gaseous phase change material's temperature reduces the liquefaction and becomes liquid phase change material and gets into the second cavity through interface channel under the effect of gravity, and gaseous phase change material temperature in the second cavity reduces the liquefaction and becomes liquid phase change material, and liquid phase change material in the second cavity flows into first cavity through first connecting pipe under the effect of gravity. Gaseous phase-change materials in the third cavity and the second cavity are liquefied to be liquid phase-change materials, the gaseous phase-change materials are reduced, the pressure in the third cavity and the second cavity is reduced, pressure difference is formed between the first cavity and the third cavity, and the gaseous phase-change materials in the first cavity flow to the second cavity and the third cavity through the first connecting pipe. And with the reduction of the gaseous phase-change material in the first cavity, the air pressure in the first cavity is reduced, the boiling point of the liquid phase-change material in the first cavity is reduced, and the liquid phase-change material flowing back to the first cavity absorbs heat from the outside to be vaporized into the gaseous phase-change material. Through such mode, transmit the cold source of second heat transfer part contact with the heat in first heat transfer part place, make the temperature in first heat transfer part place space reduce, realized "leading cold" of cold source. The second heat exchange component is internally provided with the second cavity and the third cavity, so that the heat exchange area is increased, and the cold conduction efficiency is improved.

Drawings

Preferred embodiments of the present invention are described below with reference to the accompanying drawings, in which:

fig. 1 is a state view of a heat conduction device for dissipating heat according to a first embodiment of the present invention;

fig. 2 is a plan view of a second heat exchange member in the heat conducting device according to the first embodiment of the present invention;

FIG. 3 is a cross-sectional view taken along the plane A-A in FIG. 2;

fig. 4 is a front view of a second heat exchanging member in the heat conducting device according to the first embodiment of the present invention;

FIG. 5 is a cross-sectional view taken along the plane B-B in FIG. 4;

fig. 6 is a state diagram of a heat conducting device for dissipating heat according to a second embodiment of the present invention;

fig. 7 is a plan view of a second heat exchanging element in a heat conducting device according to a second embodiment of the present invention;

FIG. 8 is a cross-sectional view taken along the plane C-C in FIG. 7;

fig. 9 is a front view of a second heat exchanging member in the heat conducting device according to the second embodiment of the present invention;

FIG. 10 is a cross-sectional view taken along plane D-D of FIG. 9;

FIG. 11 is a state diagram of the heat conducting device for "cold conduction" according to the second embodiment of the present invention;

fig. 12 is a partial sectional view of a second heat exchanging member in a heat conducting device according to a third embodiment of the present invention.

List of reference numerals:

1. a first heat exchange member; 11. a first cavity; 2. a second heat exchange member; 21. a housing; 22. a core body; 23. a second cavity; 24. a third cavity; 25. a sub-channel; 26. a first heat conductive member; 27. a second heat conductive member; 28. a filling port; 3. a first connecting pipe; 4. a second connecting pipe.

Detailed Description

Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention.

It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either directly or indirectly through intervening media, or through the communication between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In order to solve the problem that the heat dissipation efficiency of the existing heat dissipation device in the background art cannot meet the heat dissipation requirements of electronic components with large heat productivity and high heating speed, the invention provides a heat conduction device which comprises a first heat exchange component, a second heat exchange component and a connecting pipe, wherein a first cavity is formed in the first heat exchange component, a second cavity and a third cavity are formed in the second heat exchange component, and the second cavity and the third cavity are communicated through a connecting channel. The connecting pipe comprises a first connecting pipe, and the second cavity is communicated with the first cavity through the first connecting pipe. The first cavity, the second cavity, the third cavity, the connecting channel and the connecting pipe form a closed space, and gas-liquid phase change materials are filled in the closed space.

In use, the second heat exchange component is in contact with the heat generating source, and the first heat exchange component is at a higher position than the second heat exchange component. The liquid phase-change material in the third cavity absorbs heat and is vaporized, and the gaseous phase-change material flows to the second cavity through the connecting channel. Gaseous phase-change material carries partial liquid phase-change material to flow into the second cavity through the connecting passage at this in-process, because the space at gaseous phase-change material place increases suddenly in the twinkling of an eye from connecting passage to second cavity, pressure reduces suddenly, phase-change material's boiling point reduces, partial liquid phase-change material that gaseous phase-change material carried further vaporizes the heat absorption, gaseous phase-change material flows to first cavity through first connecting pipe, gaseous phase-change material dispels the heat in first cavity and becomes liquid phase-change material and flows back to in the third cavity under the effect of gravity. Through the arrangement of the structure, the liquid phase-change material can be fully vaporized in the second heat exchange part, so that the heat exchange capacity of the second heat exchange part is greatly improved, the heat transfer capacity of the heat conduction device is improved, and the high-efficiency heat dissipation requirements of electronic components with large heat productivity and high heating speed are met.

