WO2021147725A1

WO2021147725A1 - Heat dissipation structure of optical module, and communication device

Info

Publication number: WO2021147725A1
Application number: PCT/CN2021/071469
Authority: WO
Inventors: 韩云超; 刘旭; 庄宝山
Original assignee: 华为技术有限公司
Priority date: 2020-01-20
Filing date: 2021-01-13
Publication date: 2021-07-29
Also published as: CN113138446A; CN113138446B

Abstract

A heat dissipation structure of an optical module, and a communication device, which relate to the technical field of optical communications. The heat dissipation structure of an optical module comprises: a panel (1) provided with a first jack; a PCB (3) provided at one side of the panel (1), wherein the PCB (3) is provided with a first face (A1) and a second face (A2) opposite each other, and the first face (A1) is used for installing a first optical module (411); a first protective plate (21), which is opposite the first face (A1) and connected to the panel (1), wherein the PCB (3) is connected to the first protective plate (21) or is connected to the panel (1); and a first heat conduction module (5) for conducting heat emitted from the first optical module (411) to the first protective plate (21). The heat dissipation structure of an optical module and the communication device mainly dissipate heat of the optical module by using the protective plate.

Description

Heat dissipation structure of optical module and communication equipment

This application claims the priority of a Chinese patent application filed with the State Intellectual Property Office of China, the application number is 202010066294.3, and the invention title is "Optical module heat dissipation structure and communication equipment" on January 20, 2020, the entire content of which is incorporated by reference In this application.

Technical field

This application relates to the field of optical communication technology, and in particular to a heat dissipation structure of an optical module and communication equipment.

Background technique

The structure shown in FIG. 1 is a communication device in the prior art. As shown in Fig. 1, the optical cage 04 is set on the PCB board 03, the optical module 05 is set in the optical cage 04 through the socket of the panel 01, and the radiator 06 is set above the optical module 05 and has a plurality of heat dissipation fins. , The protective board 02 is connected with the panel 01 to prevent other structures from scratching with the PCB board, and protect the PCB board. Since the radiator 06 is arranged directly above the optical module 05, it occupies a large space.

Summary of the invention

The embodiments of the present application provide a heat dissipation structure of an optical module and a communication device, which have solved the technical problem of the existing technology that occupies a large space. To this end, the embodiments of the present application adopt the following technical solutions.

In the first aspect, the present application provides a heat dissipation structure for an optical module, including: a panel with a first jack; a PCB board arranged on one side of the panel, and the PCB board has a first surface and a second surface opposite to each other. One side is used to install the first light module; the first protection board is opposite to the first side and connected to the panel, and the PCB board is connected to the first protection board or connected to the panel; the first heat conduction module is used to connect the first light The heat dissipated by the module is conducted to the first protective plate.

The heat dissipation structure of the optical module in the embodiment of the present application adopts the first heat conduction module to conduct the heat dissipated by the first optical module to the first protective plate for heat dissipation, without the need for a dedicated heat sink. Compared with the prior art, the heat sink arranged along the height direction of the panel and occupying a larger space is removed, thereby simplifying the structure of the heat dissipation structure of the entire optical module.

In a possible implementation manner of the first aspect, it further includes: the panel has a second insertion hole, and the second surface is used for installing the second optical module; and a heat sink is used for diffusing the heat emitted by the second optical module. That is to say, when the first optical module is installed on the first surface of the PCB board and the second optical module is installed on the second surface, the optical modules are installed on both the first surface and the second surface of the PCB board. The optical interface density of the PCB board is increased to meet the demand for high-density optical interfaces of network transmission equipment, and a heat sink is provided to dissipate heat from the second optical module to ensure the heat dissipation effect of each optical module.

In a possible implementation of the first aspect, the heat sink includes: a second protective plate, which is opposite to the second surface and connected to the panel; and a second heat conduction module, configured to conduct the heat emitted by the second optical module to the second protective plate superior. By arranging a second protection board connected to the panel and adopting a second heat conduction module, the heat emitted by the second optical module is conducted to the second protection board, so that the height dimension of the entire panel remains unchanged, and the PCB board is improved In the case of high optical interface density, there is no need to install a dedicated heat sink that takes up a lot of space to dissipate heat from the second optical module.

In a possible implementation of the first aspect, the heat sink includes: heat dissipation fins located on the side of the second optical module away from the panel; a third heat conduction module, one end of which is in contact with the second optical module, and the other end of the heat dissipation fin片连接。 Piece connection. By arranging a third heat conduction module in contact with the second optical module, the heat dissipated by the second optical module is conducted to the heat dissipation fins, and the heat dissipation fins are used for heat dissipation, and the heat dissipation fins are located on the side of the second optical module away from the panel , That is, located outside the electrical interface of the second optical module, so that under the premise of ensuring the heat dissipation effect of the second optical module, the height of the entire panel will not be increased.

