CN110794641A - Heat dissipation device and projection equipment - Google Patents

Abstract

The embodiment of the invention provides a heat dissipation device and projection equipment. The heat dissipation device comprises at least one heat conducting piece, a radiator, a soaking plate, a circuit board, at least one fixing piece and at least one elastic piece, at least one heat conducting piece is connected between the radiator and the soaking plate, the heat conducting piece extends to the inside of the radiator, and the heat conducting piece extends to the inside of the soaking plate, first mounting holes are formed in the circuit board, the soaking plate is provided with second mounting holes, the fixing piece simultaneously penetrates through the first mounting holes and the second mounting holes, the fixing piece avoids the at least one heat conducting piece, one end of the elastic piece is clamped in the fixing piece, the other end of the elastic piece is abutted to the surface of the circuit board, the fixing piece and the elastic piece are mutually matched to fixedly connect the circuit board and the soaking plate. The heat dissipation device provided by the embodiment of the invention can effectively conduct heat on the circuit board and has a good shock absorption effect.

Description

Heat dissipation device and projection equipment

Technical Field

The invention relates to the technical field of electronics, in particular to a heat dissipation device and projection equipment.

Background

The projector generally includes a projection imaging system and an optical amplification system, and the projection signal is converted into an image signal by processing of the imaging technology of the projector, and then the image signal is projected and displayed on a screen by amplification of the optical system. In the projection process of the projector, if a high-quality and high-definition projected image is to be obtained, high-brightness output is to be ensured, the projector adopts a high-power and high-brightness light source, and after the high-power light source works for a long time, a large amount of heat is inevitably accumulated in the projector. If the heat cannot be discharged from the projector quickly in time, the working efficiency of the projector can be greatly influenced by the high temperature caused by the heat, and the service life of the projector can be greatly shortened by working at the high temperature for a long time. With the continuous improvement of the technological level, people have higher and higher requirements on the light weight, the miniaturization and the portability of the projector, so that higher requirements are provided for the layout design of the heat dissipation structure inside the projector. The mode that adopts the screw fixed heating panel in the projector at present often damages easily, needs to provide a spring structure and connects radiator structure to solve projection equipment physical shock problem under unstable condition.

Disclosure of Invention

The embodiment of the invention provides a heat dissipation device and projection equipment, which can uniformly dissipate heat of a circuit board and can physically absorb shock of a soaking plate through an elastic piece.

The embodiment of the invention provides a heat dissipation device which comprises at least one heat conduction piece, a radiator, a soaking plate, a circuit board, at least one fixing piece and at least one elastic piece, wherein the at least one heat conduction piece is connected between the radiator and the soaking plate, the heat conduction piece extends to the inside of the radiator, the heat conduction piece extends to the inside of the soaking plate, a first mounting hole is formed in the circuit board, a second mounting hole is formed in the soaking plate, the fixing piece penetrates through the first mounting hole and the second mounting hole at the same time, the fixing piece avoids the at least one heat conduction piece, one end of the elastic piece is clamped in the fixing piece, the other end of the elastic piece abuts against the surface of the circuit board, and the fixing piece and the elastic piece are matched with each other to fixedly connect the circuit board and the soaking plate.

According to the heat dissipation device provided by the embodiment of the invention, the heat conducting piece is connected between the heat radiator and the soaking plate, the circuit board is attached to the soaking plate, and the heat on the circuit board can be transmitted to the heat radiator through the soaking plate and the heat conducting piece, so that the aim of dissipating heat of the circuit board is fulfilled. And the elastic piece is abutted against the circuit board, so that the circuit board and the soaking plate can be attached more uniformly, and the soaking plate can conduct heat uniformly to the circuit board. In addition, the elastic piece is abutted against the circuit board, and the physical shock absorption effect can be achieved.

