CN210199244U - Device for testing performance of semiconductor chip - Google Patents
Device for testing performance of semiconductor chip Download PDFInfo
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- CN210199244U CN210199244U CN201920797481.1U CN201920797481U CN210199244U CN 210199244 U CN210199244 U CN 210199244U CN 201920797481 U CN201920797481 U CN 201920797481U CN 210199244 U CN210199244 U CN 210199244U
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- probe
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Abstract
The utility model relates to a device for semiconductor chip capability test, comprising a base plate, adjusting part, probe subassembly and year dish, adjusting part and year dish set up the left and right sides on the bottom plate respectively, adjusting part includes quick adjustment frame, fine setting adjusting frame, arm and angle axle, probe subassembly includes spacing sleeve, adjusting sleeve and tungsten filament probe, spacing sleeve and angle axle detachable connection, be equipped with the blind hole on the spacing sleeve, adjusting sleeve suit is on the tungsten filament probe, adjusting sleeve inserts in the blind hole, the tungsten filament probe runs through spacing sleeve, the syringe needle of tungsten filament probe is located the below of spacing sleeve, in this device for semiconductor chip capability test, adopt soft tungsten filament as the probe, can carry out a large amount of times repeatability tests, the metal level of protection chip; the extending length and the extending distance of the two tungsten filament probes can be controlled at will, and the PAD test of a chip with the minimum size of 50um can be realized; the device realizes a quick test function, is simple to operate, and has low device cost and high operation efficiency.
Description
Technical Field
The utility model relates to the field of communication technology, in particular to a device for semiconductor chip capability test.
Background
With the rapid development of the optical communication industry, the semiconductor chip plays an extremely important role as a core component, and from data centers, mobile broadband, internet, national defense and military industry and the like, the application of optical devices is ubiquitous, and in order to meet different application requirements of people and adapt to different working environments, the performance reliability of the semiconductor chip directly influences the quality of signal transmission, the stability and the timeliness, and how to more effectively screen and test the semiconductor chip with high performance and higher reliability becomes an indispensable work.
At present, two methods are mainly used for testing the performance of a chip, one method is to use a POGO-PIN probe, namely a spring device is arranged in the probe and can freely stretch and retract, the head of the probe is generally in a semi-circular arc shape and directly contacts with a chip PAD, and the defects are that the probe cannot be applied to the interval of the micron-sized PAD, the interval between two parallel PINs cannot be smaller than the diameter of a probe seat, and the minimum interval can be about 200um on the market at present. The other method is a hard probe testing method, wherein the tip of a hard probe can reach 2-10 um level after being specially ground, although the method can be applied to chips with micron-sized spacing, the damage to a PAD metal layer of the chip is easily caused during use, due to rigid contact, the pressure cannot be controlled, a pinhole trace is often left on the PAD, and the bending and deformation of the tip of the hard probe are easily caused after the probe is used for a long time, and if the hard probe is used again, the chip is permanently damaged.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: in order to overcome the defects of the prior art, the device for testing the performance of the semiconductor chip is provided.
In order to achieve the above technical effect, the utility model discloses a technical scheme is: a device for testing the performance of a semiconductor chip comprises a base plate, an adjusting component, a probe component and a carrying disc, wherein the adjusting component and the carrying disc are respectively arranged on the left side and the right side of the base plate;
the adjusting assembly comprises a quick adjusting frame, a fine adjusting frame, a mechanical arm and an angle shaft, the quick adjusting frame is vertically arranged on the bottom plate, the fine adjusting frame is vertically arranged on the right side of the quick adjusting frame, the mechanical arm is arranged on the right side of the fine adjusting frame along the X-axis direction, an opening is formed in the right side of the mechanical arm, and the angle shaft is arranged in the opening along the Y-axis direction;
the probe subassembly has two, and two probe subassemblies set up respectively at the both ends of angle axle, the probe subassembly includes spacing sleeve, adjusting sleeve and tungsten filament probe, spacing sleeve sets up on the right side of angle axle, and spacing sleeve and angle axle detachable connections are equipped with the blind hole on the spacing sleeve, the blind hole is parallel with spacing sleeve's axis, adjusting sleeve suit is on the tungsten filament probe, and it is fixed through glue between adjusting sleeve and the tungsten filament probe, and the adjusting sleeve inserts in the blind hole, the tungsten filament probe runs through spacing sleeve, and the syringe needle of tungsten filament probe is located spacing sleeve's below.