In a possible implementation manner of the first aspect, the surface of the first optical module opposite to the first protection plate is a heat conduction surface, and the first heat conduction module is disposed between the heat conduction surface and the first protection plate. Since the surface of the first optical module opposite to the first protective plate emits a large amount of heat, this surface is used as a heat conduction surface, and the first heat conduction module is placed between the heat conduction surface and the first protective plate, which can not only improve The heat dissipation effect of the first optical module, and make full use of the space between them, to avoid interference with other structures when installed in other positions.

In a possible implementation of the first aspect, the first heat conduction module is provided with a connection hole, the first optical module and the first heat conduction module are connected by a connector passing through the connection hole, and the connector is sleeved with a retractable spring. Through this connection structure, not only the connection between the first heat conduction module and the first optical module is realized, but at the same time, if the first optical module has a tolerance when plugging in, the expansion and contraction of the spring is used, so that the first heat conduction module is connected to the first optical module. Floating in the direction, thereby ensuring the smooth insertion of the first optical module, and the first direction is a direction perpendicular to the insertion direction of the first optical module.

In a possible implementation manner of the first aspect, it further includes: a fastener, an end of the first heat conduction module close to the first optical module is clamped with the first optical module through the fastener, the fastener can float along the first direction, and the first The direction is a direction perpendicular to the insertion direction of the first optical module. When the first optical module is inserted along its insertion direction, it may have a tolerance in the first direction perpendicular to the insertion direction. By floating the buckle in the first direction, the smooth insertion of the first optical module can be ensured. Will be interfered by the first heat conduction module. In addition, the buckle adopts a buckle connection method to realize the connection of the first optical module of the first heat conduction module, which is convenient to operate.

In a possible implementation of the first aspect, the buckle includes a support, an outer sleeve and an inner sleeve that are sleeved and made of rigid materials, the outer sleeve is fixed to the support, and the inner sleeve extends along the first The outer sleeve is slid from the first position to the second position in the direction relative to the outer sleeve, and the inner sleeve is also connected with the elastic resetting member. The elastic resetting member is used to reset the inner sleeve sliding to the second position to the first position to realize the whole The buckle floats in the first direction.

In a possible implementation of the first aspect, the fastener is made of an elastic material. The buckle is made by using elastic material, so that the buckle can float in the first direction, and the implementation is convenient.

In a possible implementation manner of the first aspect, the buckle includes a pressing part, a first side part and a second side part, and the pressing part is used to fit the side of the first heat conduction module away from the first optical module, and press The tight portion has opposite first and second sides, the first side is connected to the first side, the second side is connected to the second side, and both the first side and the second side can be connected to the first side. An optical module card is connected. When disassembling the first heat conduction module, move the first side and the second side of the buckle so that the bent part between the first side and the pressing part, and the second side and the pressing part The bending part between the middle part is elastically deformed, so that the clamping structure between the first side and the first optical module is separated, and the clamping structure between the second side and the first optical module is separated, so that the buckle can be removed. Tool to realize the disassembly of the first heat conduction module. When installing the first heat conduction module, the first side part can be clamped to the first optical module, and the second side part is also clamped to the first optical module, thereby realizing the installation of the first heat conduction module. This installation and disassembly operation is simple and easy to realize.

In a possible implementation manner of the first aspect, the first heat conduction module includes an elastic heat conduction pad, one end of the heat conduction pad is in contact with the first optical module, and the other end of the heat conduction pad is in contact with the first protective plate.

In a possible implementation of the first aspect, the first thermal conduction module includes a thermally conductive substrate, one end of the thermally conductive substrate is in contact with the first optical module, and the other end of the thermally conductive substrate is in contact with the first protective plate. The use of a thermally conductive substrate as the first thermal conduction module not only has a good thermal conductivity effect, but also has a certain strength, which can ensure the service life of the first thermal conduction module to meet the requirements of use under different working conditions.

In a possible implementation of the first aspect, the first heat conduction module further includes: a heat pipe having opposite evaporating ends and condensing ends, the heat pipe is arranged in the heat conducting substrate, the evaporating end is close to the first optical module, and the condensing end is close to the first optical module. Fenders. By arranging a heat pipe with higher heat conduction efficiency in the heat conducting substrate, the heat conduction efficiency is further improved.

In a possible implementation of the first aspect, the first heat conduction module extends to an end of the first protective plate away from the panel, and is connected to the first protective plate through a connector. By extending the first heat conduction module to the end of the first protective plate away from the panel, the heat conduction path is extended and the heat conduction efficiency is improved.

