CN117250699A - Optical module heat dissipation assembly and optical communication equipment - Google Patents
Optical module heat dissipation assembly and optical communication equipment Download PDFInfo
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- CN117250699A CN117250699A CN202210651921.9A CN202210651921A CN117250699A CN 117250699 A CN117250699 A CN 117250699A CN 202210651921 A CN202210651921 A CN 202210651921A CN 117250699 A CN117250699 A CN 117250699A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 249
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 245
- 238000004891 communication Methods 0.000 title claims abstract description 39
- 239000003507 refrigerant Substances 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 abstract description 29
- 238000013461 design Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 16
- 238000001816 cooling Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract 1
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 67
- 238000010586 diagram Methods 0.000 description 27
- 239000002826 coolant Substances 0.000 description 10
- 238000009434 installation Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application provides an optical module heat dissipation assembly and optical communication equipment, wherein the optical module heat dissipation assembly comprises at least two layers of optical modules, a heat dissipation structure, a heat exchanger and a driving pump, wherein the at least two layers of optical modules are arranged in a lamination mode, and the heat dissipation direction of the bottommost optical module deviates from the adjacent optical module positioned on the upper layer; the heat radiation structure is in heat conduction contact with one end of the bottommost optical module in the heat radiation direction; the heat exchanger stores refrigerant; the driving pump is connected with the heat exchanger and used for controlling the refrigerant to circularly flow between the heat radiation structure and the heat exchanger. In this application, the refrigerant can take away the heat of transmission to heat radiation structure in cyclic process to realized the continuous heat dissipation cooling to the bottommost optical module. Through the principle of refrigerant flow cooling, can make the whole volume design of heat radiation structure less, need not to design the fin, and simple to operate, the radiating effect is excellent.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module heat dissipation assembly and optical communication equipment.
Background
With the increase of the capacity of the network equipment, the speed of the optical module is higher and higher, and the power consumption is higher and higher from 10G, 25G, 100G, 400, 800G and 1.6T, so that the heating device in the optical communication equipment needs to have good heat dissipation to ensure the port density of the equipment and the performance of products. Generally, the double-layer optical cage has the advantages of high integration level and simple plate-level arrangement, but the lowest-layer optical module in the double-layer optical cage has small heat dissipation space and is difficult to effectively dissipate heat, so that the double-layer optical cage cannot be widely applied.
Disclosure of Invention
An object of the present application is to provide an optical module heat dissipation assembly and an optical communication device, so as to solve the problem that the lowest optical module in the existing double-layer optical cage is difficult to effectively dissipate heat.
A first aspect of the present application provides an optical module heat sink assembly, comprising:
at least two layers of optical modules are arranged in a laminated mode, and the heat dissipation direction of the bottommost optical module deviates from the adjacent optical module positioned on the upper layer;
the heat dissipation structure is in heat conduction contact with one end of the bottommost light module in the heat dissipation direction;
the heat exchanger is used for storing a refrigerant;
the driving pump is connected with the heat exchanger and used for controlling the refrigerant to circularly flow between the heat dissipation structure and the heat exchanger.
The application provides an optical module cooling assembly, through making the heat dissipation direction of bottom optical module towards circuit board place one side, heat radiation structure can be with the surface contact heat conduction towards circuit board one side on the bottom optical module to make the heat of bottom optical module can directly transmit to heat radiation structure on. Meanwhile, the refrigerant can circulate between the heat radiation structure and the heat exchanger under the action of the driving pump, and the refrigerant can take away the heat transferred to the heat radiation structure in the circulation process, so that the continuous heat radiation and temperature reduction of the bottommost optical module are realized. The heat radiation structure can be a box-shaped structure, has smaller thickness, can realize the flow of refrigerant, can lead the whole volume design of the heat radiation structure to be smaller through the principle of refrigerant flow cooling, does not need to design fins, and can utilize the space between the bottommost optical module and the circuit board to be arranged, or can also open holes on the circuit board, so that the heat radiation structure is embedded in the holes on the circuit board, and has convenient connection and excellent heat radiation effect.
In one possible design, the at least two layers of optical modules are two layers of optical modules, and the heat dissipation direction of the upper layer of optical modules is away from the bottommost layer of optical modules; and a heat dissipation device is arranged on one side of the upper layer optical module, which is away from the bottommost layer optical module.
The upper layer optical module has a relatively large space above, and heat dissipation of the upper layer optical module can be realized by arranging a heat dissipation device. The heat sink may be a conventional heat sink having fins for dissipating heat. The heat dissipation direction of the upper layer optical module is opposite to that of the bottommost layer optical module, and faces to one side of the heat dissipation device, so that heat can be transferred to the heat dissipation device and dissipated through the fins. Therefore, the double-layer optical module can have good heat dissipation effect through the heat dissipation device and the matching of the optical module heat dissipation assembly. Of course, the uploading optical module can also adopt the optical module radiating assembly to radiate heat, namely, the radiating structure can be in contact with the surface of the top of the upper optical module for heat conduction, so that the cooling medium is utilized for radiating heat.
In one possible design, the at least two layers of optical modules are three layers of optical modules, the heat dissipation direction of the middle layer of optical modules is away from the bottommost layer of optical modules, and the heat dissipation direction of the topmost layer of optical modules is away from the middle layer of optical modules; and the heat dissipation structure is in heat conduction contact with the bottommost optical module, the middle optical module and the topmost optical module respectively.
