CN114980708A

CN114980708A - Electronic device

Info

Publication number: CN114980708A
Application number: CN202210859513.2A
Authority: CN
Inventors: 饶晓东
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2022-07-21
Filing date: 2022-07-21
Publication date: 2022-08-30

Abstract

The application provides an electronic device, including: a first body; a second body positioned at one side of the first body; a hinge assembly connecting the first body and the second body; an electronic element provided in the first body or the second body; a heat conducting assembly connecting the electronic component and the hinge assembly; wherein, the heat that the electronic component produced when working can be conducted to the hinge subassembly through heat-conducting component.

Description

Electronic device

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.

Background

In the related art, the hardware architecture design of the folding screen mobile phone promotes the corresponding use performance, and simultaneously increases the power consumption and temperature rise, and the whole stacking design of the folding screen mobile phone is very compact, and the heat dissipation space of the whole mobile phone is very limited, so that the problem of temperature rise burning is very obvious on the folding screen mobile phone.

Disclosure of Invention

The application aims to provide electronic equipment, and solves or improves one of the technical problems of serious heating in the operation process of folding electronic equipment.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, the present application provides an electronic device, comprising:

a first body;

a second body positioned at one side of the first body;

a hinge assembly connecting the first body and the second body;

an electronic element provided in the first body or the second body;

a heat conducting assembly connecting the electronic component and the hinge assembly;

wherein, the heat that the electronic component produced when working can be conducted to the hinge subassembly through heat-conducting component.

In an embodiment of the present application, an electronic device includes a first body, a second body, and a hinge assembly connecting the first body and the second body such that the first body and the second body can be rotated to a folded state and an unfolded state by the hinge assembly.

The electronic device further comprises an electronic element and a heat conduction assembly, the electronic element is arranged inside the first main body or inside the second main body, the heat conduction assembly is connected with the electronic element and the hinge assembly, and further heat generated in the working process of the electronic element can be conducted to the hinge assembly through the heat conduction assembly, namely the electronic element can dissipate heat through the hinge assembly, and the hinge assembly is composed of various parts, so that the hinge assembly has a larger surface area, and the heat dissipation speed and the heat dissipation effect of the electronic element can be improved by the aid of the hinge assembly.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram illustrating an electronic device in an unfolded state according to an embodiment of the present application;

fig. 2 is a schematic diagram illustrating an electronic device provided by an embodiment of the present application in a folded state;

FIG. 3 is a schematic diagram illustrating an electronic device provided by one embodiment of the present application not including a screen assembly;

FIG. 4 is a schematic diagram illustrating a thermal conductive rod in an electronic device provided by an embodiment of the present application;

FIG. 5 is a schematic diagram illustrating an end surface of a thermally conductive assembly in an electronic device provided by an embodiment of the application;

FIG. 6 is a schematic diagram illustrating an electronic device provided by one embodiment of the present application not including a screen assembly;

FIG. 7 is a schematic diagram illustrating a heat pipe in an electronic device according to an embodiment of the application;

FIG. 8 illustrates a schematic view of an end face of a thermally conductive assembly in an electronic device provided by an embodiment of the present application;

FIG. 9 illustrates a cross-sectional view of a thermally conductive assembly in an electronic device provided by an embodiment of the present application;

FIG. 10 illustrates a schematic view of a thermally conductive assembly, an electronic component, a hinge assembly, a first fan, and a second fan in an electronic device provided by an embodiment of the present application;

FIG. 11 illustrates a schematic diagram of an electronic device provided by an embodiment of the application;

FIG. 12 illustrates a schematic view of a hinge assembly, a first fan, and a second fan in an electronic device provided by an embodiment of the present application;

fig. 13 is a schematic diagram illustrating a heat-conducting component, a heat-conducting medium, and an electronic element in an electronic device according to an embodiment of the present application.

Fig. 1 to 13 reference numerals:

100 electronic device, 110 first body, 120 second body, 130 hinge assembly, 132 rotation shaft, 134 damping mechanism, 136 guide mechanism, 138 housing, 140 electronic component, 142 processor, 144 camera component, 150 heat conducting component, 152 heat conducting pipe, 154 cooling medium, 156 first heat conducting part, 158 second heat conducting part, 160 third heat conducting part, 162 heat conducting rod, 170 heat conducting medium, 180 first fan, 190 temperature detecting component, 200 second fan, 210 screen component, 220 first battery, 230 second battery, 240 secondary circuit board.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the description of the present application, it is to be understood that the terms "upper", "inner", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

An electronic device 100 according to an embodiment of the present application is described below with reference to fig. 1 to 13.

