CN110815609A - Splitting device and method - Google Patents
Splitting device and method Download PDFInfo
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- CN110815609A CN110815609A CN201810920343.8A CN201810920343A CN110815609A CN 110815609 A CN110815609 A CN 110815609A CN 201810920343 A CN201810920343 A CN 201810920343A CN 110815609 A CN110815609 A CN 110815609A
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 89
- 238000005520 cutting process Methods 0.000 claims abstract description 76
- 230000008093 supporting effect Effects 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims description 55
- 230000003139 buffering effect Effects 0.000 claims description 9
- 206010041662 Splinter Diseases 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 15
- 230000006378 damage Effects 0.000 description 11
- 208000027418 Wounds and injury Diseases 0.000 description 6
- 208000014674 injury Diseases 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
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- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention provides a lobe of a leaf device, apply to the technical field of the wafer cutting, the lobe of a leaf device includes at least: a base plate; the first support frame is arranged on the bottom plate; the second support frame is arranged on the bottom plate, wherein the first support frame and the second support frame are used for supporting at least one substrate; a pressure device for applying pressure to the at least one substrate; the cutting device is arranged on the bottom plate, is positioned between the first support frame and the second support frame, is used for cutting the at least one substrate, and is arranged below the pressure device; when the pressure device applies pressure to the substrate, the pressure device applies pressure to two sides of a cutting line on the substrate. And, providing a method of cleaving.
Description
Technical Field
The invention relates to the technical field of wafer splitting, in particular to a splitting device and a splitting method.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions.
The smallest unit of the wafer is called a die (die), and in order to ensure the effectiveness of the circuit elements processed by the wafer, the die is subjected to failure analysis to ensure that the die is not in a failure state, and the fault diagnosis of an effective product provides necessary information. One of the common analysis methods for failure analysis is cross-sectional analysis, and the first action of cross-sectional analysis is wafer breaking, i.e. obtaining the cross-section of the wafer to be analyzed.
The problem that the splinter process in the prior art is easy to generate is that the splinter needs to be broken manually, so that the requirement on the finger strength of personnel is particularly high, and the chip is damaged if the operation is improper; in addition, when the manual operation of personnel is improper, the hands are scratched by the needle points or the edges of the slices, and debris splashes into the faces of the personnel to cause injury.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention provides a splinter device and method for solving the problems of chip damage caused by improper manual operation of some existing splinter tools and personal injury of operators caused by splinter tools and splinter debris.
To achieve the above and other related objects, the present invention provides a splitting apparatus, which at least comprises:
a base plate;
the first support frame is arranged on the bottom plate;
the second support frame is arranged on the bottom plate, wherein the first support frame and the second support frame are used for supporting at least one substrate;
a pressure device for applying pressure to the at least one substrate;
the cutting device is arranged on the bottom plate, is positioned between the first support frame and the second support frame, is used for cutting the at least one substrate, and is arranged below the pressure device;
when the pressure device applies pressure to the at least one substrate, the pressure device applies pressure to two sides of a cutting line on the substrate.
In one embodiment of the present invention, the pressure device includes: the elastic telescopic rod, the first connecting rod, the second connecting rod, the first extending part and the second extending part; the first end of the elastic telescopic rod is connected with the bottom plate, the second end of the elastic telescopic rod is connected with the first end of the first connecting rod, the second end of the first connecting rod is connected with the middle part of the second connecting rod, the first end of the second connecting rod is connected with the first end of the first extending part, the second end of the second connecting rod is connected with the first end of the second extending part, and the second end of the first extending part and the second end of the second extending part extend to the bottom plate.
In an embodiment of the present invention, a first end of the first support frame and a first end of the second support frame are both connected to the bottom plate, a second end of the first support frame extends toward the first extension portion, a second end of the second support frame extends toward the second extension portion, and when the pressure device is not under a stress, the first extension portion is located above the first support frame, and the second extension portion is located above the second support frame.
In one embodiment of the present invention, the bottom of the cutting device is fixedly connected to the bottom plate, and the cutting end of the cutting device extends toward the middle of the second connecting rod.
In an embodiment of the present invention, the first support frame and the second support frame are all telescopic structures with the same structure, and the height of the cutting device is greater than a minimum compressed height, where the minimum compressed height is a minimum shortened height of the first support frame and the second support frame.
