CN110806272A - Power strip temperature rise testing arrangement - Google Patents

Abstract

The invention relates to a power supply board temperature rise test device, comprising a thermocouple, a workbench, a support frame which is supported on the workbench and can be placed above the power supply board to be tested, and a mounting seat for fixing and installing the thermocouple, and the support frame A guide hole is arranged on the guide hole, and the mounting seat can be slidably installed in the guide hole, and the mounting seat can move up and down relative to the support frame to make the thermocouple abut on the temperature rise test position of the component to be tested. The power board temperature rise test device realizes contact with the component to be tested through the up and down adjustment of the mounting seat, which effectively ensures the tightness of the contact between the thermocouple and the component to be tested, and ensures that the test can truly reflect the component to be tested during the test process. Temperature rise data for components. And in the process of operation, there is no need to fix the thermocouple on the component to be tested, the operation is simple and fast, and the work efficiency is high. Moreover, the separation between the thermocouple and the component to be tested is convenient and will not affect subsequent use.

Description

A power board temperature rise test device

technical field

The invention relates to a power board temperature rise testing device.

Background technique

The temperature rise test of the power board is an important work content of the electrical safety testing of home appliances. In the temperature rise test, a thermocouple is usually used to convert the temperature signal into an electrical signal, and then the temperature rise data is obtained. In order to obtain accurate temperature rise data, thermocouples are usually attached to the surface of the test parts by a fixed method such as pasting. For example, the Chinese utility model patent "Embedded Smart Home Appliance Temperature Rise Test Device" with the authorization announcement number of CN201637497U (application number: 200920215592.3), the disclosed test device is about to be used for testing the thermocouple probe to be arranged on the site. Position and fix it, and then realize the temperature test. First, the thermocouple needs to be fixed manually, which takes a long time. In addition, after the thermocouple is fixed manually, the tightness of the connection between the thermocouple and the component under test cannot be guaranteed, which will cause test errors during the test. In addition, after the temperature rise test is completed, each thermocouple needs to be removed separately, which has low work efficiency, and it is easy to cause certain damage to the tested components and thermocouples during separation, which affects the secondary use. However, if it is fixed by colloid bonding, colloid will also remain on the tested component and thermocouple, which will affect its subsequent use.

SUMMARY OF THE INVENTION

The first technical problem to be solved by the present invention is to provide a power board temperature rise test device that can ensure the tightness of the contact between the thermocouple and the measured part, and facilitate the fixing and separation of the thermocouple and the part. .

The second technical problem to be solved by the present invention is to provide a power board temperature rise test device that can automatically realize the positioning of the thermocouple to test the temperature rise of each component in view of the above-mentioned prior art.

The technical solution adopted by the present invention to solve the above-mentioned first technical problem is: a power supply board temperature rise test device, comprising a thermocouple and a workbench, and is characterized in that: it also includes a support arranged on the workbench and can be placed on the testbench. A support frame above the power board and a mounting seat for fixedly installing the thermocouple, the support frame is provided with a guide hole, the mounting seat can be slidably installed in the guide hole, and the mounting seat can be relatively The support frame moves up and down so that the thermocouple is pressed against the temperature rise test position of the component to be tested.

In order to facilitate the simultaneous testing of multiple thermocouples, a plurality of guide holes are arranged in parallel on the support frame.

In order to facilitate the installation of the thermocouple, facilitate the movement of the mounting seat in the guide hole, and ensure that the thermocouple is in close contact with the component to be tested, the mounting seat includes

a base column, which is hollow, and at least the outer circumference of the upper section of the base column is provided with threads, and the thermocouple is fixedly installed on the lower end of the base column;

a fixing knob, sleeved on the outside of the base post and below the support frame;

an adjustment knob, which is threadedly connected to the outside of the base post and is arranged above the support frame, the adjustment knob extends downward with a connecting portion, and the connecting portion can be fixedly connected with the fixing knob;

The clip is arranged between the fixing knob and the adjustment knob, the clip is sleeved outside the connecting portion, and the outer periphery of the clip is provided with a concave that can be clipped in the guide hole. groove.

In order to ensure that the thermocouple can be in close contact with each component to be tested on the power supply board to be tested by rotating the base column, the lower section of the base column is bent.

Preferably, the base column includes an adjusting rod and a fixing tube detachably connected to the lower part of the adjusting rod, and the thermocouple is fixed on the free end of the fixing tube.