As shown in fig. 3 and 6, the present application provides an electronic device 100 including: a first body 110; a second body 120 positioned at one side of the first body 110; a hinge assembly 130 connecting the first body 110 and the second body 120; an electronic component 140 disposed in the first body 110 or the second body 120; a thermally conductive assembly 150 connecting the electronic component 140 and the hinge assembly 130; wherein, heat generated when the electronic component 140 operates can be conducted to the hinge assembly 130 through the heat conductive assembly 150.

In an embodiment of the present application, as shown in fig. 1 and 2, the electronic device 100 includes a first body 110, a second body 120, and a hinge assembly 130, and the hinge assembly 130 connects the first body 110 and the second body 120, so that the first body 110 and the second body 120 can be rotated to a folded state and an unfolded state by the hinge assembly 130.

As shown in fig. 3, 6 and 10, the electronic device 100 further includes an electronic component 140 and a heat conduction assembly 150, the electronic component 140 is disposed inside the first body 110 or inside the second body 120, the heat conduction assembly 150 is connected to the electronic component 140 and further connected to the hinge assembly 130, and further heat generated during the operation of the electronic component 140 can be conducted to the hinge assembly 130 through the heat conduction assembly 150, that is, the electronic component 140 can dissipate heat through the hinge assembly 130, and the hinge assembly 130 is composed of various components, so that the hinge assembly 130 has a larger surface area, and thus, the heat dissipation speed and the heat dissipation effect of the electronic component 140 can be improved by using the hinge assembly 130.

Specifically, the number of the integral parts of the hinge assembly 130 may be hundreds or even thousands, and gaps exist between the parts, so that the hinge assembly 130 is formed to have a plurality of surfaces and key details, such as gear parts, and the like, and therefore, the contact area between the hinge assembly 130 and the air is increased, and the hinge assembly 130 has a large heat dissipation area, specifically, the heat dissipation area of the hinge assembly 130 is up to 10 square centimeters or more.

As one possible embodiment, as shown in fig. 4 and 5, the heat conductive assembly 150 includes: a heat conductive rod 162 connecting the electronic component 140 and the hinge assembly 130; or the heat conducting assembly 150 includes: a heat pipe 152 connecting the electronic component 140 and the hinge assembly 130; and a cooling medium 154 provided in the heat transfer pipe 152.

Specifically, the heat conductive assembly 150 includes the heat conductive rod 162, and the electronic component 140 and the hinge assembly 130 are connected by the heat conductive rod 162, and the heat conductive rod 162 can have a thin thickness, so that the overall thickness of the electronic device 100 can be reduced.

And the heat conducting rod 162 may be a parallel-flat structure, the cross section of the heat conducting rod 162 may be rectangular, and the length a may range from 4mm to 8mm, for example: a is 4mm, a is 5mm, a is 6mm, a is 7mm or a is 8mm, and the width b ranges from 1mm to 3mm, for example: b 1mm, b 2mm or b 3 mm.

Moreover, the heat conducting rod 162 may be made of metal, such as: copper, aluminum, iron, gold, or the like, the heat pipe 152 may also be made of metal alloy material, such as: copper alloy, aluminum alloy, iron alloy, gold alloy, or the like, and the heat pipe 152 may also be made of graphite material, and the heat pipe 152 may also be made of graphene material, or the like.

The heat conductive rod 162 may be connected to the electronic component 140 through the peripheral side wall or the end face, and similarly, the heat conductive rod 162 may be connected to the hinge assembly 130 through the peripheral side wall or the end face.

Alternatively, as shown in fig. 7, 8 and 9, the heat conducting assembly 150 includes a heat conducting pipe 152 and a cooling medium 154 disposed in the heat conducting pipe 152, the cavity of the heat conducting pipe 152 is filled with the cooling medium 154, the heat conducting performance of the cooling medium 154 is generally better than that of the heat conducting pipe 152, and further, the heat conducting performance of the heat conducting assembly 150 can be improved by filling the heat conducting pipe 152 with the cooling medium 154, so as to improve the heat conducting performance of the electronic price.