In one embodiment of the present invention, the first support frame includes: the first fixed sleeve, the first elastic part and the first movable rod are arranged on the first fixed sleeve; the first end of the first fixed sleeve is connected to the bottom plate, the second end of the first fixed sleeve is connected with the first end of the first elastic component, the second end of the first elastic component is connected with the first end of the first movable rod, and the second end of the first movable rod extends towards the first extension part; the second support frame includes: the second fixed sleeve, the second elastic part and the second movable rod are arranged on the second fixed sleeve; the first end of the second fixed sleeve is connected to the bottom plate, the second end of the second fixed sleeve is connected to the first end of the second elastic component, the second end of the second elastic component is connected to the first end of the second movable rod, and the second end of the second movable rod extends towards the second extending portion.
In one embodiment of the present invention, a first pressure buffer component is disposed at a second end of the first movable rod, and the first buffer component and the first movable rod form a T-shaped structure; and a second pressure buffering part is arranged at the second end of the second movable rod, and the second pressure buffering part and the second movable rod form a T-shaped structure. In one embodiment of the present invention, the elastic telescopic rod comprises: a third fixed sleeve, a third elastic component and a third movable rod; the first end of the third fixed sleeve is connected to the bottom plate, the second end of the third fixed sleeve is connected to the first end of the third elastic component, the second end of the third elastic component is connected to the first end of the third movable rod, and the second end of the third movable rod is connected to the first end of the first connecting rod.
In one embodiment of the present invention, the second connecting rod includes: a first telescoping mechanism and a second telescoping mechanism; the first end of the first telescopic mechanism and the first end of the second telescopic mechanism are both connected with the second end of the first connecting rod, the second end of the first telescopic mechanism is connected with the first end of the first extending part, and the second end of the second telescopic mechanism is connected with the first end of the second extending part.
In an embodiment of the present invention, each of the first and second telescoping mechanisms includes at least two telescoping rods.
In an embodiment of the present invention, the cross section of the first telescoping mechanism includes a circle, a rectangle, and a regular polygon, the cross section of the second telescoping mechanism includes a circle, a rectangle, and a regular polygon, and the center line of the first telescoping mechanism and the center line of the second telescoping mechanism are on the same straight line.
In one embodiment of the present invention, the diameter of the first telescopic mechanism with a circular cross section decreases or increases from the second end of the first connecting rod to the first extending portion; the diameter of the second telescopic mechanism with a circular cross section is sequentially reduced or sequentially increased from the second end of the first connecting rod to the second extension part.
In an embodiment of the present invention, the first extension portion and the second extension portion are both of an inverted T-shaped structure.
In an embodiment of the present invention, a center of the first extending portion and a center of the second extending portion form a first straight line, a center of the first support frame and a center of the second support frame form a second straight line, and a plane formed by the first straight line and the second straight line is perpendicular to a plane on which the bottom plate is located.
In addition, the embodiment of the invention also provides a splitting method, which comprises the following steps:
placing a substrate on a first support frame and a second support frame of a splitting device, wherein a cutting device in the splitting device is positioned between the first support frame and the second support frame;
positioning the substrate, and aligning a cutting line on the substrate above a blade of the cutting device so that the cutting line on the substrate is positioned between the first support frame and the second support frame;
and pressing a pressure device in the splitting device so that the pressure applied by the pressure device is balanced on two sides of the cutting line of the substrate.
As described above, the lobe of a leaf device and method of the present invention has the following beneficial effects: after the substrate is placed on the first support frame and the second support frame, the pressure device is pressed to enable the pressure device to cut the substrate downwards, so that the substrate is in contact with the cutting device and is stressed and disconnected. Therefore, the problems that chips are damaged when manual operation of some splitting tools in the prior art is improper, and personal injury of operators is caused by the splitting tools and the splitting debris are solved.
Drawings
FIG. 1 is a schematic view of a first embodiment of the breaking apparatus of the present invention;
FIG. 2 is a schematic view of the structure of the substrate of the present invention
FIG. 3 is a schematic view of a second embodiment of the breaking apparatus of the present invention;
FIG. 4 is a schematic view of a third structure of the breaking device of the present invention;
FIG. 5 is a schematic view of a fourth embodiment of the breaking device of the present invention;
FIG. 6 is a schematic view of a fifth embodiment of the breaking apparatus of the present invention;
FIG. 7 is a schematic view of a sixth embodiment of the breaking apparatus of the present invention;
FIG. 8 is a schematic structural view of a telescopic mechanism according to the present invention;
FIG. 9 is a schematic view showing a state of use of the telescopic mechanism according to the present invention;
FIG. 10 is a schematic flow chart of the breaking method of the present invention.
