CN110797624A - High-power tile-type phased array antenna - Google Patents
High-power tile-type phased array antenna Download PDFInfo
- Publication number
- CN110797624A CN110797624A CN201911088406.9A CN201911088406A CN110797624A CN 110797624 A CN110797624 A CN 110797624A CN 201911088406 A CN201911088406 A CN 201911088406A CN 110797624 A CN110797624 A CN 110797624A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- board layer
- heat dissipation
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Abstract
The invention discloses a high-power tile-type phased array antenna, which comprises a first printed circuit board layer, a second printed circuit board layer and a third printed circuit board layer which are sequentially arranged; the first printed circuit board layer is used for transmitting radio frequency signals and realizing a 64-unit power division network; the second printed circuit board layer is electrically connected with the first printed circuit board layer and is used for controlling the phase shift and attenuation of signals; the third printed circuit board layer is electrically connected with the second printed circuit board layer and is used for power supply and signal input control; a plurality of chips for signal output are arranged on the first printed circuit board layer; and a heat dissipation cold plate is further arranged between the second printed circuit board layer and the third printed circuit board layer, and a heat absorption end of the heat dissipation cold plate is in contact with the chip. The invention can solve the problem of chip heating in the antenna in real time, thereby really realizing high-power transmission of signals.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a high-power tile-type phased array antenna.
Background
Traditional radar phased array antenna mainly adopts brick formula T/R subassembly or tile formula T/R subassembly, and traditional brick formula integrated mode mainly indicates: the T/R assembly adopts an integrated form of longitudinal layout and transverse assembly; the tile type integration mode mainly refers to: the T/R assembly adopts an integrated form of transverse layout, longitudinal assembly and vertical interconnection.
The traditional brick type antenna has the advantages of large longitudinal size, heavy weight, low integration level and high requirement on the scale of a feed network, and the tile type antenna has a series of advantages of high density set, low section, light weight, low batch production cost and the like, so that the brick type antenna can be widely applied.
However, the tile-type phased array antenna has the following defects: because the integration level is higher, the heat dissipation effect of the chip in the antenna is poorer, and the antenna is easy to burn due to overheating when the power is higher, so that the conventional tile-type phased array antenna is difficult to be applied to high power, and the application range of the antenna is severely limited.
Disclosure of Invention
The invention aims to solve the problem that the chip in the existing tile-type phased array antenna has poor heat dissipation effect and cannot be applied to high-power application, and the invention aims to provide a tile-type phased array antenna which can solve the problem of heating of the chip in the antenna in real time so as to really realize high-power transmission.
The technical scheme adopted by the invention is as follows:
a high-power tile-type phased-array antenna comprises a first printed circuit board layer, a second printed circuit board layer and a third printed circuit board layer which are sequentially arranged;
the first printed circuit board layer is used for transmitting radio frequency signals and realizing a 64-unit power division network;
the second printed circuit board layer is electrically connected with the first printed circuit board layer and is used for controlling the phase shift and attenuation of signals;
the third printed circuit board layer is electrically connected with the second printed circuit board layer and is used for power supply and signal input control;
a plurality of chips for signal output are arranged on the first printed circuit board layer;
and a heat dissipation cold plate is further arranged between the second printed circuit board layer and the third printed circuit board layer, and a heat absorption end of the heat dissipation cold plate is in contact with the chip.
Optimally, the heat dissipation cold plate is a hollow plate, wherein a capillary heat dissipation channel is arranged in an inner cavity of the heat dissipation cold plate, and heat dissipation liquid is stored in the capillary heat dissipation channel;
the surface of the heat dissipation cold plate facing the second printed circuit board layer is provided with a plurality of heat dissipation bosses with the same number as the chips;
and each heat dissipation boss is used as a heat absorption end of the heat dissipation cold plate and is in one-to-one corresponding contact with the chip.
Optimally, through holes corresponding to the heat dissipation bosses one by one are formed in the second printed circuit board layer;
the chips are positioned on the surface of the first printed circuit board layer facing the second printed circuit board layer and correspond to the through holes one by one;
the heat dissipation boss contacts the chip on the corresponding side after penetrating through the through hole on the corresponding side.
Preferably, heat-conducting silicone grease is further arranged between the chip and the heat dissipation boss.
Preferably, the first printed circuit board layer and the second printed circuit board layer and the third printed circuit board layer are conducted through a hair button structure.