An embodiment of the present invention further provides a projection apparatus, including an optical component and the heat dissipation structure provided in any of the above embodiments, where the optical component is electrically connected to the circuit board, and the optical component projects an optical image under the control of the circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a first schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 5 is a schematic partial structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 6 is a schematic partial structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 7 is a schematic view of a partial structure of a heat dissipation device according to an embodiment of the present invention.

Fig. 8 is a schematic structural diagram of a heat conducting member of a heat dissipation device according to an embodiment of the present invention.

Fig. 9 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 10 is a sixth schematic structural view of a heat dissipation device according to an embodiment of the present invention.

Fig. 11 is a seventh schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.

Fig. 12 is a schematic structural diagram of a projection apparatus according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.

The description of illustrative embodiments in accordance with the principles of the invention is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description. In describing the embodiments of the invention disclosed, reference to any direction or orientation is intended merely to facilitate explanation and is not intended to limit the scope of the invention in any way. Relative terms such as "front," "back," "upper," "lower," "side," "outer," "inner," "middle," "inner," "outer," "lower," "upper," "horizontal," "vertical," "above," "below," "up," "down," "top" and "bottom") and derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description only and do not require that the apparatus be constructed or operated in a particular orientation unless otherwise specifically stated. Thus, the invention should not be limited to the exemplary embodiments which illustrate some possible non-limiting combinations of features which may be present alone or in other feature combinations; the scope of protection of the invention is defined by the appended claims.

As presently contemplated, this disclosure describes the best mode or mode of practice of the invention. The present invention is not intended to be understood from the limiting layer, but rather is to be provided as an illustrative example only, in connection with the accompanying drawings, so as to inform those skilled in the art of the advantages and construction of the invention. Like reference characters designate like or similar parts throughout the various views of the drawings.

Referring to fig. 1 and 2 together, a heat dissipation device 10 according to an embodiment of the present invention includes at least one heat conductive member 100, a heat sink 200, a heat spreader 300, a circuit board 400, at least one fixing member 500, and at least one elastic member 600, wherein the at least one heat conductive member 100 is connected between the heat sink 200 and the heat spreader 300, the heat conductive member 100 extends into the heat sink 200, the heat conductive member 100 extends into the heat spreader 300, the circuit board 400 has a first mounting hole 410, the heat spreader 300 has a second mounting hole 310, the fixing member 500 passes through the first mounting hole 410 and the second mounting hole 310, the fixing member 500 avoids the at least one heat conductive member 100, one end of the elastic member 600 is clamped to the fixing member 500, and the other end of the elastic member 600 is clamped to the surface of the circuit board 400, the fixing member 500 and the elastic member 600 cooperate with each other to fixedly couple the circuit board 400 and the soaking plate 300.

The heat conducting member 100 is made of a material with high thermal conductivity, and may be copper or aluminum. The heat-conducting member 100 may have a solid structure or may be a hollow pipe. Further, when the heat conductive member 100 is a hollow pipe, a flowing liquid medium may be disposed in the hollow pipe, and the flowing direction of the liquid medium is from the side of the soaking plate 300 toward the side of the heat sink 200. One end of the heat conductive member 100 extends into the heat spreader 200 and the other end extends into the soaking plate 300 to fixedly connect the heat spreader 200 and the soaking plate 300. The circuit board 400 is fixed to the soaking plate 300 through the fixing member 500 and the elastic member 600, and heat generated from the circuit board 400 can be transmitted to the heat sink 200 through the soaking plate 300 and the heat conductive member 100, so that heat on the circuit board 400 can be conducted away, and the heat dissipation effect on the circuit board 400 can be achieved.