Preferably, in order to rapidly drive the tungsten wire probe to lift, the rapid adjusting frame can drive the fine adjusting frame to move up and down.
Preferably, in order to slowly adjust the lifting of the tungsten wire probe and realize accurate adjustment, the fine adjustment frame can drive the mechanical arm to move up and down.
Preferably, in order to drive the tungsten wire probe to swing left and right for adjusting the angle and facilitate observation of the specific position of the tungsten wire probe under a microscope, the angle shaft can drive the limiting sleeve to swing left and right.
Preferably, in order to adjust the distance between the two tungsten wire probes, a plurality of adjusting holes are arranged on the angle shaft, and the adjusting holes are arranged in a row on the angle shaft.
As preferred, in order to link to each other spacing sleeve and angle axle to adjust spacing sleeve's position, spacing sleeve's top upwards extends and forms connecting portion, be equipped with the bar hole on the connecting portion, the bar hole is parallel with spacing sleeve's axis, links to each other through locking screw between bar hole and the regulation hole.
Preferably, in order to insert a locking screw into the positioning threaded hole, the adjusting sleeve can be fixed by screwing the locking screw, the length of the extended tungsten wire probe can be adjusted by unscrewing the locking screw, and the top of the limiting sleeve is provided with a positioning threaded hole which is vertically communicated with the blind hole.
Preferably, in order to limit the descending position of the rapid adjusting frame and prevent the tungsten wire probe from directly impacting the chip to be damaged, the bottom of the rapid adjusting frame is provided with a limiting block.
Compared with the prior art, the beneficial effects of the utility model are that: in the device for testing the performance of the semiconductor chip, the soft tungsten wire is used as a probe, so that a large number of repeated repeatability tests can be carried out, and a metal layer of the chip is protected; the extending length and the extending distance of the two tungsten filament probes can be controlled at will through the probe assembly, and the PAD test of a chip with the minimum size of 50um can be realized; the position of the tungsten filament probe can be flexibly adjusted through the adjusting assembly, the rapid testing function is realized, the operation is simple, the device cost is low, and the operation efficiency is high.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the embodiments, and it is obvious that the described embodiments are some embodiments, not all embodiments of the present invention.
Drawings
Fig. 1 is a perspective view of the testing device for semiconductor chip performance according to the present invention.
Fig. 2 is a right side view of the testing device for semiconductor chip performance according to the present invention.
Fig. 3 is a schematic structural diagram of a probe assembly of the testing apparatus for semiconductor chip performance according to the present invention.
The reference numbers and corresponding designations in the drawings are: 1. the device comprises a base plate, a loading disc, a quick adjusting frame, a fine adjusting frame, a mechanical arm, an angle shaft, a limiting block, a limiting sleeve, a tungsten wire probe, a regulating hole, a blind hole, a strip-shaped hole and a positioning threaded hole, wherein the loading disc is 2, the quick adjusting frame is 3, the fine adjusting frame is 4, the mechanical arm is 5, the angle shaft.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.
As shown in fig. 1-2, an apparatus for testing performance of a semiconductor chip includes a base plate 1, an adjusting assembly, a probe assembly and a carrying tray 2, wherein the adjusting assembly and the carrying tray 2 are respectively disposed at left and right sides of the base plate 1, the probe assembly is disposed above the carrying tray 2, and the probe assembly is detachably connected to the adjusting assembly;
the adjusting assembly comprises a quick adjusting frame 3, a fine adjusting frame 4, a mechanical arm 5 and an angle shaft 6, the quick adjusting frame 3 is vertically installed on the bottom plate 1, the fine adjusting frame 4 is vertically arranged on the right side of the quick adjusting frame 3, the mechanical arm 5 is arranged on the right side of the fine adjusting frame 4 along the X-axis direction, an opening is formed in the right side of the mechanical arm 5, and the angle shaft 6 is arranged in the opening along the Y-axis direction;
as shown in fig. 3, the probe subassembly has two, two probe subassemblies set up respectively at the both ends of angle axle 6, the probe subassembly includes stop sleeve 8, adjusting sleeve 9 and tungsten filament probe 10, stop sleeve 8 sets up the right side at angle axle 6, stop sleeve 8 and angle axle 6 detachable connections, be equipped with blind hole 801 on the stop sleeve 8, blind hole 801 is parallel with stop sleeve 8's axis, adjusting sleeve 9 suit is on tungsten filament probe 10, it is fixed through glue between adjusting sleeve 9 and the tungsten filament probe 10, adjusting sleeve 9 inserts in blind hole 801, tungsten filament probe 10 runs through stop sleeve 8, tungsten filament probe 10's syringe needle is located stop sleeve 8's below.