The optical modules of each layer can radiate heat through the corresponding heat radiation structure, so that a traditional radiator is not required to be arranged, and poor heat radiation caused by limited fin height is avoided. The heat dissipation structures corresponding to the light modules in each layer are uniformly distributed on one side of the corresponding light module in the heat dissipation direction, so that heat of the light modules is mainly transferred to the heat dissipation structures, and effective heat dissipation is realized through a refrigerant.
In one possible design, the heat-dissipating structure is provided with a cavity and an inflow port and an outflow port communicating with the cavity, through which the cavity communicates with the drive pump and the heat exchanger, respectively.
The cooling medium can flow into the containing cavity from the inflow port, the heat radiating structure is in contact with the optical module, the optical module can conduct heat to the heat radiating structure, the heat of the heat radiating structure can be in heat exchange with the cooling medium in the containing cavity, the cooling of the whole heat radiating structure can be achieved through the cooling medium, the cooling medium with higher temperature can flow out of the containing cavity from the outflow port, the cooling medium with higher temperature is subjected to heat exchange again in the heat exchanger, so that the cooling medium with lower temperature is output from the heat exchanger, and the cooling medium with lower temperature participates in the circulation heat radiation of the next time. Therefore, continuous heat dissipation of the optical module can be realized through the flow of the refrigerant, and in order to realize the circulation flow of the refrigerant, only the containing cavity, the inflow port and the outflow port are required to be arranged in the heat dissipation structure, and the structures such as fins and the like are not required to be designed outside the heat dissipation structure, so that the space is effectively saved.
In one possible design, the inflow opening communicates with the outflow opening of the heat exchanger via a line, and the outflow opening communicates with the inflow end of the drive pump via a line; or the inflow port is communicated with the liquid inlet of the heat exchanger through a pipeline, and the outflow port is communicated with the outflow end of the driving pump through a pipeline.
In one possible design, the optical module heat dissipation assembly comprises a main pipeline and at least two heat dissipation loops, wherein at least one heat exchanger and at least one heat dissipation structure are connected in series in each heat dissipation loop; the driving pump comprises a plurality of micropumps, the micropumps are connected in series in the main pipeline, and the main pipeline is connected in series with the at least two heat dissipation loops respectively.
The two heat dissipation loops are connected in parallel through the main pipeline, the power sources of the two heat dissipation loops are all from micropumps connected in series on the main pipeline, and as the number of micropumps connected in series on the main pipeline is at least two, when one micropump fails or only one micropump can normally work, the main pipeline is connected in series with the two heat dissipation loops respectively, at the moment, the two heat dissipation loops can still be in a parallel connection mode through the micropump capable of normally working and simultaneously provide power for the refrigerants of the two heat dissipation loops, and the refrigerants in each heat dissipation loop can only conduct heat dissipation and temperature reduction on the optical module in the corresponding loop, so that the optical module in each heat dissipation loop can still maintain a better heat dissipation effect.
In one possible design, the optical module heat dissipation assembly comprises a main pipeline and at least two heat dissipation loops, wherein at least one heat exchanger, at least one heat dissipation structure and at least one driving pump are connected in series in each heat dissipation loop; the main pipeline is respectively connected with the at least two radiating loops in series.
In one possible design, the heat dissipation structure includes a base and a cover, the cavity is disposed on the base, and the cover is fastened on the base to close the cavity.
The cover body can be welded on the base, so that reliable connection and fixation between the cover body and the base can be realized, and on the other hand, the sealing effect on the containing cavity can be ensured. The heat radiation structure can conduct thermal contact with the optical module through the cover body, and the refrigerant in the containing cavity can conduct heat exchange with the heat of the cover body, so that the heat radiation structure and the optical module are cooled.
In one possible design, the bottom of the base is provided with a concave space for arranging a pipeline, and the inflow port and the outflow port are arranged on one side of the containing cavity, which is close to the concave space.
Wherein, through set up the sunken space in the bottom of base, can make the pipeline arrange in sunken space, this sunken space can make things convenient for the arrangement of pipeline to and be convenient for the pipeline to be connected with inflow port and egress opening, can realize the restraint to the pipeline through the lateral wall in sunken space.
In one possible design, a plurality of teeth are arranged in the accommodating cavity, and the inflow opening and the outflow opening are respectively positioned at two sides of the teeth.
The refrigerant flowing into the accommodating cavity from the inflow port needs to be radiated through the relieving teeth, and can flow out from the outflow port after passing through the relieving teeth. Wherein the gear relieved can directly machine-shaping on the base, also can weld on the base, and the gear relieved can give the base with heat transfer, and the base can carry out the heat exchange with air medium and realize the heat dissipation. That is, the heat radiation structure can radiate heat through a refrigerant on one hand, and can radiate heat naturally through the shovel teeth and the base on the other hand, so that the heat radiation structure has a good heat radiation effect.
In one possible design, the heat dissipation structure further includes an elastic member, one end of the elastic member abuts against the base, and the other end of the elastic member is used for being mounted on the optical communication device.
The base can be supported on the elastic piece, the elastic piece can provide elastic force for the base, the base is enabled to be in a 'suspension' structure, when the optical module is installed on the optical communication device, the optical module can be in contact with the cover plate of the heat dissipation structure, the heat dissipation structure is integrally pressed down, the elastic piece is compressed through the base, and the reaction force of the elastic piece can ensure that the cover plate can be reliably contacted with the optical module.
In one possible design, the elastic element is a spring or a metal spring plate.