Referring to fig. 1 to 5, fig. 1 is a diagram illustrating a state in which a heat conduction device according to a first embodiment of the present invention is used for heat dissipation; fig. 2 is a plan view of a second heat exchange member in the heat conducting device according to the first embodiment of the present invention; FIG. 3 is a cross-sectional view taken along the plane A-A in FIG. 2; fig. 4 is a front view of a second heat exchanging member in the heat conducting device according to the first embodiment of the present invention; fig. 5 is a sectional view taken along the plane B-B in fig. 4.

In the first embodiment, as shown in fig. 1 to 5 and described with reference to fig. 3, the heat conducting device includes a first heat exchanging component 1, a second heat exchanging component 2 and a connecting pipe, a first cavity 11 is formed in the first heat exchanging component 1, the second heat exchanging component 2 includes a shell 21, a core 22 is arranged in the shell 21, the core 22 divides an inner cavity of the shell 21 into an upper second cavity 23 and a lower third cavity 24, a connecting channel is formed in the core 22, the connecting channel includes a plurality of vertical sub-channels 25, and each sub-channel 25 is a cylindrical channel. The connecting pipe comprises a first connecting pipe 3, and the second cavity 23 and the first cavity 11 are communicated through the first connecting pipe 3. A plurality of first heat conduction members 26 are disposed in the third cavity 24, one end of each first heat conduction member 26 is connected to the lower surface of the core 22, and the other end of each first heat conduction member 26 is connected to the inner wall of the lower portion of the housing 21. A plurality of second heat conduction members 27 are disposed in the second cavity 23, one end of each second heat conduction member 27 is connected to the upper surface of the core 22, and the other end of each second heat conduction member 27 is connected to the inner wall of the upper portion of the housing 21. Specifically, the first heat-conductive member 26 and the second heat-conductive member 27 are each a columnar structure. The first cavity 11, the second cavity 23, the third cavity 24, the sub-channel 25 and the first connecting pipe 3 form a closed space, and gas-liquid phase change materials such as Freon, nitrogen, ammonia and the like are filled in the closed space. Preferably, the case 21, the core 22, the first heat conductive member 26, and the second heat conductive member 27 are integrally molded.

When the heat exchanger is used for heat dissipation, the first heat exchange component 1 is located at a position higher than the second heat exchange component 2, a liquid phase change material is stored in the third cavity 24 of the sealed space, and the lower surface of the shell 21 is in contact with a heat source (such as a CPU) needing heat dissipation. The liquid phase change material in the third cavity 24 absorbs the heat of the heat source, the temperature rises to reach boiling point, the liquid phase change material is vaporized into the gaseous phase change material, the generated gaseous phase change material flows to the second cavity 23 through the plurality of sub-channels 25, and meanwhile, part of the liquid phase change material is mixed in the gaseous phase change material flowing to the second cavity 23 through the plurality of sub-channels 25. At the moment when the flow from the plurality of sub-passages 25 flows to the second cavity 23, the gas pressure is reduced due to the sudden increase of the flow cross-sectional area, the boiling point of the liquid phase-change material is reduced, and a part of the liquid phase-change material included in the gaseous phase-change material is changed into superheated liquid, and then the superheated liquid is rapidly boiled and evaporated to be changed into the gaseous phase-change material. Gaseous phase-change material in the second cavity 23 flows to the first cavity 11 through the first connecting pipe 3, and the gaseous phase-change material is changed into liquid phase-change material by heat dissipation in the first cavity 11, flows into the second cavity 23 through the first connecting pipe 3 under the action of gravity, and finally flows back to the third cavity 24. In the second heat exchange component 2, the liquid phase change material is boiled and vaporized for multiple times, so that the heat exchange capacity is improved greatly, and the heat transfer efficiency of the heat conduction component is improved.