Description of the element reference numerals
1 base plate
2 first support frame
3 second support frame
4 pressure device
5 cutting device
6 base plate
7-edge blade
21 first fixing sleeve
22 first elastic member
23 first movable bar
31 second fixing sleeve
32 second elastic member
33 second Movable rod
41 elastic telescopic rod
42 first connecting rod
43 second connecting rod
44 first extension
45 second extension part
411 third fixing sleeve
412 third elastic member
413 third Movable rod
431 first telescopic mechanism
432 second telescoping mechanism
4311A first telescopic rod
4321 second telescopic rod
4331A third telescopic rod
4341A fourth telescopic rod
4351 fifth Telescopic rod
4361 sixth expansion link
4371 seventh telescopic rod
4381 eighth Telescopic rod
S101-S103
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Please refer to fig. 1 to 10. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the practical limit conditions of the present invention, so that the present invention has no technical significance, and any structural modification, ratio relationship change or size adjustment should fall within the scope of the technical content of the present invention without affecting the function and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.
Referring to fig. 1, the present invention provides a splitting apparatus, which at least comprises:
the bottom plate (1) is provided with a plurality of grooves,
the first support frame 2 is arranged on the bottom plate 1;
the second support frame 3 is arranged on the bottom plate 1, wherein the first support frame 2 and the second support frame 3 are used for supporting at least one substrate;
a pressure device 4 for applying pressure to at least one substrate;
the cutting device 5 is arranged on the bottom plate 1, is positioned between the first support frame 2 and the second support frame 3, is used for cutting at least one substrate, and is arranged below the pressure device 4;
wherein, when the pressure device 4 applies pressure to the substrate, the pressure device 4 applies pressure to two sides of a cutting line on the substrate.
It should be noted that, a rectangular region is roughly split around a position to be analyzed in a wafer as a center, and then a high-power laser microscope is used to perform fixed-point local damage on a region around a target position to obtain a substrate 6.
It should be noted that fig. 1 is a side view of the lobe device, and the bottom plate 1 is a bottom fixing plate of the lobe device, and is used for placing the lobe device stably when in use, for example, on a horizontal ground or other placing table. And two support frames, namely a first support frame 2 and a second support frame 3, are arranged on the bottom plate 1 and are used for assisting the cutting device 5 in supporting and stably placing the substrate 6.
In addition, in the embodiment of the present invention, the number of the supporting frames included in the first supporting frame 2 and the second supporting frame 3 may be multiple, and the distances between the supporting frames may be unequal, so that substrates with different sizes may be placed on the supporting frames.
The specific operation process is as follows: the substrate 6 is placed on the second ends of the first support frame 2 and the second support frame 3, the pressure device 4 is pressed to cut the substrate 6 downwards, so that the substrate 6 is in contact with the cutting device 5 and is broken under stress, and the substrate 6 does not need to be manually split by a person in the splitting process due to the supporting effect of the first support frame 2 and the second support frame 3 and the contact of the pressure device 4 and the cutting device 5. Therefore, the problems that chips are damaged when manual operation of some splitting tools in the prior art is improper, and personal injury of operators is caused by the splitting tools and the splitting debris are solved.
In addition, an embodiment of the present invention provides an implementation manner of the pressure device 4, as shown in fig. 1, fig. 3 to fig. 6, and the specific structure includes: an elastic expansion link 41, a first connecting rod 42, a second connecting rod 43, a first extending part 44 and a second extending part 45; the first end of the elastic telescopic rod 41 is connected to the bottom plate 1, the second end of the elastic telescopic rod 41 is connected to the first end of the first connecting rod 42, the second end of the first connecting rod 42 is connected to the middle of the second connecting rod 43, the first end of the second connecting rod 43 is connected to the first end of the first extending portion 44, the second end of the second connecting rod 43 is connected to the first end of the second extending portion 45, and the second end of the first extending portion 44 and the second end of the second extending portion 45 both extend towards the bottom plate 1.
It should be noted that, as shown in fig. 3, the pressure device 4 can slide up and down through the arrangement of the elastic telescopic rod 41, for example, when the elastic telescopic rod 41 is pressed down by a force, the first connecting rod 42 and the second connecting rod 43 are driven to move down, so that the first extending portion 44 and the second extending portion 45 on the second connecting rod 43 move down. It will be appreciated that in order to facilitate the application of pressure to the base plate 6, the bottom planes of the first and second extensions 44, 45 are horizontal and the center of gravity thereof is vertically downward. The first and second extending portions 44 and 45 press the base plate 6 during the downward movement. It can be understood that, when the pressure device 4 is pressed down, the pressure device 4 is firstly attached to the upper surface of the substrate 6, the lower surface of the substrate 6 is contacted with the cutting device 5, and the cutting device 5 is driven to be passively stressed, so as to cut the substrate 6.