In one possible design, the light module heat dissipation assembly further comprises a fixing frame, and a positioning hole is formed in the fixing frame; the base is provided with a positioning protrusion, and the positioning protrusion is matched with the positioning hole. Therefore, the accuracy of the installation positions of the plurality of heat dissipation structures is ensured, and the installation operation is convenient.
The second aspect of the present application also provides an optical communication apparatus, including:
a system backboard;
the optical module heat dissipation device comprises a system backboard, a plurality of single boards, at least one optical module heat dissipation assembly and a plurality of optical modules, wherein the single boards are connected to the system backboard, and each single board is provided with at least one optical module heat dissipation assembly provided by the first aspect of the application, and the bottommost optical module in the optical module heat dissipation assembly is close to the single board.
The third aspect of the present application further provides an optical communication device, which includes a single board and the optical module heat dissipation assembly provided in the first aspect of the present application, where the optical module heat dissipation assembly is disposed on the single board.
In one possible design, the single board includes a circuit board, the circuit board is provided with a through hole, and the heat dissipation structure is arranged through the through hole.
The circuit board may be a printed circuit board (Printed circuit boards, PCB), and a through hole may be disposed on the PCB, and the heat dissipation structure 1 may be movably disposed in the through hole. The through hole can provide a larger arrangement space for the heat radiation structure 1 under the existing structural layout condition of the optical communication equipment, is beneficial to arranging the heat radiation structure 1 below the bottommost optical module, and avoids extra occupied space.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
FIG. 1 is a state diagram of a double layer optical cage in practical application;
fig. 2 is a schematic structural diagram of an optical module heat dissipation assembly according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an optical module heat dissipation assembly according to another embodiment of the present disclosure;
FIG. 4 is a state diagram of a heat dissipating structure in an application (I);
FIG. 5 is an exploded view of a heat dissipating structure;
FIG. 6 is a schematic diagram of a heat dissipation structure at a bottom view;
fig. 7a is a schematic diagram of a refrigerant circulation flow when two micropumps in an optical module heat dissipation assembly provided in an embodiment of the present application are connected in series in a main pipeline;
FIG. 7b is a schematic view of the refrigerant circulation flow of FIG. 7a with only one micropump operating normally;
fig. 7c is a schematic structural diagram of two micropumps in the optical module heat dissipation assembly provided in the present application connected in series in a main pipeline;
fig. 8a is a schematic diagram of refrigerant circulation flow when two micropumps in an optical module heat dissipation assembly provided in another embodiment of the present application are respectively connected in series in different heat dissipation loops;
FIG. 8b is a schematic view of the refrigerant circulation flow of FIG. 8a with only one micropump operating normally;
FIG. 9 is a state diagram of the elastic member installed in the heat dissipating structure;
fig. 10 is a schematic diagram of an optical communication device according to an embodiment of the present application;
fig. 11 is a schematic diagram of an optical communication device according to another embodiment of the present application;
fig. 12 is a schematic diagram of an optical communication device according to another embodiment of the present application.
Reference numerals:
100-optical cage;
101 a-an upper optical module;
101 b-an underlying optical module;
102 a-upper layer optical module;
102 b-a bottommost optical module;
103 a-a bottommost light module;
103 b-an intermediate layer optical module;
103 c-topmost light module;
200-a circuit board;
201-a heat generating device;
202-a through hole;
203-a stent;
300-a heat sink;
301-fins;
400-fans;
1-a heat dissipation structure;
11-a cover;
12-a base;
121-an inflow port;
122-outflow port;
123-positioning protrusions;
13-a cavity;
14-a concave space;
15-relieving;
2-a heat exchanger;
3-driving a pump;
31-micropump;
4 a-a heat dissipation loop;
4 b-a heat dissipation loop;
4 c-a large circulation loop;
5-pipeline;
51-main line;
6-elastic members;
7-fixing frames;
71-positioning holes;
8-a system back plate;
9-veneer.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
Detailed Description
For a better understanding of the technical solutions of the present application, embodiments of the present application are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In the description of the present application, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance unless explicitly specified or limited otherwise; the term "plurality" means two or more, unless specified or indicated otherwise; the terms "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
The light cage generally comprises a single layer and multiple layers, and the multiple layers of light cage can be a double layer light cage, a three layer light cage or even more layers of light cage. The light cage 100 is illustrated as a double layer light cage. Fig. 1 is a state diagram of a double-layer optical cage in practical application, as shown in fig. 1, a conventional double-layer optical cage 100 includes two optical modules, which are located on the same side of a circuit board 200 and are stacked in an up-down direction. In this case, since there is no other light module above the light module 101a located above, a relatively large space is provided, and a heat sink may be disposed to dissipate heat from the light module 101a located above. However, for the optical module 101b located below, since the top of the optical module 101b below is close to the optical module 101a above and the bottom of the optical module 101b below is close to the circuit board 200, the heat dissipation space of the optical module 101b below is relatively small, and heat dissipation is difficult, if considering that a heat sink is arranged between the optical module 101b below and the circuit board 200, since there is generally a long fin on the heat sink, there is not enough space between the optical module 101b below and the circuit board 200 to arrange the heat sink with fins; however, if the fin length is reduced, a good heat dissipation effect cannot be achieved. Therefore, the existing double-layer optical cage 100 has a poor heat dissipation effect of the optical module 101b below, and has a large limitation in the application process.
The embodiment of the application provides an optical module heat dissipation assembly and an optical communication device, wherein the optical module heat dissipation assembly is applied to the optical communication device, and the optical communication device can be a switch, an optical distribution box, an optical transceiver and the like, and is not particularly limited herein.
