CN110814575A - 焊膏和焊膏的制备方法 - Google Patents
焊膏和焊膏的制备方法 Download PDFInfo
- Publication number
- CN110814575A CN110814575A CN201911180212.1A CN201911180212A CN110814575A CN 110814575 A CN110814575 A CN 110814575A CN 201911180212 A CN201911180212 A CN 201911180212A CN 110814575 A CN110814575 A CN 110814575A
- Authority
- CN
- China
- Prior art keywords
- nano
- mixed solution
- particles
- solder paste
- graphene oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911180212.1A CN110814575B (zh) | 2019-11-27 | 2019-11-27 | 焊膏和焊膏的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911180212.1A CN110814575B (zh) | 2019-11-27 | 2019-11-27 | 焊膏和焊膏的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110814575A true CN110814575A (zh) | 2020-02-21 |
CN110814575B CN110814575B (zh) | 2021-06-18 |
Family
ID=69559851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911180212.1A Active CN110814575B (zh) | 2019-11-27 | 2019-11-27 | 焊膏和焊膏的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110814575B (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112238310A (zh) * | 2020-10-30 | 2021-01-19 | 重庆平创半导体研究院有限责任公司 | 铜焊膏、铜焊膏制备方法和芯片 |
CN112351598A (zh) * | 2020-09-27 | 2021-02-09 | 深圳先进技术研究院 | 一种铜颗粒焊膏及其制备方法以及烧结方法 |
CN112809241A (zh) * | 2020-12-31 | 2021-05-18 | 南京力之兴焊接材料有限公司 | 一种铝焊膏及其制备方法 |
CN113084393A (zh) * | 2021-04-21 | 2021-07-09 | 兰州理工大学 | 一种用于金属材料焊接的抗氧化助焊剂 |
CN114043123A (zh) * | 2021-12-15 | 2022-02-15 | 深圳先进技术研究院 | 纳米铜焊膏及其在芯片封装互连结构中的应用 |
WO2022061834A1 (zh) * | 2020-09-27 | 2022-03-31 | 深圳先进技术研究院 | 一种铜颗粒焊膏及其制备方法以及烧结方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050116208A1 (en) * | 2002-03-22 | 2005-06-02 | Takashi Watsuji | Paste composition for brazing and brazing method using the same |
CN104741821A (zh) * | 2015-04-17 | 2015-07-01 | 哈尔滨工业大学 | 一种用于电子模块高温封装微纳米铜颗粒填充Sn基焊膏及其制备方法 |
CN104889595A (zh) * | 2015-06-09 | 2015-09-09 | 郴州市金贵银业股份有限公司 | 一种氧化石墨烯/纳米银复合钎焊材料及其制备方法 |
CN107350663A (zh) * | 2017-08-30 | 2017-11-17 | 桂林电子科技大学 | 液态金属增强基纳米银焊膏热界面材料及其制备方法 |
CN108890170A (zh) * | 2018-08-30 | 2018-11-27 | 桂林电子科技大学 | 一种石墨烯-纳米银焊膏导热材料及其制备方法 |
CN109226993A (zh) * | 2018-08-30 | 2019-01-18 | 桂林电子科技大学 | 一种微米铜-银焊膏导热材料及其制备方法 |
-
2019
- 2019-11-27 CN CN201911180212.1A patent/CN110814575B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050116208A1 (en) * | 2002-03-22 | 2005-06-02 | Takashi Watsuji | Paste composition for brazing and brazing method using the same |
CN104741821A (zh) * | 2015-04-17 | 2015-07-01 | 哈尔滨工业大学 | 一种用于电子模块高温封装微纳米铜颗粒填充Sn基焊膏及其制备方法 |
CN104889595A (zh) * | 2015-06-09 | 2015-09-09 | 郴州市金贵银业股份有限公司 | 一种氧化石墨烯/纳米银复合钎焊材料及其制备方法 |
CN107350663A (zh) * | 2017-08-30 | 2017-11-17 | 桂林电子科技大学 | 液态金属增强基纳米银焊膏热界面材料及其制备方法 |
CN108890170A (zh) * | 2018-08-30 | 2018-11-27 | 桂林电子科技大学 | 一种石墨烯-纳米银焊膏导热材料及其制备方法 |
CN109226993A (zh) * | 2018-08-30 | 2019-01-18 | 桂林电子科技大学 | 一种微米铜-银焊膏导热材料及其制备方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112351598A (zh) * | 2020-09-27 | 2021-02-09 | 深圳先进技术研究院 | 一种铜颗粒焊膏及其制备方法以及烧结方法 |