In a possible implementation of the first aspect, it further includes: a thermally conductive pad with elasticity, the thermally conductive pad is arranged between the thermally conductive substrate and the first protective plate; a connector, the thermally conductive substrate and the thermally conductive pad are connected to the first protective plate through the connector . In specific implementation, when the assembly space in the first direction is small at the position where the thermally conductive substrate is connected to the first protective plate, if the thermally conductive substrate has processing tolerances, it will not be able to be connected to the first protective plate. Therefore, An elastic thermal pad is provided here to absorb tolerances, which will reduce the processing accuracy of the thermally conductive substrate, ensure the smooth assembly of the thermally conductive substrate and the first protective plate, and the thermally conductive pad can also ensure the thermal conductivity effect.

In the second aspect, the present application also provides a communication device, including: the heat dissipation structure of the optical module of the above technical solution;

The first optical module; the first socket, the first socket is arranged on the first surface, and the first optical module passes through the first socket and is plugged into the first socket.

In the communication device provided by the embodiments of the present application, due to the heat dissipation structure of the optical module including any of the above technical solutions, the heat emitted by the first optical module is conducted to the first protective plate through the first heat conduction module, and the first protective plate acts as a heat sink. The radiator dissipates the heat, so there is no need to install a radiator that takes up a large space, which simplifies the structure of the entire communication device.

In a possible implementation manner of the second aspect, the first optical module is detachably installed in the first optical cage, the first optical cage has a heat dissipation hole, and the end of the first heat conduction module close to the first optical module has a boss, and the boss It passes through the heat dissipation hole and contacts the first optical module. By detachably connecting the first optical module and the first optical cage, for example, a snap connection, a threaded connection, etc., the first optical module and the first optical cage can be easily disassembled and assembled, and the boss and the first optical cage of the first heat conduction module are used. The first optical module contacts to ensure that the heat emitted by the first optical module is conducted to the first heat conduction module.

In a possible implementation manner of the second aspect, the first optical cage is fixed on the first surface, and the first optical module is inserted into the first optical cage through the first insertion hole; or, the first optical cage and the first optical module can be They are arranged on the first surface through the first insertion hole together.

In a possible implementation manner of the second aspect, it further includes: a main PCB board, and the main PCB board is electrically connected to the PCB board through a connector. The PCB board is electrically connected to the main PCB board through the connector to realize the signal transmission of the first optical module to the main PCB, or the signal of the main PCB is transmitted to the first optical module to realize information intercommunication.

In a third aspect, the present application also provides a communication device, including: the heat dissipation structure of the optical module of the above technical solution; a second optical module; a second socket, the second socket is arranged on the second surface, and the second optical module Through the second socket and plugged into the second socket. Through the setting of the second optical module, the optical interface density of the entire communication device can be increased to meet the requirements of the network transmission equipment for high-density optical interfaces.

Since the communication device provided in the embodiment of the present application includes the heat dissipation structure of the optical module of the above technical solution, the communication device provided in the embodiment of the present application achieves the same expected effect as the communication device in the second aspect, and will not be repeated.

In a possible implementation manner of the third aspect, the second optical module is detachably installed in the second optical cage, the second optical cage has a heat dissipation hole, and the end of the heat sink close to the second optical module has a boss through which the boss passes The heat dissipation hole is in contact with the second optical module. By detachably connecting the second optical module and the second optical cage, for example, snap connection, screw connection, etc., the convenient disassembly and assembly of the second optical module and the second optical cage are realized, and the boss of the heat sink and the second optical cage are used. The optical module contacts to ensure that the heat dissipated by the second optical module is conducted to the radiator.

Description of the drawings

Figure 1 is a schematic diagram of the structure of a communication device in the prior art;

FIG. 2 is a schematic structural diagram of a communication device provided by some embodiments of the application;

FIG. 3 is a schematic diagram of the connection relationship between the thermally conductive substrate and the heat pipe provided by some embodiments of the application;

4 is a schematic diagram of the connection relationship between the thermal conductive substrate, the heat pipe, and the first optical module provided by some embodiments of the application;

Figure 5 is a schematic structural diagram of a fastener provided by some embodiments of the application;

FIG. 6 is a schematic diagram of the structure of a buckle provided by some embodiments of the application;

FIG. 7 is a schematic structural diagram of a communication device provided by some embodiments of the application;

FIG. 8 is a schematic structural diagram of a communication device provided by some embodiments of the application.

Reference signs:

01-panel; 02-protection board; 03-PCB board; 04-light cage; 05-optical module; 06-heat sink; 1-panel; 101-folded section; 21-first protection board; 22 second protection Board; 3-PCB board; 411-first optical module; 412-first optical cage; 413-first socket; 421-second optical module; 422-second optical cage; 423-second socket; 5-th A heat conduction module; 51—heat conduction substrate; 52—heat pipe; 6—second heat conduction module; 71—third heat conduction module; 72—heat dissipation fins; 8-buckle; 81—pressing part; 82—first side 82-second side; 9-main PCB board; 10-connector; 11-thermal pad; 12-connector.