For the convenience of use, the free end of the fixing tube is conical, and the thermocouple is fixed on the tip of the fixing tube.

Preferably, the fixing tube is bent.

The technical solution adopted by the present invention to solve the above-mentioned second technical problem is: further comprising a driving mechanism capable of driving the mounting base to move to the test position, and the driving mechanism is arranged on the workbench and beside the support frame.

Preferably, the driving mechanism is a three-dimensional driving mechanism.

In order to automatically adjust the tightness of the contact between the thermocouple and the component to be tested, it also includes a gripper, a drive source and a controller, the drive source is fixedly installed on the drive mechanism, the gripper is connected to the drive end of the drive source, the The driving source is electrically connected to the controller and drives the gripper to rotate and open and close under the control of the controller.

In order to automatically complete the positioning of each temperature rise test point, a camera electrically connected to the controller is also included.

The structure is simple, the camera is fixedly connected to the driving mechanism, and the camera can move to the top of the power board to be tested.

Preferably, the camera is a line scan camera, and the camera is further provided with a macro lens.

The structure is simple, the support frame is supported and arranged above the power board to be tested by the support frame seat;

In order to realize the fully automated working process of the temperature rise test, the support frame base includes two groups, and the support frame includes a first support frame assembly and a second support frame assembly that are in the shape of a tooth comb and can be butted with each other, wherein the first support frame assembly A support frame assembly is erected on one set of support frame bases, and a second support frame assembly is movably erected on another set of support frame bases away from and close to the first support frame assembly.

Preferably, the power board to be tested can be matched and clamped between the two sets of support brackets.

Preferably, the drive mechanism includes an X-axis drive assembly, a Y-axis drive assembly and a Z-axis drive assembly that are vertically arranged, the Z-axis drive assembly can be slidably connected to the X-axis drive assembly and can be connected to the X-axis drive assembly The X-axis drive assembly is slidably connected to the Y-axis drive assembly and can move along the Y-axis direction under the drive of the Y-axis drive assembly.

Compared with the prior art, the present invention has the advantages that: the power board temperature rise testing device sets the thermocouple on the mounting seat, and then drives the thermocouple to move to the component to be tested through the movement of the mounting seat in the guide hole of the support frame. The upper and lower parts of the thermocouple are in contact with the parts to be tested by adjusting the mounting base up and down, which effectively ensures the tightness of the contact between the thermocouple and the parts to be tested, and ensures that the testing process can truly reflect the quality of the parts to be tested. temperature rise data. And in the process of operation, there is no need to fix the thermocouple on the component to be tested, the operation is simple and fast, and the work efficiency is high. Moreover, the separation between the thermocouple and the component to be tested is convenient and will not affect subsequent use.

In addition, additionally setting the drive mechanism, gripper, drive source, controller, and camera can realize the fully automated operation of the power board temperature rise test device without manual operation, with higher work efficiency and less work error.

Description of drawings

FIG. 1 is a perspective view of a power board temperature rise testing device in an undetected state according to an embodiment of the present invention.

FIG. 2 is a perspective view of a detection state of a power board temperature rise testing device in an embodiment of the present invention.

FIG. 3 is a perspective view of a mounting seat in an embodiment of the present invention.

Detailed ways

The present invention will be further described in detail below with reference to the embodiments of the accompanying drawings.

As shown in FIG. 1 to FIG. 3 , the power board temperature rise test device in this embodiment includes a workbench 2 . The workbench 2 can also be made of materials on the spot, for example, a table with a board surface can be used as the workbench 2 . The workbench 2 in this embodiment is a plate structure.

Two sets of support bases 400 are provided on the workbench 2 . In this embodiment, each set of support bases 400 includes four pillars, which extend upward from the workbench 2 and are arranged in a rectangular shape. In order to conveniently fix the power board to be tested, positioning ribs are vertically arranged on the inner sides of the four adjacent pillars of the two sets of support frames 4 , and the power board can just be clamped between the two sets of support frame bases 400 through the positioning ribs. time, to prevent the power board from shifting during the test and affecting the test results. For the convenience of description, the two groups of support bases 400 in this embodiment are respectively defined as a first support base 400 and a second support base 400 .