A first heat conduction member 26 is disposed in the third cavity 24, one end of the first heat conduction member 26 is connected to the lower surface of the core 22, the other end of the first heat conduction member 26 is connected to the inner wall of the lower portion of the housing 21, a second heat conduction member 27 is disposed in the second cavity 23, one end of the second heat conduction member 27 is connected to the upper surface of the core 22, and the other end of the second heat conduction member 27 is connected to the inner wall of the upper portion of the housing 21. With this arrangement, the heat absorbed at the bottom of the housing 21 can be better conducted to the first heat conducting member 26, the core 22 and the second heat conducting member 27, and the gaseous phase-change material generated by the vaporization of the liquid phase-change material in the third cavity 24 can continuously and effectively heat the liquid phase-change material in the second cavity 23 through the sub-channel 25, thereby promoting the evaporation and heat absorption of the liquid phase-change material. Meanwhile, the arrangement of the plurality of first heat-conducting members 26 and the plurality of second heat-conducting members 27 increases the heat exchange area, and has a certain promotion effect on improving the vaporization heat absorption of the liquid phase-change material. In addition, the strength of the housing 21 is also increased by the arrangement of the plurality of first heat-conducting members 26 and the plurality of second heat-conducting members 27, and thermal deformation is avoided. The connecting channel formed in the core body 22 comprises a plurality of vertical sub-channels 25, so that the heat exchange area is increased, and the vaporization and heat absorption of the liquid phase-change material are promoted.

Casing 21, core 22, first heat conduction component 26 and second heat conduction component 27 integrated into one piece set up, and the heat conduction effect between casing 21, core 22, first heat conduction component 26 and the second heat conduction component 27 is better on the one hand, is favorable to thermal conduction, promotes the liquid phase change material evaporation heat absorption, and on the other hand has reduced the assembly process, the cost is reduced.

It will be understood by those skilled in the art that the first and second heat-conducting

members

26 and 27 are each a cylindrical structure, but one skilled in the art can adjust them as needed, for example, the first and/or second heat-conducting members are sheet-shaped, cone-shaped, etc. The first heat conducting member 26 is disposed in the third cavity 24, and the second heat conducting member 27 is disposed in the second cavity 23, which is a preferred embodiment, and those skilled in the art can make modifications as needed, such as disposing the first heat conducting member 26 only in the third cavity 24, disposing the second heat conducting member 27 only in the second cavity 23, or not disposing the first heat conducting member 26 and the second heat conducting member 27.

In addition, it is also a preferred embodiment that the connecting channel formed in the core 22 includes a plurality of vertical sub-channels 25, which can be adjusted as needed by those skilled in the art, for example, the connecting channel may be one sub-channel 25 formed in the core 22. In a possible embodiment, the connecting channel may not be disposed in the core 22, for example, the core 22 divides the inner cavity of the shell 21 into the second cavity 23 and the third cavity 24, and the second cavity 23 and the third cavity 24 are communicated with each other through a pipeline outside the shell 21.

Referring to fig. 6 to 10, fig. 6 is a diagram illustrating a state where a heat conducting device according to a second embodiment of the present invention is used for heat dissipation; fig. 7 is a plan view of a second heat exchanging element in a heat conducting device according to a second embodiment of the present invention; FIG. 8 is a cross-sectional view taken along the plane C-C in FIG. 7; fig. 9 is a front view of a second heat exchanging member in the heat conducting device according to the second embodiment of the present invention; fig. 10 is a sectional view taken along the plane D-D in fig. 9.

In the second embodiment, as shown in fig. 6 to 10, it is preferable that the connecting tube further includes a second connecting tube 4, and the first cavity (not shown) and the third cavity 24 are communicated through the second connecting tube 4. Specifically, in the second embodiment, the first heat exchange component 1 is a fin heat exchanger, and the inner space of the heat exchange tube of the fin heat exchanger forms a first cavity. One end of the heat exchange tube of the fin type heat exchanger is communicated with the second cavity 23 through the first connecting tube 3, and the other end of the heat exchange tube of the fin type heat exchanger is communicated with the third cavity 24 through the second connecting tube 4.