Detailed ways

The embodiments of the present application relate to the heat dissipation structure of the optical module and the communication device. The heat dissipation structure of the optical module and the communication device will be described in detail below with reference to the accompanying drawings.

The optical module is an important component in the field of optical communication. The optical module includes an electrical interface and an optical interface. The electrical interface is used for mating and plugging with the socket on the PCB board in the communication device, and the optical interface is used for connecting the optical fiber. The optical module can convert the electrical signal input by the electrical interface into an optical signal and output it by the optical interface, or convert the optical signal input by the optical interface into an electrical signal and output it by the electrical interface, or convert the electrical signal input by the electrical interface into an optical signal It is output by the optical interface, and at the same time, the optical signal input by the optical interface is converted into an electrical signal and output by the electrical interface.

Fig. 2 is a schematic structural diagram of a communication device provided by some embodiments of the application. The communication device includes: a panel 1 with a first jack, a PCB board 3 is arranged on one side of the panel 1, the PCB board 3 has a first surface A1 and a second surface A2 opposite to each other, and the first protection board 21 and the first surface A1 is opposite and connected to the panel 1, the PCB board 3 is connected to the first protection board 21 or connected to the panel 1, and the first optical module 411 is disposed on the first surface A1 through the first jack. Since the first optical cage 412 and the first socket 413 for plugging with the first optical module 411 are provided on the first surface A1, the first optical module 411 is inserted into the first optical cage 412 through the first socket and connected with The first socket 413 is plugged in, and the PCB board 3 is electrically connected to the main PCB board 9 through the connector 10. The main PCB board 9 is connected to the first protection board 21. In other words, the electrical signal on the first optical module 411 can be transmitted to the main PCB board 9 through the connector 10, or the electrical signal on the main PCB board 9 can be transmitted to the first optical module 411 through the connector 10, so Information exchange can be realized.

It should be noted that all the first directions involved in this application are the H direction as shown in FIG. 2.

The first protection board 21 in the embodiment shown in FIG. 2 is to protect the PCB board 3, the main PCB board 9 and the components on the PCB board 3 and the components on the main PCB board 9.

When the PCB board 3 is connected to the first protection board 21, a connector (for example, a bolt or a rivet connection) can be used. When the PCB board 3 and the panel 1 are connected, connectors can be used for connection, for example, bolts or rivets. As shown in FIG. 2, the PCB board 3 is connected to the flange section 101 of the panel 1 through a connector. Alternatively, the PCB board 3 and the panel may be connected by a card connection structure. For example, a card slot is opened at a position where the panel 1 is opposite to the PCB board 3, and the PCB board 3 is clamped in the card slot. This application does not limit the connection structure between the PCB board 3 and the first protection board 21 and the connection structure between the PCB board 3 and the panel 1.

In order to dissipate heat for the first optical module, some embodiments of the present application provide a heat dissipation structure for dissipating heat for the first optical module. As shown in FIG. 2, the heat dissipation structure includes a first heat conduction module 5 for conducting the heat emitted by the first optical module 411 to the first protection plate 21. The specific heat dissipation principle is as follows: the heat emitted by the first optical module 411 is conducted to the first protective plate 21 through the first heat conduction module 5, and the heat is dissipated through the first protective plate 21. That is, the embodiment provided in this application uses the existing first protective plate 21 as a heat sink for heat dissipation.

The technical effect produced by using the first protective plate 21 as the heat sink in the embodiment of the present application is that only the first heat conduction module 5 is required, and there is no need to install a heat sink that takes up a large space. This not only simplifies the structure of the entire communication device, but also saves a larger space for the entire communication device along the H direction as shown in FIG. 2.

The surface of the first optical module 411 opposite to the first protection plate 21 and the surface opposite to the surface emit heat generally higher than the heat emitted by other positions. In order to make full use of the difference between the first optical module and the first protection plate In the space between the first optical module 411, the surface of the first optical module 411 opposite to the first protection plate 21 is used as the heat conduction surface (the Q surface as shown in FIG. 2), and the first heat conduction module 5 is arranged between the heat conduction surface and the first protection plate 21 between.

The first heat conduction module 5 has a variety of achievable structures, and the structure is explained by two embodiments below.

In the first embodiment, as shown in FIG. 2, the first thermal conduction module 5 includes a thermally conductive substrate 51, one end of the thermally conductive substrate 51 is in contact with the first optical module 411, and the other end of the thermally conductive substrate 51 is in contact with the first protective plate 21. The heat of the first optical module 411 is conducted to the first protective plate 21 through the thermally conductive substrate 51. For example, the thermally conductive substrate 51 may be other metal plates such as aluminum plate, copper plate, or iron plate.

In the second embodiment, the first heat conduction module 5 includes an elastic heat conduction pad. One end of the thermal pad is in contact with the first optical module, and the other end of the thermal pad is in contact with the first protective plate 21.