Preferably, the chip is electrically connected to the first printed circuit board layer through solder balls.
Preferably, the surface of the first printed circuit board layer, which faces away from the second printed circuit board layer, is provided with a plurality of antenna units, and the number of the chips is 16.
Preferably, a digital-to-analog conversion chip and a plurality of interface circuits are arranged on the surface of the second printed circuit board layer facing the first printed circuit board layer.
Preferably, the surface of the third printed circuit board layer, which faces away from the heat dissipation cold plate, is provided with an FPGA chip, a FLASH chip, a DC-DC power circuit and an IO interface.
Preferably, the sum of the thicknesses of the first printed circuit board layer, the second printed circuit board layer and the third printed circuit board layer is 20 mm.
The invention has the beneficial effects that:
(1) the invention relates to a high-power tile-type phased array antenna, which is characterized in that a layer of heat dissipation cold plate is arranged in the tile-type phased array antenna, and the heat dissipation cold plate is in contact with a chip for signal output on a first printed circuit board layer, so that the chip is subjected to real-time heat dissipation, the problem that the chip is overheated is avoided, the problem that the chip in the traditional tile-type phased array antenna cannot dissipate heat is solved, and the high-power work of the chip and the high-power transmission of signals can be really realized.
(2) The heat dissipation cold plate provided by the invention is internally provided with the capillary heat dissipation channel, the heat dissipation liquid is stored in the capillary heat dissipation channel, and the capillary heat dissipation channel is matched with the heat dissipation liquid for use, so that the heat dissipation cold plate has the advantages of large heat exchange area, good heat conductivity and uniform heat exchange.
(3) The heat-conducting silicone grease is arranged between the heat-radiating cold plate and the chip, is a high-heat-conducting insulating silicone material, can hardly be cured forever, can keep a grease state in use for a long time, and has excellent electrical insulation and excellent heat conductivity. Through the design, the heat generated by the chip can be quickly transferred to the heat dissipation cold plate, so that the heat dissipation of the heat dissipation cold plate to the chip is further increased, and the heat dissipation requirement of the chip in the high-power working process is met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a cross-sectional view of a high power tile-type phased array antenna provided by the present invention.
Fig. 2 is an exploded view of a high power tile-type phased array antenna provided by the present invention.
FIG. 3 is a schematic diagram of the internal structure of a heat sink cold plate according to the present invention.
Fig. 4 is a top view of a first printed circuit board layer provided by the present invention.
Fig. 5 is a bottom view of a first printed circuit board layer provided by the present invention.
Fig. 6 is a top view of a second printed circuit board layer provided by the present invention.
Fig. 7 is a bottom view of a second printed circuit board layer provided by the present invention.
Fig. 8 is a bottom view of a third printed circuit board layer provided by the present invention.
Reference numeral, 1-a first printed circuit board layer; 2-a second printed circuit board layer; 3-a third printed circuit board layer; 4-chip; 5-heat dissipation cold plate; 6-capillary heat dissipation channel; 7-radiating bosses; 8-a through hole; 9-tin ball; 10-an antenna element; 11-a digital-to-analog conversion chip; 12-an FPGA chip; 13-FLASH chip; 14-DC-DC power supply circuit; 15-hair button structure.
Detailed Description
The invention will be further illustrated with reference to specific examples. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto.
The term "and/or" herein is merely an association relationship describing an associated object, and means that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, B exists alone, and A and B exist at the same time, and the term "/and" is used herein to describe another association object relationship, which means that two relationships may exist, for example, A/and B, may mean: a alone, and both a and B alone, and further, the character "/" in this document generally means that the former and latter associated objects are in an "or" relationship.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and/or groups thereof.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
Furthermore, the particular features, structures, functions, or characteristics may be combined in any suitable manner in one or more embodiments. For example, a first embodiment may be combined with a second embodiment as long as the particular features, structures, functions, or characteristics associated with the two embodiments are not mutually exclusive.
Example one
As shown in fig. 1 to 8, the high-power tile-type phased-array antenna provided in this embodiment includes a first printed circuit board layer 1, a second printed circuit board layer 2, and a third printed circuit board layer 3, which are sequentially disposed.
The first printed circuit board layer 1 is used for transmitting radio frequency signals and realizing a 64-unit power division network.