The support frame 400 is provided with a support frame 4 , and the support frame 4 includes a first support frame assembly 41 and a second support frame assembly 42 which are in the shape of a tooth comb and can be butted against each other. The first support frame assembly 41 is erected on the first support frame base 400 , and the second support frame assembly 42 is erected on the second support frame base 400 . In the two groups of support frame bases 400 , guide ribs on the same horizontal plane are also arranged on the pillars in the horizontal direction. Both the first support frame assembly 41 and the second support frame assembly 42 are attached above the guide ribs. The second support frame assembly 42 in this embodiment is movably mounted on the guide rib of the second support frame 4 and can approach and move away from the first support frame assembly 41 along the direction of the guide rib. When testing is required, first the second support frame assembly 42 is at a position away from the first support frame assembly 41 . After the power board is clamped between the two sets of support frame bases 400, the second support frame assembly 42 is moved to move toward the direction close to the first support frame assembly 41, and then the front end of the first support frame assembly 41 is aligned. At this time, the second support frame assembly 42 is supported on the four pillars adjacent to the first support frame base 400 and the second support frame base 400 .

After the first support frame assembly 41 and the second support frame assembly 42 are combined, a completed support frame 4 is formed, and the support frame 4 is located above the power board to be tested. The comb gaps on the first support frame assembly 41 and the second support frame assembly 42 are combined to form a plurality of parallel guide holes 40 . The spacing between the guide holes 40 is a design factor that can cover the test positions of the temperature rise components to be measured on the power supply board. After the test is completed, the movable second support frame assembly 42 moves away from the first support frame assembly 41 until the second support frame assembly 42 is completely moved to the second support frame base 400 . At this point, you can take out the power board that has completed the test.

At least one mounting seat 5 for fixing the thermocouple 1 can be placed in each guide hole 40 , and each mounting seat 5 can slide along the guide hole 40 where it is located. The mounting seat 5 in this embodiment includes a base post 51 , a fixing knob 52 , an adjusting knob 53 and a clip 54 , wherein the base post 51 is hollow, and the base post 51 in this embodiment includes an adjusting rod 511 and a detachable connecting rod 511 . The fixing pipe 512 at the lower part of the adjusting rod 511, the adjusting rod 511 and the fixing pipe 512 are both hollow. The free end of the fixing tube 512 is conical, and the tip of the fixing tube 512 is located at the lower end. The detection head of the thermocouple 1 is exposed outside the lower end of the fixed tube 512 , and the signal wire of the thermocouple 1 passes through the fixed tube 512 and the adjustment rod 511 and is connected to an external data processing unit. For example, the data collected by the thermocouple 1 can be processed in the setting computer, and then the temperature rise curve data of each component on the power board can be obtained.

In this embodiment, the fixing tube 512 is bent so that the vertical distance between the lower end of the fixing tube 512 and the axis of the fixing tube 512 is not less than half of the distance between the two guide holes 40 . By rotating the mounting seat 5 in this way, the mounting seat 5 in the guide hole 40 can drive the thermocouple 1 to each detection position on the power board.

At least the outer circumference of the upper section of the base column 51 is provided with threads, that is, the outer circumference of the adjustment rod 511 is provided with threads. The fixing knob 52 is sleeved outside the adjusting rod 511 and is arranged below the support frame 4 . The adjusting knob 53 is connected to the outside of the adjusting rod 511 through an internal thread and is disposed above the support frame 4 . The adjusting knob 53 extends downward with a connecting portion, which has an external thread, and the fixing knob 52 has an internal thread. The clamping piece 54 is sleeved outside the connecting portion. After the fixing knob 52 and the connecting knob are fixed, the clamping piece 54 is located between the fixing knob 52 and the adjusting knob 53. The groove 541 in the guide hole 40 . That is, the mounting seat 5 is clamped in the guide hole 40 through the groove 541 , and can move along the guide of the guide hole 40 . By rotating the adjustment knob 53 , the base post 51 can be moved up and down relative to the support frame 4 , so that the detection head of the thermocouple 1 can be tightly pressed against the surface of the components on the power board, thereby facilitating the acquisition of accurate temperature data.