Although both the thermally conductive substrate and the thermally conductive pad can meet the thermal conductivity requirements, the thermally conductive substrate has greater strength than the thermally conductive pad, so that it can be used in different environments, even in harsh environments, to improve performance. Therefore, in the present application, a thermally conductive substrate with simple structure, convenient materials, low manufacturing cost, and strong strength is preferred as the first thermal conduction module.

In order to further improve the heat conduction efficiency, the thermally conductive substrate 51 and the first optical module 411 are in surface contact, and the thermally conductive substrate 51 and the first protective plate 21 are also in surface contact. Compared with discrete point contact, the thermal conduction efficiency can be effectively improved.

Generally, the first optical cage 412 is provided with heat dissipation holes. In order to promote the contact between the thermally conductive substrate 51 and the first optical module 411, the thermally conductive substrate 51 has a boss at one end close to the first optical module, and the boss passes through the heat dissipation hole and the first optical module 411. Module face contact.

To further improve the heat conduction efficiency, the flatness of the contact surface of the thermally conductive substrate 51 and the first optical module 411 is as small as possible, and the roughness is also as small as possible. For example, the flatness is less than or equal to 0.05, and the roughness is less than or equal to 3.2 to reduce the thermal resistance between the thermally conductive substrate 51 and the first optical module 411, and to reduce the thermal resistance between the thermally conductive substrate 51 and the first protection plate 21.

To further improve the heat transfer efficiency, referring to FIG. 3, the first heat transfer module 5 further includes a heat pipe 52. The heat pipe 52 has an evaporating end and a condensing end opposite to each other. The heat pipe 52 is disposed in the heat conducting substrate 51, and the evaporating end is close to the first optical module 411, and the condensing end is close to the first protective plate 21. The heat pipe 52 is generally composed of a tube shell, a liquid wick and an end cap. The inside of the heat pipe 52 is pumped into a negative pressure state and filled with an appropriate liquid, which has a low boiling point and is easy to volatilize. The tube wall has a wick, which is made of capillary porous material. When the evaporating end of the heat pipe 52 is heated, the liquid in the capillary evaporates quickly, and the vapor flows to the condensing end under a slight pressure difference, and releases heat to condense again. Liquid, the liquid flows along the porous material back to the evaporation end by capillary force, and the cycle continues. This kind of circulation is rapid, and heat can be continuously conducted away. Therefore, the use of the heat pipe 52 arranged in the thermally conductive substrate 51 will effectively improve the heat transfer efficiency, so that the heat emitted by the first optical module 411 is diffused as soon as possible, and the phenomenon of heat accumulation that affects its performance is avoided.

The number of heat pipes can be determined according to the amount of heat dissipated by the first optical module. For example, when the heat dissipated by the first optical module is large, a plurality of heat pipes arranged in parallel may be used.

Generally, in a specific implementation, a plurality of first optical modules 411 are installed along the length direction of the panel 1 (the P direction as shown in FIG. 4). If a thermally conductive substrate is used to heat the first heat conduction module of the conduit, the structure shown in FIG. 4 can be adopted, that is, the thermally conductive substrate includes a first section 511 and a second section 512 that are separated. The first section 511 is in contact with the first optical module 411, and the corresponding multiple second sections 512 are connected as a whole, so that the heat pipe corresponding to each first optical module 411 is formed and hidden in the first section 511. Section 521, the second hidden section 522 hidden in the second section 512, and the exposed section 523 that is exposed. The purpose of this design is: because the heat pipe has a certain degree of flexibility compared to the heat-conducting substrate, when two adjacent first optical modules are inserted, the exposed section 523 can be designed to ensure that the insertion of one first optical module will not affect Insertion of another first optical module. That is, even if two adjacent first optical modules have different tolerances in the first direction when they are plugged in, the plugging can be completed smoothly.

In order to further improve the heat conduction efficiency, as shown in FIG. 2, the first heat conduction module 5 extends to an end of the first protective plate 21 away from the panel 1, and is connected to the first protective plate through a connector. Since the contact position of the first heat conduction module 5 and the first protective plate 21 is farther away from the panel 1, that is, the distance technology adopted is closer to the panel 1 than the contact position of the first heat conduction module 5 and the first protective plate 21, Due to the short distance, the heat diffused by the first protective plate will not flow to the first optical module 411 again, which will affect the heat dissipation effect of the first optical module 411. Therefore, the remote technology adopted in this application will be improved correspondingly. The heat dissipation effect of the first optical module.

In order to further improve the heat transfer efficiency, a heat pipe may be provided in the first protective plate 21. The heat pipe is added to increase the heat dissipation efficiency without reducing the strength of the first protective plate.