The second printed circuit board layer 2 is electrically connected to the first printed circuit board layer 1 for controlling the phase shift and attenuation of signals.
The third printed circuit board layer 3 is electrically connected to the second printed circuit board layer 2, and is used for power supply and signal input control.
And a plurality of chips 4 for signal output are arranged on the first printed circuit board layer 1.
A heat dissipation cold plate 5 is further arranged between the second printed circuit board layer 2 and the third printed circuit board layer 3, and a heat absorption end of the heat dissipation cold plate 5 is in contact with the chip 4.
As shown in fig. 1 and 2, the specific structure of the high-power tile-type phased array antenna is described as follows:
the high-power tile-type phased-array antenna comprises three printed circuit boards, namely a first printed circuit board layer 1, a second printed circuit board layer 2 and a third printed circuit board layer 3 are sequentially arranged from top to bottom as can be seen from figure 1.
The chip 4 on the first printed circuit board layer 1 is used for outputting signals to achieve communication transmission of the antenna, and just as the chip 4 is used for signal transmission, heating is serious during operation, and high-power transmission of the signals is required to be met, namely heat dissipation of the chip 4 is required to be guaranteed, so that the heat dissipation cold plate 5 is arranged between the second printed circuit board layer 2 and the third printed circuit board layer 3, and a heat absorption end of the heat dissipation cold plate 5 is in contact with the chip 4 to absorb heat generated on the chip 4 in real time, so that heat dissipation of the chip 4 is achieved.
Through the design, the chip 4 is cooled in real time through the heat dissipation cold plate 5, the chip 4 is prevented from being burnt down due to overheating, the problem that the chip cannot be cooled in the traditional tile-type phased array antenna is solved, and the high-power transmission of the chip 4 can be realized through the heat dissipation of the chip.
In this embodiment, the first printed circuit board layer 1 is used for transmitting rf signals and implementing a 64-element power division network to implement multi-channel transmission of signals.
In this embodiment, the chip 4 is a gallium nitride chip (GaN chip), which mainly provides a high-power microwave signal output and includes a power divider with four divisions and a vector modulator.
The power divider is a device which divides one path of input signal into two paths or multiple paths of input signals and outputs equal or unequal energy, and a 64-unit power division network of the first printed circuit board layer 1 can be realized through the power divider. While a vector modulator is a device that performs phase shifting and attenuation of signals.
The second printed circuit board layer 2 is used for controlling the phase shift and attenuation of signals, and particularly controls the vector modulator to realize the phase shift and attenuation of signals and some refreshing signals through voltage output signals.
The third printed circuit board layer 3 is a digital control part, which may also be called a power beam control board, and on one hand, performs input control of signals, and on the other hand, is used for receiving power from a power extension to perform power distribution of each active device in the phased array antenna.
Through the design, the phased array antenna provided by the embodiment can dissipate heat of the chip 4 in real time through the heat dissipation cold plate 5, meets the heat dissipation requirement of the chip 4 for high-power transmission, and then truly realizes the high-power transmission of the chip 4.
Example two
As shown in fig. 1 to 8, this embodiment is a specific implementation of the high-power tile-type phased array antenna described in the first embodiment.
The structure in a phased array antenna is described in detail below:
as shown in fig. 1, 2 and 3, the following description of the specific structure of a heat sink cold plate is provided:
preferably, the heat dissipation cold plate 5 is a hollow plate, wherein a capillary heat dissipation channel 6 is arranged in an inner cavity of the heat dissipation cold plate 5, and a heat dissipation liquid is stored in the capillary heat dissipation channel 6.
The surface of the heat dissipation cold plate 5 facing the second printed circuit board layer 2 is provided with a plurality of heat dissipation bosses 7 with the same number as the chips 4.
Each heat dissipation boss 7 is used as a heat absorption end of the heat dissipation cold plate 5 and is in one-to-one corresponding contact with the chip 4.
First, the heat dissipation cold plate 5 is provided with heat dissipation bosses 7, the number of which is the same as that of the chips 4, that is, each heat dissipation boss 7 corresponds to one chip 4, and the heat dissipation bosses are used for dissipating heat of the chip 4.
Through the design, each chip 4 can be guaranteed to achieve a good heat dissipation effect, and a reliable heat dissipation guarantee is provided for the work of each chip 4.