In one implementation, the first end of the first support frame 2 and the first end of the second support frame 3 are both connected to the base plate 1, the second end of the first support frame 2 extends to the first extension portion 44, the second end of the second support frame 3 extends to the second extension portion 45, and under the condition that the pressure device 4 is not stressed, the first extension portion 44 is located above the first support frame 2, and the second extension portion 45 is located above the second support frame 3; the bottom of the cutting device 5 is fixedly connected to the base plate 1, and the cutting end of the cutting device 5 extends towards the middle of the second connecting rod 43.
It can be understood that as shown in fig. 1 and 3, the cutting end of the cutting device 5 is a blade 7, and the blade 7 makes contact with the lower surface of the substrate 6, so that the height of the blade 7 on the cutting device is greater than the height of the first support frame 2 and the second support frame 3 on both sides of the blade, otherwise the substrate 6 cannot be pressed downwards by force to realize cutting.
In a traditional working mode, pressure is directly applied to the edge-type blade, and the substrate is cut by the edge-type blade to realize splitting, so that the problem that the substrate is suddenly stressed too much to cause damage to a wafer is caused. Therefore, the embodiment of the invention can avoid the pressure from being directly applied to the edge-type blade, so the embodiment of the invention carries out problem processing based on different technical schemes, and the obtained processing results are different.
In addition, as will be understood by those skilled in the art, the edge-type blade 7 of the cutting device 5 coincides with the line to be cut of the substrate 6, and when the edge-type blade 7 of the cutting device 5 is long enough, a plurality of substrates can be cut simultaneously, which serves the purpose of improving the efficiency of cutting the substrates. Further, the number of the first extension portion 44 and the second extension portion 45 may be plural, for performing simultaneous pressure cutting on different numbers of base plates placed on the first support frame 2 and the second support frame 3.
By applying the embodiment of the invention, the specific operation process is summarized as follows: the cut line of the substrate 6 is aligned with the tip of the blade under a magnifying glass and placed on the first support 2 and the second support 3 as shown in fig. 6. The first support frame 2 and the second support frame 3 are symmetrical to two sides of the blade 7 and can be positioned at the inner side of the first extension part 44 and the second extension part 45 of the pressure device 4. At this time, the pressure device 4 is in a raised state, and the substrate 6 can be conveniently placed. After the base plate 6 is placed, pressure is applied to the pressure device 4, and the first extension part 44 and the second extension part 45 of the pressure device 4, which are in contact with the base plate 6, are symmetrical to both sides of the blade-shaped blade 7 of the cutting device 5, as shown in fig. 6. And applying force to the pressure device 4, splitting the substrate 6 along the cutting line, lifting the pressure device 4, taking out the split substrate by using tweezers, and finishing the splitting process of the area 1 and the area 2.
According to the invention, the blade-shaped blade is vertical to the cutting target by pressing the pressure device to move downwards without contacting the substrate by people, so that the consistency of the splitting direction can be ensured, the blade-shaped blade is conveniently and quickly split to the target position of a large area, and the effects of saving time and labor and preventing the blade from being injured by chips in the splitting process are achieved.
In an implementation manner of the present invention, the first support frame 2 and the second support frame 3 are both telescopic structures with the same structure, and the height of the cutting device 5 is greater than the lowest compressed height, where the lowest compressed height is the lowest shortened height of the first support frame 2 and the second support frame 3. It should be noted that the minimum height after shortening is the minimum height reached by the first support frame 2 and the second support frame 3 after compressing, so as to ensure that the substrate 6 on the upper portion of the cutting device 5 becomes the point of force in the process of pressing downward by the pressure device 4, so that the substrate is broken along the knife-edge 7 of the cutting device 5 after being stressed.
Therefore, in the embodiment of the invention, the pressure device 4 is firstly used for pressing the substrate 6, so as to drive the first support frame 2 and the second support frame 3 to be pressed downwards under stress, in the pressing process, the first support frame 2 and the second support frame 3 are elastically pressed downwards, and when the height between the first support frame 2 and the second support frame 3 and the substrate 6 is smaller than the height between the cutting device 5 and the substrate 6, the contact part between the substrate 6 and the cutting device 5 is stressed and broken, so that the split sheet of the substrate 6 is formed.