Have first mounting hole 410 on the circuit board 400, second mounting hole 310 has on the soaking plate 300, and mounting 500 runs through first mounting hole 410 and second mounting hole 310 in order to link together circuit board 400 and soaking plate 300, the one end joint of elastic component 600 in mounting 500, the other end of elastic component 600 supports and holds in the surface of circuit board 400, and elastic component 600 can be to the even elasticity effect that circuit board 400 provided to make the even laminating of circuit board 400 in soaking plate 300, thereby be convenient for with the even transmission to soaking plate 300 of heat on the circuit board 400 on, play even radiating purpose to circuit board 400. In addition, the elastic member 600 can absorb physical shock on the soaking plate 300, protect the soaking plate 300, and prevent the electronic device on the heat dissipation device 10 from being damaged due to the physical shock. Wherein, the elastic member 600 may be a spring. In addition, the elastic member 600 has an elastic function, so that the connection between the circuit board 400 and the soaking plate 300 is flexible contact, and compared with the case of rigid contact, the electronic device on the circuit board 400 can be prevented from being damaged under the extrusion action of an external force, and therefore, the electronic device on the circuit board 400 can be elastically protected.

The fixing member 500 may be a screw, a rivet, or another fixing structure, and the fixing member 500 penetrates through the first mounting hole 410 and the second mounting hole 310 to connect the soaking plate 300 and the circuit board 400. The elastic member 600 is sleeved on the fixing member 500, and one end of the elastic member 600 abuts against the fixing member 500, and the other end abuts against the surface of the circuit board 400. The quantity of elastic component 600 can be a plurality of, and a plurality of elastic components 600 provide even elastic action to circuit board 400 to make circuit board 400 even laminating on soaking plate 300, thereby can be with the even transmission of heat on circuit board 400 to soaking plate 300, and then transmit to radiator 200 through soaking plate 300, heat-conducting piece 100, play the purpose of conducting away the heat on circuit board 400 fast.

In the heat dissipating device 10 according to the embodiment of the present invention, the heat conducting member 100 is connected between the heat sink 200 and the soaking plate 300, and the circuit board 400 is attached to the soaking plate 300, so that heat on the circuit board 400 can be transmitted to the heat sink 200 through the soaking plate 300 and the heat conducting member 100, thereby dissipating heat from the circuit board 400. And the elastic member 600 is abutted against the circuit board 400, so that the circuit board 400 and the soaking plate 300 can be attached more uniformly, and the soaking plate 300 can conduct heat uniformly to the circuit board 400. In addition, the elastic member 600 is supported by the circuit board 400, and can also perform a physical shock absorption function. The elastic member 600 has an elastic function, so that the connection between the circuit board 400 and the soaking plate 300 is flexible contact, and compared with the rigid contact, the damage of the electronic device on the circuit board 400 under the extrusion action of an external force can be avoided, and therefore, the elastic protection can be formed on the electronic device on the circuit board 400.

Referring to fig. 3 and fig. 4, the fixing member 500 includes a first limiting member 510 and a second limiting member 520, the first limiting member 510 and the second limiting member 520 are respectively located at two sides of the heat conducting member 100, and distances between the first limiting member 510 and the second limiting member 520 and a central position of the heat conducting member 100 are kept consistent.

Specifically, the first mounting hole 410 includes a first spacing hole 411 and a second spacing hole 412 which are spaced apart from each other, the second mounting hole 310 includes a third spacing hole 311 and a fourth spacing hole 312 which are spaced apart from each other, the first spacing hole 411 and the third spacing hole 311 are right opposite to each other, the second spacing hole 412 and the fourth spacing hole 312 are right opposite to each other, the first limiting member 510 simultaneously penetrates through the first spacing hole 411 and the third spacing hole 311, the second limiting member 520 simultaneously penetrates through the second spacing hole 412 and the fourth spacing hole 312, and the heat conducting member 100 is located between the first limiting member 510 and the second limiting member 520. Further, the distance from the heat conducting member 100 to the first limiting member 510 and the distance from the heat conducting member 100 to the second limiting member 520 are kept consistent, so that the soaking plate 300 and the heat conducting member 100 can be attached more uniformly, and the heat conducting member 100 can conduct heat to the soaking plate 300 uniformly.