The cooling medium 154 includes antifreeze, ethylene glycol, methanol, or the like. The circumferential outer wall of the heat conductive pipe 152 may be a circle, a polygon, an ellipse, a special-shaped structure, or the like.

The heat transfer pipe 152 may be made of a metal material, for example: copper, aluminum, iron, gold, or the like, the heat conduction pipe 152 may be made of a metal alloy material, for example: copper alloy, aluminum alloy, iron alloy, gold alloy, or the like, and the heat pipe 152 may also be made of graphite material, and the heat pipe 152 may also be made of graphene material, or the like.

The heat pipe 152 may be connected to the electronic component 140 through the peripheral side wall or the end face, and similarly, the heat pipe 152 may be connected to the hinge assembly 130 through the peripheral side wall or the end face and the added assembly.

And, the value of the wall thickness of the heat pipe 152 may be 0.5mm to 1.5mm, so as to ensure the strength of the heat pipe 152 and simultaneously increase the capacity of the cooling medium 154 in the heat pipe 152, and the wall thickness of the heat pipe 152 may be 0.5mm, 1mm, or 1.5 mm.

Further, heat pipe 152 adopts the pipe, and then promotes heat pipe 152's intensity, reduces heat pipe 152's the manufacturing degree of difficulty, and wherein, heat pipe 152 can be that tip and electronic component 140 are connected, or electronic component 140 sets up and heat pipe 152 has corresponding radiator to the circular lateral wall of cooperation heat pipe 152, the value range of the external diameter c of heat pipe 152 is 4mm to 8mm, for example: c 4mm, c 5mm, c 6mm, c 7mm or c 8 mm.

As one possible implementation, as shown in fig. 13, the electronic device 100 further includes: and a heat transfer medium 170 interposed between the electronic component 140 and the heat transfer assembly 150, and between the hinge assembly 130 and the heat transfer assembly 150.

Specifically, the heat conducting medium 170 is disposed between the electronic element 140 and the heat conducting assembly 150, and the surfaces of the electronic element 140 and the heat conducting assembly 150 cannot be completely attached to each other, so that the contact area between the electronic element 140 and the heat conducting assembly 150 can be increased through the heat conducting medium 170, the heat conducting effect between the electronic element 140 and the heat conducting assembly 150 is increased, and the heat dissipation effect on the electronic element 140 is increased.

Similarly, the heat conducting medium 170 is disposed between the hinge assembly 130 and the heat conducting assembly 150, and since the surfaces of the hinge assembly 130 and the heat conducting assembly 150 cannot be completely attached to each other, the contact area between the hinge assembly 130 and the heat conducting assembly 150 can be increased by the heat conducting medium 170, so that the heat conducting effect of the hinge assembly 130 and the heat conducting assembly 150 is increased, and the heat dissipation effect of the electronic component 140 is increased.

The heat-conducting medium 170 may be heat-conducting silicone grease.

As one possible implementation, as shown in fig. 10, 11 and 12, the electronic device 100 further includes: and a first fan 180 provided at the hinge assembly 130.

Specifically, the first fan 180 is disposed on the hinge assembly 130, and the first fan 180 drives the airflow to flow, so that the airflow flows on the surface of the hinge assembly 130, and the heat exchange effect of the hinge assembly 130 is improved. The first fan 180 may be mounted on a middle pillar of the hinge assembly 130.

As a possible implementation, as shown in fig. 10, the electronic device 100 further includes: the temperature detecting assembly 190 is disposed on the heat conducting assembly 150, and the first fan 180 adjusts the state according to the detection result of the temperature detecting assembly 190.

Specifically, a temperature detection assembly 190 is provided on the heat conductive assembly 150, the temperature detection assembly 190 is capable of detecting the temperature of the heat conductive assembly 150, and the first fan 180 adjusts the state according to the detection result of the temperature detection assembly 190. For example: when the temperature of the heat conducting assembly 150 is lower than the first preset temperature, the first fan 180 is not started, and when the temperature of the heat conducting assembly 150 is higher than the second preset temperature, the first fan 180 is started, wherein the first preset temperature and the second preset temperature can be the same or different, so that the state of the first fan 180 is determined by utilizing the actual temperature of the heat conducting assembly 150, the heat dissipation effect is improved, and meanwhile, the energy consumption can be reduced.

Also, the first fan 180 may have a plurality of stages, and the operation stage of the first fan 180 may be controlled according to the temperature of the heat conductive member 150.