It can be understood that, in the process of the first support frame 2 and the second support frame 3 being stressed and elastically pressing down, the pressure applied on the substrate 6 can be further relieved, the pressure buffering effect is achieved, and the pressure damage caused by the substrate 6 in the pressing down process can be reduced.
The embodiment of the present invention provides a simple and reliable telescopic structure of the first supporting frame 2 and the second supporting frame 3, as shown in fig. 3 and fig. 5: the first support frame 2 includes: a first fixed sleeve 21, a first elastic part 22, a first movable rod 23; a first end of the first fixed sleeve 21 is connected to the base plate 1, a second end of the first fixed sleeve 21 is connected to a first end of the first elastic member 22, a second end of the first elastic member 22 is connected to a first end of the first movable rod 23, and a second end of the first movable rod 23 extends towards the first extending portion 44; the second support frame 3 includes: a second fixed sleeve 31, a second elastic member 32, a second movable rod 33; a first end of the second fixing sleeve 31 is connected to the bottom plate 1, a second end of the second fixing sleeve 31 is connected to a first end of the second elastic member 32, a second end of the second elastic member 32 is connected to a first end of the second movable rod 33, and a second end of the second movable rod 33 extends toward the second extending portion 45.
In another embodiment of the present invention, as shown in fig. 7, the pressure device 4 can span the upper portion of the cutting device 5, and the first connecting rod 42 and the second connecting rod 43 form a cross structure, so as to further improve the force application stability of the pressure structure.
Specifically, in the embodiment of the present invention, the first elastic component 22 and the second elastic component 32 are springs, and taking the first support frame 2 as an example, the springs are disposed inside the first fixed sleeve 21, and one end of each spring is connected inside the first fixed sleeve 21, and the other end of each spring is connected to one end of the first movable rod 23, when the other end of the first movable rod 23 receives pressure and presses down, the pressure is transmitted along the springs to compress, so as to implement a compression process of the first support frame 2; when the pressure is removed, the length of the first support frame 2 returns to the original length due to the elastic restoring ability of the spring.
With the embodiment of the present invention, as shown in fig. 5, the second end of the first movable rod 23 is provided with a first pressure buffer member 24, and the second end of the second movable rod 33 is provided with a second pressure buffer member 34, so as to perform a pressure buffering function. The problem that the substrate 6 is damaged due to contact and friction with the second end of the first movable bar 23 and the second end of the second movable bar 33 during the process that the substrate 6 is pressed by the elastic pressure is avoided. In a specific implementation of the present invention, the first pressure buffering component 24 and the second pressure buffering component 34 are components with a pressure buffering function, such as a sponge head, a cushion pad, or a rubber pad, and the embodiments of the present invention are not limited in this respect.
On the other hand, in order to increase the cushioning effect of the first cushioning member 24 and the second cushioning member 34, the first cushioning member 24 and the first movable rod 23 form a T-shaped structure, and the second cushioning member 34 and the second movable rod 33 form a T-shaped structure, so that the area of the cushioning member is increased to further increase the cushioning area of the base plate 6, the first support frame 2, and the second support frame 3, thereby enhancing the cushioning effect.
As shown in fig. 3, an embodiment of the present invention provides a specific implementation structure of an elastic telescopic rod 41, including: a third fixed sleeve 411, a third elastic member 412, a third movable rod 413; a first end of the third fixed sleeve 411 is connected to the bottom plate 1, a second end of the third fixed sleeve 411 is connected to a first end of the third elastic member 412, a second end of the third elastic member 412 is connected to a first end of the third movable rod 413, and a second end of the third movable rod 413 is connected to a first end of the first connecting rod 42. The sliding mode of the elastic telescopic rod 41 is convenient to operate, simple to implement, low in cost and convenient to apply in actual production, the specific structural principle of the embodiment of the invention is the same as that of the first support frame 2 and the second support frame 3, and the embodiment of the invention is not aligned and is not repeated.
In order to enhance the adaptability of the splitting apparatus of the embodiment of the present invention and enable the splitting apparatus to perform splitting operations with different sizes, in the embodiment of the present invention, the lengths of the two ends of the second connecting rod 43 are adjustably set, and further, the distance between the first extending portion 44 and the second extending portion 45 is adjusted, so that the substrate 6 with different sizes is applied, and the distance between the first extending portion 44 and the second extending portion 45 is adjusted according to the size of the substrate 6, and further, the pressure application process is performed on the substrate 6.