Fig. 2 is a schematic structural diagram of an optical module heat dissipation assembly according to an embodiment of the present application, as shown in fig. 2, the optical module heat dissipation assembly includes at least two layers of optical modules, a heat dissipation structure 1, a heat exchanger 2 and a driving pump 3. The optical modules of at least two layers are stacked, and the heat dissipation direction of the optical module of the bottommost layer deviates from the adjacent optical module positioned on the upper layer. The at least two-layer optical module may have two layers, three layers, or more, and this embodiment will be described taking the example of the optical module having two layers. The bottommost light module is close to the circuit board 200, and the upper light module 102a is located above the bottommost light module 102b and away from the circuit board 200.
As shown in fig. 2, the heat dissipation structure 1 is in heat conduction contact with one end of the bottommost optical module 102b in the heat dissipation direction, and the heat dissipation direction of the bottommost optical module 102b is downward, that is, toward the side where the circuit board 200 is located. It should be noted that, the optical module has a unidirectional main conduction characteristic, that is, the heat of the optical module is mainly transferred in a single direction, in this embodiment, the heat dissipation direction of the bottommost optical module 102b faces the side of the circuit board 200, and the heat dissipation structure 1 may contact with the surface of the bottommost optical module 102b facing the side of the circuit board 200 to conduct heat, so that the heat of the bottommost optical module 102b may be directly transferred to the heat dissipation structure 1.
The heat exchanger 2 stores a refrigerant, the driving pump 3 is connected with the heat exchanger 2, the driving pump 3 is used for controlling the refrigerant to circulate between the heat radiation structure 1 and the heat exchanger 2, and the refrigerant can take away the heat transferred to the heat radiation structure 1 in the circulation process, so that the continuous heat radiation and cooling of the bottommost optical module 102b are realized. The heat dissipation structure 1 can be a box-shaped structure, has smaller thickness, can realize the flow of a refrigerant, can enable the whole volume design of the heat dissipation structure 1 to be smaller through the principle of cooling by flowing the refrigerant, does not need to design fins, and can utilize the space between the bottommost optical module 102b and the circuit board 200 to be arranged, or can also be provided with holes on the circuit board 200, so that the heat dissipation structure 1 is embedded in the holes on the circuit board 200, and is convenient to connect and excellent in heat dissipation effect.
In a specific implementation, as shown in fig. 2, the optical module stack is provided with two layers, the heat dissipation direction of the upper optical module 102a is away from the bottommost optical module 102b, and the upper optical module 102a is provided with a heat dissipation device 300 at a side away from the bottommost optical module 102 b. In this embodiment, a relatively large space is provided above the upper layer optical module 102a, and heat dissipation of the upper layer optical module 102a can be achieved by arranging the heat dissipation device 300. The heat sink 300 may be a conventional heat sink having fins 301 for dissipating heat. Since the heat dissipation direction of the upper layer optical module 102a is away from the bottommost layer optical film module, that is, the heat dissipation direction of the upper layer optical module 102a is opposite to the heat dissipation direction of the bottommost layer optical module 102b, and faces the side of the heat dissipation device 300, heat can be transferred to the heat dissipation device 300 and dissipated through the fins 301. Therefore, by matching the heat dissipation device 300 with the heat dissipation assembly of the optical module provided by the embodiment, the double-layer optical module can have a good heat dissipation effect. Of course, the uploading optical module can also adopt the optical module heat dissipation assembly to dissipate heat, namely the heat dissipation structure 1 can be in contact with the surface of the top of the upper optical module 102a for heat conduction, so that heat dissipation by using a refrigerant is realized.
In another specific implementation manner, fig. 3 is a schematic structural diagram of an optical module heat dissipation assembly according to another embodiment of the present application, and as shown in fig. 3, an optical module may be stacked with three layers, and is mainly applied to a scenario of a high-density output port. The three layers of optical modules are stacked in a limited space, which can cause the space around each layer of optical module to be further compressed, and particularly for the topmost layer of optical module, the heat dissipation is difficult to be performed by arranging a traditional radiator with fins, and in a step, the fins need to have a certain height to realize the heat dissipation, but insufficient space around the topmost layer of optical module is provided with a radiator with higher fin height, and if the fin height is reduced, the effect is poor. Of course, the intermediate optical module cannot effectively dissipate heat due to space limitation.
For this reason, in this embodiment, as shown in fig. 3, the heat dissipation direction of the middle layer optical module 103b is away from the bottommost layer optical module 103a, the heat dissipation direction of the topmost layer optical module 103c is away from the middle layer optical module 103b, and the heat dissipation structure 1 is in heat conduction contact with the bottommost layer optical module 103a, the middle layer optical module 103b, and the topmost layer optical module 103c, respectively. That is, the optical modules in each layer can perform cooling medium heat dissipation through the corresponding heat dissipation structure 1, so that a traditional radiator is not required to be arranged, and poor heat dissipation caused by limited fin height is avoided. The heat dissipation structures 1 corresponding to the optical modules of each layer are uniformly distributed on one side corresponding to the heat dissipation direction of the optical module, so that the heat of the optical module is mainly transferred to the heat dissipation structures 1, and the effective heat dissipation is realized through a refrigerant.