The heat dissipation cold plate 5 is a hollow plate, a capillary heat dissipation channel 6 is arranged in the inner cavity, and heat dissipation liquid is stored in the capillary heat dissipation channel 6.
The capillary heat dissipation channel 6 comprises a plurality of capillaries, namely heat dissipation channels formed by the capillaries in the inner cavity of the heat dissipation cold plate 5, the channels are communicated, and heat dissipation liquid is stored in the capillaries.
The capillary is a thin tube with the inner diameter of less than 1 millimeter, and is an existing device.
Through the design, the heat of the heat dissipation boss 7 absorbed from the chip 4 can be transferred to the capillary inside through the heat dissipation cold plate 5, and the heat can be dispersed due to a large number of capillaries, and meanwhile, the heat on each capillary can be quickly absorbed by the aid of heat dissipation liquid in the capillary, so that the function of quickly dissipating heat of the chip 4 is finally achieved.
In this embodiment, the heat-dissipating cold plate 5 is made of aluminum alloy or copper material.
In this embodiment, the capillary tubes may be combined into a capillary network, which may achieve the same technical effect as the capillary heat dissipation channel 6.
In the present embodiment, the heat dissipating liquid may be, but is not limited to, liquid water.
Preferably, through holes 8 corresponding to the heat dissipation bosses 7 one by one are formed in the second printed circuit board layer 2;
the chips 4 are positioned on the surface of the first printed circuit board layer 1 facing the second printed circuit board layer 2 and are in one-to-one correspondence with the positions of the through holes 8.
The heat dissipation boss 7 contacts the chip 4 on the corresponding side after passing through the through hole 8 on the corresponding side.
As shown in fig. 2, the specific installation structure of the heat dissipation cold plate 5 and the first printed circuit board layer 1 can be seen from fig. 2.
Through set up through-hole 8 on second printed circuit board layer 2, will dispel the heat boss 7 and pass through-hole 8, and then with chip 4 contact, realize the heat dissipation to chip 4.
Through the design, the second printed circuit board layer 2 can be installed on the heat dissipation cold plate 5, so that the heat dissipation cold plate 5 can dissipate the heat of the second printed circuit board layer 2, the temperature of electronic devices on the second printed circuit board layer 2 is reduced, and the working stability of the whole second printed circuit board layer 2 can be improved.
Preferably, heat-conducting silicone grease is further arranged between the chip 4 and the heat dissipation boss 7.
The scheme is further optimized, namely heat-conducting silicone grease is arranged between the chip 4 and the heat-radiating boss 7, namely heat on the chip 4 is conducted to the heat-radiating boss 7 through the heat-conducting silicone grease.
The heat-conducting silicone grease is a high-heat-conducting insulating silicone material, can hardly be cured forever, can keep a grease state for a long time when in use, and has excellent electrical insulation and excellent heat conductivity. Through the design, the heat generated on the chip 4 can be quickly transferred to the heat dissipation boss 7, and the heat dissipation of the chip 4 by the heat dissipation cold plate 5 is further increased, so that the heat dissipation requirement of the chip in the high-power working process is met.
Preferably, the first printed circuit board layer 1 and the second printed circuit board layer 2, and the second printed circuit board layer 2 and the third printed circuit board layer 3 are connected through a ground button structure 15.
The hair button structure 15 is an existing connecting structure, the hair button connecting structure 15 has the advantages of being stable in connecting contact and small in size, the hair button structure 15 is adopted to conduct between the printed circuit board layers, the transmission stability can be guaranteed, the thickness of the whole antenna is reduced, and the integration level of the whole antenna is improved.
In this embodiment, the printed circuit board layers can be conducted in a pin arrangement manner.
Preferably, the chip 4 is electrically connected to the first printed circuit board layer 1 through solder balls 9.
The tin ball 9 is adopted, so that the connection stability between the chip 4 and the first printed circuit board layer 1 can be increased, and the specific connection mode is as follows: the solder balls 9 are mounted on the surface of the chip 4 by a Flip-chip (a prior art) process, and then connected to the first printed circuit board layer 1 by a surface mounting process.
Preferably, the surface of the first printed circuit board layer 1, which faces away from the second printed circuit board layer 2, is provided with a plurality of antenna units 10, and the number of the chips 4 is 16.