Specifically, the second connecting rod 43 includes: a first telescoping mechanism 431 and a second telescoping mechanism 432; the first end of the first telescopic mechanism 431 and the first end of the second telescopic mechanism 432 are both connected with the second end of the first connecting rod 42, the second end of the first telescopic mechanism 431 is connected with the first end of the first extending part 44, and the second end of the second telescopic mechanism 432 is connected with the first end of the second extending part 45.
In addition, in a specific implementation manner, the first telescopic mechanism 431 and the second telescopic mechanism 432 each include at least two telescopic rods that are sleeved with each other. The length of each telescopic rod can be freely set so as to achieve the purpose of different extension lengths.
In a specific implementation manner, the cross section of the first telescopic mechanism 431 includes a circle, a rectangle and a regular polygon, the cross section of the second telescopic mechanism 432 includes a circle, a rectangle and a regular polygon, and the central line of the first telescopic mechanism 431 and the central line of the second telescopic mechanism 432 are on the same straight line, and the telescopic mechanism is convenient to extend and retract through the arrangement of the central lines on the same straight line.
In a specific implementation structure, the diameter of the first telescopic mechanism 431 with a circular cross section decreases or increases from the second end of the first connecting rod 42 to the first extending portion 44; the diameter of the second telescopic mechanism 432 with a circular cross section decreases or increases from the second end of the first connecting rod 42 to the second extending portion 45. In this way, the first telescopic structure 431 and the second telescopic structure 432 are adjusted in length along two opposite directions, so as to achieve the purpose of extending or shortening the length along the second end of the first telescopic structure 431 to both ends in an equal manner.
Illustratively, as shown in fig. 8 and 9, the first telescopic mechanism 431 includes: the first telescopic rod 4311, the second telescopic rod 4321, the third telescopic rod 4331 and the fourth telescopic rod 4341, and the second telescopic mechanism 432 comprises a fifth telescopic rod 4351, a sixth telescopic rod 4361, a seventh telescopic rod 4371 and an eighth telescopic rod 4381, the diameters of which are sequentially reduced from the second end of the first connecting rod 42 to the two ends of the second connecting rod 43, and the lengths of the corresponding connecting rods are the same. For example, the first telescopic rod 4311 and the fifth telescopic rod 4351 are corresponding telescopic rods and have the same size, the second telescopic rod 4321 and the sixth telescopic rod 4361 are corresponding telescopic rods and have the same size, the third telescopic rod 4331 and the seventh telescopic rod 4371 are corresponding telescopic rods and have the same size, and the fourth telescopic rod 4341 and the eighth telescopic rod 4381 are corresponding telescopic rods and have the same size.
The embodiment of the invention aims to adjust any telescopic rod of the first telescopic mechanism 431 when the length of the telescopic rod needs to be extended, and the corresponding telescopic rod of the second telescopic mechanism 432 needs to be extended, so that the lengths of the first telescopic mechanism 431 and the second telescopic mechanism 432 are the same, and further the central line of the blade-shaped blade 7 of the cutting device 5 is symmetrical, and the uniformity of stress is kept.
For shortening, as shown in fig. 9, the third telescopic rod 4331 is shortened into the second telescopic rod 4321, and similarly, the seventh telescopic rod 4371 is shortened into the sixth telescopic rod 4361, and the total length of the first telescopic mechanism 431 and the second telescopic mechanism 432 is the same. Thus, the embodiments of fig. 8 and 9 are combined for the purpose of accommodating substrates of different sizes.
In addition, it should be noted that the number of the telescopic rods in fig. 8 and 9 is only exemplary, and is not limited to the specific limitations of the present invention, specifically, the number of the telescopic rods in the first telescopic mechanism and the second telescopic mechanism may be 2, 3, 4, 5, 6, 10, and the like, and the embodiment of the present invention is not limited to the specific limitations herein.
In order to further increase the force application effect of the first extending portion 44 and the second extending portion 45 on the substrate 6 and avoid the occurrence of an accident that the substrate 6 is damaged due to unbalanced cutting force caused by unbalanced local force application of the substrate 6, the first extending portion 44 and the second extending portion 45 are both arranged in an inverted T-shaped structure in the embodiment of the present invention. The contact area between the lower part of the inverted T-shaped structure and the substrate 6 is increased, and the stress balance is enhanced.