Specifically, fig. 4 is a state diagram (one) of the heat dissipating structure in application, fig. 5 is an exploded view of the heat dissipating structure, fig. 6 is a schematic view of the heat dissipating structure 1 from the bottom perspective, and as shown in fig. 4 to 6, the heat dissipating structure 1 is provided with a cavity 13 and an inflow port 121 and an outflow port 122 communicating with the cavity 13, the cavity 13 communicating with the driving pump 3 and the heat exchanger 2 through the inflow port 121 and the outflow port 122, respectively. The refrigerant can flow into the cavity 13 from the inflow port 121, the optical module can conduct heat to the heat dissipation structure 1 due to the contact between the heat dissipation structure 1 and the optical module, the heat of the heat dissipation structure 1 can exchange heat with the refrigerant in the cavity 13, the whole heat dissipation structure 1 can be cooled by the refrigerant, the refrigerant with higher temperature can flow out of the cavity 13 from the outflow port 122, the refrigerant with higher temperature exchanges heat in the heat exchanger 2 again, so that the refrigerant with lower temperature is output from the heat exchanger 2, and the refrigerant with lower temperature participates in the circulation heat dissipation of the next time again. Therefore, continuous heat dissipation of the optical module can be realized through the flow of the refrigerant, and in order to realize the circulation flow of the refrigerant, the heat dissipation structure 1 is only required to be internally provided with the containing cavity 13, the inflow port 121 and the outflow port 122, and the structures such as fins and the like are not required to be designed outside the heat dissipation structure 1, so that the space is effectively saved.
Specifically, in one connection manner, fig. 7a is a schematic diagram of a refrigerant circulating flow when two micropumps in an optical module heat dissipation assembly provided in an embodiment of the present application are connected in series in a main pipeline, as shown in fig. 7a, an inflow port 121 of a heat dissipation structure 1 is communicated with a liquid outlet of a heat exchanger 2 through a pipeline 5, and an outflow port 122 of the heat dissipation structure 1 is communicated with an inflow end of a driving pump 3 through the pipeline 5. The driving pump 3 can provide power for circulating flow of the refrigerant, and in a circulation loop formed by adopting the connection mode of the embodiment, the driving pump 3 can provide power to enable the refrigerant in the heat exchanger 2 to directly flow into the containing cavity 13 in the heat dissipation structure 1 through the pipeline, and the refrigerant subjected to heat exchange in the containing cavity 13 can flow back to the driving pump 3 through the outflow port 122 of the heat dissipation structure 1 and further flow back to the heat exchanger 2 through the driving pump 3.
In another connection manner, fig. 8a is a schematic diagram of a refrigerant circulating flow when two micropumps in an optical module heat dissipation assembly provided in another embodiment of the present application are respectively connected in series in different heat dissipation loops, as shown in fig. 8a, an inflow port 121 is communicated with a liquid inlet of a heat exchanger 2 through a pipeline 5, and an outflow port 122 is communicated with an outflow end of a driving pump 3 through a pipeline 5. In the circulation loop formed by adopting the connection mode of the embodiment, the driving pump 3 provides power to enable the heat exchanger 2 to output the refrigerant with lower temperature, the refrigerant with lower temperature is firstly input into the accommodating cavity 13 of the heat dissipation structure 1 through the driving pump 3, and the refrigerant subjected to heat exchange in the accommodating cavity 13 directly flows back into the heat exchanger 2 through the pipeline.
That is, the connection positions of the driving pump 3 and the heat exchanger 2 may be interchanged, and in particular, may be designed according to the actual connection requirements.
Specifically, in one embodiment, fig. 7a is a schematic diagram of a refrigerant circulating flow when two micropumps in an optical module heat dissipation assembly provided in one embodiment of the present application are connected in series in a main pipeline, and fig. 7c is a schematic structural diagram of two micropumps in an optical module heat dissipation assembly provided in the present application connected in series in a main pipeline, as shown in fig. 7a and fig. 7c, the optical module heat dissipation assembly includes a main pipeline 51 and at least two heat dissipation loops 4a, and at least one heat exchanger 2 and at least one heat dissipation structure 1 are connected in series in each heat dissipation loop 4 a; the driving pump 3 includes a plurality of micropumps 31, the micropumps 31 being connected in series in a main pipe 51, the main pipe 51 being connected in series with at least two heat dissipation circuits 4a, respectively. In this application, the number of micropumps 31 in series is preferably two.
That is, the two heat dissipation circuits 4a are connected in parallel to each other through the main pipe 51, and the power sources of the two heat dissipation circuits 4a are all from the micropump 31 connected in series to the main pipe 51. Fig. 7b is a schematic diagram of the refrigerant circulation flow when only one micropump 31 in fig. 7a works normally, as shown in fig. 7b, since at least two micropumps 31 are connected in series on the main pipeline 51, when one micropump 31 fails, or only one micropump 31 can work normally, the main pipeline 51 can be connected in series with two heat dissipation loops 4a respectively, at this time, the two heat dissipation loops 4a can still be connected in parallel by the micropump 31 capable of working normally to provide power for the refrigerant of the two heat dissipation loops 4a, and the refrigerant in each heat dissipation loop 4a can only dissipate heat and cool the optical module in the corresponding loop, so that the optical module in each heat dissipation loop 4a can still maintain a better heat dissipation effect.