In order to quickly drive the tungsten wire probe 10 to lift, the quick adjusting frame 3 can drive the fine adjusting frame 4 to move up and down.
In order to slowly adjust the lifting of the tungsten wire probe 10 and realize accurate adjustment, the fine adjustment adjusting frame 4 can drive the mechanical arm 5 to move up and down.
In order to drive the tungsten wire probe 10 to swing left and right to adjust the angle and facilitate the observation of the specific position under a microscope, the angle shaft 6 can drive the limiting sleeve 8 to swing left and right.
In order to adjust the distance between the two tungsten wire probes 10, a plurality of adjusting holes 601 are formed on the angle shaft 6, and the adjusting holes 601 are arranged in a row on the angle shaft 6.
In order to link to each other limit sleeve 8 and angle axle 6 to adjust limit sleeve 8's position, limit sleeve 8's top upwards extends and forms connecting portion, is equipped with bar hole 802 on the connecting portion, and bar hole 802 is parallel with limit sleeve 8's axis, links to each other through locking screw between bar hole 802 and the regulation hole 601.
In order to insert a locking screw into the positioning threaded hole 803, the adjusting sleeve 9 can be fixed by screwing the locking screw, the length of the extended tungsten wire probe 10 can be adjusted by unscrewing the locking screw, the positioning threaded hole 803 is formed in the top of the limiting sleeve 8, and the positioning threaded hole 803 is vertically communicated with the blind hole 801.
In order to limit the descending position of the rapid adjusting frame 3 and prevent the tungsten wire probe 10 from directly impacting the chip to be damaged, the bottom of the rapid adjusting frame 3 is provided with a limiting block 7.
Before testing, the chip is placed in the carrying disc 2, the tungsten wire probes 10 are connected with a current and voltage source meter through electric wires, the positions of the tungsten wire probes 10 are sleeved with the adjusting sleeves 9, the extending lengths of the tungsten wire probes 10 are adjusted, the adjusting sleeves 9 are inserted into the blind holes 801 and fixed with the limiting sleeves 8, the limiting sleeves 8 are installed on the angle shafts 6, and the needle head distances of the two corresponding tungsten wire probes 10 are adjusted according to the distance between two metal layer PADs of the chip. The intraoral angle axle 6 of manual rotatory arm 5's opening, thereby drive tungsten filament probe 10 and turn certain angle left or right, the convenience is at the concrete position of microscope observation tungsten filament probe 10, upper and lower position that can quick adjustment tungsten filament probe 10 through quick adjustment frame 3, at the in-process that descends fast, the decline position through stopper 7 restriction quick adjustment frame 3, can avoid tungsten filament probe 10 striking chip to damage, then finely tune tungsten filament probe 10's syringe needle position through fine setting adjustment frame 4, make it continue to descend and contact with the metal level PAD of chip, voltage drive chip through current voltage source, the current signal of reading feedback, thereby judge the performance of chip, realize test function.
The utility model discloses in, adopt soft tungsten filament as test probe, soft tungsten filament has elastic deformation's characteristics, during the detection, soft tungsten filament is bending state, and during the separation, soft tungsten filament resumes original shape, can realize a large amount of repeatability tests, the effectual metal level PAD who has protected the chip, bad phenomena such as the mar of difficult metal level, fish tail, fracture appear. In addition, the length and the distance between the two tungsten wire probes 10 can be controlled at will through the probe assembly, and the PAD test of a chip with the minimum size of 50um can be realized. The position of the tungsten wire probe 10 can be adjusted through the adjusting assembly, the rapid testing function is realized, the operation is simple, the device cost is low, and the operation efficiency is high.
The present invention is not limited to the above specific embodiments, and for those skilled in the art, the above conception can be used without any creative work, and all the changes made fall within the protection scope of the present invention.