It can be understood that, as can be seen from the above embodiments, the bottom planes of the first extending portion 44 and the second extending portion 45 are on the same horizontal plane, so as to achieve the purpose of applying pressure to the substrate 6 simultaneously, and avoid the problem of unbalanced stress. From the physical point of view, it can be seen that only when the centers of the first extension portion 44 and the second extension portion 45 form a first straight line, the pressure applied by the bottom plane where the first extension portion 44 and the second extension portion 45 are located will be not only uniform but also at the same time. And in the same way, for the reason that the stress of the center of the first support frame 2 and the stress of the center of the second support frame 3 are from the base plate 6 at the same time, in order to ensure that the lengths of the center of the first support frame 2 and the center of the second support frame 3 compressed by the stress are changed synchronously, in the embodiment of the invention, the center of the first support frame 2 and the center of the second support frame 3 form a second straight line, and the plane formed by the first straight line and the second straight line is vertical to the plane of the base plate 1.
In summary, the lobe of a leaf device of the present invention has the following beneficial effects: the substrate is placed on the first support frame and the second support frame, the pressure device is pressed to enable the pressure device to cut the substrate downwards, the substrate is in contact with the cutting device and is disconnected under stress, and due to the supporting effect of the first support frame and the second support frame and the contact between the pressure device and the cutting device, the substrate is not required to be manually split by a worker in the splitting process. Therefore, the problems that chips are damaged when manual operation of some splitting tools in the prior art is improper, and personal injury of operators is caused by the splitting tools and the splitting debris are solved. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
In addition, as shown in fig. 10, an embodiment of the present invention further provides a splitting method, including the steps of:
s101, placing the substrate on a first support frame and a second support frame of a splitting device, wherein a cutting device in the splitting device is located between the first support frame and the second support frame.
S102, positioning the substrate, and aligning the cutting line on the substrate above the blade-shaped blade of the cutting device so that the cutting line on the substrate is positioned between the first support frame and the second support frame.
S103, pressing a pressure device in the splitting device to enable the pressure applied by the pressure device to be evenly positioned on two sides of the cutting line of the substrate.
The specific operation process is as follows: the base plate is arranged on the first support frame and the second support frame, the pressure device is pressed to enable the base plate to be cut downwards, the base plate is enabled to be in contact with the cutting device and to be broken under stress, and due to the supporting effect of the first support frame and the second support frame and the contact of the pressure device and the cutting device, the splitting process of the base plate does not need manual splitting operation of personnel. Therefore, the problems that chips are damaged when manual operation of some splitting tools in the prior art is improper, and personal injury of operators is caused by the splitting tools and the splitting debris are solved.
In order to further improve the cutting accuracy, the substrate is positioned, and the cutting line on the substrate can be positioned above the blade-shaped blade of the cutting device. When the pressure device applies pressure, the two ends of the substrate are pressed downwards under stress, the cutting line is a laser damage position, and the cutting line can be quickly disconnected through the interaction force of the cutting edge type blade of the cutting device, and the substrate cannot be damaged.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (15)
1. A lobe of a leaf device, characterized in that, lobe of a leaf device includes at least:
a base plate;
the first support frame is arranged on the bottom plate;
the second support frame is arranged on the bottom plate, wherein the first support frame and the second support frame are used for supporting at least one substrate;
a pressure device for applying pressure to the at least one substrate;
the cutting device is arranged on the bottom plate, is positioned between the first support frame and the second support frame, is used for cutting the at least one substrate, and is arranged below the pressure device;
when the pressure device applies pressure to the at least one substrate, the pressure device applies pressure to two sides of a cutting line on the substrate.
2. The fracturing device of claim 1, wherein said pressure device comprises: the elastic telescopic rod, the first connecting rod, the second connecting rod, the first extending part and the second extending part; the first end of the elastic telescopic rod is connected with the bottom plate, the second end of the elastic telescopic rod is connected with the first end of the first connecting rod, the second end of the first connecting rod is connected with the middle part of the second connecting rod, the first end of the second connecting rod is connected with the first end of the first extending part, the second end of the second connecting rod is connected with the first end of the second extending part, and the second end of the first extending part and the second end of the second extending part extend to the bottom plate.
3. The lobe assembly of claim 2, wherein the first end of the first support bracket and the first end of the second support bracket are both connected to the base plate, the second end of the first support bracket extends toward the first extension, the second end of the second support bracket extends toward the second extension, and the first extension is located above the first support bracket and the second extension is located above the second support bracket when the pressure device is not under force.