As shown in fig. 4 and 5, the antenna unit 10 is disposed on a surface of the first printed circuit board layer 1 facing away from the second printed circuit board layer 2 as transmission of a signal. In the present embodiment, the number of the antenna units 10 is 64.
As described in the first embodiment, each chip 4 includes a power divider that divides four by one, and the number of chips 4 is 16; meanwhile, in the embodiment, the first layer printed circuit board 1 further includes a power dividing circuit of 1 to 16, so that it substantially constitutes a power dividing network of 64 units in the first embodiment.
Preferably, a digital-to-analog conversion chip 11 and a plurality of interface circuits are arranged on the surface of the second printed circuit board layer 2 facing the first printed circuit board layer 1.
As shown in fig. 6 and 7, the digital-to-analog conversion chip 11 is used for implementing digital-to-analog conversion, and the interface circuit receives some signals of voltage output, and controls the vector modulator in the chip 4 to implement phase shift and attenuation of the signals according to the signals.
In this embodiment, the interface circuit has an SPI interface, and is also connected to the control port of the FPGA chip 12.
Preferably, an FPGA chip 12, a FLASH chip 13, a DC-DC power circuit 14 and an IO interface are disposed on a surface of the third printed circuit board layer 3 facing away from the heat dissipation cold plate 5.
As shown in fig. 8, the FLASH chip 12 is mainly used to store phase data of the phased array antenna, the IO interface is mainly an interface for controlling phase shift and attenuation of output voltage of the digital-to-analog conversion chip 11 by the FPGA, and the DC-DC power circuit 14 is a power supply circuit for supplying power to electronic devices in the whole antenna.
Preferably, the sum of the thicknesses of the first printed circuit board layer 1, the second printed circuit board layer 2 and the third printed circuit board layer 3 is 20 mm.
Through the design, the whole antenna can be ensured to be small in size, light in weight, high in integration level and convenient for batch production.
In the present embodiment, the first printed circuit board layer 1, the second printed circuit board layer 2 and the third printed circuit board layer 3 are illustrated as being square, and the length and the width thereof are 85 mm.
In summary, the high-power tile-type phased array antenna provided by the invention has the following technical effects:
(1) the invention can dissipate the heat of the chip 4 in real time through the heat dissipation cold plate 5, thereby meeting the heat dissipation requirement of the chip 4 for high-power transmission and further really realizing the high-power transmission of the chip 4.
(2) The phased array antenna provided by the invention has the advantages of thin thickness, small volume and high integration level, and is suitable for batch production.
The invention is not limited to the above alternative embodiments, and any other various forms of products can be obtained by anyone in the light of the present invention, but any changes in shape or structure thereof, which fall within the scope of the present invention as defined in the claims, fall within the scope of the present invention.
Claims (10)
1. A high-power tile-type phased array antenna is characterized in that: the printed circuit board comprises a first printed circuit board layer (1), a second printed circuit board layer (2) and a third printed circuit board layer (3) which are arranged in sequence;
the first printed circuit board layer (1) is used for transmitting radio frequency signals and realizing a 64-unit power division network;
the second printed circuit board layer (2) is electrically connected with the first printed circuit board layer (1) and is used for controlling the phase shift and attenuation of signals;
the third printed circuit board layer (3) is electrically connected with the second printed circuit board layer (2) and is used for power supply and input control of signals;
a plurality of chips (4) for signal output are arranged on the first printed circuit board layer (1);
and a heat dissipation cold plate (5) is further arranged between the second printed circuit board layer (2) and the third printed circuit board layer (3), and the heat absorption end of the heat dissipation cold plate (5) is in contact with the chip (4).
2. A high power tile phased array antenna as claimed in claim 1, wherein: the heat dissipation cold plate (5) is a hollow plate, wherein a capillary heat dissipation channel (6) is arranged in an inner cavity of the heat dissipation cold plate (5), and heat dissipation liquid is stored in the capillary heat dissipation channel (6);
the surface of the heat dissipation cold plate (5) facing the second printed circuit board layer (2) is provided with a plurality of heat dissipation bosses (7) with the same number as the chips (4);
each heat dissipation boss (7) is used as a heat absorption end of the heat dissipation cold plate (5) and is in one-to-one corresponding contact with the chips (4).