As shown in fig. 6, the first heat exchange member 1 is located higher than the second heat exchange member 2 for heat dissipation. The third cavity 24 of the sealed space stores liquid phase-change material, and the lower surface of the shell 21 is in contact with a heat source needing heat dissipation. The liquid phase change material in the third cavity 24 absorbs the heat of the heat source, the temperature rises to reach boiling point, the liquid phase change material is vaporized into the gaseous phase change material, the generated gaseous phase change material flows to the second cavity 23 through the plurality of sub-channels 25, and meanwhile, part of the liquid phase change material is mixed in the gaseous phase change material flowing to the second cavity 23 through the plurality of sub-channels 25. At the moment when the flow from the plurality of sub-passages 25 flows to the second cavity 23, the gas pressure is reduced due to the sudden increase of the flow cross-sectional area, the boiling point of the liquid phase-change material is reduced, and a part of the liquid phase-change material included in the gaseous phase-change material is changed into superheated liquid, and then the superheated liquid is rapidly boiled and evaporated to be changed into the gaseous phase-change material. Gaseous phase-change material in the second cavity 23 flows to the first cavity 11 through the first connecting pipe 3, and the gaseous phase-change material is changed into liquid phase-change material through heat dissipation in the first cavity 11, flows into the second cavity 23 through the second connecting pipe 4 under the action of gravity, and finally flows back to the third cavity 24. The liquid phase-change material in the third cavity 24 absorbs heat to be vaporized and enters the second cavity 23 and then enters the first cavity 11 along the first connecting pipe 3, the gaseous phase-change material is liquefied and changed into the liquid phase-change material after being dissipated in the first cavity 11, and flows back to the third cavity 24 through the second connecting pipe 4 under the action of gravity, so that the flow paths of the gaseous phase-change material and the liquid phase-change material are separated, the resistance generated by the reverse flow of the gaseous phase-change material and the liquid phase-change material is eliminated, the phase-change material flows circularly, the flow speed is accelerated, and the heat conduction efficiency is greatly improved. In addition, the phase-change material changes in the heat absorption/release process, pressure difference is generated between the first heat exchange component and the second heat exchange component, the phase-change material is enabled to circularly flow in the circulating pipeline between the first heat exchange component and the second heat exchange component, heat conduction is continuously carried out, power components such as a circulating pump and the like do not need to be arranged in the circulating pipeline to drive the phase-change material to circularly flow, and the manufacturing cost of the heat conduction device is reduced.

It will be understood by those skilled in the art that the first heat exchange component 1 is a finned heat exchanger, and those skilled in the art can adjust it as required, for example, the first heat exchange component 1 may be a heat exchange device having a cavity inside a housing, and two interfaces communicating with the cavity on the housing.

Referring to fig. 11, fig. 11 is a state diagram of a heat conduction device for "cold conduction" according to a second embodiment of the present invention. As shown in fig. 11, when the heat conduction device is used for "cold conduction", the upper portion of the second heat exchange member 2 is in contact with the cold source (e.g., semiconductor chilling plate), and the first heat exchange member 1 is located lower than the second heat exchange member 2. Gaseous phase change material in the third cavity 24 exchanges heat with the cold source of outside, and gaseous phase change material's temperature reduces the liquefaction and becomes liquid phase change material and gets into the second cavity 23 through a plurality of subchannels 25 under the effect of gravity, and gaseous phase change material temperature reduction liquefaction in the second cavity 23 becomes liquid phase change material, and liquid phase change material in the second cavity 23 flows into first cavity 11 through first connecting pipe 3 under the effect of gravity. The gaseous phase-change material in the third cavity 24 and the second cavity 23 is liquefied to become the liquid phase-change material, the gaseous phase-change material is reduced, the pressure in the third cavity 24 and the second cavity 23 is reduced, a pressure difference is formed between the first cavity 11 and the third cavity 24, and the gaseous phase-change material in the first cavity 11 flows to the third cavity 24 and the second cavity 23 through the second connecting pipe 4. As the gaseous phase-change material in the first cavity 11 decreases, the pressure in the first cavity 11 decreases, the boiling point of the liquid phase-change material in the first cavity 11 decreases, and the liquid phase-change material flowing back into the first cavity 11 absorbs heat from the outside to vaporize into the gaseous phase-change material. Therefore, the heat is rapidly conducted, the heat in the space where the first heat exchange component 1 is located is conducted to the cold source contacted with the second heat exchange component 2, the temperature of the space where the first heat exchange component 1 is located is reduced, the cold energy generated by the cold source is conducted to the space where the first heat exchange component 1 is located, and cold conduction is achieved.