In an embodiment, the elastic member 600 includes a first elastic member 610 and a second elastic member 620, the first elastic member 610 is sleeved on the first limiting member 510, the first elastic member 610 abuts against the circuit board 400, the second elastic member 620 is sleeved on the second limiting member 520, the second elastic member 620 abuts against the circuit board 400, and the abutting force of the first elastic member 610 against the circuit board 400 is consistent with the abutting force of the second elastic member 620 against the circuit board 400.

Specifically, the first elastic member 610 is sleeved on the first limiting member 510, one end of the first elastic member 610 abuts against the first limiting member 510, the other end of the first elastic member 610 abuts against the surface of the circuit board 400, the second elastic member 620 is sleeved on the second limiting member 520, one end of the second elastic member 620 abuts against the second limiting member 520, and the other end of the second elastic member 620 abuts against the surface of the circuit board 400. Because the distances from the first limiting member 510 and the second limiting member 520 to the heat conducting member 100 are kept consistent, the distances from the first elastic member 610 and the second elastic member 620 to the heat conducting member 100 are also kept consistent, so that the abutting forces of the first elastic member 610 and the second elastic member 620 on the circuit board 400 are kept consistent, and thus the circuit board 400 and the soaking plate 300 can be attached uniformly, and the soaking plate 300 can conduct uniform heat on the circuit board 400. Wherein, the first elastic member 610 and the second elastic member 620 may be springs. In addition, the first elastic member 600 and the second elastic member 600 can absorb physical shock at the position of the soaking plate 300, thereby preventing the electronic devices on the heat dissipating device 10 from being damaged due to shock.

With reference to fig. 5, the heat conducting member 100 includes a plurality of spaced heat conducting pipes 110, and the arrangement density of the heat conducting pipes 110 decreases from the middle position of the soaking plate 300 to the edge position of the soaking plate 300.

Wherein, several means at least two, i.e. two or more. The arrangement density of the heat conduction pipes 110 arranged at intervals is regularly changed, and specifically, the arrangement density of the heat conduction pipes 110 is gradually reduced from the middle position of the soaking plate 300 to the edge position of the soaking plate 300. Because the electronic devices arranged at the middle of the circuit board 400 are usually more, and the electronic devices arranged at the edge of the circuit board 400 are usually less, the temperature at the middle of the soaking plate 300 is higher, and heat accumulation is easily caused, therefore, the density of the heat conducting pipes 110 arranged at the middle of the soaking plate 300 is higher, and the density of the heat conducting pipes 110 arranged at the edge of the soaking plate 300 is lower, so that the heat on the circuit board 400 can be quickly transmitted to the heat conducting pipes 110 through the soaking plate 300 by reasonably arranging the arrangement density of the heat conducting pipes 110, and then transmitted to the heat sink 200 through the heat conducting pipes 110.

With continued reference to fig. 6, further, the radial dimension of the plurality of spaced heat pipes 110 also varies regularly. Specifically, the size of the radial dimension of the heat conductive pipe 110 gradually decreases from the middle position of the soaking plate 300 toward the edge position of the soaking plate 300. Because the electronic devices arranged at the middle part of the circuit board 400 are usually more, the electronic devices arranged at the edge part of the circuit board 400 are usually less, so that the temperature at the middle part of the soaking plate 300 is higher, and heat accumulation is easily caused, therefore, the radial dimension of the heat conducting pipe 110 arranged at the middle position corresponding to the soaking plate 300 is larger, and the radial dimension of the heat conducting pipe 110 arranged at the edge position corresponding to the soaking plate 300 is smaller, so that the heat on the circuit board 400 can be rapidly transmitted to the heat conducting pipe 110 through the soaking plate 300 by reasonably setting the radial dimension of the heat conducting pipe 110, and then transmitted to the heat sink 200 through the heat conducting pipe 110.