3. A high power tile phased array antenna as claimed in claim 2, wherein: through holes (8) which correspond to the heat dissipation bosses (7) one by one are formed in the second printed circuit board layer (2);
the chips (4) are positioned on the surface of the first printed circuit board layer (1) facing the second printed circuit board layer (2) and are in one-to-one correspondence with the positions of the through holes (8);
the heat dissipation boss (7) contacts the chip (4) on the corresponding side after penetrating through the through hole (8) on the corresponding side.
4. A high power tile phased array antenna as claimed in claim 2, wherein: and heat-conducting silicone grease is also arranged between the chip (4) and the heat-radiating boss (7).
5. A high power tile phased array antenna as claimed in claim 1, wherein: the first printed circuit board layer (1) and the second printed circuit board layer (2) are connected, and the second printed circuit board layer (2) and the third printed circuit board layer (3) are connected through a hair button structure (15).
6. A high power tile phased array antenna as claimed in claim 1, wherein: the chip (4) is electrically connected with the first printed circuit board layer (1) through a solder ball (9).
7. A high power tile phased array antenna as claimed in claim 1, wherein: the surface of the first printed circuit board layer (1) back to the second printed circuit board layer (2) is provided with a plurality of antenna units (10), and the number of the chips (4) is 16.
8. A high power tile phased array antenna as claimed in claim 1, wherein: and a digital-to-analog conversion chip (11) and a plurality of interface circuits are arranged on the surface of the second printed circuit board layer (2) facing the first printed circuit board layer (1).
9. A high power tile phased array antenna as claimed in claim 1, wherein: and an FPGA chip (12), a FLASH chip (13), a DC-DC power circuit (14) and an IO interface are arranged on the surface of the third printed circuit board layer (3) back to the heat dissipation cold plate (5).
10. A high power tile phased array antenna as claimed in claim 1, wherein: the sum of the thicknesses of the first printed circuit board layer (1), the second printed circuit board layer (2) and the third printed circuit board layer (3) is 20 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911088406.9A CN110797624B (en) | 2019-11-08 | 2019-11-08 | High-power tile-type phased array antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911088406.9A CN110797624B (en) | 2019-11-08 | 2019-11-08 | High-power tile-type phased array antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110797624A true CN110797624A (en) | 2020-02-14 |
| CN110797624B CN110797624B (en) | 2021-11-30 |
Family
ID=69443506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911088406.9A Active CN110797624B (en) | 2019-11-08 | 2019-11-08 | High-power tile-type phased array antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110797624B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141708A (en) * | 2021-04-29 | 2021-07-20 | 成都天锐星通科技有限公司 | Multi-beam chip integrated module and phased array system |
| CN113194607A (en) * | 2021-03-26 | 2021-07-30 | 中国电子科技集团公司第二十九研究所 | Positioning and heat dissipation structure based on blind-mate feed of multilayer printed board |
| CN113451732A (en) * | 2021-08-30 | 2021-09-28 | 成都雷电微力科技股份有限公司 | Novel airtight tile formula phased array antenna |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020132094A1 (en) * | 2000-12-27 | 2002-09-19 | Ngk Spark Plug Co., Ltd. | Wiring board and method for fabricating the same |
| EP2642587A1 (en) * | 2012-03-21 | 2013-09-25 | Selex Es S.P.A | Modular active radiating device for electronically scanned array aerials |
| JP2015026873A (en) * | 2014-11-07 | 2015-02-05 | サイビーム インコーポレイテッド | Surface mountable integrated circuit packaging scheme |
| CN204857954U (en) * | 2015-08-06 | 2015-12-09 | 中国电子科技集团公司第三十八研究所 | Wide angle sweep phased array antenna of ka frequency channel |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
| WO2018182756A1 (en) * | 2017-04-01 | 2018-10-04 | Intel Corporation | 5G mmWAVE COOLING THROUGH PCB |
| CN108931765A (en) * | 2018-04-20 | 2018-12-04 | 西安电子工程研究所 | High-power vertical tile type multi-channel digital receives and dispatches submatrix design method |