As one possible embodiment, as shown in fig. 3, 6 and 10, the hinge assembly 130 includes: a rotating shaft 132; the damping mechanism 134 is disposed at one side of the rotating shaft 132, the heat conducting assembly 150 is connected to the damping mechanism 134, and the first fan 180 is disposed between the rotating shaft 132 and the damping mechanism 134.

Specifically, the hinge assembly 130 includes a rotating shaft 132 and a damping mechanism 134, the damping mechanism 134 is disposed on one side of the rotating shaft 132, the damping mechanism 134 is disposed at a distance from the rotating shaft 132, the first fan 180 is disposed between the damping mechanism 134 and the rotating shaft 132, and the heat conducting assembly 150 is connected to the damping mechanism 134, and generally, the damping mechanism 134 has a large volume and a large surface area, so that the heat conducting assembly 150 is directly connected to the damping mechanism 134 to improve the heat dissipation effect.

Wherein the thermally conductive assembly 150 and the damping mechanism 134 are lap joined.

Further, the hinge assembly 130 further includes a guide mechanism 136, and the rotation shaft 132 is connected to the first body 110 and the second body 120 through the guide mechanism 136.

As one possible implementation, as shown in fig. 10, 11, and 12, the electronic device 100 further includes: and a plurality of second fans 200, wherein the hinge assemblies 130 are provided, the second fans 200 are disposed between the adjacent hinge assemblies 130, and the second fans 200 adjust states according to the detection result of the temperature detection assembly 190.

Specifically, the hinge assembly 130 is provided in plurality, the second fan 200 is provided between the adjacent hinge assemblies 130, and the second fan 200 adjusts the state according to the detection result of the temperature detection assembly 190. And the combination of the first fan 180 and the second fan 200 can improve the heat dissipation effect of the hinge assembly 130.

Wherein the heat conductive assembly 150 is coupled to one of the plurality of hinge assemblies 130.

Further, the second fan 200 is provided on the guide mechanism 136, or the second fan 200 may be mounted on the middle pillar of the hinge assembly 130.

Also, the second fan 200 may have a plurality of gears, and the operating gear of the second fan 200 may be controlled according to the temperature of the heat conductive assembly 150.

The hinge assembly 130 is illustrated as having two, namely two first fans 180 and one second fan 200: when the temperature of the heat conducting assembly 150 is lower than the third preset temperature, the first fan 180 and the second fan 200 are not turned on, and the heat on the electronic component 140 is conducted to the hinge assembly 130 through the heat conducting assembly 150, so that the hinge assembly 130 is used for heat dissipation. Wherein the third preset temperature is within a range of 41 ℃ to 43 ℃.

When the temperature is equal to or higher than the third preset temperature and lower than the fourth preset temperature, the first fan 180 disposed on the hinge assembly 130 connected to the heat conduction assembly 150 is turned on to operate at the first gear, the other first fan 180 and the second fan 200 are not turned on, and the heat on the electronic component 140 is conducted to the hinge assembly 130 through the heat conduction assembly 150, and the hinge assembly 130 is used for heat dissipation. Wherein the fourth preset temperature is in a range of 44 ℃ to 46 ℃.

When the temperature is equal to or higher than the fourth preset temperature and lower than the fifth preset temperature, the first fan 180 disposed on the hinge assembly 130 connected to the heat conduction assembly 150 is turned on to operate at the first gear, the second fan 200 is turned on to operate at the first gear, the other first fan 180 is not turned on, and the heat on the electronic component 140 is conducted to the hinge assembly 130 through the heat conduction assembly 150, and the hinge assembly 130 is used for heat dissipation. Wherein the value range of the fifth preset temperature is 49 ℃ to 51 ℃.

When the temperature is equal to or higher than the fifth preset temperature and lower than the sixth preset temperature, the two first fans 180 and the one second fan 200 are both turned on and both operate at the first gear, and the heat on the electronic component 140 is conducted to the hinge assembly 130 through the heat conducting assembly 150, and is dissipated by the hinge assembly 130. Wherein the value range of the sixth preset temperature is 59 ℃ to 61 ℃.

When the temperature is equal to or higher than the sixth preset temperature and lower than the seventh preset temperature, the two first fans 180 and the one second fan 200 are both turned on and both operate in the second gear, and the heat on the electronic component 140 is conducted to the hinge assembly 130 through the heat conducting assembly 150, and is dissipated by the hinge assembly 130. Wherein, the value range of the seventh preset temperature is 69 ℃ to 71 ℃.