With reference to fig. 7, the heat conducting member 100 includes a first heat conducting pipe 101, a second heat conducting pipe 102 and a third heat conducting pipe 103 that are sequentially disposed at intervals, the first heat conducting pipe 101 and the third heat conducting pipe 103 are disposed corresponding to edge positions of the soaking plate 300, the second heat conducting pipe 102 is disposed corresponding to a middle position of the soaking plate 300, a first cooling medium 150 is disposed in the first heat conducting pipe 101 and the third heat conducting pipe 103, a second cooling medium 160 is disposed in the second heat conducting pipe 102, and a cooling performance of the second cooling medium 160 is higher than a cooling performance of the first cooling medium 150.

In one embodiment, the distance between the first heat conductive pipe 101 and the second heat conductive pipe 102 is equal to the distance between the second heat conductive pipe 102 and the third heat conductive pipe 103, the first cooling medium 150 is disposed within the first heat conductive pipe 101 and the third heat conductive pipe 103, and the second cooling medium 160 is disposed within the second heat conductive pipe 102, the cooling performance of the second cooling medium 160 being better than the cooling performance of the first cooling medium 150. The first cooling medium 150 may be water, and the second cooling medium 160 may be oil or liquid nitrogen. Because the electronic devices disposed in the middle of the circuit board 400 are usually more, and the electronic devices disposed in the edge of the circuit board 400 are usually less, so that the temperature in the middle of the soaking plate 300 is higher, and heat accumulation is easily caused, therefore, the cooling performance of the second cooling medium 160 in the second heat pipe 102 disposed in the middle of the soaking plate 300 is better, and the cooling performance of the first cooling medium 150 in the first heat pipe 101 and the third heat pipe 103 disposed in the edge of the soaking plate 300 is relatively poorer, so that the heat in the circuit board 400 can be rapidly transmitted to the heat pipe 110 through the soaking plate 300 and then transmitted to the heat sink 200 through the heat pipe 110 by reasonably setting the type of the cooling medium of the heat pipe 110.

With reference to fig. 8, the heat conducting element 100 includes a first portion 100a, a connecting portion 100b and a second portion 100c connected in sequence, the first portion 100a extends into the heat spreader 200, the first portion 100a is annularly distributed on the heat spreader 200, the second portion 100c extends into the heat spreader 300, the second portion 100c is annularly distributed on the heat spreader 300, the second portion 100c avoids the fixing member 500, and the second portion 100c covers the area where the circuit board 400 is located.

Specifically, the connecting portion 100b is connected between the first portion 100a and the second portion 100c, the first portion 100a extends into the heat sink 200, and the first portion 100a extends in a ring shape, so that a heat dissipation path of the first portion 100a in the heat sink 200 can be extended, and an effect of rapidly cooling the first portion 100a can be achieved. The second portion 100c extends into the soaking plate 300, and the second portion 100c extends in a ring shape, which may extend a heat dissipation path of the second portion 100c in the soaking plate 300. And the second portion 100c needs to avoid the arrangement of the fixing member 500, and the second portion 100c covers the region where the circuit board 400 is located, so that the region of the circuit board 400 corresponding to the soaking plate 300 can be well conducted, and the problem that the temperature on the circuit board 400 is gathered on the soaking plate 300 and cannot be conducted out quickly is avoided.

With reference to fig. 9, a cooling member 700 is disposed outside the connection portion 100b, the cooling member 700 includes a first cooling jacket 710, a second cooling jacket 720 and a third cooling jacket 730, the first cooling jacket 710, the second cooling jacket 720 and the third cooling jacket 730 are sequentially arranged at intervals in the extending direction of the connection portion 100b, the first cooling jacket 710 is disposed adjacent to the soaking plate 300 relative to the third cooling jacket 730, the length of the first cooling jacket 710 is greater than that of the second cooling jacket 720, and the length of the second cooling jacket 720 is greater than that of the third cooling jacket 730.