WO2022061834A1 (zh) * | 2020-09-27 | 2022-03-31 | 深圳先进技术研究院 | 一种铜颗粒焊膏及其制备方法以及烧结方法 |
CN112238310A (zh) * | 2020-10-30 | 2021-01-19 | 重庆平创半导体研究院有限责任公司 | 铜焊膏、铜焊膏制备方法和芯片 |
CN112809241A (zh) * | 2020-12-31 | 2021-05-18 | 南京力之兴焊接材料有限公司 | 一种铝焊膏及其制备方法 |
CN113084393A (zh) * | 2021-04-21 | 2021-07-09 | 兰州理工大学 | 一种用于金属材料焊接的抗氧化助焊剂 |
CN113084393B (zh) * | 2021-04-21 | 2022-06-17 | 兰州理工大学 | 一种用于金属材料焊接的抗氧化助焊剂 |
CN114043123A (zh) * | 2021-12-15 | 2022-02-15 | 深圳先进技术研究院 | 纳米铜焊膏及其在芯片封装互连结构中的应用 |
Also Published As
Publication number | Publication date |
---|---|
CN110814575B (zh) | 2021-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110814575B (zh) | 焊膏和焊膏的制备方法 | |
JP5606421B2 (ja) | 銅ナノ粒子を用いた焼結性接合材料及びその製造方法及び電子部材の接合方法 | |
CN109664049B (zh) | 一种用于电子封装领域的多尺度微纳米颗粒复合焊膏及其制备方法 | |
CN108847395B (zh) | 一种用于低温快速连接的预烧结纳米网络银膜制备及封装方法 | |
CN109979904B (zh) | 一种多尺寸纳米颗粒混合金属膜及其制备方法 | |
JP6153077B2 (ja) | 金属ナノ粒子ペースト、それを含有する接合材料、およびそれを用いた半導体装置 | |
CN101805574A (zh) | 采用表面活化处理的银填料的烧结型导电胶及其制备方法 | |
JP5557698B2 (ja) | 焼結接合剤、その製造方法およびそれを用いた接合方法 | |
JP4876979B2 (ja) | 接合部材および接合方法 | |
CN109852835B (zh) | 一种石墨烯/铜纳米复合材料的制备方法 | |
JP6032110B2 (ja) | 金属ナノ粒子材料、それを含有する接合材料、およびそれを用いた半導体装置 | |
JP2022046765A (ja) | 銅ペースト、接合方法および接合体の製造方法 | |
CN112351598A (zh) | 一种铜颗粒焊膏及其制备方法以及烧结方法 | |
CN111112597A (zh) | 一种三元金属核壳结构微纳米颗粒及其制备方法 | |
JP2007080635A (ja) | 導電部形成用粒子 | |
Zhang et al. | Synergy effect of mixed sintering accelerator on the deoxidation and sintering property improvement of Cu nanoparticles at low temperature | |
CN116580872A (zh) | 自致密纳米银浆及制备用于高功率电子器件的互连层的方法 | |
CN113976877B (zh) | 一种用于制备AgCuTi焊片的金属组合物、焊片及其制备方法 | |
WO2022061834A1 (zh) | 一种铜颗粒焊膏及其制备方法以及烧结方法 | |
CN114310038A (zh) | 银盐纳米银复合焊膏及制备方法烧结方法和应用 | |
CN111415918B (zh) | 一种基于反应性膜的互连方法 | |
CN114231092A (zh) | 一种铜导电油墨、柔性基底及柔性基底的制备方法 | |
JP2006120973A (ja) | 回路基板および回路基板の製造方法 | |
Lai et al. | Study on the interconnect performance of multicomponent paste for 3rd generation semiconductor packaging | |
CN114654126B (zh) | 一种银包覆铜焊膏及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200616 Address after: 402760 No.92, Donglin Avenue, Biquan street, Bishan District, Chongqing (No.52 plant, No.53 plant) Applicant after: Chongqing Pingchuang Semiconductor Research Institute Co.,Ltd. Applicant after: GUILIN University OF ELECTRONIC TECHNOLOGY Address before: 402760 No.92, Donglin Avenue, Biquan street, Bishan District, Chongqing (No.52 plant, No.53 plant) Applicant before: Chongqing Pingchuang Semiconductor Research Institute Co.,Ltd. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220215 Address after: 402760 No. 1, Hongyu Avenue, Biquan street, Bishan District, Chongqing (buildings 2 and 3) Patentee after: Chongqing Pingchuang Semiconductor Research Institute Co.,Ltd. Address before: 402760 No.92 Donglin Avenue, Biquan street, Bishan District, Chongqing Patentee before: Chongqing Pingchuang Semiconductor Research Institute Co.,Ltd. Patentee before: Guilin University of Electronic Technology |