Claims (8)
1. The device for testing the performance of the semiconductor chip is characterized by comprising a base plate (1), an adjusting assembly, a probe assembly and a carrying disc (2), wherein the adjusting assembly and the carrying disc (2) are respectively arranged on the left side and the right side of the base plate (1), the probe assembly is arranged above the carrying disc (2), and the probe assembly is detachably connected with the adjusting assembly;
the adjusting assembly comprises a quick adjusting frame (3), a fine adjusting frame (4), a mechanical arm (5) and an angle shaft (6), the quick adjusting frame (3) is vertically installed on the bottom plate (1), the fine adjusting frame (4) is vertically arranged on the right side of the quick adjusting frame (3), the mechanical arm (5) is arranged on the right side of the fine adjusting frame (4) along the X-axis direction, an opening is formed in the right side of the mechanical arm (5), and the angle shaft (6) is arranged in the opening along the Y-axis direction;
the probe subassembly has two, and two probe subassemblies set up respectively at the both ends of angle axle (6), the probe subassembly includes spacing sleeve (8), adjusting sleeve (9) and tungsten filament probe (10), spacing sleeve (8) set up on the right side of angle axle (6), and spacing sleeve (8) and angle axle (6) detachable connection are equipped with blind hole (801) on spacing sleeve (8), blind hole (801) are parallel with the axis of spacing sleeve (8), adjusting sleeve (9) suit is on tungsten filament probe (10), and is fixed through glue between adjusting sleeve (9) and tungsten filament probe (10), and adjusting sleeve (9) insert in blind hole (801), tungsten filament probe (10) run through spacing sleeve (8), and the syringe needle of tungsten filament probe (10) is located the below of spacing sleeve (8).
2. The apparatus for testing the performance of semiconductor chips as claimed in claim 1, wherein the quick adjusting rack (3) can move the fine adjusting rack (4) up and down.
3. The apparatus for testing the performance of semiconductor chips as claimed in claim 1, wherein the fine adjustment frame (4) drives the robot arm (5) to move up and down.
4. The apparatus for testing the performance of the semiconductor chip as claimed in claim 1, wherein the angle shaft (6) drives the limit sleeve (8) to swing left and right.
5. The apparatus for testing the performance of semiconductor chips as claimed in claim 1, wherein the angular axis (6) is provided with a plurality of adjustment holes (601), and the adjustment holes (601) are arranged in a row on the angular axis (6).
6. The device for testing the performance of the semiconductor chip as recited in claim 5, wherein the top end of the limiting sleeve (8) extends upwards to form a connecting portion, a strip-shaped hole (802) is formed in the connecting portion, the strip-shaped hole (802) is parallel to the axis of the limiting sleeve (8), and the strip-shaped hole (802) is connected with the adjusting hole (601) through a locking screw.
7. The device for testing the performance of the semiconductor chip as claimed in claim 1, wherein the top of the limiting sleeve (8) is provided with a positioning threaded hole (803), and the positioning threaded hole (803) is vertically communicated with the blind hole (801).
8. The apparatus for testing the performance of the semiconductor chip according to claim 1, wherein the bottom of the fast adjusting frame (3) is provided with a limiting block (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920797481.1U CN210199244U (en) | 2019-05-30 | 2019-05-30 | Device for testing performance of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920797481.1U CN210199244U (en) | 2019-05-30 | 2019-05-30 | Device for testing performance of semiconductor chip |
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| Publication Number | Publication Date |
|---|---|
| CN210199244U true CN210199244U (en) | 2020-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920797481.1U Active CN210199244U (en) | 2019-05-30 | 2019-05-30 | Device for testing performance of semiconductor chip |
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| CN (1) | CN210199244U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110118920A (en) * | 2019-05-30 | 2019-08-13 | 苏州天孚光通信股份有限公司 | A kind of device and method for semiconductor chip performance test |
| CN114280455A (en) * | 2021-12-28 | 2022-04-05 | 国芯微(重庆)科技有限公司 | Probe regulating mechanism |
-
2019
- 2019-05-30 CN CN201920797481.1U patent/CN210199244U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110118920A (en) * | 2019-05-30 | 2019-08-13 | 苏州天孚光通信股份有限公司 | A kind of device and method for semiconductor chip performance test |
| CN110118920B (en) * | 2019-05-30 | 2024-01-02 | 苏州天孚光通信股份有限公司 | Device and method for testing performance of semiconductor chip |
| CN114280455A (en) * | 2021-12-28 | 2022-04-05 | 国芯微(重庆)科技有限公司 | Probe regulating mechanism |
| CN114280455B (en) * | 2021-12-28 | 2024-04-09 | 国芯微(重庆)科技有限公司 | Probe adjusting mechanism |
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