When the temperature is equal to or higher than the seventh preset temperature, the two first fans 180 and the one second fan 200 are both turned on and both operate at the third gear, and the heat on the electronic component 140 is conducted to the hinge assembly 130 through the heat conductive assembly 150, and is dissipated by the hinge assembly 130.

The air volume of the first fan 180 at the first gear is smaller than the air volume of the first fan 180 at the second gear, the air volume of the first fan 180 at the second gear is smaller than the air volume of the first fan 180 at the third gear, the air volume of the second fan 200 at the first gear is smaller than the air volume of the second fan 200 at the second gear, and the air volume of the second fan 200 at the second gear is smaller than the air volume of the second fan 200 at the third gear.

As one possible embodiment, as shown in fig. 11, the hinge assembly 130 includes: the housing 138, the housing 138 has a heat sink, and the first fan 180 is disposed at the heat sink.

Specifically, the hinge assembly 130 includes a housing 138, at least a portion of the rotating shaft 132 and the damping assembly is located inside the housing 138, a heat sink is disposed on the housing 138, and the first fan 180 is disposed at the heat sink, so as to enhance the airflow flowing effect inside the hinge assembly 130 and improve the heat dissipation effect.

Further, the heat dissipation openings are multiple, and the first fan 180 and the second fan 200 are respectively disposed at different heat dissipation openings, so as to improve the heat dissipation effect.

Taking the electronic device 100 having two first fans 180 therein, one second fan 200 as an example, the second fan 200 is disposed at a middle position of the hinge assembly 130, one first fan 180 is disposed at one quarter of the hinge assembly 130, and the other first fan 180 is disposed at three quarters of the hinge assembly 130.

As one possible embodiment, at least one of the shaft 132 and the damping mechanism 134 has a thermally conductive layer.

Specifically, at least one of the rotating shaft 132 and the damping mechanism 134 has a heat conductive layer, thereby improving the heat conduction and dissipation effects of the hinge assembly 130 by using the heat conductive layer.

Further, the guide mechanism 136 also has a heat conductive layer.

The heat conducting layer may be a metal layer, for example: copper layer, aluminium layer, iron layer or gold layer etc. the heat conduction layer can also adopt metal alloy layer, for example: the heat conducting layer can also adopt a graphite layer, and the heat conducting layer can also adopt a graphene layer and the like.

The bodies of the rotating shaft 132 and the damping mechanism 134 may be made of steel.

Note that the heat conductive layers of the rotating shaft 132, the damping mechanism 134, and the guide mechanism 136 are provided on the respective components, and the heat conductive layers are not provided on the rotating shaft 132, the damping mechanism 134, and the guide mechanism 136 that have been mounted.

As a possible embodiment, as shown in fig. 3, 6 and 10, the electronic component 140 includes: a processor 142; the camera assembly 144, the processor 142 and the camera assembly 144 are arranged on the first body 110; the heat conduction assembly 150 includes a first heat conduction portion 156, a second heat conduction portion 158, and a third heat conduction portion 160, the first heat conduction portion 156 is connected to the second heat conduction portion 158, the first heat conduction portion 156 is connected to the third heat conduction portion 160, the first heat conduction portion 156 is connected to the hinge assembly 130, the second heat conduction portion 158 is connected to the processor 142, and the third heat conduction portion 160 is connected to the camera assembly 144. As shown in fig. 4, the heat conducting rod 162 may include the first heat conducting portion 156, the second heat conducting portion 158, and the third heat conducting portion 160, and as shown in fig. 7, the heat conducting pipe 152 may include the first heat conducting portion 156, the second heat conducting portion 158, and the third heat conducting portion 160.

Specifically, the electronic component 140 includes the processor 142 and the camera assembly 144, and the processor 142 and the camera assembly 144 generate heat during operation, and a large amount of heat may be generated if the processed data is excessive, so that the heat generated by the camera assembly 144 and the processor 142 is transferred to the hinge assembly 130 by using the heat conducting assembly 150, thereby improving the heat dissipation effect of the processor 142 and the camera assembly 144, and improving the heat dissipation effect of the whole electronic device 100.