A driving mechanism 6 is also provided on the worktable 2 , and the driving mechanism 6 is located beside the support frame 400 . The driving mechanism 6 in this embodiment adopts a common three-dimensional driving mechanism 6 . Specifically, the X-axis drive assembly 61 , the Y-axis drive assembly 62 and the Z-axis drive assembly 63 are arranged perpendicular to each other in the drive mechanism 6 in this embodiment, and the Z-axis drive assembly 63 is slidably connected to the X-axis drive assembly 61 and The X-axis driving assembly 61 can move in the X-axis direction under the driving of the X-axis driving assembly 61 .

The driving mechanism 6 is also electrically connected to an external processing unit, and performs driving work under the control of the external processing unit. The driving mechanism 6 in this embodiment is further provided with a clamping jaw 7 , a driving source 8 and a camera 9 . For the convenience of installation, the Z-axis drive assembly 63 in this embodiment includes two synchronous guide columns, one of which is driven to connect to the drive source 8, the other to be driven to connect to the camera 9, and the Z-axis drives The driver of the assembly 63 can drive the drive source 8 and the camera 9 to move up and down along the Z axis. The clamping jaw 7 is connected to the driving end of the driving source 8, and the driving source 8 can be driven to perform rotation, opening, clamping and other actions. A controller is also provided externally, and the controller can adopt the aforementioned processing unit, that is, a computer can be provided externally, and the processor in the computer can be used as the controller. The controller electrically connects the driving source 8 and the camera 9 respectively, and then controls the driving source 8 and the camera 9 to work. The camera 9 in this embodiment adopts a line scan camera, and the camera 9 is also provided with a macro lens.

The use process of the power board temperature rise testing device is as follows: the power board to be tested is fixedly clamped between two sets of support brackets 400 . Then the driving mechanism 6 drives the camera 9 to move to a position suitable for taking pictures above the power board 3 to be tested, and then the camera 9 takes a picture of the power board, and then transmits the taken picture to the controller, and the controller processes the picture, and then obtains The coordinate position of each component on the power board to be tested for temperature rise. Then the controller controls the driving mechanism 6 to work, and drives the clamping jaws 7 to move to the position of the second supporting frame assembly 42, and the clamping jaws 7 clamp the second supporting frame assembly 42, thereby driving the second supporting frame assembly 42 to the first supporting frame assembly. 41 moves and engages with the first support frame assembly 41 . A complete support frame 4 is formed after the abutment, and a plurality of parallel guide holes 40 are formed on the support frame 4 at the same time. The controller controls the drive mechanism 6 to work according to the coordinate position of each component, and drives the gripper 7 to drive the mounting base 5 along the corresponding test position. If the thermocouple 1 at the lower end of the mounting seat 5 cannot directly contact the test position, the driving source 8 drives the clamping jaw 7 to rotate, the clamping jaw 7 clamps the base post 51, and then drives the base post 51 to rotate, so that the tip of the base post 51 corresponds to above the test location. After the thermocouple 1 is located directly above the test position, the driving source 8 drives the gripper 7 to clamp the adjustment knob 53, and drives the adjustment knob 53 to rotate, so that the base column 51 moves up and down, so that the thermocouple 1 is tightly pressed against the component. on the surface of the test location. After all the thermocouples 1 are in close contact with the test position, the controller collects the temperature data collected by the thermocouples 1, and then the controller draws a temperature rise curve through calculation.

After the temperature rise test of one power board is completed, the clamping jaw 7 drives the second support frame assembly 42 to move away from the first support frame assembly 41, and after the power board is exposed, the power board can be removed from the two sets of support frame bases. Take out between 400.

The power board temperature rise test device can effectively ensure the tightness of the contact between the thermocouple 1 and the component to be tested when in use, and ensure that the temperature rise data of the component to be tested can be truly reflected during the testing process. In addition, during the operation, the thermocouple 1 does not need to be fixed and pasted on the component to be tested, the operation is simple and fast, and the work efficiency is high. Moreover, the separation between the thermocouple 1 and the component to be tested is convenient, and subsequent use will not be affected.