4. The splitting apparatus of claim 2 or 3, wherein a bottom portion of the cutting apparatus is fixedly connected to the base plate, and a cutting end of the cutting apparatus extends toward a middle portion of the second connecting rod.
5. The splinter device of any of claims 1-3, wherein the first and second supports are all of the same telescopic construction and the cutting device has a height greater than a minimum compressed height, wherein the minimum compressed height is the minimum shortened height of the first and second supports.
6. The lobe of splitting device of claim 2 or 3, wherein the first support frame comprises: the first fixed sleeve, the first elastic part and the first movable rod are arranged on the first fixed sleeve;
the first end of the first fixed sleeve is connected to the bottom plate, the second end of the first fixed sleeve is connected with the first end of the first elastic component, the second end of the first elastic component is connected with the first end of the first movable rod, and the second end of the first movable rod extends towards the first extension part;
the second support frame includes: the second fixed sleeve, the second elastic part and the second movable rod are arranged on the second fixed sleeve;
the first end of the second fixed sleeve is connected to the bottom plate, the second end of the second fixed sleeve is connected to the first end of the second elastic component, the second end of the second elastic component is connected to the first end of the second movable rod, and the second end of the second movable rod extends towards the second extending portion.
7. The lobe splitting device of claim 6, wherein the second end of the first movable rod is provided with a first pressure buffer component, and the first buffer component and the first movable rod form a T-shaped structure; and a second pressure buffering part is arranged at the second end of the second movable rod, and the second pressure buffering part and the second movable rod form a T-shaped structure.
8. The splitting device of any one of claims 2-3, 7, wherein the elastic telescoping rod comprises: a third fixed sleeve, a third elastic component and a third movable rod;
the first end of the third fixed sleeve is connected to the bottom plate, the second end of the third fixed sleeve is connected to the first end of the third elastic component, the second end of the third elastic component is connected to the first end of the third movable rod, and the second end of the third movable rod is connected to the first end of the first connecting rod.
9. The lobe splitting device of claim 2, wherein the second connecting rod comprises: a first telescoping mechanism and a second telescoping mechanism;
the first end of the first telescopic mechanism and the first end of the second telescopic mechanism are both connected with the second end of the first connecting rod, the second end of the first telescopic mechanism is connected with the first end of the first extending part, and the second end of the second telescopic mechanism is connected with the first end of the second extending part.
10. The lobe apparatus of claim 9, wherein the first and second telescoping mechanisms each include at least two telescoping rods.
11. The breaking apparatus of claim 10, wherein the cross section of the first telescoping mechanism comprises a circle, a rectangle, a regular polygon, the cross section of the second telescoping mechanism comprises a circle, a rectangle, a regular polygon, and the center line of the first telescoping mechanism is aligned with the center line of the second telescoping mechanism.
12. The fracturing device of claim 11, wherein the first telescoping mechanism, which is circular in cross section, decreases in diameter or increases in diameter from the second end of the first connecting rod to the first extension; the diameter of the second telescopic mechanism with a circular cross section is sequentially reduced or sequentially increased from the second end of the first connecting rod to the second extension part.
13. The lobe apparatus of any one of claims 2-3, 7, 9-12, wherein the first extension and the second extension are both inverted T-shaped structures.
14. The splinter device of claim 2, wherein the center of the first extension and the center of the second extension form a first line, the center of the first support frame and the center of the second support frame form a second line, and the plane formed by the first line and the second line is perpendicular to the plane of the base plate.
15. A splitting method based on the splitting device of any one of claims 1 to 14, wherein the method comprises the following steps:
placing a substrate on a first support frame and a second support frame of a splitting device, wherein a cutting device in the splitting device is positioned between the first support frame and the second support frame;
positioning the substrate, and aligning a cutting line on the substrate above a blade of the cutting device so that the cutting line on the substrate is positioned between the first support frame and the second support frame;
and pressing a pressure device in the splitting device so that the pressure applied by the pressure device is balanced on two sides of the cutting line of the substrate.
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| CN201810920343.8A CN110815609B (en) | 2018-08-14 | 2018-08-14 | Splitting device and method |
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| CN201810920343.8A CN110815609B (en) | 2018-08-14 | 2018-08-14 | Splitting device and method |
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| CN112895183A (en) * | 2021-01-20 | 2021-06-04 | 中国科学院微电子研究所 | Lobe of a leaf device |
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| CN110815609B (en) | 2021-02-19 |
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