In some embodiments, the first heat conduction module 5 and the first protective plate 21 are fixedly connected by a connecting member, for example, by bolts, screws, or rivets. In some other embodiments, the first heat conduction module 5 and the first protective plate 21 are elastically connected by an elastic connecting member. For example, as shown in FIG. 2, an elastic thermally conductive pad 11 is provided between the first thermally conductive module 5 and the first protective plate, and then the first thermally conductive module is connected to the thermally conductive pad and the first protective plate through the connecting member 12.

It should be noted that the first connection method of the above two connection methods is generally applicable to scenarios where the first heat conduction module has a long extension distance. When the extension distance of the first heat conduction module is long, the fixed connection mode is adopted, and the influence on the floating of the first heat conduction module in the first direction is small. The second connection method is generally suitable for scenarios where the extension distance of the first heat conduction module is short. One is to ensure the smooth floating of the first heat conduction module in the first direction through elastic connection; the other is because of the extension distance of the first heat conduction module. When it is shorter, the assembly space along the first direction with the first protective plate is very small, on the order of millimeters. If the end of the first heat conduction module close to the first protective plate has a processing error, it may be connected to the first protective plate. Interference with other structures during connection. Therefore, the provision of an elastic thermal pad here can absorb the processing error of the first thermal conduction module, thereby reducing the processing accuracy of the first thermal conduction module, and ensuring smoother assembly of the first thermal conduction module and the first protective plate.

There are many ways to connect the first heat conduction module 5 and the first optical module 411. For example, the fixed connection, that is, the first heat conduction module 5 and the first optical module 411 are relatively fixed along the first direction. For another example, movably connected, that is, the first thermal conduction module 5 and the first optical module 411 can float relative to each other along the first direction.

During specific implementation, when the first optical module 411 is inserted along its insertion direction, it generally has a tolerance in the first direction. If the first heat conduction module 5 and the first optical module 411 are relatively fixed along the first direction, the first optical module 411 cannot be inserted into the optical cage 412 smoothly. Therefore, the embodiment of the present application provides that the first thermal conduction module 5 and the first optical module 411 can float relative to each other along the first direction.

The structure of the floating connection between the first thermal conduction module 5 and the first optical module 411 has various structures, and the structure is explained by two embodiments below.

In the first embodiment, as shown in FIG. 2, the first heat conduction module 5 is buckled with the first optical module 411 through a fastener 8, and the fastener 8 can float along the first direction. That is, the first heat conduction module 5 and the first optical module 411 are connected in a buckle manner, which is convenient for disassembly and assembly and easy operation.

In the second embodiment, a connecting hole is opened on the first heat conduction module 5, the first optical module 411 and the first heat conduction module 5 are connected by a connecting piece passing through the connecting hole, and a retractable spring is sleeved on the connecting piece. Specifically, the first heat conduction module is floated in the first direction relative to the first optical module through the expansion and contraction of the spring, so as to ensure the smooth insertion and connection of the first optical module.

Both of the above-mentioned embodiments can realize floating in the first direction. However, the buckle connection form of the first embodiment is convenient to operate, especially for communication equipment with a small installation space, and has stronger operability.

There are various design schemes for the structure that realizes the floating of the fastener 8 in the first direction. One possible design is a fastener made of elastic material. For example, it is made of spring steel, plastic and other materials with certain elasticity. The specific design of another buckle includes a support, an outer sleeve and an inner sleeve that are sleeved and made of rigid materials. The outer sleeve is fixed to the support, and the inner sleeve is sleeved in a first direction. The barrel slides from the first position to the second position, and the inner sleeve is also connected with an elastic resetting member for resetting the inner sleeve slid to the second position to the first position. Through the movement of the inner sleeve between the first position and the second position, the entire buckle floats in the first direction.

When a fastener made of an elastic material is used, as shown in FIGS. 5 and 6, the fastener 8 includes a pressing portion 81, a first side portion 82 and a second side portion 83. Wherein, the pressing portion 81 is used for attaching to the side of the first heat conduction module away from the first optical module, the pressing portion 81 has a first side and a second side opposite to each other, and the first side 82 is connected to the first side. The side edge is connected, the second side portion 83 is connected to the second side edge, and both the first side portion 82 and the second side portion 83 can be connected to the first optical module. When the fastener of this structure is used to fix the first thermal conduction module 5, the first side 82 can be clamped with the first optical module, and the second side 83 can also be clamped with the first optical module, thereby realizing the first thermal conduction module installation. In addition, when disassembling the first heat conduction module, move the first side 82 and the second side 83 of the buckle to make the bending part between the first side 82 and the pressing part 81 and the second side The bending part between the portion 83 and the pressing portion 81 is elastically deformed, so that the clamping structure between the first side portion 82 and the first optical module, and the clamping structure between the second side portion 83 and the first optical module The connection structure is separated, and the buckle can be removed to realize the disassembly of the first heat conduction module. The installation and disassembly operation is simple and easy to realize, and the buckle is made of elastic material to ensure that it can float in the first direction.