In another embodiment, fig. 8a is a schematic diagram of a refrigerant circulating flow when two micropumps in an optical module heat dissipation assembly provided in another embodiment of the present application are respectively connected in series in different heat dissipation loops, as shown in fig. 8a, the optical module heat dissipation assembly includes a main pipeline 51 and at least two heat dissipation loops 4b, at least one heat exchanger 2, at least one heat dissipation structure 1 and at least one driving pump 3 are connected in series in each heat dissipation loop 4b, and the main pipeline 51 is respectively connected in series with the at least two heat dissipation loops 4 b. In this embodiment, the main pipeline 51 is a pipeline for only transmitting refrigerant, the micro pump 31 is not connected in series to the main pipeline 51, and the micro pump 31 is connected in series to the corresponding heat dissipation circuit 4b to provide power for the corresponding heat dissipation circuit 4 b. Fig. 8b is a schematic diagram of the circulation flow of the refrigerant when only one micropump in fig. 8a is in normal operation, as shown in fig. 8b, when the micropump 31 in one heat dissipation loop 4b fails and the micropump 31 in the other heat dissipation loop 4b is in normal operation, at this time, two small heat dissipation loops 4b are connected in series to form a larger large circulation loop 4c, in this large circulation loop 4c, the optical modules originally in the two heat dissipation loops 4b are connected in series, the heat exchangers 2 in the two heat dissipation loops 4b are connected in series, the micropump 31 capable of normal operation provides power for the whole large circulation loop 4c, and during the circulation process, the refrigerant sequentially passes through all the optical modules, since in the large circulation loop 4c, the number of the optical modules connected in series is the sum of the number of the optical modules of the two heat dissipation loops 4b, and during the sequential passing through all the optical modules, the temperature of the refrigerant gradually increases, which has a limited heat dissipation effect on the following optical modules. For the scheme of connecting each micropump 31 in series to the main pipeline 51, even if only one micropump 31 works normally, the cooling medium in each heat dissipation circuit 4b can only dissipate heat of the optical module in the corresponding heat dissipation circuit 4b, so that the heat dissipation efficiency of each heat dissipation circuit 4b can be improved, and the heat dissipation effect is improved.
As a specific implementation manner, the heat dissipation structure 1 includes a base 12 and a cover 11, the cavity 13 is disposed on the base 12, and the cover 11 is fastened to the base 12 and is used for sealing the cavity 13.
The cover 11 may be welded to the base 12, so that reliable connection and fixation between the cover 11 and the base 12 may be achieved, and on the other hand, a sealing effect on the cavity 13 may be ensured. The heat radiation structure 1 can be in thermal contact with the optical module through the cover body 11, and the refrigerant in the accommodating cavity 13 can exchange heat with the heat of the cover body 11, so that the heat radiation and the temperature reduction of the heat radiation structure 1 and the optical module are realized.
As a specific implementation, the bottom of the base 12 is provided with a concave space 14 for arranging a pipeline, and the inflow port 121 and the outflow port 122 are disposed on one side of the cavity 13 near the concave space 14.
It will be appreciated that the inflow port 121 and the outflow port 122 may be connected to the driving pump 3 or the heat exchanger 2 through pipes, respectively, and that the pipes 5 occupy more space and are inconvenient for constraint management of the pipes 5 because the pipes 5 have a certain volume, so that the pipes 5 are arranged from above or from the side of the heat dissipation structure 1. In this embodiment, by providing the concave space 14 at the bottom of the base 12, the pipe 5 can be disposed in the concave space 14, the concave space 14 can facilitate the arrangement of the pipe 5, and the connection of the pipe 5 with the inflow port 121 and the outflow port 122, and the restriction of the pipe 5 can be achieved through the side wall of the concave space 14.
Wherein, in order to reduce the pipeline bridging force, the pipeline can adopt a corrugated pipe.
As a specific implementation manner, a plurality of teeth 15 are disposed in the accommodating cavity 13, and the inflow port 121 and the outflow port 122 are respectively located at two sides of the teeth 15. That is, the inflow port 121 is provided on one side of the tooth 15, the outflow port 122 is provided on the other side of the tooth 15, and the refrigerant flowing into the cavity 13 from the inflow port 121 needs to be radiated through the tooth 15, and then can flow out from the outflow port 122 after passing through the tooth 15. The relieved tooth 15 can be directly machined and formed on the base 12, and can also be welded on the base 12, the relieved tooth 15 can transfer heat to the base 12, and the base 12 can exchange heat with an air medium to realize heat dissipation. That is, the heat dissipation structure 1 can dissipate heat by the refrigerant on one hand, and can dissipate heat naturally by the relieved tooth 15 and the base 12 on the other hand, thereby having a good heat dissipation effect.
As a specific implementation manner, the heat dissipation structure 1 further includes an elastic member 6, one end of the elastic member 6 is abutted against the base 12, and the other end of the elastic member 6 is used for being mounted on the optical communication device.
The base 12 may be supported on the elastic element 6, the elastic element 6 may provide an elastic force for the base 12, so that the base 12 presents a "floating" structure, when the optical module is mounted on the optical communication device, the optical module may contact with the cover plate of the heat dissipation structure 1, and the heat dissipation structure 1 is integrally pressed down, the elastic element 6 is compressed by the base 12, and the reaction force of the elastic element 6 may ensure that the cover plate can reliably contact with the optical module.
In particular, the elastic member 6 may be a spring or a metal elastic sheet. One end of the spring or the metal elastic sheet can be fixed on the shell of the optical communication device, and the other end of the spring or the metal elastic sheet can be in contact with or fixedly connected with the base 12 of the heat dissipation structure 1.