| CN109301431A (en) * | 2018-10-18 | 2019-02-01 | 北京无线电测量研究所 | A kind of Planar Phased Array Antenna |
-
2019
- 2019-11-08 CN CN201911088406.9A patent/CN110797624B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020132094A1 (en) * | 2000-12-27 | 2002-09-19 | Ngk Spark Plug Co., Ltd. | Wiring board and method for fabricating the same |
| EP2642587A1 (en) * | 2012-03-21 | 2013-09-25 | Selex Es S.P.A | Modular active radiating device for electronically scanned array aerials |
| JP2015026873A (en) * | 2014-11-07 | 2015-02-05 | サイビーム インコーポレイテッド | Surface mountable integrated circuit packaging scheme |
| CN204857954U (en) * | 2015-08-06 | 2015-12-09 | 中国电子科技集团公司第三十八研究所 | Wide angle sweep phased array antenna of ka frequency channel |
| CN105188260A (en) * | 2015-11-02 | 2015-12-23 | 中国电子科技集团公司第二十六研究所 | Printed circuit board embedded runner liquid cooling heat exchange device |
| WO2018182756A1 (en) * | 2017-04-01 | 2018-10-04 | Intel Corporation | 5G mmWAVE COOLING THROUGH PCB |
| CN108931765A (en) * | 2018-04-20 | 2018-12-04 | 西安电子工程研究所 | High-power vertical tile type multi-channel digital receives and dispatches submatrix design method |
| CN109301431A (en) * | 2018-10-18 | 2019-02-01 | 北京无线电测量研究所 | A kind of Planar Phased Array Antenna |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113194607A (en) * | 2021-03-26 | 2021-07-30 | 中国电子科技集团公司第二十九研究所 | Positioning and heat dissipation structure based on blind-mate feed of multilayer printed board |
| CN113194607B (en) * | 2021-03-26 | 2022-06-14 | 中国电子科技集团公司第二十九研究所 | Positioning and heat dissipation structure based on blind-mate feed of multilayer printed board |
| CN113141708A (en) * | 2021-04-29 | 2021-07-20 | 成都天锐星通科技有限公司 | Multi-beam chip integrated module and phased array system |
| CN113451732A (en) * | 2021-08-30 | 2021-09-28 | 成都雷电微力科技股份有限公司 | Novel airtight tile formula phased array antenna |
| CN113451732B (en) * | 2021-08-30 | 2021-11-23 | 成都雷电微力科技股份有限公司 | Novel airtight tile formula phased array antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110797624B (en) | 2021-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108987942B (en) | Surface-mounted flat active phased-array antenna system architecture | |
| CN110797624B (en) | High-power tile-type phased array antenna | |
| US7859835B2 (en) | Method and apparatus for thermal management of a radio frequency system | |
| US11682844B2 (en) | Heatsink antenna array structure | |
| CN105514566A (en) | Millimeter wave tile-type phased-array antenna TR module | |
| CN106981720A (en) | The integrated TR components of millimeter wave tile style phased array antenna | |
| US7391382B1 (en) | Transmit/receive module and method of forming same | |
| CN115881663B (en) | Novel high-power tile type TR module | |
| JP2008543248A5 (en) | ||
| US7511664B1 (en) | Subassembly for an active electronically scanned array | |
| CN107732373B (en) | Microwave vertical interconnection ceramic connection structure | |
| Wang et al. | An improved high-power X-band 4× 4 tile-type LTCC T/R module based on liquid cooling micro-channels | |
| CN109698398B (en) | Integrally designed millimeter wave phased array antenna | |
| Duffy et al. | Stepped notch antenna array used as a low thermal resistance heat sink | |
| CN116505253A (en) | Multi-beam phased array antenna | |
| CN115225114B (en) | Omnidirectional electric scanning radio frequency assembly of missile-borne frequency hopping communication system | |
| Haarla et al. | Scalable 3D-printable antenna array with liquid cooling for 28 GHz | |
| CN211352604U (en) | Heat dissipation optimization structure of circuit board | |
| US7456789B1 (en) | Integrated subarray structure | |
| CN114841108A (en) | Power amplifier product three-dimensional integrated design method and power amplifier product | |
| Aslan | Opportunities, progress and challenges in active heatsink antenna arrays for 5G and beyond | |
| CN115241624B (en) | High-heat-dissipation miniaturized satellite communication antenna main bearing structure | |
| CN216413231U (en) | Heat radiation structure of phased array antenna, phased array antenna and satellite platform | |
| CN214428760U (en) | Low-orbit satellite phased array terminal antenna based on LTCC micro-channel | |
| CN114597627B (en) | High-power-density integrated active phased-array antenna micro-system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |