CN110808231B - Double-fluid heat dissipation device - Google Patents
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- CN110808231B CN110808231B CN201911045079.9A CN201911045079A CN110808231B CN 110808231 B CN110808231 B CN 110808231B CN 201911045079 A CN201911045079 A CN 201911045079A CN 110808231 B CN110808231 B CN 110808231B
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- 239000012530 fluid Substances 0.000 title claims abstract description 61
- 230000017525 heat dissipation Effects 0.000 title abstract description 49
- 239000000243 solution Substances 0.000 claims abstract description 42
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 239000007864 aqueous solution Substances 0.000 claims abstract description 22
- 230000009977 dual effect Effects 0.000 claims description 23
- 239000002585 base Substances 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- 229910052733 gallium Inorganic materials 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 239000010935 stainless steel Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 239000003513 alkali Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 24
- 238000012546 transfer Methods 0.000 abstract description 12
- 238000005516 engineering process Methods 0.000 abstract description 7
- 230000004907 flux Effects 0.000 abstract description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 26
- 230000008859 change Effects 0.000 description 10
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- 239000000919 ceramic Substances 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 229910000846 In alloy Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of heat dissipation equipment, and provides a double-fluid heat dissipation device, which comprises: a base plate, liquid metal-aqueous solution dual-fluid, a ring magnet, a ring electrode and a cylindrical electrode; the annular electrode and the cylindrical electrode are uniformly distributed on the surface of the bottom plate; the annular magnet is sleeved on the outer side of the annular electrode, and the annular electrode is sleeved on the surface of the cylindrical electrode; the liquid metal-water solution double fluid is placed in the area enclosed by the annular electrode, the cylindrical electrode and the bottom plate. The liquid metal-water solution double-fluid in the double-fluid heat dissipation device is electromagnetically driven, and compared with the traditional air cooling or water cooling technology, the heat dissipation device with a compact structure can be realized, the heat conductivity coefficient of the liquid metal is more than 30 times that of water, high-efficiency heat transfer can be realized, and the limit heat flux density reached by water cooling in the heat dissipation field can be greatly expanded.
Description
Technical Field
The invention relates to the technical field of heat dissipation equipment, in particular to a double-fluid heat dissipation device.
Background
In recent years, the thermal barrier problem caused by high-integration computer chips, optoelectronic devices, etc. has become one of the technical bottlenecks that restrict the continuous development thereof. In particular, computer and optoelectronic chips are developing towards the trend of increasing integration level, reducing size and increasing clock frequency, so that the power and heat flux density of the chips during operation are becoming larger and larger, higher temperature is generated inside the devices, and the high temperature is very easy to cause chip failure, so the problem of "thermal barrier" becomes more and more severe.
At present, the heat dissipation technology mainly includes: heat pipe cooling, air cooling, water cooling, etc. The heat transfer efficiency of heat dissipation of the heat pipe is high, but the heat pipe cannot work after the heat flow exceeds the heat dissipation limit, so that cooling failure can be caused, and the temperature of the device continuously rises until the device is burnt out; the air cooling efficiency is low, and the air cooling device is used for CPU heat dissipation and can only discharge 60% of waste heat at most; the water-cooling heat dissipation efficiency is higher than that of air cooling, and particularly, the performance is excellent under the micro-channel, but the water-cooling heat dissipation has the problem of a driving mode for a long time, for example, on a common personal desktop computer, a CPU water-cooling pump is generally driven by a rotary impeller mechanism, and because the water-cooling pump has a large volume, the water-cooling pump is not easily used for electronic equipment with small size, such as a notebook computer, a tablet computer and the like.
Disclosure of Invention
Technical problem to be solved
In view of the above technical defects and application requirements, the present application provides a two-fluid heat dissipation device to solve the problems of low heat dissipation efficiency and complex structure of the existing heat dissipation device.
(II) technical scheme
In order to solve the above problems, the present invention provides a two-fluid heat dissipation device, comprising: a base plate, liquid metal-aqueous solution dual-fluid, a ring magnet, a ring electrode and a cylindrical electrode;
the annular electrode and the cylindrical electrode are uniformly distributed on the surface of the bottom plate; the annular magnet is sleeved on the outer side of the annular electrode, and the annular electrode is sleeved on the surface of the cylindrical electrode; the liquid metal-water solution double fluid is placed in the area enclosed by the annular electrode, the cylindrical electrode and the bottom plate.
The double-fluid heat dissipation device further comprises a heat dissipation sheet arranged on the surface of the base plate, and at least one fan is arranged on the heat dissipation sheet.
And heat-conducting silicone grease is coated between the surface of the bottom plate and the radiating fins.
Wherein the dual fluid heat sink further comprises a hot spot mounted to a surface of the base plate.
Wherein the liquid metal in the liquid metal-water solution double fluid is gallium-based, indium-based or tin-based metal with the melting point lower than 30 ℃.
Wherein the aqueous solution in the liquid metal-aqueous solution dual fluid is pure water, an acid solution or an alkali solution.
Wherein the annular electrode is a circular ring-shaped electrode, an elliptical ring-shaped electrode or a square ring-shaped electrode; the cylindrical electrode is a cylindrical or prismatic electrode.
The annular electrode and the cylindrical electrode are made of graphite, stainless steel or copper.
Wherein a thermocouple for monitoring temperature change is arranged on the annular electrode and/or the cylindrical electrode.
Wherein, the bottom plate is made of non-metallic materials.
(III) advantageous effects
According to the double-fluid heat dissipation device provided by the invention, the liquid metal-water solution double fluid absorbs heat and transfers the heat to the bottom plate, the liquid metal-water solution double fluid is driven by electromagnetism, and compared with the traditional air cooling or water cooling technology, the double-fluid heat dissipation device with a compact structure can be realized, the heat conductivity coefficient of the liquid metal is more than 30 times of that of water, the high-efficiency heat transfer can be realized, and the limit heat flux density achieved by water cooling in the heat dissipation field can be greatly expanded.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is an exploded view of a dual fluid heat sink provided by an embodiment of the present invention;
FIG. 2 is a top view of a dual fluid heat sink provided by an embodiment of the present invention;
FIG. 3 is a bottom view of a dual fluid heat sink provided by an embodiment of the present invention;
wherein, 1, a ring magnet; 2. a ring electrode; 3. liquid metal-water solution dual fluids; 4. a cylindrical electrode; 5. a base plate; 6. a hotspot; 7. a heat sink; 8. a fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The development of high heat flow in a limited space is a key difficulty of a heat dissipation technology, and the search for a cooling working medium material with excellent thermophysical performance becomes a key point for developing a novel heat dissipation technology, and liquid metal belongs to a typical heat dissipation material. The liquid metal is a low-melting-point elemental metal or alloy with a melting point lower than 30 ℃ and capable of presenting a liquid state in a room-temperature environment, and is typically represented by gallium and gallium-based alloys (such as gallium-indium alloy, gallium-tin alloy, gallium-indium-tin alloy and the like), and has a series of excellent characteristics: the liquid phase temperature zone is wide, the convective heat transfer coefficient is high, the extreme heat flux density resistance is strong, the electromagnetic driving is easy to carry out, and the heat conduction material is stable in property and non-toxic, and is an ideal heat conduction material. In the case of single-phase convection, the convective heat transfer coefficient of liquid metal can be orders of magnitude higher than that of water. Meanwhile, the outstanding stability of the heat-dissipating structure greatly expands the limit heat flux density achieved by water cooling in the heat-dissipating field. By integrating the series of advantages, the liquid metal cooling method has the potential to become a new generation of high-end heat dissipation technology in the field of chip heat dissipation.
The liquid metal is an electrically conductive fluid, and can generate directional flow under the action of Lorentz force in an electromagnetic field, so that the liquid metal is suitable for electromagnetic driving. However, because an oxide film is easily formed on the surface of the liquid metal at room temperature, an acid or alkali aqueous solution is required to be used for timely removing the oxide film, and the aqueous solution has a large specific heat capacity, the liquid metal-aqueous solution dual-fluid heat dissipation working medium has a large heat conductivity coefficient and a high specific heat capacity, and can realize high-efficiency heat dissipation.
Fig. 1 is an exploded view of a dual-fluid heat dissipation device according to an embodiment of the present invention, and as shown in fig. 1, the dual-fluid heat dissipation device according to an embodiment of the present invention includes: a bottom plate 5, liquid metal-aqueous solution double-fluid 3, a ring magnet 1, a ring electrode 2 and a cylindrical electrode 4;
the annular electrode 2 and the cylindrical electrode 4 are uniformly distributed on the surface of the bottom plate 5; the annular magnet 1 is sleeved outside the annular electrode 2, and the annular electrode 2 is sleeved on the surface of the cylindrical electrode 4; the liquid metal-aqueous solution double fluid 3 is arranged in the area enclosed by the annular electrode 2, the cylindrical electrode 4 and the bottom plate 5.
It should be noted that the bottom plate 5 is made of a non-metallic material with high thermal conductivity and no electrical conductivity. The bottom plate 5 can be a rectangular bottom plate, and the size of the bottom plate 5 can be designed according to the actual heat dissipation working condition, and is not specifically limited herein. The center of the bottom plate 5 is provided with a through hole for installing the cylindrical electrode 4, namely, the bottom of the cylindrical electrode 4 is installed in the through hole, and the size of the through hole is matched with that of the cylindrical electrode 4, so that the cylindrical electrode 4 is ensured to be fixed in the through hole. The cylindrical electrode 4 can be provided with a limiting bulge for matching installation of the cylindrical electrode 4 and the bottom plate 5, so that the cylindrical electrode 4 can be prevented from falling from the through hole.
As shown in fig. 2, the ring electrode 2 may be a two-step ring electrode, that is, the ring electrode 2 includes a first ring electrode and a second ring electrode which are integrally formed, an outer diameter of the first ring electrode is smaller than an outer diameter of the second ring electrode, an inner diameter of the first ring electrode is equal to an inner diameter of the second ring electrode, and a bottom surface of the first ring electrode is connected to a top surface of the second ring electrode. Wherein, the internal diameter of annular magnet 1 is more than or equal to the external diameter of first ring electrode, and annular magnet 1 cover is located the outside of first ring electrode. The bottom surface of the second ring electrode is in contact with the upper surface of the bottom plate 5. The central axis of the second ring electrode coincides with the central axis of the cylindrical electrode 4.
It will be appreciated that the liquid metal-water solution dual fluid 3 is disposed within the area enclosed by the inner surface of the first annular electrode, the inner surface of the second annular electrode, the outer surface of the cylindrical electrode 4 and the upper surface of the bottom plate 5.
In the embodiment of the invention, the liquid metal-water solution double-fluid absorbs heat and transmits the heat to the bottom plate, the liquid metal-water solution double-fluid is driven by electromagnetism, compared with the traditional air cooling or water cooling technology, the heat dissipation device with a compact structure can be realized, the heat conductivity coefficient of the liquid metal is more than 30 times of that of water, the high-efficiency heat transfer can be realized, and the limit heat flux density achieved by water cooling in the heat dissipation field can be greatly expanded.
Wherein, the ratio change range of the liquid metal and the aqueous solution in the liquid metal-aqueous solution double-fluid 3 is 100 percent to 0 percent, the liquid metal single-phase fluid is obtained when the ratio change range is 100 percent, and the aqueous solution single-phase fluid is obtained when the ratio change range is 0 percent.
In addition to the above-described embodiments, as shown in fig. 3, the dual fluid heat sink further includes a heat sink 7 mounted on the surface of the base plate 5, and at least one fan 8 is mounted on the heat sink 7.
In the embodiment of the present invention, a heat sink 7 is mounted on the lower surface of the base plate 5, and a fan 8 is mounted on the heat sink 7 for discharging heat.
On the basis of the above embodiment, the dual fluid heat sink further comprises a hot spot 6 mounted on the surface of the base plate 5.
In the present embodiment, the hot spot 6 is mounted on the lower surface of the base plate 5 for accelerating heat removal.
Based on the above examples, the liquid metal in the liquid metal-water solution dual fluid is a gallium-based, indium-based or tin-based metal having a melting point of less than 30 ℃. The aqueous solution in the liquid metal-aqueous solution dual fluid is pure water, an acid solution or an alkali solution.
In the embodiment of the invention, the liquid metal-water solution double-fluid is used as the heat dissipation working medium, so that the heat dissipation working medium has high heat conductivity and high specific heat capacity. In addition, the aqueous solution (such as NaOH solution) has another function of timely removing oxides on the surface of the liquid metal, and an interface sliding layer is formed among the liquid metal, the electrode and the bottom plate, so that the friction force of the movement of the liquid metal can be greatly reduced by the sliding layer, and meanwhile, the short circuit phenomenon among the electrodes is also avoided.
On the basis of the above embodiment, the ring electrode 2 is a circular ring, an elliptical ring or a square ring electrode; the columnar electrode 4 is a cylindrical or prismatic electrode. The annular electrode 2 and the cylindrical electrode 4 are made of graphite, stainless steel or copper.
In the embodiment of the present invention, a thermocouple for monitoring temperature change is placed on the ring electrode 2 and/or the cylindrical electrode 4. The outer surface of the second annular electrode is provided with a first blind hole for mounting a thermocouple, and the top of the cylindrical electrode 4 is provided with a second blind hole for mounting the thermocouple.
Example 1
The liquid metal is pure gallium with the melting point of 29.8 ℃, the water solution is pure water, and the weight ratio of the liquid metal to the water is 90 percent; the annular electrode is a circular electrode, and the cylindrical electrode is a cylindrical electrode; the annular electrode and the cylindrical electrode are made of graphite; thermocouples are drilled on the annular electrode and the cylindrical electrode and are used for monitoring temperature change; the bottom plate is made of ceramic with high heat conductivity and no electric conduction; and heat-conducting silicone grease is coated between the bottom plate and the radiating fins to enhance heat transfer. The liquid metal-water solution double-fluid is used as a heat dissipation working medium, and has high heat conductivity and high specific heat capacity.
Example 2
The liquid metal is pure gallium with the melting point of 29.8 ℃; the aqueous solution is NaOH solution; the weight ratio of the liquid metal to the NaOH solution is 90 percent; the annular electrode is a circular electrode, and the cylindrical electrode is a cylindrical electrode; the annular electrode and the cylindrical electrode are made of graphite; thermocouples are drilled on the annular electrode and the cylindrical electrode and are used for monitoring temperature change; the bottom plate is made of ceramic with high heat conductivity and no electric conduction; and heat-conducting silicone grease is coated between the bottom plate and the radiating fins to enhance heat transfer. The liquid metal-NaOH solution double-fluid is used as a heat dissipation working medium, so that the heat dissipation working medium has high heat conductivity and high specific heat capacity. In addition, the NaOH solution has another function of timely removing oxides on the surface of the liquid metal, an interface sliding layer is formed among the liquid metal, the electrode and the bottom plate, the friction force of the liquid metal in movement can be greatly reduced by the sliding layer, and meanwhile, the short circuit phenomenon among the electrodes is also avoided.
Example 3
The liquid metal is gallium-indium alloy with the melting point of 15.6 ℃; the aqueous solution is HCl solution; the weight ratio of the liquid metal to the HCl solution is 70 percent; the annular electrode is an elliptical electrode, and the cylindrical electrode is a prismatic electrode; the annular electrode and the cylindrical electrode are made of stainless steel; thermocouples are drilled on the annular electrode and the cylindrical electrode and are used for monitoring temperature change; the bottom plate is made of ceramic with high heat conductivity and no electric conduction; and heat-conducting silicone grease is coated between the bottom plate and the radiating fins to enhance heat transfer. The liquid metal-HCl solution double-fluid is used as a heat dissipation working medium, so that the heat dissipation working medium has high heat conductivity and high specific heat capacity. In addition, the HCl solution has another function of timely removing oxides on the surface of the liquid metal, an interface sliding layer is formed among the liquid metal, the electrode and the bottom plate, the friction force of the liquid metal in movement can be greatly reduced by the sliding layer, and meanwhile, the short circuit phenomenon among the electrodes is also avoided.