It will be appreciated that optical communication devices typically have multiple sets of optical modules therein, e.g., 2 sets, 4 sets, 8 sets, etc., each set of optical modules may include 1, 2, 3, or more layers. The bottommost optical modules in each group of optical modules can be respectively in heat conduction contact with one heat dissipation structure 1, and part of the heat dissipation structures 1 can be connected in series in one heat dissipation loop, and the other part of the heat dissipation structures 1 can be connected in series in the other heat dissipation loop. Fig. 9 is a state diagram of the installation of the elastic member in the heat dissipation structure, as shown in fig. 9, in order to ensure that the plurality of heat dissipation structures 1 are orderly arranged and can accurately correspond to the corresponding optical modules, the heat dissipation assembly of the optical module further comprises a fixing frame 7, a positioning hole 71 is arranged on the fixing frame 7, a positioning protrusion 123 is arranged on a base 12 of the heat dissipation structure 1, and the positioning protrusion 123 is matched with the positioning hole 71.
The fixing frame 7 is an integral structure with a certain length, and one fixing frame 7 can position a plurality of heat dissipation structures 1. Thereby not only ensuring the accuracy of the installation positions of a plurality of heat dissipation structures 1, but also facilitating the installation operation.
Fig. 10 is a schematic diagram of an optical communication device according to an embodiment of the present application, and as shown in fig. 10, an optical communication device according to an embodiment of the present application is further provided, which includes a system back plate 8 and a plurality of single plates 9, where the plurality of single plates 9 are all connected to the system back plate 8, and the system back plate 8 can provide reliable support for the plurality of single plates 9 and also facilitate heat dissipation for the single plates 9. At least one optical module heat dissipation assembly provided in any embodiment of the present application is disposed on each board 9, and a bottommost optical module in the optical module heat dissipation assembly is close to the board 9.
The board 9 may specifically include a bracket 203 and a circuit board 200, where the bracket 203 may provide support for the circuit board 200, and one side of the bracket 203 may have a port, and an optical module may be inserted from the port and may be electrically connected to the circuit board 200. As shown in fig. 2, the circuit board 200 may be a printed circuit board (Printed circuit boards, PCB), and a through hole 202 may be disposed on the PCB, and the heat dissipation structure 1 may be movably disposed in the through hole 202. The through hole 202 can provide a larger arrangement space for the heat dissipation structure 1 under the existing structural layout condition of the optical communication device, which is beneficial to arranging the heat dissipation structure 1 below the bottommost optical module and avoiding extra occupation space.
In addition, as shown in fig. 2, an elastic member 6 may be disposed below the heat dissipation structure 1, where the elastic member 6 may provide an elastic force for the heat dissipation structure 1, and when the optical module is pressed against the heat dissipation structure 1, the elastic member 6 is deformed by compression, and its reaction force may ensure that the heat dissipation structure 1 is reliably contacted with the optical module. The elastic member 6 may be a spring or a metal elastic sheet. As shown in fig. 2, taking the elastic member 6 as an example of a metal elastic sheet, one end of the elastic member 6 may be abutted against the heat dissipation structure 1, and the other end of the elastic member 6 may be abutted against the bracket 203, and of course, the elastic member 6 may also be abutted against a housing of the optical communication device, such as a chassis.
The optical communications device further comprises a chassis in which the system back plane 8 and the plurality of single boards 9 may be enclosed. In addition, the chassis may have a plurality of fan 400 modules therein, and the fan 400 modules may dissipate heat inside the chassis.
Fig. 11 is a schematic diagram of an optical communication device provided in another embodiment of the present application, and as shown in fig. 11, another embodiment of the present application further provides an optical communication device, which includes a board 9 and an optical module heat dissipation assembly provided in any embodiment of the present application, where the optical module heat dissipation assembly is disposed on the board 9. The veneer 9 in this embodiment has only one, and can be used independently. The optical communication device may further include a housing, where the housing has a smaller size, and a single board 9 and an optical module heat dissipation assembly may be encapsulated therein, and a fan 400 module may be configured in the housing to dissipate heat in the housing. The volume of the shell is far smaller than that of the case, so that the shell can be applied to a scene with limited space.
In addition, the optical module heat dissipation assembly may be applied to heat dissipation of the heat generating device 201 on the circuit board 200, in addition to heat dissipation of the optical module. Fig. 12 is a schematic diagram of an optical communication device according to another embodiment of the present application, as shown in fig. 12, a plurality of components may be integrated on a circuit board 200, and for components with a higher heat generation rate, it is difficult to arrange a radiator due to the limitation of the space around the circuit board 200, and only natural heat dissipation can be performed by air, so that the heat dissipation effect is poor and heat accumulation is easy. And through adopting the optical module cooling assembly that this application provided, can make optical module cooling assembly and the device 201 that generates heat on the circuit board 200 heat conduction contact to can dispel the heat through the refrigerant in the optical module cooling assembly, promoted the radiating effect to the device 201 that generates heat, and heat radiation structure 1 in this optical module cooling assembly is small, can utilize the space around the circuit board 200 to arrange.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (16)
1. An optical module heat sink assembly, comprising:
at least two layers of optical modules are arranged in a laminated mode, and the heat dissipation direction of the bottommost optical module deviates from the adjacent optical module positioned on the upper layer;
the heat dissipation structure is in heat conduction contact with one end of the bottommost light module in the heat dissipation direction;
the heat exchanger is used for storing a refrigerant;
the driving pump is connected with the heat exchanger and used for controlling the refrigerant to circularly flow between the heat dissipation structure and the heat exchanger.
2. The light module heat dissipation assembly of claim 1, wherein the at least two layers of light modules are two layers of light modules, and a heat dissipation direction of an upper layer of light module is away from the bottommost layer of light module;
and a heat dissipation device is arranged on one side of the upper layer optical module, which is away from the bottommost layer optical module.