Specifically, in order to rapidly conduct heat on the heat conducting pipe 110, the cooling member 700 is disposed outside the connecting portion 100b, the cooling member 700 includes a first cooling jacket 710, a second cooling jacket 720 and a third cooling jacket 730, the first cooling jacket 710, the second cooling jacket 720 and the third cooling jacket 730 are arranged at intervals on the connecting portion 100b from a side adjacent to the soaking plate 300 toward a side adjacent to the heat sink 200, the cooling effect of the cooling member 700 is better than that of the connecting portion 100b, and the heat conduction of the connecting portion 100b can be accelerated. The length of the first cooling sleeve 710 is set to be greater than that of the second cooling sleeve 720, and the length of the second cooling sleeve 720 is set to be greater than that of the third cooling sleeve 730, so that the first cooling sleeve 710 is arranged adjacent to the soaking plate 300, and the third cooling sleeve 730 is arranged adjacent to the heat sink 200, because the temperature gradually decreases in the process of transferring heat from the soaking plate 300 to the heat sink 200, the length of the first cooling sleeve 710 arranged close to the soaking plate 300 is the largest, and the length of the third cooling sleeve 730 arranged close to the heat sink 200 is the shortest, so that the cooling speed of the connecting portion 100b can be increased by optimizing the lengths of the cooling sleeves and the arrangement positions of the cooling sleeves on the connecting portion 100b, and further, the heat is prevented from being accumulated at the position of the circuit board 400.

Further, the distance between the first cooling sleeve 710 and the second cooling sleeve 720 is equal to the distance between the second cooling sleeve 720 and the third cooling sleeve 730, so that the heat can be transmitted more uniformly at the position of the connecting portion 100b, the heat conduction pipe 110 is prevented from being damaged by sudden change of the heat, and the service life of the heat conduction pipe 110 is prolonged.

With continued reference to fig. 10, the heat conducting member 100 is a curved pipe, and the heat spreader 200 and the vapor chamber 300 are stacked and spaced apart. In one embodiment, the circuit board 400 is located on the side of the heat spreader 300 facing away from the heat spreader 200. At this time, the distance between the soaking plate 300 and the heat sink 200 can be set smaller, and the secondary interference of the heat conducted from the heat sink 200 to the circuit board 400 can be avoided. And it may be convenient for the fixing member 500 and the elastic member 600 to couple the circuit board 400 and the soaking plate 300 together. In another embodiment, the circuit board 400 is located on the side of the soaking plate 300 adjacent to the heat sink 200.

With reference to fig. 11, the heat sink 200 includes a plurality of fins 201 arranged at intervals, the heat conducting member 100 penetrates the fins 201 along the arrangement direction of the fins 201, and two adjacent fins 201 can partially expose the heat conducting member 100.

Specifically, the arrangement intervals of the plurality of fins 201 are kept consistent, the heat conducting member 100 penetrates through the plurality of fins 201 along the arrangement direction of the fins 201, and the adjacent fins 201 can expose part of the heat conducting member 100, so that the heat of the heat conducting member 100 is transmitted out through the gaps between the adjacent fins 201.

With reference to fig. 12, an embodiment of the present application further provides a projection apparatus 1, which includes an optical component 20 and the heat dissipation device 10 provided in any of the above embodiments, wherein the optical component 20 is electrically connected to the circuit board 400, and the optical component 20 projects an optical image under the control of the circuit board 400.

The projection apparatus 1 may be a projector, the optical assembly 20 has a light source, the optical assembly 20 is electrically connected to the circuit board 400, and the light source can project an optical image under the control of the circuit board 400, so as to be displayed on a curtain for a user to watch. Projection device 1 may also include other functional components that are compatible with heat sink 10.

The above embodiments of the present invention are described in detail, and the principle and the implementation of the present invention are explained by applying specific embodiments, and the above description of the embodiments is only used to help understanding the method of the present invention and the core idea thereof; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.