Example 4
The liquid metal is gallium-indium alloy with the melting point of 15.6 ℃; the weight ratio of the liquid metal to the aqueous solution is 100 percent, namely the liquid metal single-phase fluid; the annular electrode is an elliptical electrode, and the cylindrical electrode is a prismatic electrode; the annular electrode and the cylindrical electrode are made of stainless steel; thermocouples are drilled on the annular electrode and the cylindrical electrode and are used for monitoring temperature change; the bottom plate is made of ceramic with high heat conductivity and no electric conduction; and heat-conducting silicone grease is coated between the bottom plate and the radiating fins to enhance heat transfer. The liquid metal is used as a heat dissipation working medium, so that the heat dissipation device has high heat conductivity and can realize high heat dissipation efficiency.
Example 5
The liquid metal is gallium-indium alloy with the melting point of 15.6 ℃; the aqueous solution is NaOH solution; the weight ratio of the liquid metal to the NaOH solution is 0 percent, namely the NaOH solution single-phase fluid; the annular electrode is a circular electrode, and the cylindrical electrode is a circular electrode; the annular electrode and the cylindrical electrode are made of stainless steel; thermocouples are drilled on the annular electrode and the cylindrical electrode and are used for monitoring temperature change; the bottom plate is made of ceramic with high heat conductivity and no electric conduction; and heat-conducting silicone grease is coated between the bottom plate and the radiating fins to enhance heat transfer. The NaOH solution fluid is used as a heat dissipation working medium, has higher specific heat capacity, and can realize higher heat dissipation efficiency.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A dual fluid heat sink, comprising: a base plate, liquid metal-aqueous solution dual-fluid, a ring magnet, a ring electrode and a cylindrical electrode;
the annular electrode and the cylindrical electrode are uniformly distributed on the surface of the bottom plate; the annular magnet is sleeved on the outer side of the annular electrode, and the annular electrode is sleeved on the surface of the cylindrical electrode; the liquid metal-water solution double fluid is placed in the area enclosed by the annular electrode, the cylindrical electrode and the bottom plate.
2. The dual fluid heat sink of claim 1, further comprising a heat sink mounted to a surface of the base plate, the heat sink having at least one fan mounted thereon.
3. The dual fluid heat sink of claim 2, wherein a thermally conductive silicone grease is applied between the surface of the base plate and the heat sink.
4. The dual fluid heat sink of claim 1, further comprising a hot spot mounted to a surface of the base plate.
5. The dual fluid heat sink of claim 1 wherein the liquid metal in the liquid metal-water solution dual fluid is a gallium-based, indium-based or tin-based metal having a melting point below 30 ℃.
6. The dual fluid heat sink of claim 1 wherein the aqueous solution in the liquid metal-aqueous solution dual fluid is pure water, an acid solution, or an alkali solution.
7. The dual fluid heat sink of claim 1, wherein the annular electrode is a circular, elliptical, or square annular electrode; the cylindrical electrode is a cylindrical or prismatic electrode.
8. The dual fluid heat sink of claim 1, wherein the ring electrode and the cylindrical electrode are made of graphite, stainless steel or copper.
9. The dual fluid heat sink of claim 1, wherein a thermocouple is placed on the ring electrode and/or the cylindrical electrode to monitor temperature changes.
10. The dual fluid heat sink of claim 1, wherein the base plate is made of a non-metallic material.
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CN2736933Y (en) * | 2004-07-02 | 2005-10-26 | 中国科学院理化技术研究所 | Liquid metal chip radiator driven by thermoelectric-electromagnetic pump |
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