In order to further improve the connection strength between the fastener 8 and the first optical module, the contact area between the pressing portion 81 and the first optical module can be increased. As shown in FIG. 6, the pressing portion 81 is extended along the extending direction of the first optical module to improve the connection strength.

Since the distance between the heat conduction surface and the first protective plate is relatively close, basically at the millimeter level, in order to minimize the space occupied by the fastener, the fastener can be made of aluminum, steel or copper with a smaller thickness. have to.

In the above-mentioned embodiment, the clamping structure between the first side 82 and the first optical module may be: the first side 82 is provided with a card slot, the outer surface of the first optical module is provided with a buckle, and the card slot The card is connected to the buckle. Alternatively, a buckle is provided on the first side portion 82, a groove is provided on the outer surface of the first optical module, and the buckle is clamped in the groove. The clamping structure realized by the clamping slot and the buckle has a simple structure and is easy to realize.

The clamping structure between the second side 83 and the first optical module may be as follows: a clamping slot is provided on the second side, a buckle is provided on the outer surface of the first optical module, and the clamping groove is clamped on the buckle. Alternatively, a buckle is provided on the second side portion, and a groove is provided on the outer surface of the first optical module, and the buckle is clamped in the groove. Of course, other structures of the card connection structure can also be used, and this application does not limit the specific card connection structure, and any structure falls within the protection scope of this application.

As shown in Figure 2, the use of the first protective plate 21 as a heat sink can save a large space for the communication device in the H direction. In this case, as shown in Figures 7 and 8, the communication device also includes a second light. Module 421, the panel 1 has a second jack. Since the second surface A2 is provided with a second optical cage 422 and a second socket 423 for plugging in the second optical module 421, the second optical module 421 passes through Insert the second optical cage 422 through the second jack and plug into the second socket 423. That is to say, the PCB board 3 is used as a center-mounted PCB board, and optical modules are arranged on both the first side A1 and the second side A2, thus increasing the optical interface density of a PCB board, that is, adding a PCB board The number of optical interfaces meets the requirements of network transmission equipment for high-density optical interfaces.

In order to dissipate the heat of the second optical module 421 to ensure the working performance of the second optical module 421, a heat sink is also included. The heat sink is used for dissipating heat of the second optical module 421.

The radiator has a variety of achievable structures, and the achievable structures are explained through two embodiments below.

In the first embodiment, as shown in FIG. 7, the heat sink includes a second protective plate 22 and a second heat conduction module 6. The second protective plate 22 is opposite to the second surface A2 and connected to the panel 1; the second heat conduction module 6 is used to conduct the heat emitted by the second optical module 421 to the second protective plate 22.

By setting the second protective plate 22 connected to the panel 1, and using the second thermal conduction module 6 to conduct the heat emitted by the second optical module 421 to the second protective plate 22, the height dimension of the entire panel 1 can be kept unchanged. , And when the optical interface density of the PCB board is increased, there is no need to provide a dedicated heat sink that takes up a large space to dissipate heat from the second optical module.

In the second embodiment, as shown in FIG. 4, the heat sink includes heat dissipation fins 72 and a third heat conduction module 71. The heat dissipation fin 72 is located on a side of the second optical module 421 away from the panel 1, one end of the third heat conduction module 71 is in contact with the second optical module 421, and the other end of the third heat conduction module 71 is connected to the heat dissipation fin 72.

The heat emitted by the second optical module 421 is transferred to the heat dissipation fins 72 through the third heat conduction module 71 contacting the second optical module 421, and the heat dissipation fins 72 are used to dissipate heat, so as to realize the heat dissipation of the second optical module. In addition, the heat dissipation fins 72 are located on the side of the second optical module 421 far away from the panel 1, that is, on the outside of the electrical interface of the second optical module, so as not to occupy the space along the H direction of the communication device, thereby ensuring the Under the premise of the heat dissipation effect of the second optical module, the height dimension of the entire panel will not be increased.

In specific implementation, the first optical module 412 and the second optical module 421 are disposed oppositely on both sides of the PCB board 3.

The connection structure of the second heat conduction module 6 and the second optical module 421 shown in FIG. 7 may be the same as the connection structure of the first heat conduction module 5 and the first optical module 411. For example, the connection structure shown in FIGS. 5 and 6 is also used. The buckle connection. That is to say, the pressing part 81 is used for attaching to the side of the second heat conduction module 6 away from the second optical module, the pressing part 81 has a first side and a second side opposite to each other, and the first side 82 It is connected to the first side, and the second side 83 is connected to the second side. Both the first side 82 and the second side 83 can be connected to the second optical module. In addition, the structure of the fastener for fixing the second heat conduction module and the second optical module can be the same as the structure of the fastener for fixing the first heat conduction module and the first optical module, and the size can be designed according to the actual installation space.