Claims (10)

1. The utility model provides a heat abstractor, its characterized in that includes at least one heat-conducting piece, radiator, soaking board, circuit board, at least one mounting and at least one elastic component, at least one heat-conducting piece connect in the radiator with between the soaking board, the heat-conducting piece extends to the inside of radiator, just the heat-conducting piece extends to the inside of soaking board, first mounting hole has on the circuit board, the soaking board has the second mounting hole, the mounting passes simultaneously first mounting hole with the second mounting hole, just the mounting avoids at least one heat-conducting piece, the one end card of elastic component is held in the mounting, the other end of elastic component support hold in the surface of circuit board, the mounting with the elastic component mutually supports in order with circuit board with soaking board fixed connection.

2. The heat dissipating device of claim 1, wherein the fixing member comprises a first limiting member and a second limiting member, the first limiting member and the second limiting member are respectively located at two sides of the heat conducting member, and the distances between the first limiting member and the second limiting member and the central position of the heat conducting member are kept consistent.

3. The heat dissipation device of claim 2, wherein the elastic member includes a first elastic member and a second elastic member, the first elastic member is sleeved on the first limiting member, the first elastic member abuts against the circuit board, the second elastic member is sleeved on the second limiting member, the second elastic member abuts against the circuit board, and the abutting force of the first elastic member against the circuit board is consistent with the abutting force of the second elastic member against the circuit board.

4. The heat dissipating device of claim 1, wherein said heat conducting member comprises a plurality of heat conducting pipes spaced apart from each other, and said heat conducting pipes are arranged in a density decreasing from a middle position of said soaking plate toward an edge position of said soaking plate.

5. The heat dissipating device according to claim 1, wherein the heat conducting member includes a first heat conducting pipe, a second heat conducting pipe and a third heat conducting pipe which are sequentially disposed at intervals, the first heat conducting pipe and the third heat conducting pipe are disposed corresponding to an edge position of the soaking plate, the second heat conducting pipe is disposed corresponding to an intermediate position of the soaking plate, a first cooling medium is disposed in the first heat conducting pipe and the third heat conducting pipe, a second cooling medium is disposed in the second heat conducting pipe, and a cooling performance of the second cooling medium is higher than a cooling performance of the first cooling medium.

6. The heat dissipating device according to claim 1, wherein the heat conducting member includes a first portion, a connecting portion, and a second portion connected in sequence, the first portion extends into the heat sink, the first portion is annularly distributed on the heat sink, the second portion extends into the soaking plate, the second portion is annularly distributed on the soaking plate, the second portion avoids the fixing member, and the second portion covers a region where the circuit board is located.

7. The heat dissipating device according to claim 6, wherein a cooling member is disposed outside the connecting portion, the cooling member includes a first cooling jacket, a second cooling jacket, and a third cooling jacket, the first cooling jacket, the second cooling jacket, and the third cooling jacket are sequentially arranged at intervals in an extending direction of the connecting portion, the first cooling jacket is disposed adjacent to the soaking plate with respect to the third cooling jacket, a length of the first cooling jacket is greater than a length of the second cooling jacket, and a length of the second cooling jacket is greater than a length of the third cooling jacket.

8. The heat dissipating device of claim 1, wherein said heat conducting member is a bent tube, said heat spreader and said heat spreader are stacked and spaced apart, and said circuit board is located on a side of said heat spreader facing away from said heat spreader; or the circuit board is positioned on one side of the soaking plate adjacent to the heat radiator.

9. The heat dissipating device of claim 1, wherein said heat sink comprises a plurality of spaced apart fins, said heat conducting member extending through said fins in a direction of said fins, adjacent two of said fins exposing a portion of said heat conducting member.

10. A projection device comprising an optical assembly and the heat sink of any of claims 1-9, the optical assembly being electrically connected to the circuit board, the optical assembly projecting an optical image under control of the circuit board.

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