3. The light module heat dissipation assembly of claim 1, wherein the at least two layers of light modules are three layers of light modules, the heat dissipation direction of the middle layer of light modules is away from the bottommost layer of light modules, and the heat dissipation direction of the topmost layer of light modules is away from the middle layer of light modules;
and the heat dissipation structure is in heat conduction contact with the bottommost optical module, the middle optical module and the topmost optical module respectively.
4. The light module heat sink assembly of claim 1 wherein the heat dissipating structure is provided with a cavity and an inflow port and an outflow port in communication with the cavity, the cavity being in communication with the drive pump and the heat exchanger through the inflow port and the outflow port, respectively.
5. The light module heat sink assembly of claim 4 wherein the inflow port is in communication with the outlet of the heat exchanger via a conduit and the outflow port is in communication with the inflow end of the drive pump via a conduit;
or the inflow port is communicated with the liquid inlet of the heat exchanger through a pipeline, and the outflow port is communicated with the outflow end of the driving pump through a pipeline.
6. The optical module heat dissipation assembly of claim 5, wherein the optical module heat dissipation assembly comprises a main pipeline and at least two heat dissipation loops, each heat dissipation loop having at least one of the heat exchangers and at least one of the heat dissipation structures in series;
the driving pump comprises a plurality of micropumps, the micropumps are connected in series in the main pipeline, and the main pipeline is connected in series with the at least two heat dissipation loops respectively.
7. The light module heat dissipation assembly of claim 5, comprising a main conduit and at least two heat dissipation loops, each heat dissipation loop having at least one of the heat exchangers, at least one of the heat dissipation structures, and at least one of the drive pumps in series;
the main pipeline is respectively connected with the at least two radiating loops in series.
8. The light module heat sink assembly of any one of claims 4-7, wherein the heat dissipation structure comprises a base and a cover, the cavity is disposed on the base, and the cover is fastened to the base for closing the cavity.
9. The heat dissipating assembly of claim 8, wherein a bottom of said base is provided with a recessed space for arranging a pipe, and said inflow port and said outflow port are provided on a side of said cavity adjacent to said recessed space.
10. The light module heat sink assembly of claim 8 wherein a plurality of teeth are disposed in the cavity, the flow inlet and the flow outlet being located on either side of the teeth.
11. The light module heat sink assembly of claim 8, wherein the heat dissipating structure further comprises an elastic member, one end of the elastic member abuts against the base, and the other end of the elastic member is configured to be mounted on an optical communication device.
12. The light module heat sink assembly of claim 11, wherein the resilient member is a spring or a metal dome.
13. The light module heat sink assembly of claim 8, further comprising a mount having a locating hole disposed thereon;
the base is provided with a positioning protrusion, and the positioning protrusion is matched with the positioning hole.
14. An optical communication device, comprising:
a system backboard;
a plurality of single boards, wherein the single boards are all connected to the system back board, and each single board is provided with at least one optical module heat dissipation assembly as claimed in any one of claims 1 to 13, and the bottommost optical module in the optical module heat dissipation assembly is close to the single board.
15. An optical communication device, comprising a single board and the optical module heat dissipation assembly of any one of claims 1-13, the optical module heat dissipation assembly being disposed on the single board.
16. The optical communication device according to claim 14 or 15, wherein the single board comprises a circuit board provided with a through hole, and the heat dissipation structure is provided through the through hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210651921.9A CN117250699A (en) | 2022-06-09 | 2022-06-09 | Optical module heat dissipation assembly and optical communication equipment |
| PCT/CN2023/098715 WO2023236966A1 (en) | 2022-06-09 | 2023-06-06 | Optical module heat dissipation assembly and optical communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210651921.9A CN117250699A (en) | 2022-06-09 | 2022-06-09 | Optical module heat dissipation assembly and optical communication equipment |
Publications (1)
| Publication Number | Publication Date |
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| CN117250699A true CN117250699A (en) | 2023-12-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210651921.9A Pending CN117250699A (en) | 2022-06-09 | 2022-06-09 | Optical module heat dissipation assembly and optical communication equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117250699A (en) |
| WO (1) | WO2023236966A1 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204362490U (en) * | 2015-01-07 | 2015-05-27 | 加弘科技咨询(上海)有限公司 | A kind of high efficiency and heat radiation optical module device |
| CN106098657B (en) * | 2016-08-15 | 2018-09-14 | 华南理工大学 | A kind of small-sized liquid cooling system and method for the driving of electrohydraulic dynamic Micropump |
| US20190387650A1 (en) * | 2018-06-14 | 2019-12-19 | Cisco Technology, Inc. | Heat sink for pluggable module cage |
| CN110806620A (en) * | 2018-08-06 | 2020-02-18 | 华为技术有限公司 | Single board and network equipment |
| US11122705B2 (en) * | 2019-01-14 | 2021-09-14 | Cisco Technology, Inc. | Liquid cooled optical cages for optical modules |
| CN110146956B (en) * | 2019-04-25 | 2021-04-27 | 东南大学 | Internal heat transport microstructure of optical module |
| CN113138446B (en) * | 2020-01-20 | 2022-07-22 | 华为技术有限公司 | Heat radiation structure and communication equipment of optical module |
-
2022
- 2022-06-09 CN CN202210651921.9A patent/CN117250699A/en active Pending
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- 2023-06-06 WO PCT/CN2023/098715 patent/WO2023236966A1/en unknown
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| WO2023236966A1 (en) | 2023-12-14 |
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