Claims (17)

1. A power supply board temperature rise test device, comprising a thermocouple (1), a workbench (2), and characterized in that: it also includes a support that is arranged on the workbench (2) and can be placed on the power supply board (3) to be measured The upper support frame (4) and the mounting seat (5) for fixing and installing the thermocouple (1), the support frame (4) is provided with a guide hole (40), and the mounting seat (5) is slidable It is installed in the guide hole (40), and the mounting seat (5) can move up and down relative to the support frame (4) so that the thermocouple (1) is pressed against the temperature rise test position of the component to be tested. 2 . The power board temperature rise test device according to claim 1 , wherein a plurality of guide holes ( 40 ) are arranged in parallel on the support frame ( 4 ). 3 . 3. The power board temperature rise test device according to claim 1, characterized in that: the mounting seat (5) comprises a base post (51), which is hollow, and at least the outer periphery of the upper section of the base post (51) A thread is provided, and the thermocouple (1) is fixedly installed on the lower end of the base column (51); a fixing knob (52), sleeved on the outside of the base column (51) and below the support frame (4); An adjustment knob (53) is screwed on the outside of the base column (51) and is arranged above the support frame (4), the adjustment knob (53) has a connecting portion extending downward, and the connecting portion can be connected with The fixed knob (52) is fixedly connected; The clip (54) is arranged between the fixing knob (52) and the adjustment knob (53), the clip (54) is sleeved outside the connecting portion, and the clip (54) is The outer periphery is provided with a groove (541) which can be clamped in the guide hole (40) along the circumferential direction. 4. The power board temperature rise test device according to claim 3, characterized in that: the lower section of the base column (51) is bent and arranged. 5 . The power board temperature rise test device according to claim 3 , wherein the base column ( 51 ) comprises an adjusting rod ( 511 ) and a fixing pipe ( 512 ) that can be detachably connected to the lower part of the adjusting rod ( 511 ). 6 . , the thermocouple (1) is fixed on the free end of the fixing tube (512). 6. The power board temperature rise test device according to claim 5, wherein the free end of the fixing tube (512) is conical, and the thermocouple (1) is fixed on the tip of the fixing tube (512). . 7. The power board temperature rise test device according to claim 5, wherein the fixing tube (512) is bent and arranged. 8. The power board temperature rise test device according to any one of claims 1 to 7, characterized in that it further comprises a drive mechanism (6) capable of driving the mounting seat (5) to move to the test position, the drive mechanism (6) is arranged on the workbench (2) and beside the support frame (4). 9 . The power board temperature rise testing device according to claim 8 , wherein the driving mechanism ( 6 ) is a three-dimensional driving mechanism ( 6 ). 10 . 10. The power board temperature rise test device according to claim 8, characterized in that: it further comprises a clamping jaw (7), a driving source (8) and a controller, wherein the driving source (8) is fixedly installed on the driving mechanism ( 6), the gripper (7) is connected to the drive end of the drive source (8), the drive source (8) is electrically connected to the controller and drives the gripper (7) to rotate under the control of the controller and opening and closing. 11. The power board temperature rise testing device according to claim 8, characterized in that it further comprises a camera (9) electrically connected to the controller. 12. The power board temperature rise test device according to claim 11, wherein the camera (9) is fixedly connected to the driving mechanism (6), and the camera (9) can move to the power board to be tested ( 3) above. 13 . The power board temperature rise test device according to claim 11 , wherein the camera ( 9 ) is a line scan camera, and a macro lens is further provided on the camera ( 9 ). 14 . 14. The power board temperature rise test device according to any one of claims 1 to 7, wherein the support frame (4) is supported on the power board (3) to be tested by a support frame seat (400). above. 15. The power board temperature rise test device according to claim 14, characterized in that: the support frame seat (400) includes two groups, and the support frame (4) includes a tooth comb shape and can be butted with each other The first support frame assembly (41) and the second support frame assembly (42), wherein the first support frame assembly (41) is erected on a set of support frame bases (400), and the second support frame assembly (42) can move The ground is erected on another group of support frame bases (400) away from and close to the first support frame assembly (41). 16. The power board temperature rise test device according to claim 15, wherein the power board (3) to be tested can be matched and clamped between two sets of support brackets (400). 17. The power board temperature rise test device according to claim 9, wherein the drive mechanism (6) comprises an X-axis drive assembly (61), a Y-axis drive assembly (62) and a Z-axis that are arranged perpendicular to each other A drive assembly (63), the Z-axis drive assembly (63) is slidably connected to the X-axis drive assembly (61) and can move in the X-axis direction under the drive of the X-axis drive assembly (61), the X-axis The shaft driving assembly (61) is slidably connected to the Y-axis driving assembly (62) and can move along the Y-axis direction under the driving of the Y-axis driving assembly (62).

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