Also, the processor 142 and the camera assembly 144 are both provided at the first body 110 or at the second body 120, and specifically, the processor 142 and the camera assembly 144 are both provided on a main circuit board located at one of the first body 110 and the second body 120, and the other of the first body 110 and the second body 120 is provided with a sub circuit board 240.

The heat conduction assembly 150 includes a first heat conduction portion 156, a second heat conduction portion 158, and a third heat conduction portion 160, wherein the second heat conduction portion 158 and the third heat conduction portion 160 are connected to the first heat conduction portion 156 to form a "T" structure, and the first heat conduction portion 156, the second heat conduction portion 158, and the third heat conduction portion 160 are an integrated structure or a split structure.

The first heat conduction portion 156 is connected to the hinge assembly 130, the second heat conduction portion 158 is connected to the processor 142, and the third heat conduction portion 160 is connected to the camera assembly 144, so that the space occupied by the heat conduction assembly 150 is reduced, and the heat dissipation effect of the heat conduction assembly 150 can be ensured.

The heat conducting assembly 150 includes a heat conducting rod 162, and the first heat conducting portion 156, the second heat conducting portion 158 and the third heat conducting portion 160 have the same thickness and the same width. The heat conducting assembly 150 includes a heat conducting pipe 152, and the first, second and third

heat conducting parts

156, 158 and 160 have the same thickness and width, and the height and width of the inner space of the heat conducting pipe 152 are the same, specifically, the heat conducting pipe 152 is a round pipe, and the first, second and third

heat conducting parts

156, 158 and 160 have the same outer diameter and the same inner diameter.

As one possible embodiment, as shown in fig. 3 and 6, the screen assembly 210 is disposed on the first body 110 and the second body 120, and the screen assembly 210 may be a flexible screen. The first body 110 is further provided therein with a first battery 220, and the second body 120 is further provided therein with a second battery 230.

As a possible implementation, the electronic device 100 includes a notebook computer, a mobile phone, a tablet computer, and the like.

Reference throughout this specification to "one embodiment," "a particular embodiment," or similar language means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

a first body;

a second body located at one side of the first body;

a hinge assembly connecting the first body and the second body;

an electronic component provided in the first body or the second body;

a thermally conductive assembly connecting the electronic component and the hinge assembly;

wherein heat generated by the electronic component during operation can be conducted to the hinge assembly through the heat conducting assembly.

2. The electronic device of claim 1,

the heat conducting assembly includes:

a heat conducting rod connecting the electronic component and the hinge assembly; or

The heat conducting assembly includes:

a heat pipe connecting the electronic component and the hinge assembly;

and the cooling medium is arranged in the heat conduction pipe.

3. The electronic device of claim 1, further comprising:

and the heat-conducting medium is arranged between the electronic component and the heat-conducting assembly and between the hinge assembly and the heat-conducting assembly.

4. The electronic device of any of claims 1-3, further comprising:

the first fan is arranged on the hinge assembly.

5. The electronic device of claim 4, further comprising:

the temperature detection assembly is arranged on the heat conduction assembly, and the first fan adjusts the state according to the detection result of the temperature detection assembly.

6. The electronic device of claim 5, wherein the hinge assembly comprises:

a rotating shaft;

the damping mechanism is positioned on one side of the rotating shaft, the heat conduction assembly is connected with the damping mechanism, and the first fan is arranged between the rotating shaft and the damping mechanism.

7. The electronic device of claim 6, further comprising:

the number of the hinge assemblies is multiple, the second fan is arranged between the adjacent hinge assemblies, and the state of the second fan is adjusted according to the detection result of the temperature detection assembly.

8. The electronic device of claim 4, wherein the hinge assembly comprises:

the casing, the casing has the thermovent, first fan is located thermovent department.

9. The electronic device of claim 6,

at least one of the shaft and the damping mechanism has a heat conductive layer.

10. The electronic device according to any one of claims 1 to 3, wherein the electronic element includes:

a processor;

the camera shooting assembly, the processor and the camera shooting assembly are arranged on the first main body;

the heat conduction assembly comprises a first heat conduction portion, a second heat conduction portion and a third heat conduction portion, the first heat conduction portion is connected with the second heat conduction portion, the first heat conduction portion is connected with the third heat conduction portion, the first heat conduction portion is connected with the hinge assembly, the second heat conduction portion is connected with the processor, and the third heat conduction portion is connected with the camera assembly.