Through such mode, transmit the cold source of second heat transfer part contact with the heat in first heat transfer part place, make the temperature in first heat transfer part place space reduce, realized "leading cold" of cold source. The second heat exchange component is internally provided with the second cavity and the third cavity, so that the heat exchange area is increased, and the cold conduction efficiency is improved. The second heat exchange component is internally provided with the second cavity and the third cavity, so that the heat exchange area is increased, and the cold conduction efficiency is improved. The plurality of sub-channels 25 in the core body 22 also increase the heat exchange area and improve the cold conduction efficiency. It will be appreciated by those skilled in the art that in the first embodiment, the heat conduction means may also be used to "conduct cold" from the cold source.

Referring to fig. 12, fig. 12 is a partial sectional view of a second heat exchanging member in a heat conducting device according to a third embodiment of the present invention. As shown in fig. 12, unlike the first and second embodiments, it is preferable that each sub-passage 25 in the core 22 includes three cylindrical segment passages, and the cross-sectional areas of the cylindrical segment passages increase sequentially in the direction from the third cavity 24 to the second cavity 23. With this arrangement, when the heat transfer device is used for heat dissipation, the liquid phase change material in the third cavity 24 absorbs heat to become a gaseous phase change material and flows to the second cavity 23 through the sub-channel 25. Gaseous phase-change material is mingled with partial liquid phase-change material, and in the process of circulation in the sub-channel 25, the cross section areas of the three cylindrical section channels are sequentially increased, the air pressure is reduced for multiple times, and the boiling point of the phase-change material is reduced for multiple times. The liquid phase-change material mixed in the gaseous phase-change material is changed into the superheated liquid for many times and is boiled violently, so that the liquid phase-change material can absorb heat and vaporize more fully, and the heat conduction efficiency is further improved.

It will be understood by those skilled in the art that the inclusion of three cylindrical segment passages per sub-passage 25 is only one specific embodiment and may be modified as desired by those skilled in the art, such as two cylindrical segment passages per sub-passage 25, four cylindrical segment passages, five cylindrical segment passages, etc. In another possible embodiment, each sub-passage 25 may be a communication passage with a gradually increasing cross-sectional area from the third cavity 24 to the second cavity 23, such as a tapered passage.

So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.

Claims

1. A heat conducting device, comprising:

the first heat exchange component is internally provided with a first cavity;

the second heat exchange component is internally provided with a second cavity and a third cavity which are communicated through a connecting channel;

the connecting pipe comprises a first connecting pipe, and the second cavity and the first cavity are communicated through the first connecting pipe;

the first cavity, the second cavity, the third cavity, the connecting channel and the connecting pipe form a closed space, and a gas-liquid phase change material is filled in the closed space.

2. The heat conducting apparatus according to claim 1, wherein the second heat exchanging member includes a shell and a core provided in the shell, the core dividing an inner space of the shell into the first cavity and the second cavity, the connecting passage being formed on the core.

3. A heat transfer device according to claim 2, wherein the connecting channel comprises a plurality of vertical sub-channels, a first end of each sub-channel being in communication with the second cavity and a second end of each sub-channel being in communication with the third cavity.

4. A heat transfer device according to claim 3, wherein the cross-sectional area of each of the sub-channels remains constant in a direction from the second end to the first end.

5. A heat transfer device according to claim 3, wherein the cross-sectional area of each of the sub-channels increases in a direction from the second end to the first end.

6. A heat transfer device according to claim 5, wherein each of the sub-channels comprises a plurality of cylindrical sections of increasing cross-sectional area distributed sequentially from the second end to the first end.

7. The heat conducting device according to claim 3, wherein a plurality of first heat conducting members are provided in the third cavity, one end of the first heat conducting member is connected to the core, and the other end of the first heat conducting member is connected to the inner wall of the housing.

8. The heat transfer device of claim 7, wherein a plurality of second heat conductive members are disposed in the second cavity, one end of the second heat conductive members is connected to the core, and the other end of the second heat conductive members is connected to an inner wall of the housing.

9. The heat conducting device according to any one of claims 1 to 8, wherein the connecting pipe includes a second connecting pipe, and the third cavity and the first cavity communicate through the second connecting pipe.

10. The heat conducting device according to claim 8, wherein the core, the first heat conducting member, the second heat conducting member, and the housing are integrally molded.