The structure of the second heat conduction module 6 may be the same as that of the first heat conduction module 5. For example, a heat conduction module with a heat conduction substrate and a heat pipe arranged in the heat conduction substrate may also be used. Similarly, the specific dimensions of the heat conduction substrate and the heat pipe may be Designed according to the actual installation space.

The surface of the second optical module opposite to the second protection plate is a heat conduction surface, and the second heat conduction module is arranged between the heat conduction surface and the second protection plate. This not only guarantees the heat dissipation effect of the second optical module, but also makes full use of the space between the second optical module and the second protective plate.

The connection structure of the third heat conduction module 71 and the second optical module 421 shown in FIG. 8 may be the same as the connection structure of the first heat conduction module 5 and the first optical module 411. For example, the connection structure shown in FIGS. 5 and 6 is also used. The buckle connection.

The structure of the third heat conduction module 71 may be the same as that of the first heat conduction module 5. For example, a heat conduction module of a heat conduction substrate and a heat pipe arranged in the heat conduction substrate may also be used.

In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner.

The above are only specific implementations of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, and they should all be covered. Within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

A heat dissipation structure of an optical module is characterized in that it comprises:

The panel has a first jack;

The PCB board is arranged on one side of the panel, the PCB board has a first surface and a second surface opposite to each other, and the first surface is used for mounting the first optical module;

A first protective plate opposite to the first surface and connected to the panel, and the PCB board is connected to the first protective plate or connected to the panel;

The first heat conduction module is used to conduct the heat emitted by the first optical module to the first protective plate.
The heat dissipation structure of the optical module according to claim 1, further comprising:

The panel has a second jack, and the second surface is used for installing a second optical module;

The heat sink is used to diffuse the heat emitted by the second optical module.
The heat dissipation structure of the optical module according to claim 2, wherein the heat sink comprises:

A second protective plate opposite to the second surface and connected to the panel;

The second heat conduction module is used to conduct the heat emitted by the second optical module to the second protective plate.
The heat dissipation structure of the optical module according to claim 2, wherein the heat sink comprises:

Heat dissipation fins located on the side of the second optical module far away from the panel;

A third heat conduction module, one end of the third heat conduction module is in contact with the second optical module, and the other end of the third heat conduction module is connected with the heat dissipation fin.
The heat dissipation structure of the optical module according to any one of claims 1 to 4, wherein the surface of the first optical module opposite to the first protective plate is a heat conduction surface, and the first heat conduction module It is arranged between the heat conduction surface and the first protection plate.
The heat dissipation structure of the optical module according to any one of claims 1-5, further comprising: a fastener, and an end of the first heat conduction module close to the first optical module passes through the fastener When it is clamped with the first optical module, the buckle can float along a first direction, and the first direction is a direction perpendicular to the insertion direction of the first optical module.
The heat dissipation structure of the optical module according to claim 6, wherein the fastener is made of elastic material.
The heat dissipation structure of the optical module according to claim 7, wherein the buckle includes a pressing part, a first side part and a second side part, and the pressing part is used to communicate with the first heat conduction module. Attach the side away from the first optical module, the pressing portion has a first side and a second side opposite to each other, the first side is connected to the first side, and the first side is connected to the first side. The two side portions are connected with the second side edge, and both the first side portion and the second side portion are clamped with the first optical module.
The heat dissipation structure of the optical module according to any one of claims 1-8, wherein the first thermal conduction module comprises: a thermally conductive substrate, one end of which is in contact with the first optical module, and the other end is in contact with the first optical module. A protective plate touches.
The heat dissipation structure of the optical module according to claim 9, wherein the first heat conduction module further comprises: a heat pipe, the heat pipe having opposite evaporating ends and condensing ends, and the heat pipes are arranged on the In the thermally conductive substrate, the evaporating end is close to the first optical module, and the condensing end is close to the first protective plate.
The heat dissipation structure of the optical module according to any one of claims 1-10, wherein the first heat conduction module extends to an end of the first protective plate away from the panel, and is connected to The first protective plate is connected.
A communication device, comprising: the heat dissipation structure of the optical module according to claim 1, the first optical module and a first socket; wherein the first socket is arranged on the first surface, And the first optical module is inserted into the first socket through the first jack.
The communication device according to claim 12, wherein the first optical module is detachably installed in a first optical cage, the first optical cage has a heat dissipation hole, and the first heat conduction module is close to the first optical cage. One end of the first optical module has a boss, and the boss passes through the heat dissipation hole to contact the first optical module.
The communication device according to claim 12 or 13, further comprising: a main PCB board, and the main PCB board is electrically connected to the PCB board through a connector.
A communication device, comprising: the heat dissipation structure of the optical module according to any one of claims 2-4, the second optical module and a second socket; wherein the second socket is arranged at the On the second surface, the second optical module is inserted into the second socket through the second jack.